CN112888238B

CN112888238B - Heat dissipation framework

Info

Publication number: CN112888238B
Application number: CN201911197933.3A
Authority: CN
Inventors: 吴启荣
Original assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Current assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2023-03-21
Anticipated expiration: 2039-11-29
Also published as: CN112888238A

Abstract

The invention discloses a heat dissipation framework, which comprises: the flexible heat conducting film is arranged on the electronic element, the heat conductor comprises a first part and a second part connected with the first part, and the first part of the heat conductor is clamped in the flexible heat conducting film. The heat dissipation structure provided by the invention can improve the heat dissipation efficiency through the technical scheme that the flexible heat conduction film is arranged on the electronic element and the first part of the heat conductor is clamped on the flexible heat conduction film.

Description

Heat dissipation framework

[ technical field ] A method for producing a semiconductor device

The present invention relates to a heat dissipation structure, and more particularly, to a flexible heat dissipation structure.

[ background of the invention ]

In electronic products, when a system has a Central Processing Unit (CPU), a chip or a solid state disk with higher wattage, a heat dissipation module is required to be disposed on the system to increase the heat dissipation efficiency.

However, in the prior art, when the heat dissipation module is abutted against components such as a CPU, the pressure applied by the heat dissipation module on the electronic component cannot be evenly distributed due to the position design of the screw hole site and/or the locking point, which further causes the problem of uneven locking pressure of the heat dissipation module and the problem of heat dissipation efficiency.

Therefore, how to improve the heat dissipation efficiency of the CPU, chip or solid state disk by improving the structure design to overcome the above-mentioned defects has become one of the important issues to be solved by the industry.

[ summary of the invention ]

The present invention provides a heat dissipation structure for overcoming the drawbacks of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a heat dissipation structure, which includes: the flexible heat conducting film is arranged on the electronic element, and the heat conductor comprises a first part and a second part connected with the first part, wherein the first part of the heat conductor is clamped in the flexible heat conducting film.

The heat dissipation structure provided by the invention has the beneficial effects that the heat dissipation efficiency can be improved through the technical scheme that the flexible heat conduction film is arranged on the electronic element and the first part of the heat conductor is clamped in the flexible heat conduction film.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

[ description of the drawings ]

Fig. 1 is a perspective assembly view of a heat dissipation structure according to a first embodiment of the invention.

Fig. 2 is an exploded perspective view of the heat dissipation structure according to the first embodiment of the invention.

Fig. 3 is another exploded perspective view of the heat dissipation structure according to the first embodiment of the invention.

Fig. 4 is a further exploded perspective view of the heat dissipation structure according to the first embodiment of the invention.

Fig. 5 is a schematic cross-sectional view of the V-V section of fig. 3.

Fig. 6 is a schematic cross-sectional view of section VI-VI of fig. 1.

Fig. 7 is an enlarged view of a VII portion of fig. 6.

Fig. 8 is a schematic view of another embodiment of a heat dissipation structure according to a first embodiment of the invention.

Fig. 9 is an enlarged view of portion IX of fig. 8.

Fig. 10 is an exploded perspective view of a heat dissipation structure according to still another embodiment of the present invention.

Fig. 11 is a schematic top view illustrating a heat dissipation structure according to still another embodiment of the present invention.

Fig. 12 is a perspective assembly view of a heat dissipation structure according to a second embodiment of the invention.

Fig. 13 is an exploded perspective view of a heat dissipation structure according to a second embodiment of the invention.

FIG. 14 is a schematic cross-sectional view of the XIV-XIV section of FIG. 13.

[ detailed description ] embodiments

The following is a description of the embodiments of the present disclosure related to a "heat dissipation structure" with specific embodiments, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First, please refer to fig. 1 to 4 for a first embodiment. A first embodiment of the present invention provides a heat dissipation structure U, which includes: an electronic component 1, a flexible heat-conducting film 2 and a heat conductor 3. For example, the electronic component 1 may be disposed on a carrier P, the flexible thermal conductive film 2 may cover the electronic component 1, and the carrier P may be a circuit board. In addition, in the first embodiment of the present invention, the electronic component 1 may be a solid-state drive (SSD), in the present embodiment, the carrier P is a Printed Circuit Board (PCB), the substrate 11 of the electronic component 1 is also a PCB, the substrate 11 has Gold fingers (Gold Finger) or Edge connectors (Edge Connector) formed on one side thereof, and the Gold fingers are plugged into the carrier P through a board-to-board Connector (not shown) fixed to the carrier P. However, in other embodiments, the electronic component 1 may be another electronic module, and the present invention is not limited to the form of the electronic component 1. In addition, preferably, the heat dissipation structure U may further include a heat dissipation structure 4, the heat dissipation structure 4 may be disposed on the carrier P, the heat dissipation structure 4 may be disposed adjacent to the heat conductor 3, and the heat conductor 3 may be disposed between the electronic component 1 and the heat dissipation structure 4, so as to utilize the heat conduction property of the heat conductor 3 to transfer the heat generated by the electronic component 1 to the heat dissipation structure 4 for heat dissipation.

