JP2000513148A - サーマル・グリースの挿入および保持 - Google Patents
サーマル・グリースの挿入および保持Info
- Publication number
- JP2000513148A JP2000513148A JP10502990A JP50299098A JP2000513148A JP 2000513148 A JP2000513148 A JP 2000513148A JP 10502990 A JP10502990 A JP 10502990A JP 50299098 A JP50299098 A JP 50299098A JP 2000513148 A JP2000513148 A JP 2000513148A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cover plate
- substrate
- package
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004519 grease Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.基板、 前記基板に装着された集積回路、 前記基板に取り付けられ、前記集積回路を封止するカバー・プレート、 前記集積回路と前記カバー・プレートの間に位置するサーマル・グリース、お よび 前記カバー・プレートと前記基板の間に位置し、前記集積回路と前記カバー・ プレートの間に前記サーマル・グリースを密封するシール を備える集積回路パッケージ。 2.前記カバー・プレートが入口ポートを有する請求項1に記載のパッケージ 。 3.前記カバー・プレートが出口ポートを有する請求項2に記載のパッケージ 。 4.前記シールが、前記カバー・プレートの溝の中に位置する請求項1に記載 のパッケージ。 5.前記シールがOリングである請求項1に記載のパッケージ。 6.前記カバー・プレートを前記基板に取り付ける複数の固着具をさらに備え る請求項1に記載のパッケージ。 7.前記基板がプリント回路板である請求項1に記載のパッケージ。 8.基板、 前記基板に装着された集積回路、 入口ポート、出口ポートおよび溝を有し、前記基板に取り付けられ、前記集積 回路を封止するカバー・プレート、 前記集積回路と前記カバー・プレートの間に位置するサーマル・グリース、お よび 前記溝の中に位置し、前記カバー・プレートと前記基板の間で変形し、前記集 積回路上に前記サーマル・グリースを密封するシール を備える集積回路パッケージ。 9.前記基板がプリント回路板である請求項8に記載のパッケージ。 10.前記カバー・プレートを前記プリント回路板に取り付ける複数の固着具 をさらに備える請求項9に記載のパッケージ。 11.前記シールがOリングである請求項10に記載のパッケージ。 12.サーマル・グリースを集積回路に塗布する方法において、 a)集積回路を基板の上へ置く段階、 b)前記基板上の前記集積回路の周囲にシールを置く段階、 c)前記カバー・プレートが前記集積回路から空間によって隔てられるよう、 前記集積回路をカバー・プレートで封止する段階、および d)前記空間にサーマル・グリースを注入する段階 を含む方法。 13.前記サーマル・グリースが、前記カバー・プレートの入口ポートを通し て注入される請求項12に記載の方法。 14.前記シールが、前記カバー・プレートによって変形される請求項12に 記載の方法。 15.前記カバー・プレートが前記基板に固定される請求項14に記載の方法 。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67179496A | 1996-06-24 | 1996-06-24 | |
US08/671,794 | 1996-06-24 | ||
PCT/US1997/009058 WO1997050124A1 (en) | 1996-06-24 | 1997-05-27 | Thermal grease insertion and retention |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000513148A true JP2000513148A (ja) | 2000-10-03 |
JP2000513148A5 JP2000513148A5 (ja) | 2004-12-09 |
JP3949724B2 JP3949724B2 (ja) | 2007-07-25 |
Family
ID=24695916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50299098A Expired - Fee Related JP3949724B2 (ja) | 1996-06-24 | 1997-05-27 | サーマル・グリースを集積回路に塗布する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6016006A (ja) |
JP (1) | JP3949724B2 (ja) |
KR (1) | KR100310585B1 (ja) |
CN (1) | CN1149669C (ja) |
AU (1) | AU3145997A (ja) |
MY (1) | MY123799A (ja) |
WO (1) | WO1997050124A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144233A (ja) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | 半導体ユニット、冷却装置およびそれらの製造方法 |
JP2008004745A (ja) * | 2006-06-22 | 2008-01-10 | Denso Corp | 電子装置 |
JP2011071550A (ja) * | 2010-12-21 | 2011-04-07 | Denso Corp | 電子装置 |
JP2013251473A (ja) * | 2012-06-04 | 2013-12-12 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2019220927A1 (ja) * | 2018-05-17 | 2019-11-21 | 株式会社オートネットワーク技術研究所 | 回路装置 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037659A (en) * | 1997-04-28 | 2000-03-14 | Hewlett-Packard Company | Composite thermal interface pad |
US6043984A (en) | 1998-07-06 | 2000-03-28 | Intel Corporation | Electrical assembly that includes a heat sink which is attached to a substrate by a clip |
