JP5264963B2 - Infrared data communication module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an infrared data communication module in which a malfunction of an integrated circuit element caused by optical noise can be prevented at a low cost. <P>SOLUTION: The infrared data communication module comprises a light-emitting element 4, a light-receiving element 5, and an integrated circuit element 6 which are mounted to the surface of a substrate 3, and a molded body 9 which is integrally formed of a mold resin so as to cover the respective elements 4, 5, 6 where a shielding body 7 for preventing an influence of optical noise is formed around the integrated circuit element 6 to cover the element, and the shielding body 7 contains an oxide for blocking infrared light. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an infrared data communication module used for performing infrared data communication by an IrDA (Infrared Data Association) system.

  Conventionally, in portable information devices, notebook personal computers, and the like, infrared data communication by IrDA method is performed between these devices or peripheral devices such as printers.

  In such infrared data communication, an infrared data communication module (hereinafter simply referred to as “module”) including an infrared light emitting element and a light receiving element is used. In this module 1, as shown in FIGS. 12 and 13, a light emitting element 4, a light receiving element 5, and an integrated circuit element 6 are mounted on a substrate 3 on which a conductor pattern 2 is formed. Each of the elements 4, 5, 6 is connected to the conductor pattern 2 via a gold wire W.

  A mold body 9 made of a mold resin is formed on the surface 3 a of the substrate 3 so as to integrally cover the elements 4, 5, and 6. On the upper surface 9 a of the mold body 9, a light emitting lens portion 11 corresponding to the light emitting element 4 and a light receiving lens portion 12 corresponding to the light receiving element 5 are formed. Further, a connection terminal portion 13 (see FIG. 12) connected to an external circuit board (not shown) by solder is formed on the back surface 3b of the substrate 3. The connection terminal portion 13 is conductively connected to the conductor pattern 2 formed on the surface 3 a of the substrate 3 through a groove portion 14 formed on the side surface 3 c of the substrate 3.

  The module 1 is mounted on an external circuit board (not shown) or the like, and the circuit board is housed in, for example, a mobile phone or a notebook personal computer. In such an electronic device, there is a case where an electronic component is adversely affected by noise generated in an internal power source or the like or external noise coming from the outside. External noise includes noise caused by fluorescent light and sunlight in addition to noise caused by electromagnetic waves (excluding light).

  Here, in the integrated circuit element 6 described above, countermeasures against noise due to the electromagnetic waves may be taken depending on the configuration of an electronic circuit incorporated in the element. However, in many cases, the integrated circuit element 6 itself does not take measures against noise caused by light.

  Therefore, in the module 1, a metallic shield case 28 as shown in FIG. In the module 1, the shield case 28 blocks a noise signal due to electromagnetic waves or light, thereby avoiding the influence of noise. That is, the integrated circuit element 6 in the module 1 can prevent malfunction due to the noise.

  However, since the shield case 28 is generally expensive, there is a problem that the component cost of the module 1 increases. Further, in the manufacturing process of the module 1, since it is necessary to attach the shield cases 28 to each module 1 one by one, there is a problem that the manufacturing cost is increased.

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide an infrared data communication module that can prevent malfunction of an integrated circuit element due to optical noise at low cost. To do.

  In order to solve the above problems, the present invention takes the following technical means.

The infrared data communication module provided by the present invention is integrated with a light emitting element, a light receiving element and an integrated circuit element mounted on the surface of a substrate on which a predetermined conductor pattern is formed, and a mold resin so as to cover each element. An infrared data communication module including a molded body formed on the integrated circuit element, wherein the integrated circuit element has a whole surface except for a contact surface of the integrated circuit element with respect to the substrate, and an upper surface of the integrated circuit element. And a shield body that covers all of the wires that connect between the predetermined portions of the conductor pattern, and the shield body contains an oxide that blocks infrared light and contains optical noise to the integrated circuit element. In addition to preventing the influence, it functions as a buffer member between the integrated circuit element and the mold body .

  In a preferred embodiment, the oxide blocks and absorbs infrared light. In this case, the oxide preferably contains titanium oxide.

  In a preferred embodiment, the weight ratio of the titanium oxide in the shield body is 35 to 40%.

  In a preferred embodiment, the distance from the surface of the integrated circuit element to the surface of the shield body is at least 75 μm or more.

