JP2001168147A5 - - Google Patents
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- Publication number
- JP2001168147A5 JP2001168147A5 JP1999353488A JP35348899A JP2001168147A5 JP 2001168147 A5 JP2001168147 A5 JP 2001168147A5 JP 1999353488 A JP1999353488 A JP 1999353488A JP 35348899 A JP35348899 A JP 35348899A JP 2001168147 A5 JP2001168147 A5 JP 2001168147A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tin plating
- press
- concentration
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 description 40
- 229910052718 tin Inorganic materials 0.000 description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 22
- 239000010410 layer Substances 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35348899A JP3630398B2 (ja) | 1999-12-13 | 1999-12-13 | 電子部品実装用フィルムキャリアテープの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35348899A JP3630398B2 (ja) | 1999-12-13 | 1999-12-13 | 電子部品実装用フィルムキャリアテープの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004217820A Division JP2004297102A (ja) | 2004-07-26 | 2004-07-26 | 電子部品実装用フィルムキャリアテープの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001168147A JP2001168147A (ja) | 2001-06-22 |
JP2001168147A5 true JP2001168147A5 (de) | 2004-07-08 |
JP3630398B2 JP3630398B2 (ja) | 2005-03-16 |
Family
ID=18431188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP35348899A Expired - Fee Related JP3630398B2 (ja) | 1999-12-13 | 1999-12-13 | 電子部品実装用フィルムキャリアテープの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3630398B2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003069967A1 (fr) * | 2002-02-13 | 2003-08-21 | Shindo Company, Ltd. | Procede de production de substrat de circuit |
JP2004297102A (ja) * | 2004-07-26 | 2004-10-21 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープの製造方法 |
JP2019075503A (ja) | 2017-10-18 | 2019-05-16 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
WO2020230504A1 (ja) * | 2019-05-10 | 2020-11-19 | 昭和電工株式会社 | フレキシブル配線回路基板の製造方法 |
-
1999
- 1999-12-13 JP JP35348899A patent/JP3630398B2/ja not_active Expired - Fee Related
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