JP3807430B2 - Infrared data communication module manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an infrared data communication module used in electronic devices such as notebook computers, PDAs, and mobile phones.

  Infrared data communication enables data transmission and reception between portable information devices such as notebook computers and PDAs without cables, and is mechanically simple compared to data transmission methods using radio waves such as digital mobile phones and PHS. It has advantages such as low cost, small size, easy integration into information equipment, and no legal restrictions. In this infrared data communication module, as shown in FIG. 28, a light emitting element 2 (infrared LED), a light receiving element 3 (PD; photodiode), and an IC chip 4 are mounted on a substrate 1 on which a circuit is formed on an upper surface 1a. Sealed with resin 6. The IC chip 4 has functions of driving an infrared LED, amplifying a received light signal, shaping a waveform, and modulating / demodulating.

  By the way, the conventional infrared data communication module is a highly combined optical part, optical-electrical signal conversion part, and high-sensitivity amplification part, and is inherently less resistant to various types of noise than other electrical components. . For this reason, a structure that shields light and electromagnetic waves from the outside is required in places other than the lens portions 6a and 6b for light emission and reception. At present, a portion other than the lens portions 6a and 6b of the infrared data communication module is surrounded by a metal shield case 55 to provide a light shielding effect and an electrostatic shielding effect. However, in such a structure, the degree of freedom of the shape of the infrared data communication module is limited to the shape of the shield case 55, and the shield case 55 itself is damaged and deformed from the outside. Reliability may be reduced. Further, in the manufacturing process, there is a problem that the installation process of the shield case 55 is complicated and the productivity is poor.

  The present invention has been made in view of the above points, and has a higher shielding effect such as an electrostatic shield than conventional products, can reduce noise, and the shield part is not easily damaged from the outside. An object of the present invention is to provide an infrared data communication module that is excellent in reliability and has a high degree of freedom in shape design.

  A method of manufacturing an infrared data communication module according to claim 1 of the present invention includes a circuit board 1, a light emitting device 2, a light receiving device 3, an IC chip 4 mounted on the substrate 1, In a method for manufacturing an infrared data communication module including a shield part 5 for shielding light and electromagnetic waves, and lens parts 6 a and 6 b, the shield part 5 is connected to the substrate 1 on which the IC chip 4 is mounted and the connecting part 17. After the IC chip 4 is mounted, the shield portion 5 is rotated around the connecting portion 17 to shield the upper portion of the substrate 1 with the shield portion 5. Thereafter, the lens portions 6 a and 6 b are connected to the infrared transmitting resin 6. The shield portion 5 is resin-sealed when molded by the above method.

  According to a second aspect of the present invention, there is provided a method for manufacturing an infrared data communication module. In addition to the configuration of the first aspect, the shield portion 5 is formed as an IC chip after circuit formation and element mounting are performed in separate steps. 4 It installs in the upper part, It is characterized by the above-mentioned.

  According to a third aspect of the present invention, there is provided an infrared data communication module manufacturing method, wherein, in addition to the configuration of the first or second aspect, a positioning portion 18 is provided on the substrate 1 and the shield portion 5, and the shield portion 5 is integrated with the IC. It is characterized by being positioned and fixed above the chip 4.

  According to a fourth aspect of the present invention, there is provided an infrared data communication module manufacturing method, in addition to any one of the first to third aspects, a conductive pin 19 connected to the ground portion 8a of the circuit 8 formed on the substrate 1. Is provided on the substrate 1, and the shield part 5 is provided with a recess 20 into which the conductive pin 19 can be fitted. By fitting the conductive pin 19 and the recess 20, the shield part 5 is provided. In addition to being installed on the substrate 1, the shield portion 5 is electrically connected to the ground portion 8 a of the circuit 8 formed on the substrate 1.

  The manufacturing method of an infrared data communication module according to claim 5 of the present invention includes a substrate 1 on which a circuit is formed, a light emitting element 2, a light receiving element 3, an IC chip 4 mounted on the substrate 1, and an external In the manufacturing method of the infrared data communication module including the shield part 5 for shielding light and electromagnetic waves and the lens parts 6a and 6b, the layer 47 to which the shield part 5 is added is laminated on the IC chip 4 When the lens parts 6a and 6b are molded with the infrared transmitting resin 6, the shield part 5 is resin-sealed.

