CN109600982B - Local shielding method suitable for DC-DC driving and PCB layout structure - Google Patents
Local shielding method suitable for DC-DC driving and PCB layout structure Download PDFInfo
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- CN109600982B CN109600982B CN201910066275.8A CN201910066275A CN109600982B CN 109600982 B CN109600982 B CN 109600982B CN 201910066275 A CN201910066275 A CN 201910066275A CN 109600982 B CN109600982 B CN 109600982B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 133
- 229910052751 metal Inorganic materials 0.000 claims abstract description 133
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 13
- 235000014676 Phragmites communis Nutrition 0.000 claims description 26
- 239000003990 capacitor Substances 0.000 claims description 16
- 210000000078 claw Anatomy 0.000 claims description 13
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a local shielding method suitable for DC-DC driving and a PCB layout structure, which are characterized in that a DC-DC driving chip and a main inductor connected with the switch signal output of the DC-DC driving chip are adjacently arranged on a PCB, a metal baffle is arranged above part or all of the main inductor, or a metal baffle is arranged in the area above all of the main inductor and the DC-DC driving chip, a copper exposing pad with grounding polarity is arranged on the PCB in a PCB wiring mode, and a metal grounding connecting piece is connected on the copper exposing pad in a welding mode, so that the metal baffle and the metal grounding connecting piece are mechanically fixed and electrically connected. The invention can greatly reduce the space occupied by the shielding cover while ensuring the EMC shielding effect, and simultaneously save the material required by the metal shielding cover.
Description
Technical Field
The invention relates to a method for realizing local electromagnetic shielding of a PCB (printed Circuit Board) and a corresponding PCB layout, which are mainly used for an LED driving module for a vehicle, and particularly aim at a DC-DC driving module circuit of the LED for the vehicle.
Background
The LED car lamp can play a role in lighting or signal prompt in the driving process, and plays a key role in driving safety. With the development of technology, more and more electronic devices are in an automobile, and with the increase of the electronic devices, the complex electromagnetic compatibility problem is brought. How to design the electronic circuit and the PCB layout of the LED module is important for the electromagnetic compatibility of the LED module.
At present, the power and high-power LED light sources in the car light industry are powered by adopting DC-DC type LED drive, and the DC-DC type LED drive is easy to interfere external radiation electromagnetic interference and is not beneficial to rectifying and modifying an electromagnetic compatibility test. The conventional EMC rectification method is: the whole LED driving module is externally covered with a grounded metal shielding cover, the metal shielding cover is provided with a plurality of pins, the pins are inserted into a hole groove structure reserved on the PCB, the bonding pads around the hole groove are designed to be ground polarity, and the metal shielding cover is welded on the PCB in a welding mode and communicated with the ground polarity, so that the DC-DC type LED driving device can shield external radiation noise. The common metal shielding case is to cover a whole PCB, and the metal shielding case generally needs a large volume and has a large amount of metal materials. The conventional metal shielding case is often not suitable for some special assembly conditions, such as the LED driving module 1 for a vehicle lamp shown in fig. 1, and because the optical lens 2 needs to be tightly installed above the LED driving module, there is no space for installing an integral metal shielding case on the LED driving module.
Disclosure of Invention
The invention aims to provide a local shielding method suitable for DC-DC driving and a PCB layout structure, which can greatly reduce the occupied space of a shielding case while ensuring EMC shielding effect and simultaneously save the materials required by a metal shielding case.
The main technical scheme of the invention is as follows:
a local shielding method suitable for DC-DC driving is characterized in that a DC-DC driving chip and a main inductor connected with the switching signal output of the DC-DC driving chip are adjacently arranged on a PCB, a metal baffle is arranged above part or all of the main inductor, or a metal baffle is arranged in an area above all of the main inductor and the DC-DC driving chip, a copper exposing pad with grounding polarity is arranged on the PCB in a PCB wiring mode, and a metal grounding connecting piece is connected on the copper exposing pad in a welding mode, so that the metal baffle and the metal grounding connecting piece are mechanically fixed and electrically connected.
An output filter capacitor is disposed on the PCB adjacent to the DC-DC driver chip and the main inductor.
