JP2000340846A - Infrared-ray data communication module, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared-ray data communication module which is high in the effect of shielding such as electrostatic shielding as compared with conventional ones, and can reduce noise, and is excellent in reliability because the shielding part is hardly damaged from the outside, and further is high flexibility in its shape design. SOLUTION: This infrared-ray data communication module is composed of a board 1, where a circuit is made, a light emitting element 2 mounted on this board 1, a light receiving element 3, an IC chip 4, a shielding part 5 for shielding it from the light or electromagnetic waves from the outside, and lens parts 6a and 6b. In this case, the shielding part 5 is sealed with infrared transmitting resin 6 which forms the lens parts 6a and 6b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a notebook computer,
The present invention relates to an infrared data communication module used for an electronic device such as a PDA and a mobile phone, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Infrared data communication can realize data transmission and reception between portable information devices such as a notebook personal computer and a PDA without a cable, and is further compared with a data transmission system using radio waves such as a digital cellular phone and a PHS. , Mechanically simple, low cost, small size, easy to incorporate into information equipment,
It has advantages such as no legal restrictions, and is a communication system that will continue to need. As shown in FIG. 28, the infrared data communication module includes a light emitting element 2 (infrared LE
D), the light receiving element 3 (PD; photodiode), and the IC chip 4 are mounted on the substrate 1 on which the upper surface 1 a is formed with a circuit, and sealed with the infrared transmitting resin 6. The IC chip 4 has a function of driving an infrared LED, amplifying a received light signal, shaping a waveform, and modulating and demodulating.

The conventional infrared data communication module is a highly combined optical part, optical-electrical signal conversion part, and high-sensitivity amplification part, and is essentially more resistant to various noises than other electric parts. And low. Therefore, a structure that shields external light and electromagnetic waves is required at locations other than the lens portions 6a and 6b for receiving and emitting light. At present, the lens portions 6a,
A portion other than 6b is surrounded by a metal shield case 55 to provide a light shielding effect and an electrostatic shielding effect. However, with such a structure, the degree of freedom of the shape of the infrared data communication module is limited to the shape of the shield case 55, and the performance of the infrared data communication module such as the shield case 55 itself is damaged and deformed from the outside. May reduce reliability. Also, in the manufacturing process, there is a problem that the installation process of the shield case 55 is complicated and productivity is low.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has a higher shielding effect such as an electrostatic shield as compared with conventional products, and can reduce noise.
Further, it is an object of the present invention to provide an infrared data communication module which is excellent in reliability because the shield portion is not easily damaged from the outside and has a high degree of freedom in shape design.

[0005]

An infrared data communication module according to claim 1 of the present invention comprises a substrate 1 on which a circuit is formed, a light emitting element 2, a light receiving element 3, and an IC chip mounted on the substrate 1. 4, an infrared data communication module comprising a shield part 5 for shielding external light and electromagnetic waves, and lens parts 6a, 6b, wherein the shield part 5 forms the lens parts 6a, 6b. 6 is sealed.

According to a second aspect of the present invention, there is provided an infrared data communication module according to the first aspect.
Are electrically connected to the ground portion 8a of the circuit 8 formed on the substrate 1.

According to a third aspect of the present invention, there is provided an infrared data communication module according to the first or second aspect, further comprising a structure in which the shield unit blocks light from the light emitting element onto the IC chip. It is characterized by having.

According to a fourth aspect of the present invention, in the infrared data communication module, in addition to any one of the first to third aspects, the IC chip 4 is provided with a shielding resin 7 having a small electromagnetic wave transmittance.
It is characterized by being sealed.

The infrared data communication module according to a fifth aspect of the present invention is characterized in that, in addition to any one of the first to fourth aspects, the shield part 5 completely covers the IC chip 4. .

According to a sixth aspect of the present invention, there is provided an infrared data communication module according to any one of the first to fifth aspects, wherein fine processing for controlling light distribution on the surface of the infrared transmitting resin above the IC chip is performed. It is characterized by having performed.

The infrared data communication module according to a seventh aspect of the present invention is characterized in that, in addition to any one of the first to sixth aspects, a circuit is formed on the shield part 5 and an element is mounted. Things.

An infrared data communication module according to an eighth aspect of the present invention is the same as the infrared data communication module according to the seventh aspect, wherein
The circuit formation and the element mounting are performed on the inner surface 5d, and a layer 12 made of a material having low electromagnetic wave permeability is provided on the outer surface 5e of the shield portion 5.

The infrared data communication module according to a ninth aspect of the present invention is characterized in that, in addition to any one of the first to eighth aspects, a heat radiation mechanism 13 is provided on the light emitting element 2 side of the shield part 5. Is what you do.

An infrared data communication module according to a tenth aspect of the present invention is characterized in that a cooling mechanism 14 is provided on the light emitting element 2 side of the shield part 5 in addition to any one of the first to ninth aspects. Is what you do.

An infrared data communication module according to claim 11 of the present invention is characterized in that, in addition to the structure of claim 10, a thermoelectric cooling element is used for the cooling mechanism 14.

According to a method of manufacturing an infrared data communication module according to a twelfth aspect of the present invention, there is provided a substrate 1 on which a circuit is formed.
An infrared light comprising a light emitting element 2, a light receiving element 3, an IC chip 4 mounted on the substrate 1, a shield part 5 for shielding external light and electromagnetic waves, and lens parts 6a and 6b. The method for manufacturing a data communication module is characterized in that when molding the lens portions 6a and 6b with the infrared transmitting resin 6, the shield portion 5 is sealed with resin.