  According to a sixth aspect of the present invention, there is provided an infrared data communication module manufacturing method, wherein, in addition to the configuration of the fifth aspect, a layer formed with a circuit when the layer 47 to which the shield portion 5 is added is laminated above the IC chip 4. 22 is laminated between the IC chip 4 and the layer 47 to which the shield part 5 is added.

  The infrared data communication module manufacturing method according to claim 7 of the present invention includes the shield part 5 added when the layer 47 to which the shield part 5 is added is stacked above the IC chip 4 in addition to the structure of claim 5. After forming the through hole 23 in the layer between the formed layer 47 and the substrate 1, the shield portion 5 of the layer 47 in which the shield portion 5 is added to the through hole 23 and the ground portion of the circuit 8 formed in the substrate 1 The electroconductive pin 19 for electrically connecting with 8a is inserted, It is characterized by the above-mentioned.

  In the invention according to claim 1 of the present invention, the shield portion can be insert-molded in the mold by sealing the shield portion when molding the lens portion with an infrared transmitting resin. The positioning at the time of installing the shield part is facilitated, and the shield part can be easily resin-sealed, so that the productivity can be greatly improved as compared with the conventional example. In addition, the shield part is integrated with the board on which the electronic component is mounted via the connecting part, and after mounting the electronic part, the shield part is rotated around the connecting part to shield the upper part of the board. Since it can be molded with the same mold as the substrate, the number of mold production surfaces can be reduced.

  In addition, in addition to the effect of the invention described in claim 1, in the invention according to claim 2 of the present invention, after the circuit is formed in the shield part and the element is mounted in a separate process, the shield part is formed into an IC chip. By installing it above, a three-dimensional circuit can be easily formed.

  In addition, in addition to the effect of the invention described in claim 1 or 2, in the invention according to claim 3 of the present invention, a positioning part is provided at a predetermined position of the substrate and the shield part, and the shield part is located above the IC chip. By positioning and fixing to the shield, it is possible to reliably position the shield part and to prevent the shield part from being displaced due to the resin pressure during resin sealing.

  In the invention according to claim 4 of the present invention, in addition to the effect of the invention according to any one of claims 1 to 3, the conductive pin connected to the ground portion of the circuit formed on the substrate is provided on the substrate. The shield portion is provided with a recess into which the conductive pin can be fitted, and the shield portion is installed on the substrate at the same time by fitting the conductive pin and the recess. It is possible to add a grounding function by electrically connecting to the grounding portion of the circuit formed in the above.

  In the invention according to claim 5 of the present invention, the shield part can be insert-molded in the mold by sealing the shield part when the lens part is molded with infrared transmitting resin. Therefore, positioning at the time of installation of the shield part is facilitated, and the shield part can be easily resin-sealed, so that productivity can be greatly improved as compared with the conventional example. In addition, since a layer structure can be formed by laminating the layer to which the shield portion is added above the IC chip, the shield portion can be easily formed.

  According to the sixth aspect of the present invention, in addition to the effect of the fifth aspect, when the layer to which the shield portion is added is laminated above the IC chip, the circuit formed layer is shielded. By stacking between the layer to which the portion is added and the IC chip, a three-dimensional circuit can be easily formed.

  In the invention according to claim 7 of the present invention, in addition to the effect of the invention according to claim 5, when the layer to which the shield portion is added is laminated above the IC chip, the layer to which the shield portion is added. After forming a through hole in the layer between the substrate and the board, a conductive pin for electrically connecting the shield part of the layer with the shield part added to the through hole and the ground part of the circuit formed on the board By inserting, the electrical connection between the shield part and the substrate can be easily achieved.

  An embodiment of the present invention will be described with reference to FIGS.

  An example of an embodiment of the present invention is shown in FIG. Reference numeral 1 denotes a substrate on which an upper surface 1a is formed. First, a light emitting element 2 made of an infrared LED, a light receiving element 3 made of a photodiode, and an IC chip 4 are mounted on the upper surface 1a of the substrate 1. Subsequently, the upper part of the substrate 1 is molded with an infrared transmitting resin 6 with a mold so that the shield part 5 which is a flat metal plate is disposed above the IC chip 4 mounted on the upper surface 1 a of the substrate 1. The mounting component and the shield part 5 are sealed with resin. In this resin molding, hemispherical lens portions 6 a and 6 b are formed above the light emitting element 2 and above the light receiving element 3. The infrared transmitting resin 6 forming the hemispherical lens portions 6a and 6b is preferably an epoxy resin that cuts visible light (wavelength λ = 700 to 800 nm) and transmits infrared light. In this way, the shield part 5 is sealed with the infrared transmitting resin 6 that forms the lens parts 6a and 6b, so that the shield part 5 is made of a mounting component compared to the shield case of the conventional infrared data communication module. Since the vicinity is shielded, the shielding effect can be enhanced. In addition, since the shield part 5 is surrounded by the infrared transmitting resin 6, the shield part 5 is hardly damaged from the outside and is not easily deformed. Therefore, a highly reliable infrared data communication module can be provided. Further, since the outer shape of the infrared data communication module is formed of resin, the degree of freedom in shape design is also increased. In addition to the above, the shield part 5 may be a metal thin film and laminated on the upper surface of the IC chip 4, or an opaque resin having a shielding effect may be used.

