JP2001168493A - 電子装置の製造方法及び電子装置 - Google Patents
電子装置の製造方法及び電子装置Info
- Publication number
- JP2001168493A JP2001168493A JP34768799A JP34768799A JP2001168493A JP 2001168493 A JP2001168493 A JP 2001168493A JP 34768799 A JP34768799 A JP 34768799A JP 34768799 A JP34768799 A JP 34768799A JP 2001168493 A JP2001168493 A JP 2001168493A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic device
- resin
- intermediate layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 241
- 229920005989 resin Polymers 0.000 claims abstract description 178
- 239000011347 resin Substances 0.000 claims abstract description 178
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims description 64
- 230000005672 electromagnetic field Effects 0.000 claims description 20
- 239000000945 filler Substances 0.000 claims description 17
- 238000007639 printing Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 229920006015 heat resistant resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 142
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000010586 diagram Methods 0.000 description 9
- 238000000926 separation method Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34768799A JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34768799A JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001168493A true JP2001168493A (ja) | 2001-06-22 |
| JP2001168493A5 JP2001168493A5 (https=) | 2004-07-15 |
Family
ID=18391901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34768799A Pending JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001168493A (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998532B2 (en) | 2002-12-24 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component-built-in module |
| US7382628B2 (en) | 2002-09-12 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Circuit-component-containing module |
| US7701053B2 (en) | 2003-05-09 | 2010-04-20 | Murata Manufacturing Co., Ltd. | Electronic component and method for producing the same |
| JP2010225700A (ja) * | 2009-03-19 | 2010-10-07 | Olympus Corp | 実装構造体および実装構造体の製造方法 |
| US9343863B2 (en) | 2009-03-19 | 2016-05-17 | Olympus Corporation | Method for manufacturing mount assembly |
| WO2019030953A1 (ja) * | 2017-08-08 | 2019-02-14 | オムロン株式会社 | 耐蝕性電子基板およびそれに用いるコーティング組成物 |
-
1999
- 1999-12-07 JP JP34768799A patent/JP2001168493A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7382628B2 (en) | 2002-09-12 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Circuit-component-containing module |
| US6998532B2 (en) | 2002-12-24 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component-built-in module |
| US7701053B2 (en) | 2003-05-09 | 2010-04-20 | Murata Manufacturing Co., Ltd. | Electronic component and method for producing the same |
| JP2010225700A (ja) * | 2009-03-19 | 2010-10-07 | Olympus Corp | 実装構造体および実装構造体の製造方法 |
| US9343863B2 (en) | 2009-03-19 | 2016-05-17 | Olympus Corporation | Method for manufacturing mount assembly |
| WO2019030953A1 (ja) * | 2017-08-08 | 2019-02-14 | オムロン株式会社 | 耐蝕性電子基板およびそれに用いるコーティング組成物 |
| JP2019033173A (ja) * | 2017-08-08 | 2019-02-28 | オムロン株式会社 | 耐蝕性電子基板およびそれに用いるコーティング組成物 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051108 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051220 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060314 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060425 |
|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20060523 |
|
| A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20060714 |