According to a method of manufacturing an infrared data communication module according to claim 13 of the present invention, in addition to the structure of claim 12, the shield portion 5 is integrated with the substrate 1 on which the IC chip 4 is mounted via the connecting portion 17. After the IC chip 4 is mounted, the shield portion 5 is rotated around the connection portion 17 to shield the upper portion of the substrate 1 with the shield portion 5.

According to a method of manufacturing an infrared data communication module according to claim 14 of the present invention, in addition to the structure of claim 12 or 13, the circuit is formed on the shield part 5 in a separate step and the element is mounted. The unit 5 is provided above the IC chip 4.

According to a method of manufacturing an infrared data communication module according to claim 15 of the present invention, in addition to the configuration of any of claims 12 to 14, a positioning part 18 is provided on the substrate 1 and the shield part 5, 5 is positioned and fixed above the IC chip 4.

According to a method of manufacturing an infrared data communication module according to claim 16 of the present invention, in addition to the structure of any of claims 12 to 15, a conductive material electrically connected to the ground portion 8 a of the circuit 8 formed on the substrate 1 is provided. The conductive pins 19 are erected on the substrate 1, and the shield portion 5 is provided with a concave portion 20 in which the conductive pin 19 can be fitted, and the conductive pin 19 and the concave portion 20 are fitted together to form a shield. The circuit is characterized in that the portion is disposed on the substrate and the shield portion is electrically connected to the ground portion of the circuit formed on the substrate.

A method of manufacturing an infrared data communication module according to a seventeenth aspect of the present invention is characterized in that, in addition to the configuration of the twelfth aspect, a layer 21 to which a shield portion is added is laminated above the IC chip 4. Things.

According to a method of manufacturing an infrared data communication module according to claim 18 of the present invention, in addition to the structure of claim 17, a circuit is formed when the layer 21 to which the shield portion is added is laminated above the IC chip 4. And the IC chip 4 is laminated between the IC chip 4 and the layer 21 to which the shield portion is added.

According to a method of manufacturing an infrared data communication module according to a nineteenth aspect of the present invention, in addition to the configuration of the seventeenth aspect, when the layer 21 to which the shield portion is added is laminated above the IC chip 4, Added layer 21 and substrate 1
After the through hole 23 is formed in the layer between the substrate 1 and the through hole 23, the shield portion 5 of the layer 21 in which the shield portion is added to the through hole 23 and the ground portion 8a of the circuit 8 formed on the substrate 1 are electrically connected. The conductive pin 19 is fitted.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows an embodiment of the present invention.
Reference numeral 1 denotes a substrate having an upper surface 1a on which a circuit is formed. First, a light emitting element 2 composed of an infrared LED, a light receiving element 3 composed of a photodiode, and an IC chip 4 are mounted on the upper surface 1a of the substrate 1. Subsequently, the upper part of the substrate 1 is molded with a mold using an infrared transmitting resin 6 so that the shield part 5 which is a flat metal plate is disposed above the IC chip 4 mounted on the upper surface 1a of the substrate 1. Then, the mounting component and the shield part 5 are sealed with resin. Note that hemispherical lens portions 6a and 6b are formed above the light emitting element 2 and above the light receiving element 3 by this resin molding. The infrared transmitting resin 6 forming the hemispherical lens portions 6a and 6b is made of visible light (wavelength λ = 700 to 80).
0 nm), and it is preferable to use an epoxy resin or the like that transmits infrared rays. Since the shield portion 5 is sealed with the infrared transmitting resin 6 forming the lens portions 6a and 6b as described above, the shield portion 5 can be used for mounting components as compared with the shield case of the conventional infrared data communication module. Since the vicinity is shielded, the shielding effect can be enhanced. Further, since the shield part 5 is surrounded by the infrared transmitting resin 6, the shield part 5 is hardly damaged from outside and hardly deformed, so that a highly reliable infrared data communication module can be provided. Further, since the outer shape of the infrared data communication module is formed of resin, the degree of freedom in shape design is increased. The shield portion 5 may be a thin metal film and be laminated on the upper surface of the IC chip 4 in addition to the above, or an opaque resin having a shielding effect may be used.

Next, another embodiment of the present invention is shown in FIGS. The infrared data communication module shown in FIG. 2 is a box-shaped case having a fully open lower part on a substrate 1 on which a light emitting element 2, a light receiving element 3, and an IC chip 4 are mounted. The mounting part inside the shield part 5 and the outer peripheral surface of the shield part 5 are resin-sealed with the infrared transmitting resin 6 so as to arrange the shield part 5 having the holes 5a and 5b. A lens portion 6 projecting hemispherically above the two circular holes 5a, 5b
a and 6b are formed of the infrared transmitting resin 6.
As a material of the shield portion 5, a metal plate (for example, stainless steel, iron, copper,
Aluminum is desirable. In this example, since the shield portion 5 has a shape that covers all of the infrared light receiving and emitting elements 2 and 3 except for the lens portions 6a and 6b, an electrostatic shielding effect can be expected in addition to the light shielding effect. As the shape of the shield part 5, types (a) to (d) shown in FIG. 3 can be considered, and (d), which is the shape of the shield part 5 in this example, shows a light shielding effect and an electrostatic shielding effect. Is most effective in

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is the same as the infrared data communication module of FIG.
Is a conductor 24, and a conductor 25 led out from an end of the shield part 5 is connected to a ground part 8a of the circuit 8 formed on the substrate 1. With such a configuration, an electrostatic shielding effect can be expected in addition to the light shielding effect of the shield portion 5.

