JP2001050907A - 基板の検査方法 - Google Patents

基板の検査方法

Info

Publication number
JP2001050907A
JP2001050907A JP11230069A JP23006999A JP2001050907A JP 2001050907 A JP2001050907 A JP 2001050907A JP 11230069 A JP11230069 A JP 11230069A JP 23006999 A JP23006999 A JP 23006999A JP 2001050907 A JP2001050907 A JP 2001050907A
Authority
JP
Japan
Prior art keywords
substrate
defect
defect inspection
cleaning
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11230069A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001050907A5 (enrdf_load_stackoverflow
Inventor
Tsunemoto Aoki
毎祖 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP11230069A priority Critical patent/JP2001050907A/ja
Publication of JP2001050907A publication Critical patent/JP2001050907A/ja
Publication of JP2001050907A5 publication Critical patent/JP2001050907A5/ja
Withdrawn legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP11230069A 1999-08-16 1999-08-16 基板の検査方法 Withdrawn JP2001050907A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11230069A JP2001050907A (ja) 1999-08-16 1999-08-16 基板の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11230069A JP2001050907A (ja) 1999-08-16 1999-08-16 基板の検査方法

Publications (2)

Publication Number Publication Date
JP2001050907A true JP2001050907A (ja) 2001-02-23
JP2001050907A5 JP2001050907A5 (enrdf_load_stackoverflow) 2005-04-28

Family

ID=16902065

Family Applications (1)

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JP11230069A Withdrawn JP2001050907A (ja) 1999-08-16 1999-08-16 基板の検査方法

Country Status (1)

Country Link
JP (1) JP2001050907A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014121526A1 (zh) * 2013-02-05 2014-08-14 深圳市华星光电技术有限公司 玻璃表面异物检查装置、检查机及其检查方法
CN108593672A (zh) * 2018-03-01 2018-09-28 深圳回收宝科技有限公司 一种终端触控屏的检测方法、检测装置以及存储介质
WO2018207533A1 (ja) * 2017-05-09 2018-11-15 日本電気硝子株式会社 ガラス板、ガラス板の端面検査方法及びガラス板の製造方法
CN109307675A (zh) * 2017-07-26 2019-02-05 凌云光技术集团有限责任公司 一种产品外观检测方法和系统
CN109374628A (zh) * 2018-08-31 2019-02-22 中国印刷科学技术研究院有限公司 凹印版辊表面缺陷智能检测的缺陷确认方法
FR3075374A1 (fr) * 2017-12-19 2019-06-21 Saint-Gobain Glass France Systeme d'inspection de vitrage ameliore
CN110108713A (zh) * 2019-04-26 2019-08-09 武汉精立电子技术有限公司 一种表面异物缺陷快速过滤方法及系统
KR20220138332A (ko) * 2021-04-05 2022-10-12 신에쓰 가가꾸 고교 가부시끼가이샤 결함 검사 장치, 결함 검사 방법 및 포토마스크 블랭크의 제조 방법
JP2024045910A (ja) * 2022-09-22 2024-04-03 イフコ・ジャパン 株式会社 物流容器の検査方法及び洗浄方法
US12027428B2 (en) 2018-12-27 2024-07-02 Sumco Corporation Semiconductor wafer evaluation method and manufacturing method and semiconductor wafer manufacturing process management method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014121526A1 (zh) * 2013-02-05 2014-08-14 深圳市华星光电技术有限公司 玻璃表面异物检查装置、检查机及其检查方法
WO2018207533A1 (ja) * 2017-05-09 2018-11-15 日本電気硝子株式会社 ガラス板、ガラス板の端面検査方法及びガラス板の製造方法
CN109307675A (zh) * 2017-07-26 2019-02-05 凌云光技术集团有限责任公司 一种产品外观检测方法和系统
CN110178020A (zh) * 2017-12-19 2019-08-27 法国圣戈班玻璃厂 改进的玻璃检查系统
FR3075374A1 (fr) * 2017-12-19 2019-06-21 Saint-Gobain Glass France Systeme d'inspection de vitrage ameliore
WO2019122689A1 (fr) * 2017-12-19 2019-06-27 Saint-Gobain Glass France Systeme d'inspection de vitrage amélioré
CN108593672A (zh) * 2018-03-01 2018-09-28 深圳回收宝科技有限公司 一种终端触控屏的检测方法、检测装置以及存储介质
CN109374628A (zh) * 2018-08-31 2019-02-22 中国印刷科学技术研究院有限公司 凹印版辊表面缺陷智能检测的缺陷确认方法
US12027428B2 (en) 2018-12-27 2024-07-02 Sumco Corporation Semiconductor wafer evaluation method and manufacturing method and semiconductor wafer manufacturing process management method
CN110108713A (zh) * 2019-04-26 2019-08-09 武汉精立电子技术有限公司 一种表面异物缺陷快速过滤方法及系统
KR20220138332A (ko) * 2021-04-05 2022-10-12 신에쓰 가가꾸 고교 가부시끼가이샤 결함 검사 장치, 결함 검사 방법 및 포토마스크 블랭크의 제조 방법
JP2022159652A (ja) * 2021-04-05 2022-10-18 信越化学工業株式会社 欠陥検査装置、欠陥検査方法及びフォトマスクブランクの製造方法
US11940391B2 (en) 2021-04-05 2024-03-26 Shin-Etsu Chemical Co., Ltd. Defect inspection apparatus, method for inspecting defect, and method for manufacturing photomask blank
JP7578531B2 (ja) 2021-04-05 2024-11-06 信越化学工業株式会社 欠陥検査装置、欠陥検査方法及びフォトマスクブランクの製造方法
KR102831993B1 (ko) 2021-04-05 2025-07-08 신에쓰 가가꾸 고교 가부시끼가이샤 결함 검사 장치, 결함 검사 방법 및 포토마스크 블랭크의 제조 방법
JP2024045910A (ja) * 2022-09-22 2024-04-03 イフコ・ジャパン 株式会社 物流容器の検査方法及び洗浄方法

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