The DC-DC driving chip and the output filter capacitor are respectively adjacent to the main inductor, and the three positions are preferably distributed and the wiring current loop is triangular.
The metal baffle plate can be simultaneously covered above the main inductor, the output filter capacitor and the DC-DC driving chip.
The metal baffle is L-shaped, the exposed copper pads are arranged at a position adjacent to the main inductor, the vertical edges of the metal baffle and the metal grounding connecting piece are mechanically fixed and electrically connected at the same time, or the metal baffle is door-shaped, the exposed copper pads are respectively arranged at two opposite sides adjacent to the areas where the main inductor and the DC-DC driving chip are located, and the two vertical edges of the metal baffle are respectively and mechanically fixed and electrically connected with the metal grounding connecting piece on one exposed copper pad, which is equivalent to that the metal baffle spans over the main inductor and the DC-DC driving chip.
The metal grounding connecting piece adopts a metal grounding reed, at least one spring buckle structure is arranged on the metal grounding reed, the vertical edge of the metal baffle plate is inserted into the spring buckle structure, and the metal baffle plate is clamped by utilizing the elasticity of the spring buckle structure, so that the metal baffle plate and the metal grounding reed are relatively fixed and electrically connected.
The elastic buckle structure is composed of two symmetrically arranged claw pieces, the outward extending ends of the two claw pieces are outwards bent and outwards stretched, and in a natural state, the shortest distance between the two claw pieces is smaller than the thickness of the vertical edge of the metal baffle.
Preferably, circular protruding points are arranged on the surfaces of the two claw sheets of the elastic buckle structure, which face each other, and correspondingly, circular concave points which can be matched with the circular protruding points are arranged on the vertical edge surfaces of the metal baffle plates.
The metal grounding reed is provided with two elastic buckling structures, and the round concave points on the surface of the corresponding vertical edge of the metal baffle are also provided with two concave points and are respectively arranged on the two side surfaces of the corresponding vertical edge.
The utility model provides a local shielding PCB overall arrangement structure suitable for DC-DC drive, includes metal baffle, PCB and arranges DC-DC drive chip, output filter capacitor and the connection on the PCB DC drive chip's the main inductance of switching signal output, be equipped with the copper pad that exposes on the PCB, the copper pad that exposes passes through PCB wiring ground connection polarity, the welding is connected metal ground connection spare on the copper pad that exposes, the position and the mode of setting of above-mentioned each component are arranged according to arbitrary one of the aforesaid local shielding method.
The metal grounding reed is preferably made of phosphor bronze, and the surface layer is treated by tin plating.
The metal baffle plate and the top surface of the component shielded by the metal baffle plate are preferably kept at a distance of 0.5mm-5 mm.
The beneficial effects of the invention are as follows:
the invention solves the problem that under a certain special lamp body assembly structure, the DC-DC type LED driving module cannot be provided with the integral metal shielding cover to shield external radiation noise, and is particularly suitable for lamp body structures in which some LED driving modules are tightly matched with a light source and an optical structural member.
The invention also solves the problems of large metal materials and large occupied space of the whole shielding cover.
The method is convenient in installation process, is beneficial to after-sales maintenance of the module, does not need to be like an integral metal shielding cover module, and can repair a circuit after the metal shielding cover is detached.
The invention has better EMC shielding effect, can be matched with common inductance equivalent replacement shielding inductance with complete inductance value series to carry out circuit design, has large choice of inductance value, greatly facilitates inductance type selection work and greatly reduces circuit design cost.
Drawings
FIG. 1 is a schematic diagram of an LED drive module for a vehicle lamp in an azimuthal relationship with an optical lens mounting;
FIG. 2 is a schematic layout of key components on the PCB;
FIG. 3 is a schematic view of an embodiment of the metal baffle arrangement;
FIG. 4 is a schematic view of another embodiment of the arrangement of the metal shutters;
figure 5 is a schematic diagram of an embodiment of the metallic grounding reed;
FIG. 6 is a schematic structural view of an embodiment of the metal baffle.
