TWM645281U - Heterogeneous junction thermal conductivity structure - Google Patents

Abstract

This invention provides a heterogeneous joint thermal conductive structure, which is arranged between a heating body and a heat sink. The heterogeneous joint thermal conductive structure includes a thermal conductive colloid and a metal coating layer. The metal coating layer covers the thermally conductive colloid, and the thickness of the metal coating layer is less than 100 μm; wherein, the thermally conductive colloid covered with the metal coating layer is placed between the heating element and the heat sink, so that the heating element can penetrate through the metal coating layer. The heat energy is transferred to the thermally conductive colloid, which transfers the heat energy to the heat sink through the metal coating layer. The heat energy of the heating element is also directly transferred to the heat sink through the metal coating layer. In this way, this creation uses a metal coating with high thermal conductivity and ductility to improve the overall thermal conductivity and elasticity, allowing the creation to be compressed or expanded, and can be placed in the narrow gap between the heating body and the heat sink. .

Description

Heterogeneous joint thermal conductive structure

The invention relates to a thermal conductive structure, in particular to a heterogeneous joint thermal conductive structure.

Generally, electronic components generate a large amount of heat energy during operation or work, and electronic components usually dissipate heat through heat sinks (such as heat dissipation fins) to prevent large amounts of heat from damaging the electronic components. However, effective heat dissipation cannot be achieved due to the gap between the electronic components and the heat sink. Therefore, the current practice is to use thermal paste to fill the space between the electronic components and the heat sink, thereby filling the gaps and increasing the thermal conductivity effect.

However, the method of using thermal paste can only be used when the gap between the electronic component and the heat sink is relatively small. If there is a considerable distance between the electronic component and the heat sink, or the area of the electronic component is large, further, or the electronic component Due to its non-planar shape, thermal paste cannot effectively function in such a situation, and there is a need for improvement.

The main purpose of this case is to solve the problems of low versatility and low thermal conductivity of traditional thermal paste as a heat dissipation medium.

To achieve the above purpose, one embodiment of the present invention provides a heterogeneous joint thermally conductive structure, which is disposed between a heating body and a heat sink. The heterogeneous joint thermally conductive structure includes a thermally conductive colloid and a metal coating layer. The metal coating layer covers the thermally conductive colloid, and the thickness of the metal coating layer is less than 100 μm; wherein, the thermally conductive colloid covered with the metal coating layer is placed between the heating element and the heat sink, so that the heating element can penetrate through the metal coating layer. The heat energy is transferred to the thermally conductive colloid, which transfers the heat energy to the heat sink through the metal coating layer. The heat energy of the heating element is also directly transferred to the heat sink through the metal coating layer.

In this way, this creation improves the overall thermal conductivity of the heterogeneous jointed thermally conductive structure and improves the overall elasticity of the heterogeneous jointed thermally conductive structure by covering the metal coating with high thermal conductivity and high ductility in thermally conductive colloid. The entire heterogeneous joint thermal conductive structure can be compressed or expanded, and can be placed in a narrow gap between the heating body and the heat sink.

In order to facilitate the explanation of the central idea expressed in the above creative content column of this creation, specific embodiments are hereby expressed. Various objects in the embodiments are drawn according to proportions suitable for enumeration and description, rather than according to the proportions of actual components, and will be described first.

Please refer to FIG. 1 to FIG. 2 , which is a first embodiment of the heterogeneous bonding thermal conductive structure 100 of the present invention. The heterogeneous joint thermally conductive structure 100 is disposed between a heating body 200 and a heat sink 300 . The heterogeneous joint thermally conductive structure 100 includes a thermally conductive colloid 10 and a metal coating layer 20 . The heating body 200 can be a central processing unit (CPU), an operational amplifier, a transformer, a circuit board, a power amplifier and other electronic components that generate heat. The heat sink 300 can be a cooling fin, a chassis or other heat dissipation mechanism. The heating body 200 The thermal energy can be conducted to the heat sink 300 through the heterojunction thermally conductive structure 100 . In addition, taking an electric vehicle as an example, the heating element 200 can be an electronic component that generates heat, such as an inverter or a rectifier, and the heat sink 300 can be a vehicle shell.

