JP2001053202A - Heat sink for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink for electronic parts whose, being excellent in heat radiation, main material is a copper plate having a heat conductivity about 1.5 times the aluminum material and which assures a heat radiation area corresponding to the heating amount of the small and light electronic parts. SOLUTION: With a copper plate 1 of good heat conductivity as a main material, the inside is a flat surface 1a for tightly jointing to the outside surface of an electronic part E, and the outside wavy in all directions is an embossed surface 1b. The copper plate 1 is about 0.5-2 mm in thickness for a small electronic part such as a laminated chip. Related to a heat sink, a double-sided adhesive tape 3 of good thermal conductivity using a thermo-setting adhesive is provided on the flat surface 1a of the inside for tightly joining to the outside surface of the electronic part. With the double-sided adhesive tape 2 provided, peeling of a cover film (not shown in the Fig.) on one side allows easy and sure joint to the outside surface of the electronic part E while a good thermal conductivity is kept as a heat sink.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a heat sink for electronic components provided for dissipating heat generated from semiconductor chips and other electronic components.

[0002]

2. Description of the Related Art In order to dissipate heat generated from semiconductor chips and other electronic components, various heat sinks having various shapes or structures made of a thermally conductive aluminum or copper plate have been proposed. ing.

As the heat sink for electronic parts, the heat generation area corresponding to the heat generation amount of the electronic parts is maintained while the heat generation amount is increased due to the high integration and high speed of the electronic equipments. Due to demands for reduction in size and weight, a small and lightweight one is desired.

[0004]

SUMMARY OF THE INVENTION The present invention is based on a copper plate material having a thermal conductivity about 1.5 times that of an aluminum material as a main material, and is small in size and light in weight but suitable for the amount of heat generated from electronic components. An object of the present invention is to provide a heat sink for electronic components that can secure a heat radiation area and has excellent heat dissipation.

Another object of the present invention is to provide a heat sink for electronic parts which can be used for other purposes with a simple structure due to the ease of processing or molding of a copper plate material.

Another object of the present invention is to provide a heat sink for electronic components which can be easily and reliably joined to the outer surface of the electronic component while maintaining good thermal conductivity.

[0007]

According to a first aspect of the present invention, there is provided a heat sink for an electronic component, which is made of a copper plate having good thermal conductivity, and whose inner surface is in close contact with and joined to the outer surface of the electronic component. The outer surface side is formed on a wavy embossed surface that is continuous in all directions.

The electronic component heat sink according to a second aspect of the present invention is configured such that the outer surface is formed on the embossed surface by undulation of a curved surface that is continuous in all directions.

The electronic component heat sink according to the third aspect of the present invention is formed by forming the inner surface of the heat sink into a rectangular plate which is closely contacted with and joined to the flat outer surface of the electronic component.

According to a fourth aspect of the present invention, there is provided a heat sink for an electronic component, the inner surface of which is joined to the outer surface of the electronic component to form a cap that also serves as a shield that covers the electronic component.

In a heat sink for electronic parts according to a fifth aspect of the present invention, a double-sided pressure-sensitive adhesive tape made of a thermosetting pressure-sensitive adhesive having good heat conductivity is provided on an inner surface of the electronic part which is brought into close contact with the outer surface of the electronic part. It is constituted by.

Hereinafter, description will be made with reference to the accompanying drawings.
As shown in FIG. 1, the heat sink for an electronic component according to the illustrated embodiment is mainly composed of a copper plate material 1 having good thermal conductivity, and has a flat surface 1 to which an inner surface is closely contacted with an outer surface of the electronic component E and joined.
a, and the outer surface is formed on a wavy embossed surface 1b which is continuous in all directions.

As the copper plate material 1, in the case of a small electronic component such as a laminated chip, one having a plate thickness of about 0.5 to 2 mm is used. Further, a copper plate material 1 having good thermal conductivity is used as a main material, and a nickel plating film 2 is
It is preferable to impart rust prevention by forming the layer with a thickness of about μ.

The heat sink is preferably provided with a double-sided pressure-sensitive adhesive tape 3 made of a thermosetting pressure-sensitive adhesive having good thermal conductivity, on the flat surface 1a on the inner surface side which is brought into close contact with and joined to the outer surface of the electronic component. When the double-sided adhesive tape 2 is provided, if the cover film (not shown) on one side is peeled off, good heat conductivity as a heat sink can be maintained and the electronic component E can be easily and reliably joined to the outer surface.

The heat sink is a strip-shaped continuous copper plate.
After the outer surface of the (original plate) is press-formed or roll-formed into an embossed shape, the double-sided adhesive tape 3 is provided on the inner surface and cut according to the size of the electronic component E. As the embossed surface 1b, it is preferable that the embossed surface 1b is formed so as to be formed on the undulation of a curved surface that is continuous in four directions. By the embossed surface 1b, the area of the outer surface serving as the heat radiation surface can be secured about 20 to 30% larger than the flat surface.

As the embossed shape, in addition to the undulation of the curved surface, a trapezoid as shown in FIGS. 2a and 2b, a rhombus as shown in FIGS. 3a and 3b, an elliptical shape as shown in FIGS. 4a and 4b, FIG. Any one of a circle as shown by 5b, a triangular pyramid as shown in FIGS. 6a and 6b, and the like can be adopted.

