JP2001024008A5 - - Google Patents

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Publication number
JP2001024008A5
JP2001024008A5 JP1999196651A JP19665199A JP2001024008A5 JP 2001024008 A5 JP2001024008 A5 JP 2001024008A5 JP 1999196651 A JP1999196651 A JP 1999196651A JP 19665199 A JP19665199 A JP 19665199A JP 2001024008 A5 JP2001024008 A5 JP 2001024008A5
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JP
Japan
Prior art keywords
semiconductor laser
laser element
recognized
work
camera table
Prior art date
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Application number
JP1999196651A
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English (en)
Japanese (ja)
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JP3851468B2 (ja
JP2001024008A (ja
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Priority to JP19665199A priority Critical patent/JP3851468B2/ja
Priority claimed from JP19665199A external-priority patent/JP3851468B2/ja
Publication of JP2001024008A publication Critical patent/JP2001024008A/ja
Publication of JP2001024008A5 publication Critical patent/JP2001024008A5/ja
Application granted granted Critical
Publication of JP3851468B2 publication Critical patent/JP3851468B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP19665199A 1999-07-09 1999-07-09 発光部品のボンディング方法および装置 Expired - Fee Related JP3851468B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19665199A JP3851468B2 (ja) 1999-07-09 1999-07-09 発光部品のボンディング方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19665199A JP3851468B2 (ja) 1999-07-09 1999-07-09 発光部品のボンディング方法および装置

Publications (3)

Publication Number Publication Date
JP2001024008A JP2001024008A (ja) 2001-01-26
JP2001024008A5 true JP2001024008A5 (https=) 2005-06-16
JP3851468B2 JP3851468B2 (ja) 2006-11-29

Family

ID=16361333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19665199A Expired - Fee Related JP3851468B2 (ja) 1999-07-09 1999-07-09 発光部品のボンディング方法および装置

Country Status (1)

Country Link
JP (1) JP3851468B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6470054B2 (ja) * 2015-01-26 2019-02-13 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
JP6510837B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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