JP2001185832A - Electronic parts, electronic parts mounting board, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part mounting board on which electronic parts can be mounted with high density with high reliability of soldered connection. SOLUTION: The electronic parts mounting board 30 is constituted of a printed wiring board 36 having wiring patterns 31a and 31b, electrode lands 32a and 32b respectively provided on both surfaces, through holes 34A-34D, and electronic parts 20A-20D which are mounted on the board 36 in such a way that their main bodies are respectively housed in the through holes 34A-34D. The through holes have inside diameters which are made smaller than the outside diameters of the first electrode terminals 24 and larger than the outside diameters of the second electrode terminals 26 of their corresponding electronic parts, and are made through the printed wiring board 36 and electrode lands 32a and 32b. The first and second electrode terminals of each electronic parts are respectively bonded to the electrode lands provided on the front and rear surfaces of the board 36 correspondingly to the electrode terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component, an electronic component mounting board, and a method for manufacturing an electronic component mounting board.
More specifically, an electronic component that can be mounted with a high mounting density and with high reliability for electrical and mechanical bonding, an electronic component mounting board on which the electronic component is mounted with a high mounting density and high bonding reliability, and an electronic component The present invention relates to a method for manufacturing a mounting substrate.

[0002]

2. Description of the Related Art Many electronic devices are manufactured by incorporating an electronic component mounting board in which electronic components are mounted on a mounting board such as a printed wiring board. Conventionally, when mounting an electronic component on a mounting board such as a printed wiring board, an electrode land is provided at one end of a wiring pattern formed on the front surface or the back surface of the printed wiring board, and an electrode terminal of the electronic component is provided on the electrode land. The electronic component is mounted on a mounting board by soldering using a solder which is an alloy of tin (Sn) and lead (Pb), and forms a circuit.

Here, with reference to FIG. 7, a configuration of an electronic component mounting board on which electronic components are mounted by a conventional mounting method will be described. FIG. 7 is a cross-sectional view showing a configuration of a conventional electronic component mounting board. As shown in FIG. 7, a conventional electronic component mounting board 10 has a wiring pattern 12 and an electrode land 1 on its surface.
4 and an electronic component 19 in which electrode terminals 18 are connected to electrode lands 14. The electronic component 19 includes an electronic component main body 17 and electrode terminals 18 provided at both ends of the electronic component main body 17.

In order to manufacture the electronic component mounting board 10, first, cream solder is applied to the electrode lands 14 of the printed wiring board 16, and then the electrode terminals 18 of the electronic components 19 are aligned on the electrode lands 14. Electronic components 19
Is temporarily mounted on the printed wiring board 16. Subsequently, the printed wiring board 16 on which the electronic components 19 are mounted is sent into a heating furnace called a reflow furnace, and the solder in the cream solder is melted, and the electrode terminals 18 of the electronic components 19 and the electrodes of the printed wiring board 16 are melted. The land 14 is connected. Thereby, the electronic component mounting board 10 described above can be manufactured. Among conventional electronic component mounting boards, there is a double-sided mounting type board in which electronic components are mounted on both the front and back surfaces of a printed wiring board. The electronic components are mounted by applying the above mounting method to both the front surface and the rear surface of the wiring board.

[0005]

By the way, in recent years, as electronic devices have become more sophisticated, multifunctional, and miniaturized, the number of electronic components mounted on one mounting substrate has increased.
On the other hand, since the area of the mounting substrate has been reduced, the distance between the electronic components on the mounting substrate, that is, the distance between the electrode lands has to be reduced. That is, there is a demand for an electronic component mounting board on which electronic components are mounted at a high density. However, as a result, the solder applied on the electrode lands for soldering the electrode terminals of the electronic component and the electrode lands of the mounting board comes into contact with adjacent electrode lands and short-circuits the electrode lands of the mounting board. There is a problem, that is, the problem of poor connection due to a so-called solder bridge.