Reference numerals: an LED driving module; 1-1.Pcb; a DC-DC driving chip; 1-3, a main inductor; 1-4, outputting a filter capacitor; 1-5, exposing a copper bonding pad; 1-6, a metal baffle plate; 1-61, circular pits; 1-7, a direct-insert type welding connector; 1-8, a metal grounding reed; 1-81, clamping jaws; 1-82. Round bumps; 1-83, welding pins; 1-9, sealing rubber rings; 1-10, a radiator; 2. an optical lens.
Detailed Description
As shown in fig. 2-6, the present invention discloses a local shielding method suitable for DC-DC driving, which is to arrange a DC-DC driving chip 1-2 and a main inductor 1-3 connected to a switching signal output pin SW of the DC-DC driving chip on a PCB1-1 adjacently, so that a wiring from the switching signal output pin SW to the main inductor of an LED driving IC is as short as possible. And arranging metal baffles 1-6 above part or all of the main inductor or arranging metal baffles in all upper areas of the main inductor and the DC-DC driving chip, arranging rectangular copper exposing bonding pads 1-5 with grounding polarity on the PCB in a PCB wiring mode, and connecting metal grounding connecting pieces on the copper exposing bonding pads in a welding mode so as to enable the metal baffles and the metal grounding connecting pieces to be mechanically fixed and electrically connected and enable the metal baffles to be grounded.
The DC-DC driving chip and the main inductor are main components for generating high-frequency switching signals and are main interference sources of electromagnetic radiation. By providing the metal baffles in part or all of their upper regions, electromagnetic radiation is shielded to reduce their external radiation interference. Because the metal baffle only shields the area where the high-frequency switch node is located on the PCB instead of the whole PCB, the electromagnetic shielding effect is achieved, the occupied space for shielding is reduced, the electromagnetic shielding device is more flexible to use, the EMC shielding requirement of a compact structure can be met, the effective shielding of external radiation noise of the DC-DC type LED driving module can be realized under a certain special lamp body assembly structure, and meanwhile, the metal quantity for shielding is obviously reduced compared with that of a traditional metal shielding cover.
The specific positions of the large area and the shielding area shielded by the metal baffle can be determined according to EMC test results.
The metal baffle plate is preferably spaced from the top surface of the one to be shielded by a distance of 0.5mm to 5 mm.
The output filter capacitor is also an integral part of the loop of the high frequency switching node, and it is further preferred that the output filter capacitor 1-4 is arranged on the PCB at a position adjacent to the DC-DC driving chip 1-2 and the main inductor 1-3 in order to compress the loop generating the high frequency switching node as small as possible.
In the embodiment shown in the drawings, the DC-DC driving chip and the output filter capacitor are preferably arranged on one side adjacent to the main inductor respectively, so that the three positions are distributed and the wiring current loop is triangular, the arrangement is most compact, and the switching noise loop formed by the high-frequency voltage signal can be minimized.
In the case where the main inductor, the output filter capacitor and the DC-DC driver chip are disposed adjacently, it is still preferable to mask the metal shutter over part or all of the main inductor or over the entire upper region of the main inductor and the DC-DC driver chip. Second, the main inductor, the output filter capacitor and the DC-DC driving chip may be masked at the same time.
The metal baffle may be L-shaped (see fig. 3) or gate-shaped (see fig. 4). When the metal baffle is L-shaped, the copper exposing bonding pad can be arranged at one position adjacent to the main inductor, and the vertical edge of the metal baffle and the metal grounding connecting piece are mechanically fixed and electrically connected. When the metal baffle plate is in a door shape, at least two parts of the exposed copper plate are respectively arranged adjacent to two opposite sides of the area where the main inductor and the DC-DC driving chip are located, and two vertical edges of the metal baffle plate are respectively and mechanically fixed with the metal grounding connecting piece on one exposed copper plate and are simultaneously and electrically connected, which is equivalent to the fact that the metal baffle plate shields the main inductor and the DC-DC driving chip simultaneously.
And the vertical edge of the metal baffle plate is electrically connected with the metal grounding connecting piece to realize the grounding of the metal baffle plate.
The metal grounding connecting piece is preferably a metal grounding reed 1-8, at least one elastic buckling structure is arranged on the metal grounding reed, the vertical edge of the metal baffle plate is inserted into the elastic buckling structure, and the metal baffle plate is clamped by utilizing the elasticity of the elastic buckling structure, so that the metal baffle plate and the metal grounding reed are relatively fixed and connected with grounding polarity.