Thermal conductive colloid 10 has a thickness H1. There is a linear distance H2 between the heating element 200 and the heat sink 300. The thickness H1 is greater than the linear distance H2. As shown in Figures 1 and 2, in this embodiment, the material of the thermally conductive colloid 10 is silicone mixed with thermally conductive powder. Since the thermally conductive colloid 10 is an elastic material and the thickness H1 of the thermally conductive colloid 10 is greater than the linear distance H2, Therefore, the heterogeneous joint thermally conductive structure 100 can be stably sandwiched between the heating element 200 and the heat sink 300, and the heterogeneous joint thermally conductive structure 100 can be completely attached to the heating element 200 and the heat sink 300, thereby preventing heat conduction due to air. The problem of reduced effectiveness.

In the preferred embodiment of this invention, the thickness H1 of the thermally conductive glue 10 is between 1.1 times and 2 times the linear distance H2. Therefore, when the heterogeneous joint thermally conductive structure 100 is stuck between the heating element 200 and the heat sink 300 , the heterogeneous joint thermally conductive structure 100 can be stably stuck without falling off between the heating element 200 and the heat sink 300 , and when the user wants to take out the heterogeneous joint thermally conductive structure 100 from between the heating element 200 and the heat sink 300 , the heterogeneous joint thermally conductive structure 100 will not be difficult to take out due to excessive thickness.

The metal coating layer 20 covers the thermally conductive colloid 10 , and the thermally conductive colloid 10 covered with the metal coating layer 20 is located between the heating element 200 and the heat sink 300 . In this embodiment, the material of the metal coating layer 20 can be silver, gold, copper, aluminum or an alloy containing the above materials. In this embodiment, a material with a high thermal conductivity (both greater than 200W/m·K) is selected. The metal material used as the material of the metal cladding layer 20 can effectively improve the overall thermal conductivity of the heterogeneous joint thermal conductive structure 100, and quickly conduct the thermal energy of the heating element 200 to the heat sink 300 through the heterogeneous joint thermal conductive structure 100.

In the first embodiment of the present invention, the metal coating layer 20 is coated on the periphery of the thermal conductive colloid 10 by adhesion or sputtering, and the material of the metal coating layer 20 is a highly ductile metal. The coating layer 20 can completely cover the thermally conductive colloid 10, preventing the gap between the metal coating layer 20 and the thermally conductive colloid 10 from causing the problem of reduced thermal conductivity. Moreover, when the heterogeneous joint thermally conductive structure 100 is stuck on the heating element 200 and dissipates heat, When between the bodies 300, since the material of the metal cladding layer 20 has high ductility, when the thermally conductive colloid 10 deforms, the metal cladding layer 20 can also deform along with the thermally conductive colloid 10, so that the heterogeneous bonded thermally conductive structure 100 The whole body can be reliably clamped between the heating element 200 and the heat sink 300 , and the probability of the metal coating layer 20 being damaged by the heating element 200 or the heat sink 300 is reduced.

In the first embodiment of the invention, the thickness of the metal cladding layer 20 is less than 100 μm; in the preferred embodiment of the invention, the thickness of the metal cladding layer 20 is between 6 μm and 35 μm. Among them, if the thickness of the metal cladding layer 20 is less than 6 μm, the hardness of the metal cladding layer 20 will be too low, causing the metal cladding layer to 20 is easily damaged by the heating element 200 or the heat sink 300 .

As shown in FIGS. 1 and 2 , in the first embodiment of the present invention, the thermal energy of the heating element 200 can be transferred to the thermal conductive colloid 10 through the metal cladding layer 20 , and the thermal conductive colloid 10 can transmit the thermal energy through the metal cladding layer 20 to the heat sink 300; on the other hand, the thermal energy of the heating element 200 can also be directly transferred to the heat sink 300 along the periphery of the thermal conductive colloid 10 through the metal coating layer 20, because the thermal conductivity coefficient of the metal coating layer 20 is much higher than Thermal conductive colloid 10 can also effectively and quickly achieve the thermal conductivity effect by directly conducting heat to the heat sink 300 through the metal coating layer 20 . In this way, the heterogeneous joint thermal conductive structure 100 can quickly conduct the thermal energy of the heating element 200 to the heat sink 300 along two paths (arrow directions in FIG. 2 ), so as to achieve the purpose of rapid heat dissipation of the heating element 200 .

