JP2001093998A5 - - Google Patents
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- Publication number
- JP2001093998A5 JP2001093998A5 JP1999266747A JP26674799A JP2001093998A5 JP 2001093998 A5 JP2001093998 A5 JP 2001093998A5 JP 1999266747 A JP1999266747 A JP 1999266747A JP 26674799 A JP26674799 A JP 26674799A JP 2001093998 A5 JP2001093998 A5 JP 2001093998A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- metal cap
- package
- tongue piece
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 16
- 230000002093 peripheral Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Description
【特許請求の範囲】
【請求項１】
底板部と枠体部を有するセラミック製絶縁性ベースに低融点ガラスの介在により金属キャップを封止したパッケージにおいて、前記金属キャップは天板部とその周縁の立ち下がり部とを有し、前記セラミック製絶縁性ベースの枠体部の上面および周面部と、金属キャップの天板部および立ち下がり部との２面に介在した低融点ガラスで、セラミック製絶縁性ベースと金属キャップとを封止したことを特徴とするパッケージ。
【請求項２】
前記セラミック製絶縁性ベースの枠体部周面に段部を有し、前記金属キャップの立ち下がり部の下端がこの段部により位置決めされていることを特徴とする請求項１記載のパッケージ。
【請求項３】
前記セラミック製絶縁性ベースの枠体部周面に凹部を有し、前記金属キャップの立ち下がり部の下端側に舌片を設けて前記凹部に嵌合したことを特徴とする請求項１ないし２記載のパッケージ。
【請求項４】
前記舌片は前記立ち下がり部の対向する下端側に設けた屈曲部を有する複数個の舌片であり、その屈曲部が前記セラミック製絶縁性ベースの凹部に嵌合させたことを特徴とする請求項３に記載のパッケージ。
【請求項５】
前記セラミック絶縁性ベースの枠体部周面に形成された凹部から前記セラミック製絶縁性ベースの底板部裏面側に接地用導電層および端子部を設け、前記金属キャップの舌片を前記接地用の導電層に接触させたことを特徴とする請求項３に記載のパッケージ。
[Claims]
[Claim 1]
In a package in which a metal cap is sealed by interposing a low melting point glass on a ceramic insulating base having a bottom plate portion and a frame portion , the metal cap has a top plate portion and a falling portion on the periphery thereof, and the ceramic. The ceramic insulating base and the metal cap were sealed with low-melting glass interposed between the upper surface and the peripheral surface of the frame portion of the insulating base and the top plate and the falling portion of the metal cap. A package that features that.
2.
The package according to claim 1, wherein a step portion is provided on the peripheral surface of the frame portion of the ceramic insulating base, and the lower end of the falling portion of the metal cap is positioned by the step portion.
3.
Claims 1 and 2, wherein the ceramic insulating base has a recess on the peripheral surface of the frame portion, and a tongue piece is provided on the lower end side of the falling portion of the metal cap to fit into the recess. The listed package.
4.
The tongue piece is a plurality of tongue pieces having a bent portion provided on the opposite lower end side of the falling portion, and the bent portion is fitted into a recess of the ceramic insulating base. The package according to claim 3.
5.
A grounding conductive layer and a terminal portion are provided on the back surface side of the bottom plate portion of the ceramic insulating base from a recess formed on the peripheral surface of the frame portion of the ceramic insulating base, and the tongue piece of the metal cap is used for grounding. The package according to claim 3, wherein the package is brought into contact with a conductive layer.
【０００７】
【課題を解決するための手段】
本発明の請求項１記載の発明は、底板部と枠体部を有するセラミック製絶縁性ベースに低融点ガラスの介在により金属キャップを封止したパッケージにおいて、前記金属キャップは天板部とその周縁の立ち下がり部とを有し、前記セラミック製絶縁性ベースの枠体部の上面および周面部と、金属キャップの天板部および立ち下がり部との２面に介在した低融点ガラスで、セラミック製絶縁性ベースと金属キャップとを封止したことを特徴とするパッケージである。上記のパッケージによれば、絶縁性ベースの上面および周面と、カップ状の金属キャップの天板部下面および立ち下がり部内面との２面により封止されているので、耐外部衝撃性が大きくなるのみならず、絶縁ベースはその上面に凹溝等は形成しないので、機械的強度は大きく、しかも絶縁性ベースの厚さは何ら変更しないので、気密性の確保も容易確実になる。
0007
[Means for solving problems]
The invention according to claim 1 of the present invention is a package in which a metal cap is sealed by interposing a low melting point glass on a ceramic insulating base having a bottom plate portion and a frame portion, and the metal cap is the top plate portion and its peripheral edge. A low-melting glass that has a falling portion and is interposed on two surfaces of the upper surface and the peripheral surface portion of the frame portion of the ceramic insulating base and the top plate portion and the falling portion of the metal cap, and is made of ceramic. It is a package characterized by sealing an insulating base and a metal cap. According to the above package, since it is sealed by two surfaces, the upper surface and the peripheral surface of the insulating base, and the lower surface of the top plate portion and the inner surface of the falling portion of the cup-shaped metal cap, the external impact resistance is large. Not only that, since the insulating base does not form a groove or the like on the upper surface thereof, the mechanical strength is high, and the thickness of the insulating base is not changed at all, so that the airtightness can be easily ensured.