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is the same as the infrared data communication module of FIG.
The shield portion 5 extends obliquely downward from the light-emitting element 2 side of the light-emitting element 2 side, and the end portion 27a of the extended portion 27 of the shield portion 5 is connected to the ground portion 8a of the circuit 8 formed on the substrate 1. Connected. With such a configuration, in addition to the electrostatic shielding effect, the output light from the light emitting element 2
A light-shielding structure that does not directly hit the chip 4 can be provided.
Noise generated in the IC chip 4 can be further reduced.

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is the same as the infrared data communication module of FIG.
A light-shielding partition plate 28 is erected between the IC chip 4 and the light emitting element 2 inside the upper bottom 5c, and the lower end 28a of the partition plate 28 is connected to the ground portion 8a of the circuit 8 formed on the substrate 1.
Is connected. With such a configuration, the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is the same as the infrared data communication module of FIG.
As a resin for sealing the IC chip 4 between the IC chip 4 and the mounted IC chip 4, a shielding resin 7 having low electromagnetic wave permeability is provided separately from the infrared transmitting resin 6. The shielding resin 7 may include PP,
An opaque resin obtained by mixing a pigment or the like in PE, PC, PMMA, ABS, PET, epoxy resin, or the like is used. For the purpose of an electrostatic shielding effect, for example, a conductive opaque resin containing a metal filler is used. Even with such a configuration, an electrostatic shielding effect and a light shielding effect can be expected, and IC
Noise generated in the chip 4 can be further reduced.

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is the same as the infrared data communication module of FIG.
As a resin for sealing the IC chip 4 between the inside of the upper bottom 5c and the IC chip 4, a shielding resin 7 having low electromagnetic wave transmittance is arranged separately from the infrared transmitting resin 6. With such a configuration, the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module has the same configuration as the infrared data communication module of FIG.
When the shielding effect of the shielding resin 7 disposed between the IC chip 4 and the mounted IC chip 4 is sufficiently large, the shielding part 5 is removed and the shielding resin 7 is used as the shielding part 5. With such a configuration, the same effect as in the above example can be expected, and the structure can be simplified.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This infrared data communication module has the same structure as the infrared data communication module shown in FIG. 1 except that the end of the shield portion 5 on the light emitting element 2 side and the end on the light receiving element 3 side are obliquely downward from the light emitting element 2 side, and The shield portions 5 are respectively extended diagonally downward and the two extended portions 2 of the shield portions 5 are extended.
The end portions 27 a of the circuit 7 are connected to the ground portions 8 a of the circuit 8 formed on the substrate 1. With such a configuration, the IC chip 4 can be completely shielded, so that noise generated in the IC chip 4 can be further reduced and an electrostatic shielding effect can be expected. In the above configuration, the periphery of the IC chip 4 is not sealed with the resin. However, when the IC has high sensitivity, the pressure at the time of resin sealing does not affect the IC performance. Excellent in terms of protection. Of course, the periphery of the IC chip 4 surrounded by the shield part 5 may be sealed with a resin that does not affect the IC (for example, a modified acrylate or a silicon-based gel-like UV-curable resin).