Further, when the distance between the electronic components is reduced, the heat does not transfer uniformly within the mounting substrate during heating by the reflow furnace, and the solder applied on the electrode lands does not melt sufficiently. This causes a problem of poor connection. Conversely, if the temperature of the reflow furnace is set high so that all the solder is sufficiently melted, excessive heat is transmitted to the electronic components, causing a problem of damaging the electronic components. In this case, it is difficult to satisfy the requirement that the electronic component mounting board having high reliability of solder bonding and high-density mounting is required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component having high reliability for solder bonding and capable of high-density mounting, an electronic component mounting board for high-density mounting, and a mounting method therefor.

[0008]

The inventor of the present invention considers that it is difficult to increase the reliability of the solder joint as long as the structure of the electronic component and the mounting method thereof remain unchanged, and the mounting surface of the mounting board is considered to be difficult. We researched mounting more electronic components on a printed wiring board with the same mounting area as before without increasing the component density more than the current situation, and devised an electronic component with an unprecedented new bonding structure. The new joining structure is that a large flange-shaped electrode terminal is provided at one end of the electronic component and a small flange-shaped electrode terminal is provided at the other end. It is a structure that is housed inside. That is, a through-hole that penetrates the mounting board with an inner diameter larger than the diameter of the small flange-shaped electrode terminal is provided in the mounting board, and the electronic component body is housed in the through-hole by entering the through-hole from the small flange-shaped electrode terminal, By joining the flange-shaped electrode terminals to the electrode lands by soldering, it is possible to connect the electrode lands of the printed wiring board and the electrode terminals of the electronic components by soldering without the electronic components falling out of the through holes of the mounting board. Is what you do. In other words, an electronic component mounted on an electronic component mounted on a mounting substrate to enable so-called three-dimensional mounting, an electronic component mounting substrate on which the electronic component is mounted, and a method for manufacturing such an electronic component mounting substrate were tested. Was repeatedly invented.

In order to achieve the above object, based on the above findings, an electronic component of the present invention is provided on an electronic component main body and at one end of the electronic component main body, and intersects a center line of the electronic component main body. A first electrode terminal in the form of a flange extending outward from the outer peripheral edge of the electronic component body in the direction in which the first electrode terminal is provided, and an outer diameter smaller than the outer diameter of the first electrode terminal provided at the other end of the electronic component body. And a second electrode terminal having a flange shape.

In the present invention, there is no restriction on the type of electronic component, and electronic components such as an electric resistor, a capacitor, and a diode having one electrode terminal at one end, such as a semiconductor integrated circuit, may be used. The present invention can also be applied to an electronic component in which the component body has a plurality of electrodes. When the electronic component main body has a plurality of electrodes, the first electrode terminal and the second electrode terminal correspond to the plurality of electrodes of the electronic component main body, and the plurality of electrodes are respectively provided on the flange-shaped peripheral portion. It has terminals. There is no limitation on the shape of the first and second electrode terminals, but preferably, the first electrode terminal is a disk-shaped electrode terminal extending in a direction orthogonal to the center line of the electronic component body, The second electrode terminal has the same size and shape as the other end surface of the electronic component body, and is formed on the other end surface.

An electronic component mounting board according to the present invention has a mounting board having electrode lands connected to a wiring pattern on both a front surface and a back surface, and an electronic component body accommodated in a through-hole penetrating the mounting substrate. The electronic component according to any one of claims 1 to 3, wherein the electrode terminal and the second electrode terminal are solder-bonded to electrode lands on the front surface and the rear surface of the mounting board, respectively. The electronic component accommodated therein has an inner diameter smaller than the outer diameter of the first electrode terminal and larger than the outer diameter of the second electrode terminal.

In the present invention, the number of electronic components to be mounted is not limited, and the present invention can be applied to mounting one electronic component or a large number of two or more electronic components. Further, a mounting substrate having a laminated structure can be formed. For example, an electronic component mounting board on which a plurality of electronic components are mounted, wherein one solder joint portion in which a surface electrode land of the mounting board and a first electrode terminal of one electronic component are soldered, The electrode terminals of the chip-type electronic component are respectively soldered to another surface electrode land and another solder joint portion of the other electronic component that is soldered to the first electrode terminal of another electronic component to form an electronic component mounting board having a laminated structure. are doing. Alternatively, as another method, an electronic component mounting board on which a plurality of electronic components are mounted, wherein one solder joint portion in which a back electrode land of the mounting board and a second electrode terminal of one electronic component are soldered. And an electrode terminal of the chip-type electronic component is solder-bonded to another back surface electrode land of the mounting board and another solder joint portion soldered to the second electrode terminal of another electronic component. It constitutes a mounting board.