  Next, another example of the embodiment of the present invention is shown in FIGS. The infrared data communication module shown in FIG. 2 is a box-shaped case with a full opening on the top of the substrate 1 on which the light-emitting element 2, the light-receiving element 3, and the IC chip 4 are mounted. In addition to sealing the mounting parts inside the shield part 5 and the outer peripheral surface of the shield part 5 with the infrared transmitting resin 6 so as to arrange the shield part 5 having the holes 5a and 5b, the shield part 5 is provided on the shield part 5. Lens portions 6 a and 6 b projecting in a hemispherical shape above the two circular holes 5 a and 5 b are formed of infrared transmitting resin 6. As a material of the shield part 5, a metal plate (for example, stainless steel, iron, copper, aluminum, etc.) having both a light shielding effect and an electrostatic shielding effect is desirable. In this example, since the shield part 5 has a shape that covers all but the lens parts 6a and 6b of the infrared light receiving and emitting elements 2 and 3, an electrostatic shielding effect can be expected in addition to the light shielding effect. As the shape of the shield part 5, the types (a) to (d) shown in FIG. 3 are conceivable. The shape (d) of the shield part 5 of this example is a light shielding effect and an electrostatic shielding effect. Is most effective.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the shield portion 5 is a conductor 24, and a conductor 25 led out from the end of the shield portion 5 is grounded on the circuit 8 formed on the substrate 1. This is connected to the portion 8a. By adopting such a configuration, in addition to the light shielding effect of the shield part 5, an electrostatic shielding effect can also be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the shield part 5 extends obliquely downward from the light emitting element 2 side end of the shield part 5, and the shield part 5 extends. The end portion 27 a of the installation portion 27 is connected to the ground portion 8 a of the circuit 8 formed on the substrate 1. By adopting such a configuration, in addition to the electrostatic shielding effect, a light shielding structure in which the output light from the light emitting element 2 does not directly hit the IC chip 4 can be achieved, and noise generated in the IC chip 4 is further reduced. It becomes possible to make it.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module in FIG. 2, a partition plate 28 having light shielding properties is erected between the IC chip 4 inside the upper base 5 c of the shield part 5 and the light emitting element 2, The lower end portion 28 a of the partition plate 28 is connected to the ground portion 8 a of the circuit 8 formed on the substrate 1. Even with such a configuration, the same effect as the above example can be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is an electromagnetic wave separate from the infrared transmitting resin 6 as a resin for sealing the IC chip 4 between the shield part 5 and the mounted IC chip 4 in the configuration of the infrared data communication module of FIG. A shielding resin 7 having a small permeability is provided. For the shielding resin 7, for the purpose of shielding only, an opaque resin in which a pigment or the like is mixed with PP, PE, PC, PMMA, ABS, PET, epoxy resin or the like is used for the purpose of the electrostatic shielding effect. If so, for example, a conductive opaque resin containing a metal filler is used. Even with such a configuration, an electrostatic shielding effect and a light shielding effect can be expected, and noise generated in the IC chip 4 can be further reduced.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module has the same structure as the infrared data communication module shown in FIG. 2, the infrared transmitting resin 6 as a resin that seals the IC chip 4 between the inside of the upper base 5 c of the shield 5 and the IC chip 4. Separately, a shielding resin 7 having a small electromagnetic wave permeability is provided. Even with such a configuration, the same effect as the above example can be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, when the shielding effect of the shielding resin 7 disposed between the shield part 5 and the mounted IC chip 4 is sufficiently large in the configuration of the infrared data communication module of FIG. And the shielding resin 7 is used as the shield part 5. Even with such a configuration, the same effect as the above example can be expected, and the structure can be simplified.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module has the same configuration as that of the infrared data communication module of FIG. 1, the light emitting element 2 side end of the shield 5 and the light receiving element 3 side end obliquely below the light emitting element 2 side and the light receiving element 3. The shield portion 5 is extended obliquely downward on the side, and the end portions 27a and 27a of both extended portions 27 and 27 of the shield portion 5 are connected to the ground portions 8a and 8a of the circuit 8 formed on the substrate 1. is there. With such a configuration, the IC chip 4 can be completely shielded, so that noise generated in the IC chip 4 can be further reduced and an electrostatic shielding effect can be expected. In the above configuration, the periphery of the IC chip 4 is not sealed with resin. However, when the IC has high sensitivity, the IC performance is not affected by the pressure at the time of resin sealing. Excellent in terms of protection. Of course, the periphery of the IC chip 4 surrounded by the shield part 5 may be sealed with a resin that does not affect the IC (for example, a modified acrylate or a silicon-based gel UV curable resin).