  In a preferred embodiment, the shield body further contains a dye for blocking visible light and carbon black for blocking part of infrared light and part of ultraviolet light.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a figure which shows the internal structure of the infrared data communication module which concerns on this invention. It is a plane perspective view of a substrate. It is a reverse view of a board | substrate. It is a figure which shows the mounting state with respect to the external circuit board of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a figure which shows the manufacturing method of an infrared data communication module. It is a perspective view of an infrared data communication module. It is a figure which shows the internal structure of the conventional infrared data communication module. It is a perspective view of the conventional infrared data communication module with which the shield case was mounted | worn.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the accompanying drawings. In the following description, FIG. 12 described in the conventional description column will be referred to again.

  FIG. 1 is a diagram showing an internal configuration of an infrared data communication module (hereinafter simply referred to as “module”) 1 according to the present embodiment. 1 and 12, the module 1 includes a substantially rectangular substrate 3, a light emitting element 4 mounted on the substrate 3, a light receiving element 5, an integrated circuit element 6, and an integrated circuit element 6 around it. A shield body 7 formed so as to cover the light emitting element 4, a protective body 8 formed for each of the light emitting element 4 and the light receiving element 5, and a mold body 9 for integrally sealing them with a mold resin. It is configured.

  FIG. 2 is a plan perspective view of the substrate 3, and FIG. 3 is a rear view of the substrate 3. The substrate 3 is made of, for example, glass epoxy resin, and a predetermined conductor pattern 2 is formed on the surface 3a thereof, and gold plating is applied to appropriate portions of the conductor pattern 2 as necessary. The conductor pattern 2 includes a conductor pattern on which the elements 4, 5, and 6 are directly mounted, a conductor pattern on which wire bonding is performed to connect the elements 4, 5, and 6.

  On the back surface 3b (see FIG. 3) of the substrate 3, a conductor pattern 2 (dummy pattern) covering almost the entire surface thereof, and a conductor pattern connected to an external circuit board (not shown) for mounting the module 1 2 is formed. A groove portion 14 having a substantially arc-shaped cross section is formed on the side surface 3 c of the substrate 3, and a conductor layer (not shown) made of plated copper is formed on the inner peripheral surface of the groove portion 14. Through this conductor layer, the conductor pattern 2 on the front surface 3a of the substrate 3 and the connection terminal portion 13 on the back surface 3b are electrically connected.

  In addition, in appropriate regions on the front surface 3a and the back surface 3b of the substrate 3, called a green resist, an insulating layer (not shown) for protecting them is formed. This insulating layer covers a portion other than the portion that should be exposed to the outside. For example, the connection terminal portion 13 is joined to an external circuit board (not shown) via a solder fillet. Not covered by an insulating layer.

  The light emitting element 4 is formed of a light emitting diode or the like, and is mounted on a predetermined region 2A of the conductor pattern 2 on which one end of the surface 3a of the substrate 3 is plated. The top surface of the light emitting element 4 is connected to a predetermined conductor pattern 2 by wire bonding with a gold wire W.

  The light receiving element 5 is composed of a PIN photodiode or the like, and is mounted on a predetermined region 2B of the conductor pattern 2 on the other end side of the surface 3a of the substrate 3. The upper surface of the light receiving element 5 is connected to a predetermined conductor pattern 2 by wire bonding using a gold wire W.

  The integrated circuit element 6 controls transmission / reception operations by the light emitting element 4 and the light receiving element 5, and is mounted on a predetermined region 2 </ b> C of the conductor pattern 2 located at the center of the surface 3 a of the substrate 3. The upper surface of the integrated circuit element 6 is wire-bonded with a gold wire W and connected to a predetermined conductor pattern 2. Although not shown in detail, the integrated circuit element 6 is connected to the light emitting element 4 and the light receiving element 5 by the gold wire W and the conductor pattern 2. In the integrated circuit element 6 in the present embodiment, measures are taken to avoid noise due to electromagnetic waves due to the configuration of the electronic circuit incorporated in the element.

  Returning to FIG. 1, the shield body 7 is for preventing malfunction due to optical noise in the integrated circuit element 6, and the shield body 7 will be described later.