[0013] The method for manufacturing an electronic component mounting board of the present invention comprises:
A first solder application step of applying cream solder to a surface electrode land of a mounting substrate having a wiring pattern and an electrode land on both the front surface and the rear surface and having a through hole penetrating the substrate body and the electrode land; Item 4. A step of inserting the electronic component according to any one of Items 1 to 3 from the second electrode terminal into the through hole of the mounting board with the first electrode terminal facing upward; First soldering step of soldering the electrode terminals of the mounting substrate and the surface electrode lands of the mounting board, and applying the second solder to apply cream solder to the second electrode terminals of the electronic component and the backside electrode lands of the mounting board And a second soldering step of soldering the second electrode terminal of the electronic component and the back electrode land of the mounting board by a reflow method.

The solder joint between the second electrode terminal and the back electrode land is not necessarily based on the reflow method.
Subsequent to the solder bonding step, the second electrode terminal of the electronic component and the back electrode land of the mounting board are immersed in a solder melting bath, so that the second electrode terminal and the back electrode land can be solder bonded. .

In order to manufacture an electronic component mounting board having a laminated structure, following the first solder coating step, the electrode terminals of the chip type electronic component are positioned on the surface electrode lands of the mounting board, and the chip type electronic component is temporarily provided. After mounting, the first electronic terminal of the electronic component, the surface electrode land of the mounting board, and the electrode terminal of the chip-type electronic component are simultaneously solder-bonded by a reflow method. Alternatively, following the second solder application step, the chip-type electronic component is temporarily mounted by positioning the electrode terminals of the chip-type electronic component on the back surface electrode lands of the mounting board, and the second electronic terminal of the electronic component is formed by a reflow method. At the same time, the back surface electrode lands of the mounting board and the electrode terminals of the chip-type electronic component are soldered together.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments with reference to the accompanying drawings. Embodiment of Electronic Component This embodiment is an example of an embodiment of the electronic component of the present invention, and FIG. 1A is a perspective view showing the configuration of the electronic component of the embodiment. FIG. 1B shows a configuration of an electrode terminal portion having a plurality of electrode terminals. As shown in FIG. 1A, an electronic component 20 according to the present embodiment has an electronic component body 22.
And a first electrode terminal 24 provided at one end of the electronic component main body 22 and a second electrode terminal 26 provided at the other end of the electronic component main body 22. The electronic component main body 22 is an element main body of a circuit element that forms an electric circuit, such as an electric resistor, a capacitor, and a diode. In the present embodiment, the electronic component main body 22 is formed as a cylindrical body.

The first electrode terminal 24 is connected to the electronic component body 22.
Is a disk-shaped electrode terminal extending with an outer diameter larger than the outer diameter of the electronic component body 22 around the center line in a direction orthogonal to the center line of the electronic component main body 22. The second electrode terminal 26 is connected to the electronic component body 22.
Is a disk-shaped electrode terminal provided with substantially the same shape and the same outer diameter as the end face of the other end. The first and second electrode terminals 24 and 26 are formed of a thin metal plate such as copper, gold, aluminum, or an alloy thereof. For example, an electrode terminal of an electronic component that requires one electrode terminal at one end, such as an electric resistor, a capacitor, and a diode, is formed of a single disk-shaped electrode terminal.

Also, in an electronic component 20 such as a semiconductor integrated circuit in which the number of electrodes of the electronic component body 22 is plural, the first electrode terminal 24 and / or the second electrode terminal 26 are connected to the electronic component body 22. As shown in FIG. 1B, a plurality of (in FIG. 1B, eight electrode terminals are simply shown) electrode terminals 24a to 24a corresponding to the number of electrodes shown in FIG. 24h
As an electrode terminal portion having FIG. 1B is a view of the first electrode terminal 24 as viewed from the electronic component body 22 side.