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module has the same configuration as that of the infrared data communication module of FIG. 2, between the IC chip 4 and the light emitting element 2 inside the upper base 5 c of the shield part 5, and between the IC chip 4 and the light receiving element 3. The partition plates 28 and 28 having light-shielding properties are erected, and the lower end portions 28a and 28a of the partition plates 28 and 28 are connected to the ground portions 8a and 8a of the circuit 8 formed on the substrate 1, respectively. Even with such a configuration, the same effect as the above example can be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is similar to the infrared data communication module shown in FIG. 1 as shown in FIG. 12B on the surface of the infrared transmitting resin 6 that seals the shield part 5 between the hemispherical lens parts 6a and 6b. It has been subjected to fine processing to control light distribution. By adopting such a configuration, it is possible to control light distribution so that incident light incident on the surface of the infrared-transmitting resin 6 subjected to microfabrication is scattered or refracted in a certain direction to deflect the incident light in an arbitrary direction. Therefore, it is possible to reduce noise generated in the IC chip 4 by incident light.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module is similar to the above example on the surface of the infrared transmitting resin 6 that seals the upper bottom 5c of the shield part 5 between the hemispherical lens parts 6a and 6b in the configuration of the infrared data communication module of FIG. Are subjected to fine processing for light distribution control, and the same effect as the above example can be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the inner surface 5 d of the shield portion 5, that is, the lower surface 31 side is formed with the insulating layer 33, and the circuit 34 is formed on the lower surface 31. The element 35 is mounted, and the outer surface 5 e of the shield part 5, that is, the upper surface 32 side is formed of a metal plate 36. The connection between the circuit 34 formed on the lower surface 31 of the shield part 5 and the circuit 8 formed on the substrate 1 and the connection between the metal plate 36 on the upper surface 32 side of the shield part 5 and the ground portion 8a of the circuit 8 are as follows. This is done through a lead wire 37 led out from the end of the shield part 5. With this configuration, the circuit formation area can be increased, and additional functions other than infrared transmission / reception (eg, overcurrent prevention, overheat protection, etc.) are added without changing the size of the infrared data communication module. It becomes possible. Furthermore, the shielding effect can be enhanced by disposing the metal plate 36, the conductive layer, or the layer 12 made of a material having a low electromagnetic wave permeability such as a plating film on the upper surface 32 side of the shield part 5.