As shown in FIG. 3 , it is the second embodiment of the heterogeneous joint thermal conductive structure 100 of the present invention. The same component numbers in the second embodiment as those in the first embodiment represent the same components, structures and functions, and therefore will not be described again. The heterogeneous joint thermally conductive structure 100 further includes an insulating layer 30 . The insulating layer 30 covers a side surface of the metal cladding layer 20 away from the thermally conductive glue 10 . The material of the insulating layer 30 is selected from polyethylene terephthalates (PET), polyethylene naphthalate (PEN), polyimide (PI), A group consisting of biaxially oriented polypropylene (BOPP), uniaxially oriented polypropylene (MOPP) and polyetheretherketone (PEEK), the thermal conductivity of the insulating layer 30 is between 0.01~10W/m·K, and the thickness of the insulating layer 30 is between 2~250 μm. Thereby, when the heating element 200 is in the working state, the heterogeneous joint thermal conductive structure 100 can prevent the electric power generated by the heating element 200 from being transmitted to the heat sink 300 through the insulating layer 30, thereby avoiding accidents due to electric leakage.

In addition, in other embodiments of the present invention, the insulating layer 30 can be formed solely on the side surface of the metal cladding layer 20 close to the heating element 200 , or can be formed on both sides of the metal cladding layer 20 close to the heating element 200 and the heat sink 300 . side surface, so that the insulating layer 30 can reduce the process time of the insulating layer 30 and improve the overall process efficiency of the heterojunction thermally conductive structure 100 while maintaining the insulating function.

As shown in FIG. 4 , it is the third embodiment of the heterogeneous joint thermal conductive structure 100 of the present invention. The same component numbers in the third embodiment as those in the first embodiment represent the same components, structures and functions, and therefore will not be described again. The heterogeneous joint thermal conductive structure 100 further includes a graphite heat dissipation layer 40, which is composed of pure graphite. The graphite heat dissipation layer 40 is coated on the side surface of the metal coating layer 20 away from the thermal conductive colloid 10. The thickness of the graphite heat dissipation layer 40 is between 0.005 μm to 10 μm, and the thermal conductivity of the graphite heat dissipation layer 40 is 800~1800W/m·K. Thereby, the heterogeneous joint thermal conductive structure 100 can further improve the thermal conductivity efficiency through the graphite heat dissipation layer 40 with high thermal conductivity, thereby quickly conducting the thermal energy of the heating element 200 to the heat dissipation body 300, so as to achieve rapid heat dissipation of the heating element 200. Purpose.

As shown in FIG. 5 , it is the fourth embodiment of the heterogeneous joint thermal conductive structure 100 of the present invention. The same component numbers in the third embodiment as in the second embodiment represent the same components, structures and functions, and therefore will not be described again. In the fourth embodiment of the present invention, the insulating layer 30 in the second embodiment can also be coated on the side surface of the graphite heat dissipation layer 40 away from the metal coating layer 20, so that when the heating element 200 is in the working state, The heterogeneous joint thermally conductive structure 100 can prevent the electric power generated by the heating element 200 from being transmitted to the heat sink 300 through the insulating layer 30, thereby avoiding accidents due to electric leakage.

Thus, this creation has the following advantages:

1. This invention improves the overall thermal conductivity of the heterogeneous joint thermally conductive structure 100 by covering the metal coating layer 20 with high thermal conductivity and high ductility in the thermally conductive colloid 10, and improves the overall thermal conductivity of the heterogeneous jointed thermally conductive structure 100. The elasticity allows the entire heterojunction thermally conductive structure 100 to be compressed or expanded, and can be disposed in a narrow gap between the heating element 200 and the heat sink 300 .

2. This invention can further improve the thermal conductivity of the heterojunction thermal conductive structure 100 through the graphite heat dissipation layer 40 with higher thermal conductivity.

3. The insulating layer 30 of this invention can prevent the electric power generated by the heating element 200 from being transmitted to the heat sink 300 when the heating element 200 is in working condition, thereby avoiding accidents due to electric leakage.

Although this creation is illustrated with a best embodiment, those skilled in this art can make various changes in various forms without departing from the spirit and scope of this creation. The above embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. All modifications or changes that do not violate the spirit of this creation are within the scope of the patent application for this creation.