本発明の請求項２記載の発明は、前記セラミック製絶縁性ベースの枠体部周面に段部を有し、前記金属キャップの立ち下がり部の下端がこの段部により位置決めされていることを特徴とする請求項１記載のパッケージである。上記のパッケージによれば、前記段部により、金属キャップの位置決めができ、絶縁性ベースの上面と金属キャップの天板部下面との間に適正な間隔寸法を確保することができ、したがって適正な低融点ガラス量を確保できて、封止部に十分な機械的強度と、気密性とを得ることができる。
The invention according to claim 2 of the present invention has a step portion on the peripheral surface of the frame portion of the ceramic insulating base, and the lower end of the falling portion of the metal cap is positioned by this step portion. The package according to claim 1, which is a feature. According to the above package, the stepped portion allows positioning of the metal cap and ensures an appropriate spacing dimension between the upper surface of the insulating base and the lower surface of the top plate portion of the metal cap, and thus is appropriate. The amount of low melting point glass can be secured, and sufficient mechanical strength and airtightness can be obtained for the sealing portion.
本発明の請求項３記載の発明は、前記セラミック製絶縁性ベースの枠体部周面に凹部を有し、前記金属キャップの立ち下がり部の下端側に舌片を設けて前記凹部に嵌合したことを特徴とする請求項１ないし２記載のパッケージである。上記のパッケージによれば、金属キャップの舌片が絶縁性ベースの凹部に嵌合されているので、耐外部衝撃性をより向上できる。
The invention according to claim 3 of the present invention has a recess on the peripheral surface of the frame portion of the ceramic insulating base, and a tongue piece is provided on the lower end side of the falling portion of the metal cap to fit into the recess. claims 1, characterized in that the to a package 2, wherein. According to the above package, since the tongue piece of the metal cap is fitted in the recess of the insulating base, the external impact resistance can be further improved.
本発明の請求項４記載の発明は、前記舌片は前記立ち下がり部の対向する下端側に設けた屈曲部を有する複数個の舌片であり、その屈曲部が前記セラミック製絶縁性ベースの凹部に嵌合させたことを特徴とする請求項３に記載のパッケージである。上記のパッケージによれば、前述と同様の作用効果が得られるのみならず、舌片の屈曲部が絶縁性ベースの凹部に嵌合されることにより、ストレート状の舌片の場合に比較して、かしめ加工を省略できる。
According to the fourth aspect of the present invention, the tongue piece is a plurality of tongue pieces having a bent portion provided on the opposite lower end side of the falling portion, and the bent portion is made of the ceramic insulating base. The package according to claim 3, wherein the package is fitted in a recess. According to the above package, not only the same action and effect as described above can be obtained, but also the bent portion of the tongue piece is fitted into the concave portion of the insulating base, so that the case of the straight tongue piece is compared with the case of the straight tongue piece. , Caulking can be omitted.
なお、前記金属キャップの舌片の屈曲部が、封止前の状態で、前記立ち下がり部よりも金属キャップの中心軸方向に凹入し、その弾性力で前記絶縁性ベースの凹部に嵌合させることで、舌片の屈曲部がその弾性力で絶縁性ベースの凹部に嵌合する。
The bent portion of the tongue piece of the metal cap is recessed in the direction of the central axis of the metal cap from the falling portion in the state before sealing, and is fitted into the recess of the insulating base by its elastic force. By allowing the tongue piece to be bent, the bent portion of the tongue piece is fitted into the recess of the insulating base by its elastic force.
本発明の請求項５記載の発明は、前記セラミック絶縁性ベースの枠体部周面に形成された凹部から前記セラミック製絶縁性ベースの底板部裏面側に接地用導電層および端子部を設け、前記金属キャップの舌片を前記接地用の導電層に接触させたことを特徴とする請求項３に記載のパッケージである。上記のパッケージによれば、金属キャップを接地することができ、外来電磁波や浮遊容量に起因する電子素子の特性変動を防止できる。しかも、高価な導電性の低融点ガラスを必要としないので、原価低減が図れる。
In the invention according to claim 5 of the present invention, a grounding conductive layer and a terminal portion are provided on the back surface side of the bottom plate portion of the ceramic insulating base from a recess formed on the peripheral surface of the frame portion of the ceramic insulating base. The package according to claim 3, wherein the tongue piece of the metal cap is brought into contact with the conductive layer for grounding . According to the above package, the metal cap can be grounded, and fluctuations in the characteristics of the electronic device due to external electromagnetic waves and stray capacitance can be prevented. Moreover, since it does not require expensive conductive low melting point glass, cost reduction can be achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26674799A JP4093519B2 (en) | 1999-09-21 | 1999-09-21 | package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26674799A JP4093519B2 (en) | 1999-09-21 | 1999-09-21 | package |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001093998A JP2001093998A (en) | 2001-04-06 |
| JP2001093998A5 true JP2001093998A5 (en) | 2006-10-12 |
| JP4093519B2 JP4093519B2 (en) | 2008-06-04 |
Family
ID=17435158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26674799A Expired - Fee Related JP4093519B2 (en) | 1999-09-21 | 1999-09-21 | package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4093519B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5646234B2 (en) * | 2010-07-21 | 2014-12-24 | 日本電波工業株式会社 | Method for manufacturing piezoelectric device |
| JP6394161B2 (en) | 2014-08-06 | 2018-09-26 | 日亜化学工業株式会社 | Light emitting device and light source module |
| CN117374014B (en) * | 2023-12-07 | 2024-03-08 | 潮州三环（集团）股份有限公司 | Packaging base and preparation method thereof |
-
1999
- 1999-09-21 JP JP26674799A patent/JP4093519B2/en not_active Expired - Fee Related
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