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This infrared data communication module has the same structure as the infrared data communication module shown in FIG.
And partition plates 28, 28 having a light-shielding property are erected between the IC chip 4 and the light receiving element 3, respectively.
8 are formed on the substrate 1
Are connected to the ground portions 8a, 8a. With such a configuration, the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This infrared data communication module has a structure similar to that of the infrared data communication module shown in FIG. 1 and is provided on the surface of the infrared transmitting resin 6 for sealing the shield portion 5 between the hemispherical lens portions 6a and 6b as shown in FIG. It has been subjected to fine processing for light distribution control. With such a configuration, it is possible to scatter or refract incident light incident on the surface of the finely processed infrared transmitting resin 6 in a certain direction or to control light distribution so as to deflect the incident light in an arbitrary direction. Therefore, noise generated in the IC chip 4 due to incident light can be reduced.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This infrared data communication module has the same structure as the above-described example on the surface of the infrared transmitting resin 6 which seals the upper bottom 5c of the shield portion 5 between the hemispherical lens portions 6a and 6b in the configuration of the infrared data communication module of FIG. In this case, fine processing for controlling light distribution is performed, and the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in In the infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the inner surface 5 d of the shield part 5, that is, the lower surface 31 side is formed by the insulating layer 33, and the circuit 34 is formed on the lower surface 31. Element 3
5, the outer surface 5e of the shield portion 5, that is, the upper surface 32 side is formed of a metal plate 36. The connection between the circuit 34 formed on the lower surface 31 of the shield portion 5 and the circuit 8 formed on the substrate 1 and the connection between the metal plate 36 on the upper surface 32 of the shield portion 5 and the ground portion 8a of the circuit 8 This is performed via a lead wire 37 led out from an end of the shield portion 5. With this configuration, the circuit formation area can be increased, and a circuit for additional functions other than infrared transmission / reception (for example, overcurrent prevention, overheat protection, etc.) can be added without changing the size of the infrared data communication module. It becomes possible. Further, a metal plate 3 is provided on the upper surface 32 side of the shield portion 5.
The shielding effect can be enhanced by disposing the layer 12 made of a material having low electromagnetic wave transmittance, such as 6, a conductive layer, or a plating film.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in In the infrared data communication module shown in FIG. 2, the surface 5d inside the upper bottom 5c of the shield portion 5 between the hemispherical lens portions 6a and 6b, that is, the lower surface 31 side is the insulating layer 33. The circuit 34 is formed on the lower surface 31, the element 35 is mounted, and the outer surface 5 e of the upper bottom 5 c of the shield 5, that is, the upper surface 32 is formed of the metal plate 36. The connection between the circuit 34 formed on the lower surface 31 of the shield part 5 and the circuit 8 formed on the substrate 1 and the upper surface 32 of the shield part 5
The connection between the side metal plate 36 and the ground portion 8 a of the circuit 8 is made via a lead wire 37 led out from the lower surface 31 of the shield portion 5. With such a configuration, the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in In the infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the shield part 5 is extended obliquely downward from the light-emitting element 2 side end of the shield part 5, and the shield part 5 is extended. A rectangular heat radiating plate 38 longer than the width of the substrate 1 is joined to the end 27a of the installation portion 27 in a state orthogonal to the longitudinal direction of the substrate 1 and in a horizontal state, and the heat radiating plates 38 are provided on both outer sides of the infrared data communication module. The heat radiating mechanism 13 is configured to protrude and radiate heat generated by the light emitting element 2 to the outside of the infrared data communication module via the heat radiating plate 38. By providing the heat radiating mechanism 13 in this way, the amount of heat generated by the light emitting element 2 can be reduced, and a decrease in luminous efficiency can be prevented. In the above configuration, the cooling mechanism 14 can be configured by bringing the heat radiating plates 38 protruding from both sides of the infrared data communication module into contact with a cold heat source provided outside the infrared data communication module. In this case, the heat radiating plate 38 in contact with the cold heat source plays the role of the cooling plate 39, and can reduce the amount of heat generated by the light emitting element 2 as in the example of the heat radiating mechanism 13, thereby preventing a decrease in luminous efficiency.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 2, a partition plate 28 made of the same material as that of the shield part 5 is provided between the light emitting element 2 and the IC chip 4 inside the upper bottom 5c of the shield part 5. And a rectangular radiator plate 38 longer than the width of the substrate 1 is joined to the lower end portion 28a of the partition plate 28 in a state orthogonal to the longitudinal direction of the substrate 1 and in a horizontal state, and the radiator plate 38 is connected to the infrared data communication module. The heat radiating mechanism 13 is configured to protrude outward from both sides to radiate heat generated by the light emitting element 2 to the outside of the infrared data communication module via the heat radiating plate 38. With such a configuration, the same effect as in the above example can be expected. Further, in the above configuration, the cooling mechanism 14 can be configured by bringing the heat radiating plates 38 projecting to both outer sides of the infrared data communication module into contact with a cold heat source provided outside the infrared data communication module. The same effect can be expected.

In the examples of FIGS. 16 and 17, it is possible to use a thermoelectric cooling element for the cooling mechanism 14, and the same effect as in the above example can be expected.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This example shows a method for manufacturing an infrared data communication module. First, after forming the substrate 1, the substrate 1
A circuit 8 is formed on the upper surface 1a of the substrate 1, and the element 9 is die-bonded and wire-bonded on the circuit 8 of the substrate 1 by a fixing means such as an adhesive or solder. Next, the shield part 5 is placed in the mold.
And the element 9 and the shield part 5 are sealed with the infrared ray transmitting resin 6. By performing the insert molding of the shield part 5 in the mold in this way, the positioning at the time of installation of the shield part 5 becomes easy, and the shield part 5 can be easily sealed with resin. As a result, the productivity can be greatly improved.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This example shows a method for manufacturing an infrared data communication module. First, the concave portion 41 is formed in the substrate 1 in the longitudinal direction at the time of molding, and the shield portion 5 is formed integrally with the connecting portion 17 provided on one upper edge portion 42 of the concave portion 41. The connecting portion 17 is constituted by a hinge or a notch. In addition, the above-described configuration is also possible by insert-molding a metal plate as a shield portion 5 in a mold at the time of molding the substrate 1 and integrating the metal plate at the connecting portion 17. Next, the circuit 8 is formed on the flat portion 41a of the concave portion 41 of the substrate 1, and metal plating is applied to the entire back surface 5g of the shield portion 5, or a conductive paint is applied. Subsequently, the light emitting element 2, the light receiving element 3, and I
The C chip 4 is mounted. Then, the shield part 5 is attached to the substrate 1
The circuit 8 is rotated by 180 degrees to cover the upper surface of the circuit 8 formed on the flat portion 41a of the concave portion 41 of the substrate 1. At this time,
If the connecting portion 17 is constituted by a hinge, it can be easily rotated, and if it is constituted by a notch, it can be easily cut. Further, it is very efficient to perform this rotation step when the shield part 5 is in the mold, but it may be performed on another line. Thereafter, metal plating may be applied to the surface 5f of the shield portion 5 in order to further enhance the shielding effect. Finally, the shield part 5 and the mounted components on the circuit 8 are resin-sealed with the infrared transmitting resin 6 and the lens parts 6a and 6b are formed. As described above, the shield portion 5 is integrated with the substrate 1 on which the electronic component is mounted at the connection portion 17, and after mounting the electronic component, the shield portion 5 is rotated about the connection portion 17 to shield the electronic component. By that
Since the shield part 5 can also be molded with the same mold as the substrate 1, the number of mold production surfaces can be reduced.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This example shows a manufacturing process in which circuit formation and element mounting are performed on the shield portion 5 in a separate process. First, an insulating sheet 44 is provided on the back surface 5g of the shield portion 5 and then on the insulating sheet 44. The circuit 34 is formed, and subsequently, the element 35 is mounted on the circuit 34. As described above, by performing circuit formation and element mounting on the shield portion 5 in separate steps, a three-dimensional circuit can be easily formed.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This example also shows a manufacturing process in the case where a circuit is formed on the shield portion 5 and the device is mounted, similarly to the above-described example, and other configurations other than performing the circuit formation and the device mounting on the back surface 5g of the shield portion 5 are shown. Is the same as FIG. This manufacturing process will be described in order. First, the shield part 5 is formed on the substrate 1 in a state where the shield part 5 is integrated with the connection part 17, and then the flat part 41 a of the concave part 41 of the substrate 1 and the back surface 5 of the shield part 5 are formed.
The circuit 8 and the circuit 34 are simultaneously formed on g. Subsequent steps include the following two, depending on the location of the circuit on which the IC chip 4 is mounted. That is, as shown in FIG. 21B, after mounting the IC chip 4 on the circuit 8 formed in the flat portion 41a of the concave portion 41 of the substrate 1, the electronic component is rotated by rotating the shield portion 5 by 180 degrees around the connection portion 17. To shield,
As shown in FIG. 21 (c), after mounting the IC chip 4 on the circuit 34 formed on the back surface 5g of the shield part 5, both the one that shields the electronic parts by rotating the shield part 180 around the connecting part 17 is used. It is possible. Even with the above configuration, a three-dimensional circuit can be easily formed. The IC chip 4 may be mounted by wire bonding,
Flip-chip mounting is structurally simpler and more desirable.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This infrared data communication module has the same structure as the infrared data communication module shown in FIG.
Positioning pins 45 protrude from the four corners of the upper surface 1a, and concave portions 20 having a cross section as shown in FIG.
Then, the shield 20 is positioned and fixed on the substrate 1 by fitting the recesses 20 provided in the shield 5 to the positioning pins 45 arranged on the substrate 1. With such a configuration, the positioning of the shield portion 5 can be reliably performed, and the displacement of the shield portion 5 caused by the resin pressure during resin sealing can be prevented. The positioning pin 45
Can be electrically connected between the circuit 8 formed on the substrate 1 and the shield part 5 by using the conductive pins 19.