100:Heterogeneous joint thermal conductive structure

200: Heating element

300: Radiator

10: Thermal conductive colloid

20:Metal cladding

30:Insulation layer

40:Graphite heat dissipation layer

H1:Thickness

H2: Straight line spacing

[Figure 1] is a schematic structural diagram of the heterogeneous joint thermal conductive structure of the first embodiment of the present invention. [Figure 2] is a schematic diagram of the implementation state of the heterogeneous joint thermally conductive structure of the first embodiment of the present invention, which is used to show that the heterogeneous jointed thermally conductive structure is sandwiched between the heating body and the heat sink, and the heterogeneous jointed thermally conductive structure is in an extruded state . [Figure 3] is a schematic structural diagram of a heterogeneous joint thermal conductive structure according to the second embodiment of the present invention. [Figure 4] is a schematic structural diagram of a heterogeneous joint thermal conductive structure according to the third embodiment of the present invention. [Figure 5] is a schematic structural diagram of a heterogeneous joint thermal conductive structure according to the fourth embodiment of the present invention.

100:Heterogeneous joint thermal conductive structure

10: Thermal conductive colloid

20:Metal cladding

H1:Thickness

Claims (12)

A heterogeneous joint thermal conductive structure, which is provided between a heating body and a heat sink. The heterogeneous joint thermal conductive structure includes: a thermal conductive colloid; and a metal coating layer covering the thermal conductive colloid, and the metal coating layer The thickness is less than 100 μm; wherein, the thermally conductive colloid covered with the metal coating layer is disposed between the heating element and the heat sink, so that the heating element transmits thermal energy to the thermally conductive colloid through the metal coating layer, and the Thermal conductive colloid transfers thermal energy to the heat sink through the metal coating layer, and the thermal energy of the heating element is also directly transferred to the heat sink through the metal coating layer. The heterogeneous joint thermally conductive structure as claimed in claim 1, wherein the thermally conductive colloid has a thickness, there is a linear spacing between the heating element and the heat sink, and the thickness is greater than the linear spacing. The heterogeneous joint thermally conductive structure as claimed in claim 2, wherein the thickness is between 1.1 times and 2 times the straight line spacing. The heterogeneous joint thermally conductive structure as claimed in claim 1, wherein the thermally conductive colloid is made of silicone mixed with thermally conductive powder. The heterojunction thermally conductive structure as claimed in claim 1, wherein the thickness of the metal cladding layer is between 6 μm and 35 μm. The heterogeneous joint thermally conductive structure as claimed in claim 1, wherein the metal coating layer is coated on the periphery of the thermally conductive colloid by adhesion or sputtering. The heterogeneous joint thermally conductive structure of claim 1, wherein the material of the metal cladding layer is selected from the group consisting of silver, gold, copper and aluminum. The heterogeneous joint thermal conductive structure as claimed in claim 1 further includes an insulating layer, the The insulating layer covers a side surface of the metal coating layer away from the thermally conductive colloid. The heterogeneous joint thermally conductive structure according to claim 8, wherein the material of the insulating layer is selected from the group consisting of polyethylene terephthalates (PET), polyethylene naphthalate (PEN) ), polyimide (PI), biaxially oriented polypropylene (Biaxially Oriented Polypropylene, BOPP), uniaxially oriented polypropylene (Monoaxially Oriented Polypropylene, MOPP) and polyetheretherketone (PEEK) group, the thermal conductivity of the insulation layer is between 0.01~10W/m. K, the thickness of the insulating layer ranges from 2 to 250 μm. The heterogeneous joint thermal conductive structure as described in claim 1 further includes a graphite heat dissipation layer, which is composed of pure graphite. The graphite heat dissipation layer covers a side surface of the metal coating layer away from the thermal conductive colloid. The graphite heat dissipation layer The thickness of the layer ranges from 0.005 μm to 10 μm. The heterogeneous joint thermal conductive structure as described in claim 10, wherein the thermal conductivity of the graphite heat dissipation layer is 800~1800W/m. K. The heterogeneous joint thermal conductive structure as claimed in claim 10, further comprising an insulating layer covering a side surface of the graphite heat dissipation layer away from the metal cladding layer, the material of the insulating layer being selected from poly-pair Polyethylene terephthalates (PET), polyethylene naphthalate (PEN), polyimide (PI), biaxially oriented polypropylene (BOPP), A group composed of uniaxially oriented polypropylene (MOPP) and polyetheretherketone (PEEK), the thermal conductivity of the insulation layer is between 0.01~10W/m. K, the thickness of the insulating layer ranges from 2 to 250 μm.

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