As mentioned above, the thermal conductor 3 may include a first portion 31 and a second portion 32 connected to the first portion 31, the first portion 31 of the thermal conductor 3 may be sandwiched in the flexible thermal conductive film 2, and the second portion 32 of the thermal conductor 3 may be disposed on the heat dissipation structure 4. For example, the Heat conductor 3 may be a Heat pipe (Heat pipe), and the Heat dissipation structure 4 may be a Heat dissipation fin made of a metal material, so that the Heat generated by the electronic component 1 is dissipated through the Heat conductor 3 and/or the Heat dissipation structure 4. In addition, preferably, a fan (not numbered) adjacent to the heat dissipation structure 4 may be further disposed on the carrier P, so as to increase the heat dissipation efficiency of the heat dissipation structure 4 by using the fan. However, it should be noted that the present invention is not limited by the above-mentioned examples.

Referring to fig. 1 to 4 and fig. 5 to 7, the flexible heat conductive film 2 may include an adhesive layer 23, a first insulating layer 21 disposed on the adhesive layer 23, a heat conductive layer 22 disposed on the first insulating layer 21, and a second insulating layer 24 disposed on the heat conductive layer 22. The flexible thermal conductive film 2 may be adhered to the electronic component 1 through the adhesive layer 23, and the first portion 31 of the thermal conductor 3 may be disposed between the thermal conductive layer 22 and the second insulating layer 24. Further, the heat conductor 3 may include a surrounding surface 30, and the surrounding surface 30 of the first portion 31 of the heat conductor 3 may be enclosed between the heat conducting layer 22 and the second insulating layer 24. It should be noted that an adhesive layer 23 'may be disposed between the first insulating layer 21 and the heat conductive layer 22, and the first insulating layer 21 and the heat conductive layer 22 may be bonded to each other by the adhesive layer 23'. Further, an adhesive layer 23 'may be disposed between the second insulating layer 24 and the heat conducting layer 22, the second insulating layer 24 and the heat conducting layer 22 may be combined by the adhesive layer 23', and the first portion 31 of the heat conductor 3 may be wrapped between the heat conducting layer 22 and the second insulating layer 24.

Next, referring to fig. 2 to 4, for example, in the process of combining the electronic component 1, the heat conductor 3 and the flexible heat conducting film 2, the heat conductor 3 may be clamped in the flexible heat conducting film 2 by the flexible heat conducting film 2, the flexible heat conducting film 2 with the heat conductor 3 may be used to cover the electronic component 1, and finally the above components are disposed on the carrier plate P, but the invention is not limited thereto.

Further, as mentioned above, the electronic component 1 may include a first outer surface 101, a second outer surface 102 connected to the first outer surface 101, and a third outer surface 103 connected to the second outer surface 102, and the second outer surface 102 may be connected between the first outer surface 101 and the second outer surface 102. In addition, when the flexible thermal conductive film 2 covers the electronic component 1, the flexible thermal conductive film 2 may include a first area Z1 disposed on the first outer surface 101, a second area Z2 disposed on the second outer surface 102, and a third area Z3 disposed on the third outer surface 103, and the first portion 31 of the thermal conductor 3 may be disposed on the first area Z1. In addition, when the electronic component 1 is disposed on the carrier P, the third area Z3 of the flexible thermal conductive film 2 may be disposed between the carrier P and the electronic component 1. In other words, the flexible thermal conductive film 2 may be, for example, a "C" shape covering the electronic component 1, and the electronic component 1 covered by the flexible thermal conductive film 2 is disposed on the carrier P. In addition, the electronic component 1 coated with the flexible thermal conductive film 2 can be fixed on the carrier P by a locking element (such as, but not limited to, a screw) or an adhesive layer, but the invention is not limited thereto.

As shown in fig. 8 and 9, as can be seen from a comparison between fig. 8 and 9 and fig. 6 and 7, in the embodiment of fig. 8 and 9, the flexible thermal conductive film 2 may further include an adhesive layer 23 ″ so that the electronic component 1 wrapped by the flexible thermal conductive film 2 can be adhered to the carrier P through the adhesive layer 23 ″.