The elastic buckling structure is composed of two symmetrically arranged claw pieces 1-81, the claw pieces are elastic in metal, the outward extending ends of the two claw pieces are outwards bent and outwards stretched, and in a natural state, the shortest distance between the two claw pieces is smaller than the thickness of the vertical edge of the metal baffle plate, so that the vertical edge of the metal baffle plate can be tightly buckled in the metal grounding reed. Further structural description of the metallic grounding reed of the embodiment shown in fig. 5 will be seen in the detailed description hereinafter.
The invention also discloses a local shielding PCB layout structure suitable for DC-DC driving, which is a specific implementation of the local shielding method suitable for DC-DC driving, and comprises a metal baffle plate 1-6, a PCB1-1, a DC-DC driving chip 1-2 arranged on the PCB, an output filter capacitor 1-4 and a main inductor 1-3 connected with the switch signal output of the DC-DC driving chip, as shown in fig. 2-6. Rectangular copper-exposed bonding pads 1-5 with grounding polarities are arranged on the PCB in a PCB wiring mode, and metal grounding connectors are welded on the copper-exposed bonding pads. The arrangement positions and modes of the components are arranged according to any one of the local shielding methods.
The LED driving module can further comprise a heat dissipation rubber cushion, a heat radiator 1-10, a sealing rubber ring 1-9, screws, an in-line welding connector 1-7 and other electronic components on the PCB. The direct-insert type welding connector is welded on the PCB with the components in a welding mode, and penetrates through a connector guide opening (a rectangular hole allowing the connector to pass through is dug in the guide opening) of the radiator to be connected to the outside. The heat dissipation rubber cushion is adhered to the surface of the radiator, the PCB is placed on the heat dissipation rubber cushion and is fastened with the radiator through two screws, and after fastening, the heat dissipation rubber cushion is attached and clamped between the PCB and the radiator platform.
Circular protruding points 1-82 are preferably arranged on two surfaces of the two claw pieces of the elastic buckle structure on the metal grounding reed, which are opposite to each other, and are used for clamping vertical edges of the metal baffle to be installed subsequently. The surface of the corresponding vertical edge of the metal baffle plate is provided with circular concave points 1-61 which can be matched with the circular convex points, and the circular concave points are used for being matched with the circular convex points on the metal grounding reed when being installed, so that the vertical edge of the metal baffle plate is conveniently clamped in the metal grounding reed.
The metal grounding reed is preferably provided with two elastic buckling structures, and correspondingly, the surface of the corresponding vertical edge of the metal baffle is preferably provided with two circular concave points which respectively correspond to the circular convex points on one elastic buckling structure. Further, the two circular concave points on the same vertical edge are preferably respectively arranged on the two side surfaces of the corresponding vertical edge, as shown in fig. 6, so that the metal baffle plate and the metal reed can be matched and fixed more tightly by matching with the circular convex points on the two positions of the metal reed. The circular pits may be formed by stamping.
The thickness of the metal baffle is preferably greater than 0.1mm.
The metal grounding reed is preferably made of phosphor bronze, and the surface layer is preferably treated by tin plating.
The two sides of the metal grounding reed are provided with welding pins 1-83 which are used for welding the metal grounding reed on a copper-exposed bonding pad with grounding polarity on the PCB.
Experiments prove that the DC-DC type LED driving module has good performance in EMC electromagnetic compatibility experiments by combining excellent circuit layout with the arrangement of the shielding metal baffle, the shielding effect is similar to the whole shielding effect of the existing shielding cover, the space occupation required by the shielding cover can be greatly reduced while the EMC shielding effect is ensured, and meanwhile, the material required by metal shielding is saved.
In addition, on the premise of adopting the method and the layout structure, the shielding inductor with complete inductance value series and small optional margin can be used for circuit design in a matching way, thereby bringing great convenience to circuit design work, solving the problem that the shielding inductor with a certain inductance value must be used for certain special circuit characteristics and being unavailable, and reducing the circuit cost and the circuit design cost.