  The protector 8 is made of a translucent resin such as a silicone resin, for example, and is formed by applying a gelled silicone resin to each of the elements 4 and 5 and heating and solidifying at a predetermined temperature. The protector 8 is formed around the light emitting element 4 so as to cover the gold wire W connected thereto. The protector 8 is formed so as to cover the upper surface of the light receiving element 5. The protective body 8 formed in this way has rubber properties and can relieve stress due to the mold resin of the mold body 9.

  The mold body 9 is made of, for example, an epoxy resin thermosetting resin containing a pigment, and integrally seals the shield body 7 covering the integrated circuit element 6 and the protective body 8 formed for the elements 4 and 5. It is formed to stop. A light emitting lens portion 11 and a light receiving lens portion 12 are formed on a surface 9 a corresponding to the light emitting element 4 and the light receiving element 5 on the upper surface of the mold body 9. The mold body 9 has no translucency for visible light, but has translucency for infrared light.

  Here, the shield body 7 which is a feature of the present embodiment will be described. The shield body 7 is formed so as to cover the periphery of the substantially rectangular parallelepiped integrated circuit element 6 mounted on the substrate 3 in order to prevent the influence of optical noise. Specifically, the shield body 7 is formed so as to cover all of the upper surface 6a and the four side surfaces 6b excluding the periphery of the integrated circuit element 6, that is, the contact surface of the integrated circuit element 6 with the substrate 3.

  The shield body 7 is formed by applying a light shielding resin and solidifying by heating at a predetermined temperature. This light-shielding resin comprises, for example, an epoxy resin as a thermosetting resin as a main component, an oxide for blocking and absorbing part of infrared light, a dye for blocking and absorbing visible light, and ultraviolet light. Carbon black which is a black pigment for blocking and absorbing part of infrared light and part of infrared light is contained. As the oxide, for example, titanium oxide is used, and as the dye, an azo dye containing an organic pigment generally used for coloring fibers or the like is used. Specific weight ratios of the light-shielding resin are, for example, 25 to 35% by weight for epoxy resin, 35 to 40% by weight for titanium oxide, 0.5% by weight for dye, and 0.5 to 1 for carbon black. 0.5% weight ratio, 25-35% weight ratio for curing agent, and remaining weight ratio for other materials.

  The shield body 7 can block and absorb light having a wavelength of about 100 to 1200 nm. For example, visible light having a wavelength of about 300 to 780 nm is blocked and absorbed by the dye, and infrared light having a wavelength of about 780 to 1000 nm is blocked and absorbed by titanium oxide. Then, ultraviolet light having a wavelength of about 100 to 300 nm and infrared light having a wavelength of about 1000 to 1200 nm are blocked and absorbed by carbon black. That is, carbon black blocks and absorbs part of ultraviolet light and part of infrared light due to its excellent endothermic property.

  The shield body 7 is formed with a thickness of 50 μm or more and 300 μm or less. That is, as shown in FIG. 1, the shield body 7 is formed in a substantially elliptical spherical shape. In this case, the distance from the surface of the integrated circuit element 6 to the surface of the shield body 7 should not be smaller than at least 75 μm. Has been. The above-mentioned distance is obtained as a thickness capable of blocking the optical noise by the inventor's experiment. With such a configuration, the shield body 7 completely prevents the optical noise from entering the integrated circuit element 6. Can contribute to blocking.

  As described above, according to the shield body 7, light having a wavelength of about 100 to 1200 nm can be cut off and absorbed, so that optical noise in the wavelength region can be effectively cut off, and the integrated circuit element 6 Light noise will not reach. Therefore, since the integrated circuit element 6 operates stably without being erroneously affected by the influence of optical noise, the light emitting element 4 and the light receiving element 5 can be controlled well. Therefore, the module 1 with high reliability can be provided.

  Further, since the shield body 7 is used, the shield case 28 (see FIG. 14) for preventing the influence of external noise, which is mounted on the module 1 in the conventional configuration, becomes unnecessary. For this reason, according to the present embodiment, the shield case 28 that is relatively expensive can be omitted by the shield body 7, so that the component cost can be reduced. Further, since the process for mounting the shield case 28 on the module 1 can be omitted in the manufacturing process, the manufacturing time can be shortened and the operation cost can be reduced. Furthermore, the shield case 28 is somewhat heavy because it is made of metal, but by adopting the shield body 7 made of resin or the like instead of the shield case 28, the module 1 can be reduced in weight, Handling becomes easy.