As an example of its use, as shown in FIG. 7, it can be formed into a rectangular plate whose inner surface is brought into close contact with and joined to the flat outer surface of the electronic component E with a double-sided adhesive tape 3. This heat sink is made mainly of a copper plate material with a thermal conductivity about 1.5 times that of aluminum material, and it is small and lightweight, but it can secure a heat radiation area commensurate with the amount of heat generated by electronic components The electronic component E can be provided as an excellent component.

In addition to the square plate, as shown in FIG. 8, the inner surface can be joined to the outer surface of the electronic component E by a double-sided adhesive tape 3 to form a cap that also serves as a shield that covers the electronic component E. . This heat sink is obtained by cutting the heat sink into a rectangular shape as described above, and then press-molding the heat sink into a rectangular three-dimensional shape having an open bottom surface.

The heat sink can not only secure a wide heat dissipation area by the cap body but also serve as a shield for electronic components. The size of the cap body can be set as required so that the bottom surface is grounded to the plate surface of the circuit board P or a certain gap is left therebetween.

[0020]

As described above, according to the heat sink for electronic parts according to the first aspect of the present invention, the heat sink is made of a copper plate having good thermal conductivity, and the inner surface is brought into close contact with the outer surface of the electronic part and joined. Since the outer surface side is formed as a wavy embossed surface that is continuous in all directions, a heat radiation area commensurate with the amount of heat generated from the electronic component can be ensured while being small and lightweight.

According to the heat sink for electronic parts according to the second aspect of the present invention, since the embossed surface is formed into a wavy shape that is continuous in all directions due to the undulation of the curved surface, the area of the outer surface serving as the heat radiation surface can be increased. It can be secured large.

According to the heat sink for electronic parts according to the third aspect of the present invention, by forming the inner surface side into a rectangular plate which is brought into close contact with and joined to the flat outer surface of the electronic part, the electronic part is small and lightweight. A heat radiation area commensurate with the amount of heat generated from the parts can be secured, and the heat dissipation can be excellent.

According to the heat sink for electronic components according to the fourth aspect of the present invention, the heat dissipation area can be reduced by joining the inner surface to the outer surface of the electronic component and forming the cap as a shield covering the electronic component. Not only can it be widely secured,
It can be configured so that it can be used for a variety of purposes as a shield for electronic components.

According to the heat sink for electronic parts according to the fifth aspect of the present invention, the double-sided pressure-sensitive adhesive tape made of a thermosetting pressure-sensitive adhesive having good thermal conductivity is brought into intimate contact with the outer surface of the electronic part, and the inner side is joined. , It is possible to easily and surely join the electronic component to the outer surface while maintaining good thermal conductivity.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a structure of a heat sink for electronic components according to the present invention.

FIG. 2a is a plan view showing an example of an embossed shape that can be employed in the heat sink for electronic components according to the present invention.

FIG. 2b is a side view showing the embossed shape of FIG. 2a.

FIG. 3a is a plan view showing another example of an embossed shape that can be employed in the heat sink for electronic components according to the present invention.

FIG. 3b is a side view showing the embossed shape of FIG. 3a.

FIG. 4a is a plan view showing another example of an embossed shape that can be employed in the heat sink for electronic components according to the present invention.

FIG. 4b is a side view showing the embossed shape of FIG. 4a.

FIG. 5a is a plan view showing another example of an embossed shape that can be employed in the heat sink for electronic components according to the present invention.

FIG. 5b is a depression perspective view showing the embossed shape of FIG. 5a.

FIG. 6A is a plan view showing another example of an embossed shape that can be employed in the heat sink for electronic components according to the present invention.

FIG. 6b is a side view showing the embossed shape of FIG. 3a.

FIG. 7 is a perspective view showing a heat sink for an electronic component according to an example of the present invention attached to the electronic component.

FIG. 8 is a cross-sectional view showing a heat sink for an electronic component according to another example of the present invention attached to the electronic component.

[Explanation of symbols]

 Reference Signs List 1 copper plate material 1a flat inner surface side 1b wavy embossed surface 2 double-sided adhesive tape E electronic component

Claims (5)

[Claims] 1. An inner surface of a copper plate having good thermal conductivity, the inner surface of which is a flat surface which is brought into close contact with the outer surface of an electronic component, and the outer surface of which is shaped into a wavy emboss surface which is continuous in all directions. A heat sink for electronic components, comprising: 2. An electronic component heat sink according to claim 1, wherein the outer surface side is formed on the embossed surface by undulation of a curved surface that is continuous in all directions. 3. The heat sink for an electronic component according to claim 1, wherein the inner surface side is formed in a rectangular plate which is closely contacted with and joined to a flat outer surface of the electronic component. 4. The heat sink for an electronic component according to claim 1, wherein the inner surface side is joined to the outer surface of the electronic component to form a cap that also serves as a shield that covers the electronic component. 5. The electronic device according to claim 1, wherein a double-sided pressure-sensitive adhesive tape made of a thermosetting pressure-sensitive adhesive having good thermal conductivity is provided on an inner surface of the electronic component, which is in close contact with and bonded to an outer surface of the electronic component.
The heat sink for electronic components according to any one of the above.