  Next, another example of the embodiment of the present invention is shown in FIG. This infrared data communication module has the same structure as the infrared data communication module of FIG. The circuit 34 is formed on the lower surface 31, the element 35 is mounted, and the outer surface 5 e of the upper base 5 c of the shield part 5, that is, the upper surface 32 side is formed by the metal plate 36. The connection between the circuit 34 formed on the lower surface 31 of the shield part 5 and the circuit 8 formed on the substrate 1 and the connection between the metal plate 36 on the upper surface 32 side of the shield part 5 and the ground portion 8a of the circuit 8 are as follows. This is done through a lead wire 37 led out from the lower surface 31 of the shield part 5. Even with such a configuration, the same effect as the above example can be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 1, the shield part 5 extends obliquely downward from the light emitting element 2 side end of the shield part 5, and the shield part 5 extends. A rectangular heat sink 38 longer than the width of the substrate 1 is joined to the end portion 27a of the installation portion 27 in a state orthogonal to the longitudinal direction of the substrate 1 and in a horizontal state, and the heat sink 38 is placed on both outer sides of the infrared data communication module. The heat dissipating mechanism 13 is configured to project the heat generated from the light emitting element 2 to the outside of the infrared data communication module via the heat dissipating plate 38. By providing the heat dissipation mechanism 13 in this manner, the amount of heat generated by the light emitting element 2 can be reduced, and a decrease in light emission efficiency can be prevented. In the above configuration, the cooling mechanism 14 can also be configured by bringing the heat radiation plates 38 projecting outward on both sides of the infrared data communication module into contact with a cold heat source provided outside the infrared data communication module. In this case, the heat radiating plate 38 in contact with the cold heat source serves as a cooling plate 39, and as with the example of the heat radiating mechanism 13, the amount of heat generated by the light emitting element 2 can be reduced and the light emission efficiency can be prevented from being lowered.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module in FIG. 2, a partition plate 28 made of the same material as that of the shield part 5 is provided between the IC chip 4 inside the upper base 5 c of the shield part 5 and the light emitting element 2. A rectangular heat sink 38 longer than the width of the substrate 1 is joined to the lower end 28a of the partition plate 28 in a state perpendicular to the longitudinal direction of the substrate 1 and in a horizontal state, and the heat sink 38 is connected to the infrared data communication module. The heat dissipating mechanism 13 is configured to project outward from both sides and dissipate the heat generated by the light emitting element 2 to the outside of the infrared data communication module via the heat dissipating plate 38. Even with such a configuration, the same effect as the above example can be expected. Further, in the above configuration, the cooling mechanism 14 can be configured by bringing the heat radiation plate 38 protruding from both outer sides of the infrared data communication module into contact with a cold heat source provided outside the infrared data communication module. The same effect can be expected.

  In the examples of FIGS. 16 and 17, it is possible to use a thermoelectric cooling element for the cooling mechanism 14, and the same effect as in the above example can also be expected.

  Next, another example of the embodiment of the present invention is shown in FIG. This example shows a method for manufacturing an infrared data communication module. First, after forming the substrate 1, the circuit 8 is formed on the upper surface 1 a of the substrate 1, and the element 9 is mounted on the circuit 8 of the substrate 1 by die bonding and wire bonding using an adhesive or soldering means. Next, the shield part 5 is insert-molded in the mold, and the element 9 and the shield part 5 are sealed with an infrared transmitting resin 6. By insert molding the shield part 5 in the mold in this way, positioning at the time of installation of the shield part 5 is facilitated and the shield part 5 can be easily resin-sealed. Thus, productivity can be greatly improved.

  Next, another example of the embodiment of the present invention is shown in FIG. This example shows a method for manufacturing an infrared data communication module. First, the substrate 1 is formed with a concave portion 41 in the longitudinal direction at the time of molding, and the shield portion 5 is integrally molded continuously with the connecting portion 17 provided on one upper edge portion 42 of the concave portion 41. In addition, the connection part 17 is comprised with a hinge or a notch. The above-described configuration can also be achieved by insert-molding a metal plate into the mold as the shield portion 5 when the substrate 1 is formed, and integrating them with the connecting portion 17. Next, the circuit 8 is formed in the flat portion 41a of the concave portion 41 of the substrate 1, and the entire back surface 5g of the shield portion 5 is subjected to metal plating or a conductive paint. Subsequently, the light emitting element 2, the light receiving element 3, and the IC chip 4 are mounted on the circuit 8. Thereafter, the shield portion 5 is rotated 180 degrees toward the substrate 1 to cover the upper surface of the circuit 8 formed on the flat portion 41 a of the recess 41 of the substrate 1. At this time, if the connecting portion 17 is constituted by a hinge, it can be easily rotated, and if it is constituted by a notch, it can be easily cut. In addition, this rotation process is very efficient when performed with the shield part 5 in the mold, but may be performed on a separate line. Thereafter, in order to further enhance the shielding effect, the surface 5f of the shield part 5 may be subjected to metal plating. Finally, the shield part 5 and the mounted parts on the circuit 8 are resin-sealed with the infrared transmitting resin 6, and the lens parts 6a and 6b are formed. In this way, the shield part 5 is integrated with the substrate 1 on which the electronic component is mounted and the connecting part 17, and the electronic part is shielded by rotating the shield part 5 around the connecting part 17 after mounting the electronic part. Thus, since the shield part 5 can also be formed with the same mold as the substrate 1, the number of mold production surfaces can be reduced.

