JPS61136538U - - Google Patents

Info

Publication number
JPS61136538U
JPS61136538U JP1985018217U JP1821785U JPS61136538U JP S61136538 U JPS61136538 U JP S61136538U JP 1985018217 U JP1985018217 U JP 1985018217U JP 1821785 U JP1821785 U JP 1821785U JP S61136538 U JPS61136538 U JP S61136538U
Authority
JP
Japan
Prior art keywords
loop
wire
loop detection
wire bonding
detection camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985018217U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219965Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985018217U priority Critical patent/JPH0219965Y2/ja
Publication of JPS61136538U publication Critical patent/JPS61136538U/ja
Application granted granted Critical
Publication of JPH0219965Y2 publication Critical patent/JPH0219965Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1985018217U 1985-02-12 1985-02-12 Expired JPH0219965Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985018217U JPH0219965Y2 (https=) 1985-02-12 1985-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985018217U JPH0219965Y2 (https=) 1985-02-12 1985-02-12

Publications (2)

Publication Number Publication Date
JPS61136538U true JPS61136538U (https=) 1986-08-25
JPH0219965Y2 JPH0219965Y2 (https=) 1990-05-31

Family

ID=30506644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985018217U Expired JPH0219965Y2 (https=) 1985-02-12 1985-02-12

Country Status (1)

Country Link
JP (1) JPH0219965Y2 (https=)

Also Published As

Publication number Publication date
JPH0219965Y2 (https=) 1990-05-31

Similar Documents

Publication Publication Date Title
JPS61136538U (https=)
JPS6251741U (https=)
JPS58169987U (ja) 工業用ロボツト
JPS6447043U (https=)
JPH0325237U (https=)
JPS6021382U (ja) ワ−ク判別装置
JPS6375804U (https=)
JPS63180191U (https=)
JPS6449932U (https=)
JPH0390442U (https=)
JPS5960505U (ja) 形状認識装置
JPH0423241U (https=)
JPS59160445U (ja) フエンダミラ−コントロ−ル装置
JPS6142605U (ja) 工業用ロボツト
JPS61138245U (https=)
JPS60171684U (ja) レ−ザ加工装置
JPS6452633U (https=)
JPS5880192U (ja) 工業用ロボツト
JPS6153084U (https=)
JPS60103682U (ja) 可動体の原点位置決め装置
JPS5889140U (ja) タ−レツトパンチプレス
JPH02104406U (https=)
JPH01113210U (https=)
JPS6028969U (ja) ア−ク溶接用ロボツト
JPH04730A (ja) ワイヤボンディング装置