Claims (10)
1. A local shielding method suitable for DC-DC driving, characterized by:
arranging a DC-DC driving chip and a main inductor connected with a switching signal output of the DC-DC driving chip adjacently on a PCB, arranging a metal baffle above part or all of the main inductor, or arranging a metal baffle in an area above all of the main inductor and the DC-DC driving chip, arranging a copper-exposed bonding pad with grounding polarity on the PCB in a PCB wiring mode, and connecting a metal grounding connecting piece on the copper-exposed bonding pad in a welding mode to ensure that the metal baffle and the metal grounding connecting piece are mechanically fixed and electrically connected;
disposing an output filter capacitor on the PCB adjacent to the DC-DC driver chip and the main inductor;
the DC-DC driving chip and the output filter capacitor are respectively adjacent to the main inductor, so that the three positions are distributed and the wiring current loop is triangular.
2. The partial shielding method for DC-DC driving according to claim 1, wherein:
and enabling the metal baffle plate to be covered above the main inductor, the output filter capacitor and the DC-DC driving chip at the same time.
3. A local shielding method suitable for DC-DC driving according to claim 1 or 2, characterized in that:
the metal baffle is L-shaped, the exposed copper pads are arranged at one position adjacent to the main inductor, the vertical edges of the metal baffle are mechanically fixed with the metal grounding connecting piece and are electrically connected at the same time, or the metal baffle is door-shaped, the exposed copper pads are respectively arranged at two opposite sides adjacent to the areas where the main inductor and the DC-DC driving chip are located, and the two vertical edges of the metal baffle are respectively mechanically fixed with the metal grounding connecting piece on one exposed copper pad and are electrically connected at the same time.
4. A local shielding method suitable for DC-DC driving according to claim 1 or 2, characterized in that:
the metal grounding connecting piece adopts a metal grounding reed, at least one spring buckle structure is arranged on the metal grounding reed, the vertical edge of the metal baffle plate is inserted into the spring buckle structure, the metal baffle plate is clamped by utilizing the elasticity of the spring buckle structure, and the relative fixation and the electric connection of the metal baffle plate and the metal grounding reed are realized.
5. The partial shielding method for DC-DC driving according to claim 4, wherein:
the elastic buckle structure is composed of two symmetrically arranged claw pieces, the outward extending ends of the two claw pieces are outwards bent and outwards stretched, and in a natural state, the shortest distance between the two claw pieces is smaller than the thickness of the vertical edge of the metal baffle.
6. The partial shielding method for DC-DC driving according to claim 5, wherein:
round convex points are arranged on the surfaces of the two claw sheets of the elastic buckle structure, and round concave points which can be matched with the round convex points are correspondingly arranged on the vertical edge surfaces of the metal baffle plates.
7. The partial shielding method for DC-DC driving according to claim 6, wherein:
the metal grounding reed is provided with two elastic buckling structures, and the round concave points on the surface of the corresponding vertical edge of the metal baffle are also provided with two concave points and are respectively arranged on the two side surfaces of the corresponding vertical edge.
8. A local shielding PCB layout structure suitable for DC-DC driving is characterized in that:
the local shielding method comprises a metal baffle, a PCB, a DC-DC driving chip, an output filter capacitor and a main inductor, wherein the DC-DC driving chip, the output filter capacitor and the main inductor are arranged on the PCB, the main inductor is connected with the switch signal output of the DC-DC driving chip, a copper exposure pad with grounding polarity is arranged on the PCB in a PCB wiring mode, a metal grounding connecting piece is welded and connected on the copper exposure pad, and the arrangement positions and modes of the components are arranged according to the local shielding method of any one of claims 1-7.
9. The partial shield PCB layout structure adapted for DC-DC driving of claim 8, wherein:
the metal grounding reed is made of phosphor bronze, and the surface layer is treated by tin plating.
10. The partial shield PCB layout structure for DC-DC driving according to claim 8 or 9, wherein:
the metal baffle keeps a distance of 0.5mm-5mm from the top surface of the component shielded by the metal baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910066275.8A CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910066275.8A CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
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| Publication Number | Publication Date |
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| CN109600982A CN109600982A (en) | 2019-04-09 |
| CN109600982B true CN109600982B (en) | 2024-02-13 |
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| CN201910066275.8A Active CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
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| Publication number | Publication date |
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| CN109600982A (en) | 2019-04-09 |
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