  Next, another example of the embodiment of the present invention is shown in FIG. This example shows a manufacturing process when circuit formation and element mounting are performed in a separate process on the shield part 5. First, an insulating sheet 44 is disposed on the back surface 5 g of the shield part 5, and then the insulating sheet 44 is placed on the insulating sheet 44. The circuit 34 is formed, and then the element 35 is mounted on the circuit 34. In this way, by forming a circuit and mounting an element in the shield part 5 in separate steps, a three-dimensional circuit can be easily formed.

  Next, another example of the embodiment of the present invention is shown in FIG. This example also shows a manufacturing process in the case where circuit formation and element mounting are performed on the shield part 5 as in the above example, and other configurations other than circuit formation and element mounting on the back surface 5g of the shield part 5 are shown. Is the same as FIG. This manufacturing process will be described in order. First, after the mold is formed on the substrate 1 in a state where the shield portion 5 is integrated at the connecting portion 17, the circuit 8 and the circuit 34 are simultaneously formed on the flat portion 41 a of the concave portion 41 of the substrate 1 and the back surface 5 g of the shield portion 5. To do. The following processes include the following two types depending on the location of the circuit on which the IC chip 4 is mounted. That is, as shown in FIG. 21B, after mounting the IC chip 4 on the circuit 8 formed on the flat part 41a of the concave part 41 of the substrate 1, the shield part 5 is rotated by 180 degrees about the connecting part 17 so that the electronic component is mounted. After mounting the IC chip 4 on the circuit 34 formed on the back surface 5g of the shield part 5 as shown in FIG. 21 (c), the shield part 5 is rotated 180 degrees around the connecting part 17 to mount the electronic component. Both shields are possible. A three-dimensional circuit can also be easily formed by the above configuration. Although the IC chip 4 may be mounted by wire bond mounting, the flip chip mounting is structurally simple and desirable.

  Next, another example of the embodiment of the present invention is shown in FIG. In this infrared data communication module, in the configuration of the infrared data communication module of FIG. 2, positioning pins 45 protrude from the four corners of the upper surface 1 a of the substrate 1 as positioning portions 18 when the shield 5 is installed on the substrate 1. Concave portions 20 having a cross section as shown in FIG. 22C are provided at the four corners of the upper base 5c of the shield portion 5. Then, the shield portion 5 is positioned and fixed on the substrate 1 by fitting the recess 20 provided in the shield portion 5 to the positioning pin 45 disposed on the substrate 1. With such a configuration, positioning of the shield part 5 can be ensured, and displacement of the shield part 5 caused by resin pressure during resin sealing can be prevented. In addition, by using the positioning pins 45 as the conductive pins 19, it is possible to establish electrical connection between the circuit 8 formed on the substrate 1 and the shield portion 5.

  Next, another example of the embodiment of the present invention is shown in FIG. In the configuration of the infrared data communication module of FIG. 19, this infrared data communication module is an upper edge portion 42 on the opposite side of the connection portion 17 of the concave portion 41 of the substrate 1 as the positioning portion 18 when the shield 5 is installed on the substrate 1. Positioning pins 45 (conductive pins 19) are projected from both ends and the center of the wire, and can be fitted to the positioning pins 45 when the shield portion 5 is rotated 180 degrees around the connecting portion 17 on the shield portion 5. A concave portion 20 is provided. Even with such a configuration, the same effect as in the above example can be expected, and a grounding function can be added by the conductive pin 19.