US6331446B1 (en) | 1999-03-03 | 2001-12-18 | Intel Corporation | Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state |
JP3196762B2 (ja) * | 1999-04-20 | 2001-08-06 | 日本電気株式会社 | 半導体チップ冷却構造 |
US6292362B1 (en) * | 1999-12-22 | 2001-09-18 | Dell Usa, L.P. | Self-contained flowable thermal interface material module |
US6700209B1 (en) | 1999-12-29 | 2004-03-02 | Intel Corporation | Partial underfill for flip-chip electronic packages |
US6570764B2 (en) * | 1999-12-29 | 2003-05-27 | Intel Corporation | Low thermal resistance interface for attachment of thermal materials to a processor die |
US6888722B2 (en) * | 1999-12-30 | 2005-05-03 | Intel Corporation | Thermal design for minimizing interface in a multi-site thermal contact condition |
US7369411B2 (en) * | 2000-02-25 | 2008-05-06 | Thermagon, Inc. | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
JP3690729B2 (ja) * | 2000-09-11 | 2005-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 電気回路装置及びコンピュータ |
US6617682B1 (en) * | 2000-09-28 | 2003-09-09 | Intel Corporation | Structure for reducing die corner and edge stresses in microelectronic packages |
GB0203670D0 (en) * | 2002-02-15 | 2002-04-03 | Bookham Technology Ltd | An artificial environment module |
US6767765B2 (en) * | 2002-03-27 | 2004-07-27 | Intel Corporation | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
US6881265B2 (en) * | 2002-04-12 | 2005-04-19 | International Business Machines Corporation | Grease rework applicator |
US6967843B2 (en) * | 2003-02-11 | 2005-11-22 | Hewlett-Packard Development Company, L.P. | System and method for dissipating heat from an electronic board |
US7012326B1 (en) | 2003-08-25 | 2006-03-14 | Xilinx, Inc. | Lid and method of employing a lid on an integrated circuit |
US20050224953A1 (en) * | 2004-03-19 | 2005-10-13 | Lee Michael K L | Heat spreader lid cavity filled with cured molding compound |
JP4234635B2 (ja) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | 電子機器 |
US7554190B2 (en) * | 2004-12-03 | 2009-06-30 | Chris Macris | Liquid metal thermal interface material system |
US7382620B2 (en) * | 2005-10-13 | 2008-06-03 | International Business Machines Corporation | Method and apparatus for optimizing heat transfer with electronic components |
US7388284B1 (en) | 2005-10-14 | 2008-06-17 | Xilinx, Inc. | Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
KR100810491B1 (ko) * | 2007-03-02 | 2008-03-07 | 삼성전기주식회사 | 전자소자 패키지 및 그 제조방법 |
US7535714B1 (en) * | 2007-10-31 | 2009-05-19 | International Business Machines Corporation | Apparatus and method providing metallic thermal interface between metal capped module and heat sink |
US8806742B2 (en) | 2009-09-02 | 2014-08-19 | International Business Machines Corporation | Method of making an electronic package |
US8362609B1 (en) | 2009-10-27 | 2013-01-29 | Xilinx, Inc. | Integrated circuit package and method of forming an integrated circuit package |
US8810028B1 (en) | 2010-06-30 | 2014-08-19 | Xilinx, Inc. | Integrated circuit packaging devices and methods |
GB2504343A (en) * | 2012-07-27 | 2014-01-29 | Ibm | Manufacturing an semiconductor chip underfill using air vent |
US10506719B2 (en) | 2013-01-15 | 2019-12-10 | Blackberry Limited | Thermal dissipater apparatus for use with electronic devices |