Next, another example of the embodiment of the present invention will be described with reference to FIG.
Shown in This infrared data communication module has the same configuration as the infrared data communication module shown in FIG. 19, except that the upper edge portion 42 of the concave portion 41 of the substrate 1 opposite to the connection portion 17 serves as the positioning portion 18 when the shield 5 is installed. Positioning pins 45 (conductive pins 19) are protruded from both ends and the center of the connector, and can be fitted with the positioning pins 45 when the shield 5 is rotated 180 degrees around the connecting portion 17 in the shield 5. A concave portion 20 is provided. With such a configuration, the same effect as in the above example can be expected, and the grounding function can be added by the conductive pin 19.

Next, another example of the embodiment of the present invention is shown in FIG.
26 to FIG. This example shows a method for manufacturing an infrared data communication module. Hereinafter, this manufacturing method will be described in order. First, the substrate 1 is formed, and the upper surface 1a of the substrate 1 is formed.
After the circuit 8 is formed, the element 9 is mounted on the circuit 8 (the arrangement of the light emitting element 2, the light receiving element 3, and the IC chip 4 is the same as in the above example). Stop,
The resin layer 47 is formed (FIGS. 24A to 24D). Next, it is divided into two types of manufacturing processes according to specifications. First, when only the light-shielding effect and the electrostatic shielding effect are sufficient, FIG.
Manufacturing steps as shown in (e) to (f) follow. FIG.
(D) Resin layer 47 sealed with infrared transmitting resin 6
Is plated on the upper surface 47a of the substrate to form a plating layer 48 having two circular holes 48a and 48b which are not plated. The plating layer 48 functions as the shield part 5. The plating layer 48 is sealed with the infrared transmitting resin 6 to form the resin layer 49 and the lens portions 6a and 6b on the upper surface 49a, thereby completing the manufacture of the infrared data communication module. Next, in addition to the above effects, when it is necessary to form a three-dimensional circuit, after the step of FIG.
Manufacturing steps as shown in FIGS. FIG.
(D) Resin layer 47 sealed with infrared transmitting resin 6
The circuit 34 and two circular holes 22a,
The circuit-formed layer 22 having 22b is laminated. Further, an insulating layer 51 having two circular holes 51a and 51b corresponding to the two circular holes 22a and 22b of the circuit-formed layer 22 is laminated on the upper surface 22c of the circuit-formed layer 22. Then, the upper surface 51c of the insulating layer 51 is plated, and the two circular holes 48a, 4
A plating layer 48 having 8b is formed. The plating layer 48 functions as the shield part 5. This plating layer 48
Is sealed with an infrared transmitting resin 6, a resin layer 49 is formed, and lens portions 6a and 6b are formed on the upper surface 49a, thereby completing the manufacture of the infrared data communication module.