As mentioned above, the adhesion layer 23 "may be disposed on the second insulation layer 24 of the flexible heat conductive film 2, and the second insulation layer 24 is located between the adhesion layer 23" and the heat conductive layer 22, that is, the adhesion layer 23 "may be disposed on the third area Z3 of the flexible heat conductive film 2. Therefore, the electronic component 1 coated with the flexible heat-conducting film 2 can be adhered to the carrier P by the adhesive layer 23 ″ of the flexible heat-conducting film 2.

Next, referring to fig. 10 and 11, as can be seen from a comparison between fig. 10 and 11 and fig. 2, in the embodiment of fig. 10 and 11, the size of the heat conductive layer 22 may be smaller than the size of the first insulating layer 21 and the second insulating layer 24. Thus, as shown in fig. 11, the edges of the first insulating layer 21 and the second insulating layer 24 can be attached to each other, so that the heat conducting layer 22 can be enclosed between the first insulating layer 21 and the second insulating layer 24 to form a fully edge-sealed flexible heat conducting film 2.

As mentioned above, for example, the material of the first insulating layer 21 may include polyethylene terephthalate (PET) or be PET, and the color of the first insulating layer 21 may be black. In addition, the heat conductive layer 22 may be selected from the group consisting of aluminum, silver, copper, and graphene. For example, the thickness of the heat conductive layer 22 may be about 0.1 millimeter (mm), and the thickness of the first insulating layer 21 may be between 0.01 mm and 0.03 mm. In addition, for example, the material of the adhesive layer 23 can be a general or special adhesive. However, it should be noted that the present invention is not limited by the above-mentioned examples.

As mentioned above, for example, the material of the second insulating layer 24 may include polyethylene terephthalate or be polyethylene terephthalate, and the color of the second insulating layer 24 may be black. In addition, the thickness of the second insulating layer 24 may be between 0.01 mm and 0.03 mm. However, it should be noted that the present invention is not limited by the above-mentioned examples. It should be noted that an exposed surface (not labeled) of the second insulating layer 24 may also be a rough exposed surface to improve the heat dissipation efficiency.

Therefore, the heat conductor 3 is sandwiched in the flexible heat conducting film 2, and the heat conductor 3 and the electronic element 1 are combined with each other by the flexible heat conducting film 2 with flexibility in the positioning manner between the heat conductor 3 and the electronic element 1, so that the flexible heat conducting film 2 can cover the electronic element 1 according to the outline of the electronic element 1, and the heat dissipation efficiency is improved.

In a second embodiment, referring to fig. 12 and 13, a heat dissipation structure U according to a second embodiment of the present invention includes: an electronic component 1, a flexible heat-conducting film 2 and a heat conductor 3. In addition, the electronic component 1 may be disposed on a carrier P, for example, the electronic component 1 may include a substrate 11 disposed on the carrier P and a chip 12 disposed on the substrate 11, and the carrier P and the substrate 11 may be a circuit board respectively. In addition, preferably, the heat dissipation structure U may further include a heat dissipation structure 4, the heat dissipation structure 4 may be disposed on the carrier P, the heat dissipation structure 4 may be disposed adjacent to the heat conductor 3, and the heat conductor 3 may abut between the electronic component 1 and the heat dissipation structure 4, so as to utilize the heat conduction characteristic of the heat conductor 3 to transfer the heat generated by the electronic component 1 to the heat dissipation structure 4 for heat dissipation. Further, the flexible thermal conductive film 2 may be disposed on the chip 12 of the electronic component 1, the thermal conductor 3 may include a first portion 31 and a second portion 32 connected to the first portion 31, the first portion 31 of the thermal conductor 3 may be sandwiched in the flexible thermal conductive film 2, and the second portion 32 of the thermal conductor 3 may be disposed on the heat dissipation structure 4. It should be noted that other structures of the heat dissipation structure U provided in the second embodiment are similar to those of the first embodiment, and are not described herein again.

Next, referring to fig. 14, the flexible thermal conductive film 2 may include a first insulating layer 21 disposed on the electronic component 1 and a thermal conductive layer 22 disposed on the first insulating layer 21, and the first portion 31 of the thermal conductor 3 may be disposed on the thermal conductive layer 22 of the flexible thermal conductive film 2. Preferably, the flexible thermal conductive film 2 may further include an adhesive layer 23 and a second insulating layer 24. The adhesive layer 23 may be disposed on the first insulating layer 21, the first insulating layer 21 may be located between the adhesive layer 23 and the heat conductive layer 22, and the flexible heat conductive film 2 may be adhered to the electronic component 1 through the adhesive layer 23. Further, the second insulating layer 24 may be arranged on the heat conductive layer 22 and the first portion 31 of the heat conductor 3 may be arranged between the heat conductive layer 22 and the second insulating layer 24. Further, the heat conductor 3 may include a surrounding surface 30, and the surrounding surface 30 of the first portion 31 of the heat conductor 3 may be enclosed between the heat conducting layer 22 and the second insulating layer 24.