  Next, another example of the embodiment of the present invention is shown in FIGS. This example shows a method for manufacturing an infrared data communication module. Hereafter, this manufacturing method is demonstrated in order. First, the substrate 1 is formed, the circuit 8 is formed on the upper surface 1a of the substrate 1, and the element 9 is mounted on the circuit 8 (the arrangement of the light emitting element 2, the light receiving element 3, and the IC chip 4 is the same as the above example). Then, the element 9 is resin-sealed with the infrared transmitting resin 6 to form the resin layer 47 (FIGS. 24A to 24D). Next, it is divided into two manufacturing processes according to specifications. First, when only the light shielding effect and the electrostatic shielding effect are sufficient, the manufacturing process as shown in FIGS. Plating is performed on the upper surface 47a of the resin layer 47 whose elements are sealed with the infrared transmitting resin 6 of FIG. 24D, thereby forming a plated layer 48 having two circular holes 48a and 48b that are not plated. The plated layer 48 serves as the shield part 5. The plated layer 48 is sealed with the infrared transmitting resin 6 to form the resin layer 49 and the lens portions 6a and 6b are formed on the upper surface 49a, thereby completing the manufacture of the infrared data communication module. Next, in addition to the above effects, when it is necessary to form a three-dimensional circuit, a manufacturing process as shown in FIGS. 26G to 26J follows the process of FIG. The circuit 34 and the circuit-formed layer 22 having two circular holes 22a and 22b are laminated on the upper surface 47a of the resin layer 47 whose elements are sealed with the infrared transmitting resin 6 of FIG. Further, an insulating layer 51 having two circular holes 51a and 51b coinciding with the two circular holes 22a and 22b of the circuit formed layer 22 is laminated on the upper surface 22c of the circuit formed layer 22. Then, the upper surface 51c of the insulating layer 51 is plated to form a plated layer 48 having two circular holes 48a and 48b that are not plated. The plated layer 48 serves as the shield part 5. The plated layer 48 is sealed with the infrared transmitting resin 6 to form the resin layer 49 and the lens portions 6a and 6b are formed on the upper surface 49a, thereby completing the manufacture of the infrared data communication module.

  In the former manufacturing process (FIGS. 24A to 24D and FIGS. 25E to 25F) as described above, the element 9 is mounted on the circuit 8 of the substrate 1 and then the upper surface 1a of the substrate 1 is mounted. The resin layer 47 for sealing the element with the infrared transmitting resin 6 is formed on the top surface, and the shield part 5 (plating layer 48) is coated on the upper surface 47a. Therefore, the shield part 5 can be easily formed. It becomes. Further, in the latter manufacturing process (FIGS. 24A to 24D and FIGS. 26G to 26J), after the circuit 8 is formed on the upper surface 1a of the substrate 1, the element 9 is mounted on the circuit 8. Then, after the resin layer 47 for sealing the element with the infrared transmitting resin 6 is formed on the upper surface 1a of the substrate 1, the layer 22 formed with the circuit is laminated on the upper surface 47a. It can be easily performed.

  Next, another example of the embodiment of the present invention is shown in FIG. This example shows a manufacturing method of an infrared data communication module, and other configurations except the resin layer 47 for sealing the element with the infrared transmitting resin 6 and the through hole 23 provided in the insulating layer 51, and the manufacturing method are as follows. Since it is the same as the latter manufacturing process (FIGS. 26G to 26J) in the above example, only the main part will be described. In this method, when the resin layer 47 for element sealing and the insulating layer 51 are laminated on the substrate 1, the through holes 23 are provided in advance in predetermined positions of the resin layer 47 and the insulating layer 51. Then, after laminating the insulating layer 51, the conductive pin 19 is inserted into the through hole 23, or conductive resin or paint is poured into the plated layer 48 serving as the shield portion 5 and the element mounting of the substrate 1. The electrical connection with the subsequent circuit 8 is intended. With such a configuration and manufacturing method, a three-dimensional circuit can be easily formed.