As described above, the former manufacturing process (FIG. 24)
(A) to (d) and FIGS. 25 (e) to (f)), after the element 9 is mounted on the circuit 8 of the substrate 1,
a, a resin layer 47 for encapsulating the element with an infrared transmitting resin 6 is formed, and the shield portion 5 (plating layer 48) is formed on the upper surface 47a.
, The shield portion 5 can be easily formed. In addition, the latter manufacturing process (FIGS. 24A to 24D and FIGS.
In (j)), after forming the circuit 8 on the upper surface 1a of the substrate 1, the element 9 is mounted on the circuit 8, and the resin layer 47 for element sealing with the infrared transmitting resin 6 is formed on the upper surface 1a of the substrate 1. Thereafter, a method of laminating the circuit-formed layer 22 on the upper surface 47a is employed, so that a three-dimensional circuit can be easily formed.

Next, another example of the embodiment of the present invention is shown in FIG.
Shown in This example shows a method for manufacturing an infrared data communication module, in which a resin layer 47 for sealing an element with an infrared transmitting resin 6 and a through hole 2 provided in an insulating layer 51 are provided.
The other configuration and manufacturing method except for 3 are the same as the latter manufacturing process of the above example (FIGS. 26 (g) to (j)), and therefore only the main parts will be described. In this method, when the resin layer 47 for element sealing and the insulating layer 51 are laminated on the substrate 1, the resin layer 4
7, and a through hole 23 is provided in a predetermined portion of the insulating layer 51 in advance, and after laminating the resin layer 47 and the insulating layer 51,
Whether the conductive pin 19 is inserted through the through hole 23 or
Alternatively, by injecting a conductive resin or paint, the electrical connection between the plating layer 48 serving as the shield part 5 and the circuit 8 after the element mounting of the substrate 1 is achieved. With such a configuration and a manufacturing method, a three-dimensional circuit can be easily formed.

[0051]

According to the first aspect of the present invention, since the shield portion is sealed with a resin forming the lens portion, the shield portion of the conventional infrared data communication module is reduced. In comparison, the shielding part shields the vicinity of the mounted component, so that the shielding effect can be enhanced.
Further, since the shield portion is surrounded by the resin, the shield portion is hardly damaged from outside and hardly deformed, so that a highly reliable infrared data communication module can be provided. Further, since the outer shape of the infrared data communication module is formed of resin, the degree of freedom in shape design is increased.

According to the second aspect of the present invention, in addition to the effect of the first aspect, the shield portion is electrically connected to a ground portion of a circuit formed on the substrate. Therefore, in addition to the shielding effect of the shield portion, an electrostatic shielding effect can be expected.

According to the third aspect of the present invention, in addition to the effect of the first or second aspect, the shield portion shields light from the light emitting element from hitting the IC chip. With the structure, in addition to the electrostatic shielding effect, a light-shielding structure in which output light from the light emitting element does not directly hit the IC chip can be achieved, and noise generated in the IC chip can be further reduced. .

According to the invention of claim 4 of the present invention, in addition to the effect of the invention of any one of claims 1 to 3, the resin sealing the IC chip is made of an electromagnetic wave transmitting material. By using a small shielding resin, an electrostatic shielding effect and a light shielding effect can be expected, and noise generated in the IC chip can be further reduced.

According to the invention of claim 5 of the present invention, in addition to the effects of the invention of any of claims 1 to 4, the shield portion completely covers the IC chip, and
Since the C chip can be completely shielded, noise generated in the IC chip can be further reduced and an electrostatic shielding effect can be expected. Further, in this configuration, the periphery of the IC chip is not sealed with resin,
When C has a high sensitivity, the pressure at the time of resin sealing does not affect the IC performance, so that it is also excellent in protection of the IC chip.

According to the invention of claim 6 of the present invention, in addition to the effect of the invention of any one of claims 1 to 5, in addition to the effect of controlling light distribution on the surface of the infrared transmitting resin above the IC chip. By performing the micro-processing, the light distribution can be controlled so that the incident light incident on the micro-processed portion is scattered or refracted in a certain direction to deflect the incident light in an arbitrary direction. This makes it possible to reduce noise generated in the IC chip.

According to the invention of claim 7 of the present invention, in addition to the effects of the invention of any of claims 1 to 6, by forming a circuit and mounting elements on the shield portion, A circuit formation area can be increased, and a circuit for additional functions (for example, overcurrent prevention, overheat protection, etc.) other than infrared transmission / reception can be added without changing the size of the infrared data communication module.

According to the invention of claim 8 of the present invention, in addition to the effects of the invention of claim 7, a circuit is formed on the inner surface of the shield portion and the device is mounted, and the shield portion is mounted. By providing a layer made of a material having low electromagnetic wave permeability on the outer surface, the shielding effect can be enhanced, and noise can be further reduced.

According to the ninth aspect of the present invention, in addition to the effects of the first aspect, a heat radiation mechanism is provided on the light emitting element side of the shield portion. In addition, the amount of heat generated by the light emitting element can be reduced, and a decrease in luminous efficiency can be prevented.

According to the tenth aspect of the present invention, in addition to the effects of the first to ninth aspects, a cooling mechanism is provided on the light emitting element side of the shield part. In addition, the amount of heat generated by the light emitting element can be reduced, and a decrease in luminous efficiency can be prevented.

According to the eleventh aspect of the present invention, in addition to the effect of the tenth aspect, the use of a thermoelectric cooling element for the cooling mechanism allows the cooling mechanism to be configured with a simple configuration. realizable.

