JP2001093998A5 - - Google Patents
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- Publication number
- JP2001093998A5 JP2001093998A5 JP1999266747A JP26674799A JP2001093998A5 JP 2001093998 A5 JP2001093998 A5 JP 2001093998A5 JP 1999266747 A JP1999266747 A JP 1999266747A JP 26674799 A JP26674799 A JP 26674799A JP 2001093998 A5 JP2001093998 A5 JP 2001093998A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- metal cap
- package
- tongue piece
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 16
- 230000002093 peripheral effect Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26674799A JP4093519B2 (ja) | 1999-09-21 | 1999-09-21 | パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26674799A JP4093519B2 (ja) | 1999-09-21 | 1999-09-21 | パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001093998A JP2001093998A (ja) | 2001-04-06 |
| JP2001093998A5 true JP2001093998A5 (enrdf_load_stackoverflow) | 2006-10-12 |
| JP4093519B2 JP4093519B2 (ja) | 2008-06-04 |
Family
ID=17435158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26674799A Expired - Fee Related JP4093519B2 (ja) | 1999-09-21 | 1999-09-21 | パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4093519B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5646234B2 (ja) * | 2010-07-21 | 2014-12-24 | 日本電波工業株式会社 | 圧電デバイスの製造方法 |
| JP6394161B2 (ja) | 2014-08-06 | 2018-09-26 | 日亜化学工業株式会社 | 発光装置及び光源モジュール |
| CN117374014B (zh) * | 2023-12-07 | 2024-03-08 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
-
1999
- 1999-09-21 JP JP26674799A patent/JP4093519B2/ja not_active Expired - Fee Related
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