The electronic component 20 of the present embodiment has a higher density on a mounting board having the same external dimensions as the conventional electronic component, as will be described in the following embodiment of the electronic component mounting board. Moreover, it is an electronic component that can be mounted with high reliability of solder joint.

Embodiment 1 of Electronic Component Mounting Board This embodiment is an example of an embodiment of an electronic component mounting board of the present invention, and FIG. 2 is an electronic component mounting board of the present embodiment. It is sectional drawing which shows a structure of. The electronic component mounting board 30 of the present embodiment has wiring patterns 31a and 31b and electrode lands 3 on both the front and back surfaces, respectively.
2a and 32b, a printed wiring board 36 having through-holes 34A to 34D penetrating the electrode lands 32a and 32b and the substrate main body 34a (only four are simply shown in FIG. 2), and the electronic component main body 22 having a through-hole. The electronic components 20A to 20D according to the first embodiment (only four components are simply shown in FIG. 2) are accommodated in the printed circuit boards 34A to 34D and mounted on the printed wiring board 36, respectively. However, the front and back surfaces referred to in the present embodiment are opposite to the front and back surfaces described in the claims.

Each of the through holes 34A-D has an inner diameter smaller than the outer diameter of the first electrode terminal 24A-D of the corresponding electronic component 20A-D and larger than the outer diameter of the second electrode terminal 26A-D. And the printed wiring board 36 and the electrode lands 32
a, 32b. For example, when the outer diameter of the electronic component 20 is 0.5 mm, the inner diameter of the through hole 34 is, for example, 0.5 mm.
It is about 65 mm. First electrode terminal 2 of electronic component 20
4 is a printed wiring board 3 corresponding to the first electrode terminal 24.
6, the second electrode terminals 26 are soldered to the electrode lands 32a provided on the surface of the printed wiring board 36 corresponding to the second electrode terminals 26, respectively. Are joined. Also,
As described in the above embodiment of the electronic component, the first electrode terminal 24 and the second electrode terminal 26 correspond to the plurality of electrodes of the electronic component, and a plurality of When electrode terminals are provided, the electrode lands 32a, 32b
Are provided corresponding to the plurality of electrode terminals.

The electronic components 20A to 20D correspond to the electronic component main body 22.
A to D are accommodated in the through holes 34, respectively, and the wiring patterns of the printed wiring board 36 are formed by soldering the first electrode terminals 24 and the electrode lands 32b and the second electrode terminals 26 and the electrode lands 32a. 31.

With the above configuration, the electronic component mounting board 30 of the present embodiment has a space between the electrode lands, for example, between the electrode lands 32a or the electrode lands 32b for soldering the electronic component 20C and the electronic component 20D, respectively. Between the electrode lands, solder joint failure due to high-density mounting, etc. The substrate is realized.

Second Embodiment of Electronic Component Mounting Board This embodiment is another example of the embodiment of the electronic component mounting board of the present invention. FIG. 3 shows the electronic component of the present embodiment. FIG. 3 is a cross-sectional view illustrating a configuration of a mounting board. The electronic component mounting board 40 of the present embodiment includes an electrode land 32 a on the surface of the printed wiring board 36 and the second electrode terminal 2 of the electronic component 20.
6 and another solder joint 42b between another electronic component 20 and another second electrode terminal 26 are connected to the electrode terminals 46a and 46b of the conventional chip-type electronic component 44.
Are mounted by soldering to form an electronic component mounting board having a laminated structure, and have the same configuration as the electronic component mounting board 30 of the first embodiment. In the present embodiment, the outer diameter of the electronic component 20 housed in the through hole 34 of the printed wiring board 36 is 0.5 mm, and the printed wiring board 36
The outer dimensions of the electrode lands 32a are 1.0 mm, and the embedding interval of the electronic components 20, that is, the pitch of the through holes 34 is 2.
When the thickness is set to 0 mm, a chip-type electronic component called 2012 is suitable for the size of the chip-type electronic component to be mounted.