According to the twelfth aspect of the present invention, when the lens portion is formed of an infrared transmitting resin, the shield portion is resin-sealed to insert-mold the shield portion in the mold. Therefore, the positioning at the time of installation of the shield part is facilitated, and the shield part can be easily sealed with resin, so that the productivity can be greatly improved as compared with the conventional example.

According to a thirteenth aspect of the present invention, in addition to the effects of the twelfth aspect, the shield part is integrated with the board on which the electronic component is mounted via a connection part. By rotating the shield part around the connection part after mounting electronic components to shield the upper part of the substrate, the shield part can be molded with the same mold as the substrate, so the number of mold production surfaces can be reduced. .

According to a fourteenth aspect of the present invention, in addition to the effects of the twelfth or thirteenth aspects, after performing circuit formation and element mounting on the shield part in separate steps, By placing the shield above the IC chip, a three-dimensional circuit can be easily formed.

According to a fifteenth aspect of the present invention, in addition to the effects of the twelfth aspect, a positioning part is provided at a predetermined position of the substrate and the shield part. By positioning and fixing the shield portion above the IC chip, the positioning of the shield portion can be reliably performed, and displacement of the shield portion caused by resin pressure during resin sealing can be prevented.

According to a sixteenth aspect of the present invention, in addition to the effects of the twelfth to fifteenth aspects, there is provided a conductive layer which is electrically connected to a ground portion of a circuit formed on a substrate. The pins are erected on the substrate, and the shield portion is provided with a concave portion into which the conductive pin can be fitted. By fitting the conductive pin and the concave portion, the shield portion is set on the substrate, By electrically connecting the unit to the ground portion of the circuit formed on the substrate, it is possible to add a ground function.

According to a seventeenth aspect of the present invention, in addition to the effects of the twelfth to sixteenth aspects, a layer provided with a shield portion is laminated above the IC chip. By doing so, you can make a layer structure,
The shield can be easily formed.

According to the eighteenth aspect of the present invention, in addition to the effect of the seventeenth aspect, a circuit is formed when a layer to which a shield portion is added is laminated above the IC chip. By laminating the layers between the layer to which the shield portion is added and the IC chip, it is possible to easily form a three-dimensional circuit.

According to the nineteenth aspect of the present invention, in addition to the effects of the seventeenth aspect, when a layer having a shield portion is laminated above the IC chip, the shield portion is added. After forming a through hole in the layer between the layer and the substrate, a conductive layer for electrically connecting the shield portion of the layer where the shield portion is added to the through hole and the ground portion of the circuit formed on the substrate is formed. The electrical connection between the shield part and the substrate can be easily achieved by fitting the sex pins.

[Brief description of the drawings]

FIG. 1 shows an example of an embodiment of the present invention,
(A) is a longitudinal sectional view of the infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing, and (c) is a perspective view of the infrared data communication module after resin sealing.

FIG. 2 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing, and (c) is a perspective view of the infrared data communication module after resin sealing.

FIG. 3 shows another example of the embodiment of the present invention, and (a) to (d) are perspective views of an infrared data communication module having different shield portions before resin sealing.

FIG. 4 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing.

FIG. 5 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing.

FIG. 6 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing.

FIG. 7 shows another example of the embodiment of the present invention, and is a longitudinal sectional view of an infrared data communication module.

FIG. 8 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing.

FIG. 9 shows another example of the embodiment of the present invention, and is a longitudinal sectional view of the infrared data communication module.

FIG. 10 shows another example of the embodiment of the present invention, and is a longitudinal sectional view of an infrared data communication module.

FIG. 11 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing.

FIG. 12 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a cross-sectional view of a microfabricated portion applied to the surface of the infrared transmitting resin.

FIG. 13 shows another example of the embodiment of the present invention, and is a longitudinal sectional view of the infrared data communication module.

14A and 14B show another example of the embodiment of the present invention, in which FIG. 14A is a longitudinal sectional view of an infrared data communication module,
(B) is a bottom perspective view of the A part.

15A and 15B show another example of the embodiment of the present invention, in which FIG. 15A is a longitudinal sectional view around an IC chip mounting portion of an infrared data communication module, and FIG. It is a perspective view of a communication module.

FIG. 16 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing, and (c) is a perspective view of the infrared data communication module after resin sealing.

FIG. 17 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module,
(B) is a perspective view of the infrared data communication module before resin sealing, and (c) is a perspective view of the infrared data communication module after resin sealing.

FIG. 18 shows another example of the embodiment of the present invention, and (a) to (e) are manufacturing process diagrams of the infrared data communication module.

FIG. 19 shows another example of the embodiment of the present invention, and (a) to (e) are manufacturing process diagrams of the infrared data communication module.

FIGS. 20A to 20D show another example of the embodiment of the present invention, in which FIGS. 20A to 20D are manufacturing process diagrams of the shield portion of the infrared data communication module. FIGS.

FIGS. 21A to 21C show another example of the embodiment of the present invention, in which FIGS. 21A to 21C are manufacturing process diagrams of the infrared data communication module. FIGS.

FIGS. 22A and 22B show another example of the embodiment of the present invention, wherein FIGS. 22A and 22B are explanatory diagrams of a method of installing a shield portion of the infrared data communication module, and FIG. It is.

FIGS. 23A and 23B show another example of the embodiment of the present invention, and FIGS. 23A and 23B are explanatory diagrams of a method of installing a shield part of the infrared data communication module. FIGS.