  Further, the integrated circuit element 6 is covered with the shield body 7 and further covered with the mold body 9. Therefore, when the mold body 9 is formed, for example, even if the mold body 9 expands and contracts somewhat, the shield body 7 between the integrated circuit element 6 and the mold body 9 serves as a buffer member. Function. Therefore, the shield body 7 has a function of protecting the integrated circuit element 6 as well as the protection body 8 formed for the light emitting element 4 and the light receiving element 5, and sufficiently functions as a substitute for the protection body 8. It can be demonstrated.

  Note that the materials constituting the shield body 7 and the composition ratios thereof are not limited to the above-described materials and composition ratios as long as they can block and absorb light having the above wavelengths. Further, the translucent resin forming the shield body 7 may contain at least an oxide for blocking infrared light and a dye for blocking visible light. Since these oxides and dyes can block wavelengths of about 300 to 1000 μm, the influence of optical noise in this wavelength region can be avoided.

  The module 1 having such a configuration is used by being mounted on an external circuit board C as shown in FIG. Specifically, the module 1 is arranged so that the back surface 3b of the substrate 3 is perpendicular to the mounting surface of the external circuit board C, that is, the light emitting element 4 and the light receiving element 5 (not shown in FIG. 4). ) Is mounted so that the direction of light emission and emission is parallel to the mounting surface of the external circuit board C. More specifically, the solder fillet F is formed between the connection terminal portion 13 and the groove portion 14 on the back surface 3b of the substrate 3 and the wiring pattern P formed on the mounting surface of the external circuit substrate C. The module 1 is connected to an external circuit board C by soldering.

  In addition, data communication by infrared rays is performed by being arranged opposite to other modules of the counterpart device (not shown). That is, the light emitting element 4 converts an electrical signal sent from the integrated circuit element 6 into an optical signal, and emits infrared light as the optical signal to the outside. On the other hand, the light receiving element 5 converts infrared light as an optical signal received from the outside into an electric signal and supplies it to the integrated circuit element 6.

  Next, a method for manufacturing the module 1 will be described. In this manufacturing method, as shown in FIG. 5, a sheet-like collective substrate 18 extending in a strip shape is used. The collective substrate 18 has a size that allows a large number of modules 1 to be arranged, and a region 19 having a certain size is partitioned vertically and horizontally corresponding to each module 1. Engagement holes 20 for fixing the collective substrate 18 are formed on both sides of the collective substrate 18 as needed in the manufacturing process of the module 1. In the collective substrate 18, a slit 21 extending in the vertical direction for preventing warpage of the collective substrate 18 is formed for each predetermined number of regions 19.

  FIG. 6 is an enlarged view of the region 19 of FIG. As shown in FIG. 6, in each region 19, a predetermined conductor pattern 2 is formed on the front surface and the back surface of the collective substrate 18 by a known photolithography method. That is, a resist material is applied to the collective substrate 18 having a copper foil on the surface, exposed and developed using a mask (not shown) on which a desired pattern is drawn, and unnecessary portions of the copper foil are etched away. By removing, the conductor pattern 2 is formed. Thereafter, for each region 19, an appropriate number of through holes 22 that finally become the groove portions 14 for conducting the front and back surfaces of the collective substrate 18 are formed. The through hole 22 may be formed before the conductor pattern 2 is formed.

  Next, an insulating layer is formed on the front surface and the back surface of the collective substrate 18 to cover portions other than those that should be exposed to the outside. Also in this case, an insulating layer formed in advance on the entire surface of the collective substrate 18 by using a photolithography method, for example, using a mask (not shown) having a window hole corresponding to the exposed portion of the conductor pattern 2. An opening is formed in the insulating layer by performing exposure processing and then developing.

  Next, as shown in FIG. 7, the light emitting element 4, the light receiving element 5, and the integrated circuit element 6 are respectively mounted on the predetermined areas 2 </ b> A, 2 </ b> B, and 2 </ b> C of the conductor pattern 2 for each area 19 on the collective substrate 18. Then, wire bonding is applied to each element 4, 5, 6.

  After that, as shown in FIG. 8, a shield body 7 is formed on the integrated circuit element 6 so as to cover it. For this, a light-shielding resin for the shield body 7 prepared in advance is used. That is, the light-shielding resin includes, for example, an epoxy resin, titanium oxide for blocking and absorbing part of infrared light, a dye for blocking and absorbing visible light, part of ultraviolet light and infrared light. It is produced by mixing carbon black for blocking and absorbing a part at a predetermined weight ratio.

