JP2001111283A - 電磁波シールド構造及び電磁波シールド方法 - Google Patents
電磁波シールド構造及び電磁波シールド方法Info
- Publication number
- JP2001111283A JP2001111283A JP28759799A JP28759799A JP2001111283A JP 2001111283 A JP2001111283 A JP 2001111283A JP 28759799 A JP28759799 A JP 28759799A JP 28759799 A JP28759799 A JP 28759799A JP 2001111283 A JP2001111283 A JP 2001111283A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- conductive
- conductive member
- wave shielding
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 16
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- 239000007788 liquid Substances 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
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- 238000009434 installation Methods 0.000 description 3
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
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- 238000003825 pressing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28759799A JP2001111283A (ja) | 1999-10-08 | 1999-10-08 | 電磁波シールド構造及び電磁波シールド方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28759799A JP2001111283A (ja) | 1999-10-08 | 1999-10-08 | 電磁波シールド構造及び電磁波シールド方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001111283A true JP2001111283A (ja) | 2001-04-20 |
| JP2001111283A5 JP2001111283A5 (enExample) | 2006-11-09 |
Family
ID=17719358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28759799A Pending JP2001111283A (ja) | 1999-10-08 | 1999-10-08 | 電磁波シールド構造及び電磁波シールド方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001111283A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004023277A1 (en) * | 2002-09-06 | 2004-03-18 | Legend (Beijing) Limited | The shell of computer |
| US9557501B2 (en) | 2015-03-12 | 2017-01-31 | Sumitomo Electric Industries, Ltd. | Optical transceiver having gasket supported by member without narrowing inner space of housing |
| JP2018073863A (ja) * | 2016-10-24 | 2018-05-10 | 本田技研工業株式会社 | 電子装置 |
| CN108541127A (zh) * | 2017-03-06 | 2018-09-14 | 索尼互动娱乐股份有限公司 | 电子设备 |
| JPWO2024009500A1 (enExample) * | 2022-07-08 | 2024-01-11 |
-
1999
- 1999-10-08 JP JP28759799A patent/JP2001111283A/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004023277A1 (en) * | 2002-09-06 | 2004-03-18 | Legend (Beijing) Limited | The shell of computer |
| US9557501B2 (en) | 2015-03-12 | 2017-01-31 | Sumitomo Electric Industries, Ltd. | Optical transceiver having gasket supported by member without narrowing inner space of housing |
| JP2018073863A (ja) * | 2016-10-24 | 2018-05-10 | 本田技研工業株式会社 | 電子装置 |
| CN108541127A (zh) * | 2017-03-06 | 2018-09-14 | 索尼互动娱乐股份有限公司 | 电子设备 |
| JP2018148026A (ja) * | 2017-03-06 | 2018-09-20 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| US10932356B2 (en) | 2017-03-06 | 2021-02-23 | Sony Interactive Entertainment Inc. | Electronic equipment |
| CN108541127B (zh) * | 2017-03-06 | 2022-02-18 | 索尼互动娱乐股份有限公司 | 电子设备 |
| JPWO2024009500A1 (enExample) * | 2022-07-08 | 2024-01-11 | ||
| WO2024009500A1 (ja) * | 2022-07-08 | 2024-01-11 | 日立Astemo株式会社 | 電子制御装置、及び、電子制御装置の製造方法 |
| JP7773645B2 (ja) | 2022-07-08 | 2025-11-19 | Ａｓｔｅｍｏ株式会社 | 電子制御装置、及び、電子制御装置の製造方法 |
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