FIG. 24 shows another example of the embodiment of the present invention, and (a) to (d) are manufacturing process diagrams of the infrared data communication module.

25 illustrates an example of a manufacturing process following the manufacturing process of the infrared data communication module in FIG. 24, and (e).
(F) is a manufacturing process diagram of the infrared data communication module.

26 shows another example of the manufacturing process following the manufacturing process of the infrared data communication module in FIG. 24, and (g)
(J) is a manufacturing process diagram of the infrared data communication module.

FIG. 27 shows another example of the embodiment of the present invention, and (a) to (e) are manufacturing process diagrams of the infrared data communication module.

FIGS. 28A and 28B show a conventional infrared data communication module. FIG. 28A is a longitudinal sectional view of the infrared data communication module, and FIG. 28B is a perspective view of the infrared data communication module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting element 3 Light receiving element 4 IC chip 5 Shield part 5d Inner surface 5e Outer surface 6 Infrared transmitting resin 6a Lens part 6b Lens part 7 Shielding resin 8 Circuit 8a Grounding part 12 Layer of material with low electromagnetic wave transmission DESCRIPTION OF SYMBOLS 13 Heat dissipating mechanism 14 Cooling mechanism 17 Connecting part 18 Positioning part 19 Conductive pin 20 Concave part 21 Layer with added shield part 22 Layer with circuit formed 23 Through hole

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kimiaki Nakata 1048 Kazumasa Kadoma, Kadoma-shi, Osaka Matsushita Electric Works, Ltd. Terms (reference) 5F041 AA21 AA43 DA13 DA20 DA25 DA46 DA57 DA83 EE11 EE24 FF14 5F088 BA03 BB01 EA06 EA09 EA20 JA03 JA06 JA20 LA01

Claims (19)

[Claims] 1. A substrate on which a circuit is formed, a light emitting element, a light receiving element, an IC chip mounted on the substrate, a shield part for shielding external light and electromagnetic waves, and a lens part. An infrared data communication module according to claim 1, wherein the shield part is sealed with an infrared transmitting resin forming a lens part. 2. The infrared data communication module according to claim 1, wherein the shield portion is electrically connected to a ground portion of a circuit formed on the substrate. 3. The light shielding element is provided with a light from a light emitting element.
3. The infrared data communication module according to claim 1, wherein the infrared data communication module has a structure that shields the chip from hitting the chip. 4. An IC chip is sealed with a shielding resin having low electromagnetic wave transmittance.
The infrared data communication module according to any one of the above. 5. The infrared data communication module according to claim 1, wherein the shield completely covers the IC chip. 6. The infrared data communication module according to claim 1, wherein fine processing for controlling light distribution is performed on a surface of the infrared transmitting resin above the IC chip. 7. The infrared data communication module according to claim 1, wherein a circuit is formed and an element is mounted on the shield part. 8. The circuit according to claim 7, wherein a circuit is formed and an element is mounted on an inner surface of the shield portion, and a layer made of a material having low electromagnetic wave permeability is provided on an outer surface of the shield portion. Infrared data communication module. 9. The infrared data communication module according to claim 1, wherein a heat radiation mechanism is provided on the light emitting element side of the shield part. 10. The infrared data communication module according to claim 1, wherein a cooling mechanism is provided on the light emitting element side of the shield part. 11. The infrared data communication module according to claim 10, wherein a thermoelectric cooling element is used for said cooling mechanism. 12. A substrate on which a circuit is formed, a light emitting element, a light receiving element, and an IC chip mounted on the substrate, a shield part for shielding external light and electromagnetic waves, and a lens part. A method of manufacturing an infrared data communication module, comprising: sealing a shield portion with a resin when molding a lens portion with an infrared transmitting resin. 13. A shield portion is integrated with a substrate on which an IC chip is mounted via a connecting portion, and after mounting the IC chip, the shield portion is rotated about the connecting portion to shield an upper portion of the substrate with the shield portion. 2. The method according to claim 1, wherein
3. The method for manufacturing the infrared data communication module according to 2. 14. The method of manufacturing an infrared data communication module according to claim 12, wherein after forming a circuit and mounting an element on the shield part in a separate process, the shield part is installed above the IC chip. Method. 15. The method for manufacturing an infrared data communication module according to claim 12, wherein a positioning portion is provided on the substrate and the shield portion, and the shield portion is positioned and fixed above the IC chip. 16. A conductive pin electrically connected to a ground portion of a circuit formed on a substrate is erected on the substrate, and a shield portion is provided with a recess in which the conductive pin can be fitted. 16. The method according to claim 12, wherein the shield portion is mounted on the substrate by fitting the concave portion, and the shield portion is electrically connected to a ground portion of a circuit formed on the substrate. A method for manufacturing the infrared data communication module described in the above. 17. The method for manufacturing an infrared data communication module according to claim 12, wherein a layer to which a shield portion is added is laminated above the IC chip. 18. The semiconductor device according to claim 18, wherein when the layer to which the shield is added is laminated above the IC chip, the layer on which the circuit is formed is laminated between the layer to which the shield is added and the IC chip. 18. The method for manufacturing an infrared data communication module according to item 17. 19. When laminating a layer to which a shield part is added above an IC chip, a through hole is formed in a layer between the layer to which the shield part is added and the substrate, and then the shield part is added to the through hole. 18. The method for manufacturing an infrared data communication module according to claim 17, wherein a conductive pin for electrically connecting the shield portion of the layer and a ground portion of a circuit formed on the substrate is fitted.