JP2001015643A5 - - Google Patents
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- Publication number
- JP2001015643A5 JP2001015643A5 JP2000173780A JP2000173780A JP2001015643A5 JP 2001015643 A5 JP2001015643 A5 JP 2001015643A5 JP 2000173780 A JP2000173780 A JP 2000173780A JP 2000173780 A JP2000173780 A JP 2000173780A JP 2001015643 A5 JP2001015643 A5 JP 2001015643A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- apertures
- spacing
- substrate
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/330648 | 1999-06-11 | ||
US09/330,648 US6303871B1 (en) | 1999-06-11 | 1999-06-11 | Degassing hole design for olga trace impedance |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001015643A JP2001015643A (ja) | 2001-01-19 |
JP2001015643A5 true JP2001015643A5 (ko) | 2005-09-02 |
JP4671470B2 JP4671470B2 (ja) | 2011-04-20 |
Family
ID=23290678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000173780A Expired - Fee Related JP4671470B2 (ja) | 1999-06-11 | 2000-06-09 | 有機ランド・グリッド・アレイ・パッケージ、基板、有機基板、集積回路パッケージ及び回路アセンブリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US6303871B1 (ko) |
JP (1) | JP4671470B2 (ko) |
TW (1) | TW463338B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080023369A (ko) * | 1998-09-17 | 2008-03-13 | 이비덴 가부시키가이샤 | 다층빌드업배선판 |
US6225687B1 (en) * | 1999-09-02 | 2001-05-01 | Intel Corporation | Chip package with degassing holes |
US20020003049A1 (en) * | 1999-12-29 | 2002-01-10 | Sanjay Dabral | Inline and "Y" input-output bus topology |
US6496081B1 (en) * | 2001-09-28 | 2002-12-17 | Lsi Logic Corporation | Transmission equalization system and an integrated circuit package employing the same |
JP3864093B2 (ja) * | 2002-01-10 | 2006-12-27 | シャープ株式会社 | プリント配線基板、電波受信用コンバータおよびアンテナ装置 |
WO2004068581A1 (ja) * | 2003-01-30 | 2004-08-12 | Fujitsu Limited | 半導体装置及び支持板 |
US7292452B2 (en) * | 2004-06-10 | 2007-11-06 | Intel Corporation | Reference layer openings |
US20060060379A1 (en) * | 2004-09-20 | 2006-03-23 | Mao Tseng F | Printed circuit board structure |
KR101077410B1 (ko) * | 2009-05-15 | 2011-10-26 | 삼성전기주식회사 | 방열부재를 구비한 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
US9864829B2 (en) * | 2015-04-20 | 2018-01-09 | Toshiba Memory Corporation | Multilayer substrate, design method of multilayer substrate, manufacturing method of semiconductor device, and recording medium |
KR102495574B1 (ko) | 2018-12-18 | 2023-02-03 | 삼성전자주식회사 | 반도체 패키지 |
US11417821B2 (en) * | 2019-03-07 | 2022-08-16 | Northrop Grumman Systems Corporation | Superconductor ground plane patterning geometries that attract magnetic flux |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4859806A (en) * | 1988-05-17 | 1989-08-22 | Microelectronics And Computer Technology Corporation | Discretionary interconnect |
JPH0397973U (ko) * | 1990-01-29 | 1991-10-09 | ||
JPH07123150B2 (ja) * | 1992-03-06 | 1995-12-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハイブリッド半導体モジュール |
US5410107A (en) * | 1993-03-01 | 1995-04-25 | The Board Of Trustees Of The University Of Arkansas | Multichip module |
JPH06291216A (ja) * | 1993-04-05 | 1994-10-18 | Sony Corp | 基板及びセラミックパッケージ |
CA2099477A1 (en) * | 1993-06-30 | 1994-12-31 | Guy M. Duxbury | Printed circuit board |
AU5238898A (en) * | 1996-11-08 | 1998-05-29 | W.L. Gore & Associates, Inc. | Method for reducing via inductance in an electronic assembly and device |
US6184477B1 (en) * | 1998-12-02 | 2001-02-06 | Kyocera Corporation | Multi-layer circuit substrate having orthogonal grid ground and power planes |
-
1999
- 1999-06-11 US US09/330,648 patent/US6303871B1/en not_active Expired - Lifetime
-
2000
- 2000-06-09 JP JP2000173780A patent/JP4671470B2/ja not_active Expired - Fee Related
- 2000-12-14 TW TW089111366A patent/TW463338B/zh not_active IP Right Cessation
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