With the above structure, an electronic component mounting board having a laminated structure that can be easily manufactured is realized. In the present embodiment, the chip-type electronic component 44 is mounted on the second electrode terminal 26 side of the electronic component 20, but the chip-type electronic component 44 is mounted on the first electrode terminal 24 side. Can also.

Embodiment 1 of Electronic Component Mounting Method This embodiment is an example in which the electronic component mounting board manufacturing method of the present invention is applied to the manufacturing of electronic component mounting board 30 of Embodiment 1. FIGS. 4A to 4C and FIGS. 5D to 5F are each an example of a mode for manufacturing the electronic component mounting board 30 according to the method of the present embodiment. FIG. First, as shown in FIG. 4A, wiring patterns 3 are formed on both the front and back surfaces.
1a and 31b, and electrode lands 32a and 32b, and the substrate body 33 and the electrode lands 32a and 32b.
A printed wiring board 36 having through holes 34A to 34D penetrating through b is prepared. The through holes 34A to 34D are through holes having an inner diameter smaller than the outer diameter of the first electrode terminal 24 and larger than the outer diameter of the second electrode terminal 26 of the corresponding electronic component 20A to 20D, respectively.

Next, as shown in FIG. 4B, cream solder is applied onto the electrode lands 32b by screen printing using a screen mask, dispensing using a dispenser, or the like, with the back surface of the printed wiring board 36 facing upward. Apply 48. Subsequently, as shown in FIG. 4C, the electronic components 20A to 20D are inserted into the through holes 34A to 34D with the second electrode terminals 26 facing down. At the time of insertion, if a mounting machine called a chip mounter is used, it can be easily inserted. Thereby, although not shown, the cream solder 48 is interposed between the first electrode terminal 24 and the electrode land 32b.

The electronic components 2 are respectively inserted into the through holes 34A to 34D.
The printed wiring board 36 accommodating OAD was placed in a reflow furnace and heated to melt the cream solder, and FIG.
As shown in (d), the first electrode terminal 24 and the electrode land 32a of the printed wiring board 36 are soldered.

Next, the second electrode terminal 2 of the electronic component 20
Then, the process proceeds to the step of soldering the electrode 6 to the electrode lands 32a on the surface of the printed wiring board 36. The solder joining process between the second electrode terminal 26 and the electrode land 32a is substantially the same as the above-described solder joining process between the first electrode terminal 24 and the electrode land 32b. First, the printed wiring board 3 is set so that the upper surface (back surface of the printed wiring board 36) is turned downward.
6 is inverted, and as shown in FIG.
a is directed upward, and then by a printing method using a screen mask, a dispensing method using a dispenser, or the like,
Second electrode terminal 26 of electronic component 20 and printed wiring board 3
The cream solder 48 is applied so as to straddle the sixth electrode land 32b.

Next, the printed wiring board 36 coated with the cream solder 48 is placed in a reflow furnace and heated to melt the cream solder, and as shown in FIG. The terminals 24 and the electrode lands 32a of the printed wiring board 36 are soldered. Through the above steps, the electronic component mounting board 30 of the first embodiment can be manufactured. The second electrode terminal 24 and the electrode land 3
When the second electrode terminal 24 and the electrode land 32a are joined by soldering, the second electrode terminal 24 and the electrode land 32a can be joined by soldering.