BRIEF DESCRIPTION OF THE DRAWINGS It shows an example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing, (c) is resin sealing It is a perspective view of the infrared data communication module after a stop. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing, (c) is It is a perspective view of the infrared data communication module after resin sealing. The other example of embodiment of this invention is shown, (a)-(d) is a perspective view before resin sealing of the infrared data communication module in which a shield part differs. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing. The other example of embodiment of this invention is shown and it is a longitudinal cross-sectional view of an infrared data communication module. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing. The other example of embodiment of this invention is shown and it is a longitudinal cross-sectional view of an infrared data communication module. The other example of embodiment of this invention is shown and it is a longitudinal cross-sectional view of an infrared data communication module. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing. FIG. 4 shows another example of the embodiment of the present invention, in which (a) is a longitudinal sectional view of an infrared data communication module, and (b) is a sectional view of a finely processed portion provided on the surface of an infrared transmitting resin. The other example of embodiment of this invention is shown and it is a longitudinal cross-sectional view of an infrared data communication module. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is A part bottom surface perspective view. FIG. 4 shows another example of an embodiment of the present invention, where (a) is a longitudinal sectional view around the IC chip mounting portion of the infrared data communication module, and (b) is a perspective view of the infrared data communication module before resin sealing. FIG. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing, (c) is It is a perspective view of the infrared data communication module after resin sealing. It shows the other example of embodiment of this invention, (a) is a longitudinal cross-sectional view of an infrared data communication module, (b) is a perspective view of the infrared data communication module before resin sealing, (c) is It is a perspective view of the infrared data communication module after resin sealing. The other example of embodiment of this invention is shown, (a)-(e) is a manufacturing-process figure of an infrared data communication module. The other example of embodiment of this invention is shown, (a)-(e) is a manufacturing-process figure of an infrared data communication module. The other example of embodiment of this invention is shown, (a)-(d) is a manufacturing-process figure of the shield part of an infrared data communication module. The other example of embodiment of this invention is shown, (a)-(c) is a manufacturing-process figure of an infrared data communication module. It shows the other example of embodiment of this invention, (a) (b) is explanatory drawing of the installation method of the shield part of an infrared data communication module, (c) is principal part expanded sectional drawing. The other example of embodiment of this invention is shown, (a) (b) is explanatory drawing of the installation method of the shield part of an infrared data communication module. The other example of embodiment of this invention is shown, (a)-(d) is a manufacturing-process figure of an infrared data communication module. FIG. 25 shows an example of a manufacturing process subsequent to the manufacturing process of the infrared data communication module of FIG. 24, and (e) and (f) are manufacturing process diagrams of the infrared data communication module. The other example of the manufacturing process following the manufacturing process of the infrared data communication module of FIG. 24 is shown, (g)-(j) is a manufacturing process figure of an infrared data communication module. The other example of embodiment of this invention is shown, (a)-(e) is a manufacturing-process figure of an infrared data communication module. A conventional infrared data communication module is shown, (a) is a longitudinal sectional view of the infrared data communication module, and (b) is a perspective view of the infrared data communication module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Light emitting element 3 Light receiving element 4 IC chip 5 Shield part 5d Inner surface 5e Outer surface 6 Infrared transparent resin 6a Lens part 6b Lens part 7 Shielding resin 8 Circuit 8a Grounding part 12 Layer of material with small electromagnetic wave transmission DESCRIPTION OF SYMBOLS 13 Heat dissipation mechanism 14 Cooling mechanism 17 Connection part 18 Positioning part 19 Conductive pin 20 Concave part 22 Layer in which circuit was formed 23 Through hole 47 Layer to which shield part was added

Claims (7)

  Infrared data communication comprising a circuit board, a light emitting element, a light receiving element, an IC chip mounted on the circuit board, a shield part for shielding light and electromagnetic waves from the outside, and a lens part In the module manufacturing method, the shield part is integrated with the substrate on which the IC chip is mounted via the connecting part, and after the IC chip is mounted, the shield part is rotated around the connecting part to shield the upper part of the substrate with the shield part. Thereafter, when the lens part is molded with an infrared transmitting resin, the shield part is resin-sealed.   2. The method of manufacturing an infrared data communication module according to claim 1, wherein the shield part is placed above the IC chip after circuit formation and element mounting are performed in separate steps on the shield part.   The infrared data communication module manufacturing method according to claim 1, wherein a positioning part is provided on the substrate and the shield part, and the shield part is positioned and fixed above the IC chip.   A conductive pin that is electrically connected to the grounding portion of the circuit formed on the substrate is erected on the substrate, and a concave portion in which the conductive pin can be fitted is provided in the shield portion, and the conductive pin and the concave portion are fitted to each other. 4. The infrared data communication according to claim 1, wherein the shield portion is installed on the substrate, and at the same time, the shield portion is electrically connected to a ground portion of a circuit formed on the substrate. Module manufacturing method.   Infrared data communication comprising a circuit board, a light emitting element, a light receiving element, an IC chip mounted on the circuit board, a shield part for shielding light and electromagnetic waves from the outside, and a lens part An infrared data communication module characterized in that, in a module manufacturing method, after a layer to which a shield portion is added is laminated above an IC chip, the shield portion is resin-sealed when the lens portion is molded with an infrared transmitting resin. Manufacturing method.   6. The infrared data according to claim 5, wherein when the layer to which the shield portion is added is laminated above the IC chip, the layer on which the circuit is formed is laminated between the layer to which the shield portion is added and the IC chip. A method for manufacturing a communication module.   When laminating a layer with a shield part above the IC chip, after forming a through hole in the layer between the layer with the shield part and the substrate, the shield of the layer with the shield part added to the through hole 6. The method of manufacturing an infrared data communication module according to claim 5, wherein a conductive pin for electrically connecting the portion and a ground portion of a circuit formed on the substrate is inserted.

Images