  Then, the light shielding resin is supplied to the integrated circuit element 6 by using a nozzle (not shown) capable of discharging the gel light shielding resin. In this case, the upper surface 6a and the four side surfaces 6b of the integrated circuit element 6 and the gold wire W connected to the integrated circuit element 6 are coated so as to be covered with a light shielding resin. Thereafter, the applied light shielding resin is solidified by heating at a predetermined temperature, and the shield body 7 is formed so that the thickness thereof is at least 75 μm or more.

  Next, a protector 8 is formed on the light emitting element 4 and the light receiving element 5 so as to cover them. For this, a nozzle (not shown) capable of discharging a gel-like silicone resin is used to supply silicone resin to each element 4, 5, and each element 4, 5 and the gold wire W connected thereto are Apply so that it is covered with silicone resin. Thereafter, the applied silicone resin is solidified by heating at a predetermined temperature, and the protective body 8 is formed.

  When the silicone resin is solidified, it may be solidified by heating simultaneously with the light-shielding resin after the light-shielding resin is applied to the shield body 7. Further, the protective body 8 may be formed so as to slightly overlap the shield body 7. Conversely, the shield body 7 may be formed so as to slightly overlap the protection body 8 so as not to cover the upper surface of the light emitting element 4 or the light receiving element 5.

  Next, as shown in FIGS. 9 and 10, a mold body 9 is formed by transfer molding for each region 19 using an epoxy resin. For this, the predetermined molds 24 and 25 are mounted so as to be sandwiched from above and below the collective substrate 18. Then, by flowing and solidifying the fluidized epoxy resin into the cavity 26 by the molds 24 and 25, the shield body 7 and the respective protection bodies 8 formed on the collective substrate 18 are integrally molded. A substantially hemispherical light emitting lens portion 11 and a light receiving lens portion 12 are formed on the upper surface 9a of the mold body 9, respectively.

  Thereafter, the collective substrate 18 is cut vertically and horizontally to obtain a single module 1. Specifically, the cut region shown in the hatched portion A of FIG. 11 is cut using a predetermined blade (not shown), so that the collective substrate 18 is cut along the horizontal direction, and a horizontally long intermediate product is obtained. obtain. Next, a horizontally long intermediate product is cut in the vertical direction by cutting the cut region indicated by the hatched portion B in FIG. As described above, a large number of modules 1 can be obtained by cutting the collective substrate 18 vertically and horizontally. Thus, according to this manufacturing method, by using the collective substrate 18, the module 1 of this embodiment can be manufactured in large quantities at a time, so that the manufacturing cost can be reduced.

  The module 1 manufactured as described above is mounted on the above-described external circuit board C or the like and used for a mobile phone, a notebook personal computer, or the like.

  Of course, the scope of the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Infrared data communication module 2 Conductor pattern 3 Substrate 4 Light emitting element 5 Light receiving element 6 Integrated circuit element 7 Shield body 8 Protective body 9 Mold body

Claims (6)

Infrared data comprising a light emitting element, a light receiving element and an integrated circuit element mounted on the surface of a substrate on which a predetermined conductor pattern is formed, and a mold body integrally formed of a mold resin so as to cover each element. A communication module,
Around the integrated circuit device, the integrated and the total surface except the contact surface circuit with respect to the substrate of the device, the shield member which covers all the wires for connecting the predetermined portion of the upper surface and the conductor pattern of the integrated circuit device Is formed,
The shield body contains an oxide that blocks infrared light to prevent the influence of optical noise on the integrated circuit element, and functions as a buffer member between the integrated circuit element and the mold body. An infrared data communication module.   The infrared data communication module according to claim 1, wherein the oxide blocks and absorbs infrared light.   The infrared data communication module according to claim 2, wherein the oxide includes titanium oxide.   The infrared data communication module according to claim 3, wherein a weight ratio of the titanium oxide in the shield body is 35 to 40%. 5. The infrared data communication module according to claim 1, wherein a distance from a surface of the integrated circuit element to a surface of the shield body is at least 75 μm or more. The said shield body contains the dye for interrupting | blocking visible light, and the carbon black for interrupting | blocking a part of infrared light and a part of ultraviolet light in any one of Claim 1 thru | or 5 Infrared data communication module.

Images