Second Embodiment of Electronic Component Mounting Method This embodiment is an example in which the electronic component mounting substrate manufacturing method of the present invention is applied to the manufacturing of the electronic component mounting substrate 40 of the second embodiment. 6 (a) to 6 (c) are cross-sectional views for respective steps when the electronic component mounting board 40 is manufactured according to the method of the present embodiment. In the present embodiment, as shown in FIG. 6A, the second electrode terminal 26 of the electronic component 20 and the electrode land 32a of the printed wiring board 36 are provided in the same manner as in the mounting method of the second embodiment. The process until the cream solder 48 is applied so as to be straddled is completed. In this embodiment, FIG.
As shown in (b), the electrode terminals 46 of the conventional chip-type electronic component 44 are aligned on the electrode lands 32a of the printed wiring board 36 coated with the cream solder and the second electrode terminals 26 of the electronic component 20. The electronic component 44 is temporarily mounted. After the electronic components 44 are temporarily mounted, the printed wiring board 36 is inserted into a reflow furnace and heated to melt the cream solder, and as shown in FIG.
Is soldered to the electrode land 32a of the printed wiring board 36, and the electrode terminal 46 of the electronic component 44 is further connected to the second electrode terminal 24 and the printed wiring board 3.
6 is soldered to the electrode land 32a. Through the above steps, the electronic component mounting board 40 of the second embodiment can be manufactured.

[0032]

According to the present invention, a flange-shaped first electrode terminal provided at one end of the electronic component body and a first electrode terminal provided at the other end of the electronic component body are provided. By forming an electronic component having a flange-shaped second electrode terminal having an outer diameter smaller than the outer diameter of the electronic component, an electronic component capable of high-density mounting without causing solder joint failure is realized. In addition, since the electrode terminals of the electronic component are formed in a flange shape, it is easy to insert them into the through holes of the mounting board and temporarily fix them. Further, the mounting board and the electronic component body are accommodated in a through hole penetrating the mounting board, and the first electrode terminal and the second
The electronic terminal of the present invention, wherein the electrode terminals are soldered to the electrode lands on the front and back surfaces of the mounting board, respectively.
The through-holes each have a smaller inner diameter than the outer diameter of the first electrode terminal and a larger inner diameter than the outer diameter of the second electrode terminal of the accommodated electronic component, so that high-density mounting can be performed without causing solder joint failure. Electronic component mounting board. By using the electronic component mounting board of the present invention, it is easy to further reduce the size and function of the electronic device. Further, by applying the present invention, an electronic component mounting substrate having a laminated structure can be easily manufactured. Also,
The method of the present invention realizes a method of easily manufacturing the electronic component mounting board of the present invention.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a configuration of an electronic component according to an embodiment of the present invention, and FIG. 1B shows a configuration of an electrode terminal portion having a plurality of electrode terminals.

FIG. 2 is a cross-sectional view illustrating a configuration of an electronic component mounting board according to the first embodiment.

FIG. 3 is a cross-sectional view illustrating a configuration of an electronic component mounting board according to a second embodiment.

FIGS. 4A to 4C are cross-sectional views for respective steps when manufacturing the electronic component mounting board of the first embodiment according to the method of the first embodiment.

FIGS. 5 (d) to 5 (f) respectively show FIGS.
FIG. 7C is a sectional view illustrating the process of manufacturing the electronic component mounting board of the first embodiment according to the method of the first embodiment, following FIG.

6 (a) to 6 (c) are cross-sectional views for respective steps when manufacturing the electronic component mounting board of Embodiment 2 according to the method of Embodiment 2;

FIG. 7 is a cross-sectional view illustrating a configuration of a conventional electronic component mounting board.

[Explanation of symbols]

10: conventional electronic component mounting board, 12: wiring pattern, 14: electrode land, 16: printed wiring board, 1
8 ... Electrode terminal, 19 ... Electronic component, 20 ... Electronic component of the embodiment, 22 ... Electronic component main body, 24 ... First
Electrode terminals, 26... Second electrode terminals, 30... The electronic component mounting board of the first embodiment, 31.
Reference numeral 32: electrode land, 34: through hole, 36: printed wiring board, 38: solder, 40: electronic component mounting board of the second embodiment, 42: solder joint, 44: conventional Chip-type electronic components, 46: electrode terminals, 48: cream solder.