CN104716113B (zh) * | 2013-12-13 | 2017-10-10 | 华为技术有限公司 | 散热器及散热系统 |
US20150184053A1 (en) * | 2013-12-27 | 2015-07-02 | Shankar Krishnan | Gasketted thermal interface |
US10098220B2 (en) * | 2015-12-24 | 2018-10-09 | Intel Corporation | Electronic device heat transfer system and related methods |
US10687447B2 (en) * | 2016-10-14 | 2020-06-16 | Laird Technologies, Inc. | Methods of applying thermal interface materials to board level shields |
CN107331787B (zh) * | 2017-06-26 | 2019-06-21 | 京东方科技集团股份有限公司 | 封装盖板、有机发光显示器及其制备方法 |
US11054193B2 (en) | 2018-05-30 | 2021-07-06 | Amazon Technologies, Inc. | Vehicle with vibration isolated electronics |
US10912224B2 (en) * | 2018-05-30 | 2021-02-02 | Amazon Technologies, Inc. | Thermally conductive vibration isolating connector |
TWM579819U (zh) * | 2019-03-04 | 2019-06-21 | 華碩電腦股份有限公司 | 散熱結構 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
US4235283A (en) * | 1979-12-17 | 1980-11-25 | International Business Machines Corporation | Multi-stud thermal conduction module |
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
US4514752A (en) * | 1984-04-10 | 1985-04-30 | International Business Machines Corporation | Displacement compensating module |
US4639829A (en) * | 1984-06-29 | 1987-01-27 | International Business Machines Corporation | Thermal conduction disc-chip cooling enhancement means |
JPS63219143A (ja) * | 1987-03-07 | 1988-09-12 | Tanaka Electron Ind Co Ltd | 回路基板のダムリング取付構造 |
US5184211A (en) * | 1988-03-01 | 1993-02-02 | Digital Equipment Corporation | Apparatus for packaging and cooling integrated circuit chips |
US4933747A (en) * | 1989-03-27 | 1990-06-12 | Motorola Inc. | Interconnect and cooling system for a semiconductor device |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
-
1997
- 1997-05-05 US US08/850,440 patent/US6016006A/en not_active Expired - Lifetime
- 1997-05-27 WO PCT/US1997/009058 patent/WO1997050124A1/en active IP Right Grant
- 1997-05-27 CN CNB971974098A patent/CN1149669C/zh not_active Expired - Fee Related
- 1997-05-27 AU AU31459/97A patent/AU3145997A/en not_active Abandoned
- 1997-05-27 JP JP50299098A patent/JP3949724B2/ja not_active Expired - Fee Related
- 1997-05-27 KR KR1019980710628A patent/KR100310585B1/ko not_active IP Right Cessation
- 1997-06-23 MY MYPI97002824A patent/MY123799A/en unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144233A (ja) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | 半導体ユニット、冷却装置およびそれらの製造方法 |
JP2008004745A (ja) * | 2006-06-22 | 2008-01-10 | Denso Corp | 電子装置 |
JP4710735B2 (ja) * | 2006-06-22 | 2011-06-29 | 株式会社デンソー | 電子装置の製造方法 |
JP2011071550A (ja) * | 2010-12-21 | 2011-04-07 | Denso Corp | 電子装置 |
JP2013251473A (ja) * | 2012-06-04 | 2013-12-12 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2019220927A1 (ja) * | 2018-05-17 | 2019-11-21 | 株式会社オートネットワーク技術研究所 | 回路装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1149669C (zh) | 2004-05-12 |
US6016006A (en) | 2000-01-18 |
WO1997050124A1 (en) | 1997-12-31 |
KR20000022209A (ko) | 2000-04-25 |
AU3145997A (en) | 1998-01-14 |
CN1228872A (zh) | 1999-09-15 |
KR100310585B1 (ko) | 2001-11-17 |
JP3949724B2 (ja) | 2007-07-25 |
MY123799A (en) | 2006-06-30 |
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