JPS6040704B2 - Semiconductor device package - Google Patents
Semiconductor device packageInfo
- Publication number
- JPS6040704B2 JPS6040704B2 JP52154448A JP15444877A JPS6040704B2 JP S6040704 B2 JPS6040704 B2 JP S6040704B2 JP 52154448 A JP52154448 A JP 52154448A JP 15444877 A JP15444877 A JP 15444877A JP S6040704 B2 JPS6040704 B2 JP S6040704B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- cap
- semiconductor device
- adhesive
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
【発明の詳細な説明】 本発明は半導体装置のパッケージ構造の改良に関する。[Detailed description of the invention] The present invention relates to improvements in the package structure of semiconductor devices.
パッケージのベース部とキャップ部とをグラスフリット
等の接着剤ではり合わせてパッケージを形成する、いわ
ゆるグラスフリットシール型のパッケージは、落下など
の衝撃に対してシール強度が比較的弱い欠点があった。
本発明は上述の如き従来の欠点を解消する目的でなされ
たもので、パッケージキャップのシール予定部の端緑形
状に適宜の凹凸をもたせるか又は該シール部に孔を設け
たことを特徴とするものである。即ち、従来のパッケー
ジキャップのシール予定部の端縁形状は単純な円形とか
四辺形をなしており、シール予定部は単純な平面になっ
ていたものであるが、本発明の如く端縁形状を適宜な凹
凸のある形状とするかシール予定部に孔を設けることに
よって、パッケージベースとキャップとの間に形成され
る接着剤のミニスカスの領域を増大せしめることができ
、実効的な接着面積を大さしてやることができる。The so-called glass frit seal type package, in which the package base and cap are glued together with an adhesive such as glass frit, has the disadvantage that the seal strength is relatively weak against shocks such as drops. .
The present invention has been made to solve the above-mentioned drawbacks of the conventional technology, and is characterized in that the green shape of the sealing area of the package cap has an appropriate unevenness or a hole is provided in the sealing area. It is something. That is, the edge shape of the sealing area of conventional package caps was a simple circle or quadrilateral, and the sealing area was a simple plane, but the present invention has a shape of the edge. By creating an appropriately uneven shape or providing holes in the area to be sealed, it is possible to increase the area of the adhesive miniscule formed between the package base and the cap, increasing the effective bonding area. I can do it very easily.
これによって外部からの衝撃による接着部への応力を分
散せしめることができ、パッケージの耐衝撃性を向上せ
しめることが可能となる。本発明によれば、キャップの
平面端緑形状に凹凸をもたせるか、または、キャップの
シール予定部に孔を設けることによって、キャップの接
着剤に対する接着面積を増大させているので、接着剤が
形成される封止幅（シール幅）を狭くしても充分な接着
強度を得ることができる。This makes it possible to disperse stress on the bonded portion due to external impact, thereby making it possible to improve the impact resistance of the package. According to the present invention, the adhesive area of the cap for the adhesive is increased by making the planar end of the cap have an uneven green shape or by providing a hole in the sealing area of the cap, so that the adhesive is formed. Sufficient adhesive strength can be obtained even if the sealing width (seal width) is narrowed.
これは、外形寸法が制約されているパッケージにおいて
、大きな半導体べレットを封止する場合に特に有利であ
る。また、本発明によれば、キャップの端縁部を厚さ全
体にわたって加工するものであるから、特に、キャップ
の厚さが薄い場合に加工しやすい接着構造を提供するも
のである。第１図及び第２図は本発明の一実施例になる
パッケージの構造を示し、第２図の１−１線断面は第１
図に対応するものである。This is particularly advantageous when sealing large semiconductor pellets in packages with constrained external dimensions. Furthermore, according to the present invention, since the edge portion of the cap is processed over its entire thickness, it provides an adhesive structure that is easy to process, especially when the thickness of the cap is thin. 1 and 2 show the structure of a package according to an embodiment of the present invention, and the cross section taken along the line 1-1 in FIG.
This corresponds to the figure.