Claims (10)

[Claims] An electronic component main body and a flange-shaped first member provided at one end of the electronic component main body and extending outward from an outer peripheral edge of the electronic component main body in a direction intersecting a center line of the electronic component main body. An electronic component comprising: one electrode terminal; and a second electrode terminal provided on the other end of the electronic component body and having a flange-shaped outer diameter smaller than the outer diameter of the first electrode terminal. 2. A first electrode terminal and a second electrode terminal corresponding to a plurality of electrodes of an electronic component body, respectively.
The electronic component according to claim 1, wherein an electrode terminal portion including a plurality of electrode terminals is formed on a flange-shaped peripheral portion. 3. The electronic device according to claim 1, wherein the first electrode terminal is a disk-shaped electrode terminal extending in a direction orthogonal to a center line of the electronic component body, and the second electrode terminal is connected to the other end surface of the electronic component body. The electronic component according to claim 1, wherein the electronic component has the same size and the same shape and is formed on the other end surface. 4. A mounting substrate having electrode lands connected to a wiring pattern on both front and rear surfaces, and a main body of an electronic component is housed in a through-hole penetrating the mounting substrate, and a first electrode terminal and a second electrode terminal are provided. The electronic terminal according to any one of claims 1 to 3, wherein the electrode terminal is solder-bonded to an electrode land on a front surface and a rear surface of the mounting substrate, respectively, and the through-hole is formed of a third one of the accommodated electronic component. An electronic component mounting board having an inner diameter smaller than the outer diameter of the first electrode terminal and larger than the outer diameter of the second electrode terminal. 5. An electronic component mounting board on which a plurality of electronic components are mounted, wherein one solder joint portion is formed by soldering a surface electrode land of the mounting board and a first electrode terminal of one electronic component. Then, the electrode terminals of the chip-type electronic component are solder-joined to another surface electrode land of the mounting board and another solder joint portion of another electronic component, which is soldered to the first electrode terminal, to mount an electronic component having a laminated structure. The electronic component mounting board according to claim 4, wherein the board constitutes a board. 6. An electronic component mounting board on which a plurality of electronic components are mounted, wherein one solder joint portion is formed by soldering a back electrode land of the mounting board and a second electrode terminal of one electronic component. Then, the electrode terminals of the chip-type electronic component are solder-joined to another back surface electrode land of the mounting board and another solder joint portion of another electronic component, which is solder-joined to another electronic component, to mount an electronic component having a laminated structure. The electronic component mounting board according to claim 4, wherein the board constitutes a board. 7. A first solder for applying a cream solder to a surface electrode land of a mounting substrate having a wiring pattern and an electrode land on both the front surface and the rear surface, and having a through hole penetrating the substrate body and the electrode land. A coating step; a step of inserting the electronic component according to any one of claims 1 to 3 from the second electrode terminal into the through-hole of the mounting board with the first electrode terminal facing upward; A first soldering step of soldering the first electrode terminal of the electronic component to the surface electrode land of the mounting board; and applying a cream solder to the second electrode terminal of the electronic component and the backside electrode land of the mounting board. A second solder applying step of soldering the second electrode terminal of the electronic component and the back electrode land of the mounting board by a reflow method. A method for manufacturing a component mounting board. 8. Subsequent to the first solder joining step, the second electrode terminal of the electronic component and the back electrode land of the mounting board are immersed in a solder melting bath to thereby connect the second electrode terminal and the back electrode land. 8. The method according to claim 7, wherein the soldering is performed.
3. The method for producing an electronic component mounting board according to 1. 9. Following the first solder coating step, the electrode terminals of the chip-type electronic component are positioned on the surface electrode lands of the mounting board, and the chip-type electronic component is temporarily mounted. 8. The method of manufacturing an electronic component mounting board according to claim 7, wherein the electronic terminal, the surface electrode lands of the mounting substrate, and the electrode terminals of the chip-type electronic component are simultaneously soldered. 10. Following the second solder application step, the chip-type electronic component is temporarily mounted by positioning the electrode terminals of the chip-type electronic component on the rear surface electrode lands of the mounting board, and the second electronic component is reflowed by a reflow method. 8. The method for manufacturing an electronic component mounting board according to claim 7, wherein the electronic terminal, the back electrode land of the mounting board, and the electrode terminal of the chip-type electronic component are simultaneously soldered.