In light of the above, it should be noted that an adhesive layer 23' may be disposed between the first insulating layer 21 and the heat conductive layer 22, and the first insulating layer 21 and the heat conductive layer 22 may be bonded to each other by the adhesive layer. In addition, an adhesive layer 23 'may be disposed between the heat conducting layer 22 and the second insulating layer 24, and the heat conducting layer 22 and the second insulating layer 24 may be bonded to each other by the adhesive layer 23'. Furthermore, an adhesive layer 23 'may be disposed between the first portion 31 of the heat conductor 3 and the heat conductive layer 22 and the second insulation layer 24, and the first portion 31 of the heat conductor 3 and the heat conductive layer 22 and the second insulation layer 24 may be bonded to each other by the adhesive layer 23'. However, in other embodiments, the heat conductor 3 may be disposed on the heat conducting layer 22 by welding, and the second insulating layer 24 may be disposed on the heat conductor 3 by using an adhesive layer, so that the first portion 31 of the heat conductor 3 is disposed between the heat conducting layer 22 and the second insulating layer 24.

The embodiment of the invention has the following beneficial effects: the heat dissipation structure U provided by the present invention can improve the heat dissipation efficiency by the technical solutions that the flexible heat conductive film 2 is disposed on the electronic component 1 and the first portion 31 of the heat conductor 3 is sandwiched in the flexible heat conductive film 2.

Further, the flexible heat conducting film 2 can utilize the material characteristics of the first insulating layer 21, the second insulating layer 24 and/or the heat conducting layer 22 to make the flexible heat conducting film 2 have flexibility, so that the flexible heat conducting film 2 can be tightly wrapped or attached on the electronic element 1, thereby improving the heat dissipation efficiency.

Furthermore, the flexible heat conductive film 2 may be, for example, a "C" shape covering the electronic component 1, so as to increase the process convenience of attaching the flexible heat conductive film 2 to the electronic component 1.

The disclosure is only a preferred embodiment of the invention and should not be taken as limiting the scope of the invention, so that the invention is not limited by the disclosure of the specification and drawings.

Claims

1. A heat dissipating architecture, comprising:

an electronic component;

the flexible heat-conducting film is arranged on the electronic element; and

a thermal conductor comprising a first portion and a second portion connected to said first portion, wherein said first portion of said thermal conductor is sandwiched between said flexible thermally conductive films;

the flexible heat-conducting film comprises a first insulating layer arranged on the electronic element, a heat-conducting layer arranged on the first insulating layer and a second insulating layer arranged on the heat-conducting layer, and the first part of the heat-conducting body is arranged between the heat-conducting layer and the second insulating layer.

2. The heat dissipating architecture of claim 1, further comprising a heat dissipating structure disposed adjacent to the thermal conductor and the second portion of the thermal conductor disposed on the heat dissipating structure.

3. The heat dissipation architecture of claim 1, wherein the heat conductor is a heat pipe.

4. The heat dissipation architecture of claim 1, wherein a material of the first insulating layer comprises polyethylene terephthalate.

5. The heat dissipation architecture of claim 1, wherein the thermally conductive layer is selected from the group consisting of aluminum, silver, copper, and graphene.

6. The heat dissipation architecture of claim 1, wherein the heat conductor further comprises a surrounding surface, the surrounding surface on the first portion of the heat conductor being encapsulated between the thermally conductive layer and the second insulating layer.

7. The heat dissipation structure of claim 1, wherein the flexible thermal conductive film further comprises an adhesive layer, the adhesive layer is disposed on the first insulating layer, the first insulating layer is disposed between the adhesive layer and the thermal conductive layer, and the flexible thermal conductive film is adhered to the electronic component through the adhesive layer.

8. The heat dissipation structure of claim 1, wherein a material of the second insulation layer comprises polyethylene terephthalate.

9. The heat dissipation structure of claim 1, wherein the electronic component includes a first outer surface, a second outer surface connected to the first outer surface, and a third outer surface connected to the second outer surface, and the second outer surface is connected between the first outer surface and the third outer surface, wherein the flexible thermal film includes a first region disposed on the first outer surface, a second region disposed on the second outer surface, and a third region disposed on the third outer surface, and wherein the first portion of the thermal conductor is disposed on the first region.

10. The heat dissipation structure as recited in claim 9, further comprising a carrier, wherein the electronic component is disposed on the carrier, and the third area of the flexible thermal film is disposed between the carrier and the electronic component.