これらの図において、１はパッケージベース、２はキャ
ップである。図示する如くキャップ２のシール予定部に
孔２Ａ又は凹凸部２Ｂを形成することによって、キャッ
プ２とベースーとを接着剤３、例えばガラスフリツトに
より対向面同士ではり合わせたとき、接着剤３のミニス
カス形式領域は大幅に増大して効果的に接着強度を高め
ることができる。上述の如く、本発明によれば簡単な構
成によって半導体装置の耐衝撃性、シール強度を高める
ことができ、本発明の工業的効果は極めて大である。In these figures, 1 is a package base and 2 is a cap. By forming holes 2A or uneven portions 2B in the sealing portion of the cap 2 as shown in the figure, when the cap 2 and the base are glued together with the adhesive 3, for example, glass frit, the adhesive 3 forms a mini-scattering shape. The area can be increased significantly to effectively increase the adhesive strength. As described above, according to the present invention, the impact resistance and sealing strength of a semiconductor device can be improved with a simple configuration, and the industrial effects of the present invention are extremely large.
第１図は本発明の−実施例によるパッケージ機造の断面
図、第２図は第１図のパッケージの上面図である。
１……パッケージベース、２……パッケージキャップ、
２Ａ……孔、２Ｂ・・・・・・凹凸部。
菟１図涼２図FIG. 1 is a sectional view of a package structure according to an embodiment of the present invention, and FIG. 2 is a top view of the package of FIG. 1. 1...Package base, 2...Package cap,
2A... Hole, 2B... Uneven part. Figure 1 Ryo Figure 2
Claims (1)
はり合わせる構造の半導体装置のパツケージにおいて、
キヤツプのシール予定部の平面端縁形状を凹凸状にする
か、該シール予定部に孔を設けたことを特徴とする半導
体装置のパツケージ。1. In a semiconductor device package having a structure in which the package base and the peripheral edge of the cap are glued together,
1. A package for a semiconductor device, characterized in that a planar edge of a portion of a cap to be sealed is made uneven, or a hole is provided in the portion to be sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52154448A JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52154448A JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5487183A JPS5487183A (en) | 1979-07-11 |
| JPS6040704B2 true JPS6040704B2 (en) | 1985-09-12 |
Family
ID=15584423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52154448A Expired JPS6040704B2 (en) | 1977-12-23 | 1977-12-23 | Semiconductor device package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6040704B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06221005A (en) * | 1993-01-27 | 1994-08-09 | Seiko Sangyo Kk | Household toilet space unit |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133640U (en) * | 1984-02-13 | 1985-09-06 | 三菱電機株式会社 | Hollow package for semiconductor devices |
| JPS6129155A (en) * | 1984-07-19 | 1986-02-10 | Fujitsu Ltd | Semiconductor device |
-
1977
- 1977-12-23 JP JP52154448A patent/JPS6040704B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06221005A (en) * | 1993-01-27 | 1994-08-09 | Seiko Sangyo Kk | Household toilet space unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5487183A (en) | 1979-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6040704B2 (en) | Semiconductor device package | |
| KR880008446A (en) | Lead frame and manufacturing method | |
| JPH0470752U (en) | ||
| JPS62261157A (en) | Package for semiconductor device | |
| JPH0328739U (en) | ||
| JP2841831B2 (en) | Chip carrier | |
| JPS60190041U (en) | flat package | |
| JPH0373444U (en) | ||
| JPH02131344U (en) | ||
| JPS5918350U (en) | display tube envelope | |
| JPS614251A (en) | Semiconductor package | |
| JPS60186042A (en) | Ceramic package | |
| JPS63288029A (en) | Resin-sealed semiconductor device | |
| JPS6156760U (en) | ||
| JPS6112241U (en) | flat package | |
| JPH01177609U (en) | ||
| JPS6042619B2 (en) | semiconductor equipment | |
| JPS607384B2 (en) | Glass-sealed semiconductor device | |
| JPH0310622U (en) | ||
| JPH0472224U (en) | ||
| JPS60190044U (en) | flat package | |
| JPS6179540U (en) | ||
| JPS6142845U (en) | flat package | |
| JPS61143142U (en) | ||
| JPH0180473U (en) |