JP2001015188A5 - - Google Patents
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- Publication number
- JP2001015188A5 JP2001015188A5 JP1999181006A JP18100699A JP2001015188A5 JP 2001015188 A5 JP2001015188 A5 JP 2001015188A5 JP 1999181006 A JP1999181006 A JP 1999181006A JP 18100699 A JP18100699 A JP 18100699A JP 2001015188 A5 JP2001015188 A5 JP 2001015188A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- lead
- airtight terminal
- plating
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 description 37
- 239000002184 metal Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000007747 plating Methods 0.000 description 12
- 238000005219 brazing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18100699A JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18100699A JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001015188A JP2001015188A (ja) | 2001-01-19 |
| JP2001015188A5 true JP2001015188A5 (enrdf_load_stackoverflow) | 2006-08-17 |
| JP4251721B2 JP4251721B2 (ja) | 2009-04-08 |
Family
ID=16093102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18100699A Expired - Fee Related JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4251721B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817370B2 (ja) * | 2006-03-24 | 2011-11-16 | エヌイーシー ショット コンポーネンツ株式会社 | 電子部品用パッケージ |
| JP4933849B2 (ja) * | 2006-06-30 | 2012-05-16 | シチズンファインテックミヨタ株式会社 | 圧入型シリンダータイプ圧電振動子の気密端子、圧入型シリンダータイプ圧電振動子及び気密端子の製造方法 |
| DE102006054843B4 (de) * | 2006-10-10 | 2015-02-12 | BC Tech Holding AG | Elektrische Durchführung, sowie Verfahren zum Herstellen einer solchen Durchführung |
| WO2011068200A1 (ja) * | 2009-12-04 | 2011-06-09 | 株式会社大真空 | リード型圧電振動デバイス |
| JP2013035046A (ja) * | 2011-08-10 | 2013-02-21 | Nec Schott Components Corp | 金属膜とリードのはんだ接合構体およびその熱処理方法 |
-
1999
- 1999-06-28 JP JP18100699A patent/JP4251721B2/ja not_active Expired - Fee Related
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