CN220511476U - Main control board applied to vehicle-mounted equipment and vehicle-mounted equipment - Google Patents
Main control board applied to vehicle-mounted equipment and vehicle-mounted equipment Download PDFInfo
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- CN220511476U CN220511476U CN202321780892.2U CN202321780892U CN220511476U CN 220511476 U CN220511476 U CN 220511476U CN 202321780892 U CN202321780892 U CN 202321780892U CN 220511476 U CN220511476 U CN 220511476U
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- board
- vehicle
- module
- main control
- shielding
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The utility model discloses a main control board applied to vehicle-mounted equipment and the vehicle-mounted equipment, wherein the main control board comprises a bottom plate and further comprises: the module board is arranged on the bottom plate, and a plurality of components for adjusting the running state of the vehicle-mounted equipment are integrated on the module board; the shielding structure is arranged on the module board and is positioned on the same side face of the module board as the components and used for shielding electromagnetic interference among the components; and the heat dissipation device is arranged between the bottom plate and the module plate and/or between the module plate and the shielding structure and is used for dissipating heat of the module plate. Compared with the prior art, the main control board provided by the application is wider in applicability and better in heat dissipation effect.
Description
Technical Field
The utility model relates to the field of vehicle-mounted equipment, in particular to a main control board applied to vehicle-mounted equipment and the vehicle-mounted equipment.
Background
The whole area of the prior main control board is larger, meanwhile, a plurality of components such as chips are required to be placed on the main control board for realizing complex functions, the whole main control board is correspondingly modified each time because of different functions required by different definitions of products, the development speed is influenced, and the modification cost is high on the main control board with larger area according to the functions. Meanwhile, signal interference exists among all components on the main control board, and the radiating effect of the components with large part of heating value is not in place, so that the service life of the components is influenced.
Therefore, it is necessary to design a main control board which has better applicability, good heat dissipation effect and can prevent signal interference among components.
Disclosure of Invention
Aiming at the problems in the prior art, the utility model provides the main control board applied to the vehicle-mounted equipment and the vehicle-mounted equipment, and the main control board has the advantages that the main control board is divided into the module board and the base board, the functions required by the main control board are integrated on the module board with small area, the base board only needs to use the interface to lead out the functions of the module board, the main control boards with different functions can use the same module board, and only needs to modify the interface on the base board, so the applicability is better; the front and back surfaces of the main control board are subjected to heat dissipation treatment, so that the heat dissipation effect is better; and a shielding structure capable of preventing signal interference between components and assisting heat dissipation is also arranged.
The technical scheme of the utility model is that the main control board applied to the vehicle-mounted equipment comprises a bottom plate and further comprises:
the module board is arranged on the bottom plate, and a plurality of components for adjusting the running state of the vehicle-mounted equipment are integrated on the module board;
the shielding structure is arranged on the module board and is positioned on the same side face of the module board as the components and used for shielding electromagnetic interference among the components;
and the heat dissipation device is arranged between the bottom plate and the module plate and/or between the module plate and the shielding structure and is used for dissipating heat of the module plate.
Further, the shielding structure comprises a shielding frame arranged on the module board and a shielding cover buckled with the shielding frame;
and the shielding frame is provided with limiting ribs for dividing the module plate into a plurality of integrated areas, and the components are distributed in the integrated areas.
Further, the shielding frame side is provided with a plurality of round holes, the shielding cover side have with the bump of round hole position one-to-one, the shielding cover pass through the round hole with bump cooperation with the shielding frame lock.
Further, the heat dissipating device comprises a heat dissipating fin arranged on the component, and after the shielding cover is buckled with the shielding frame, the heat dissipating fin is attached to the shielding cover and the component.
Further, the heat dissipation device comprises a first heat dissipation exposed copper arranged on the bottom plate and a second heat dissipation exposed copper arranged on the module plate, and after the bottom plate is connected with the module plate, the first heat dissipation exposed copper is contacted with the second heat dissipation exposed copper.
Further, the area of the bottom plate is larger than that of the module plate, and the module plate is welded on the bottom plate.
Further, the module board perimeter edge is provided with stamp-hole pins connecting the integration area with the base plate.
Further, the side of the base plate is provided with a plurality of external interfaces and assembly holes.
The application also discloses vehicle-mounted equipment, which is provided with the main control board applied to the vehicle-mounted equipment.
Compared with the prior art, the utility model has at least the following beneficial effects:
1. the module board provided by the application has small area, high integration level and abundant interface pins around,
2. the front and back surfaces of the main control board provided by the application are all provided with heat dissipation treatment, and the heat dissipation effect is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an explosion structure of a main control board of the utility model;
FIG. 2 is a schematic view of an exploded view of a modular panel according to the present utility model;
FIG. 3 is a bottom view of the module plate of the present utility model;
FIG. 4 is a side view of a modular plate of the present utility model;
FIG. 5 is a top view of a modular plate of the present utility model;
fig. 6 is a schematic view of the assembled structure of the module board and the base board of the utility model.
1 a bottom plate, 2 a module plate, 3 a shielding structure, 4 a heat dissipating device, 11 an external interface, 12 assembly holes, 21 components, 22 pins, 31 a shielding frame, 32 a shielding cover, 41 a first heat dissipating copper, 42 a second heat dissipating copper and 43 heat dissipating fins.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Thus, reference throughout this specification to one feature will be used in order to describe one embodiment of the utility model, not to imply that each embodiment of the utility model must be in the proper motion. Furthermore, it should be noted that the present specification describes a number of features. Although certain features may be combined together to illustrate a possible system design, such features may be used in other combinations not explicitly described. Thus, unless otherwise indicated, the illustrated combinations are not intended to be limiting.
The principles and structures of the present utility model are described in detail below with reference to the drawings and the examples.
The main control board applied to the vehicle-mounted equipment comprises a bottom plate 1 and further comprises:
the module board 2 is arranged on the bottom board 1, and a plurality of components 21 for adjusting the running state of the vehicle-mounted equipment are integrated on the module board 2;
a shielding structure 3 mounted on the module board 2 and located on the same side of the module board 2 as the components 21 for shielding electromagnetic interference between the components 21;
and a heat sink 4 mounted between the base plate 1 and the module plate 2 and/or between the module plate 2 and the shielding structure 3 for dissipating heat from the module plate 2.
Specifically, as shown in fig. 1, the main control board mainly comprises a bottom plate 1 and a module board 2, a plurality of components 21 including chips are integrated on one side of the module board 2 facing away from the bottom plate 1, a shielding structure 3 for preventing mutual interference between the components 21 is arranged on one surface of the module board 2 where the components 21 are arranged, and as the components 21 generate heat during operation, a heat dissipation device 4 is arranged at the joint of the bottom plate 1 and the module board 2, in order to achieve a better heat dissipation effect on the module board 2, the surface of the components 21 and the shielding structure 3 are connected by the heat dissipation device 4 between the components 21 and the shielding structure 3, and as the shielding structure 3 is made of metal materials, the heat dissipation device 4 between the components 21 and the shielding structure 3 can conduct heat generated by the components 21 to the shielding structure 3 to realize further heat dissipation on the components 21.
The module board 2 is used as a carrier for integrating all components 21 of the main control board, and is arranged on the bottom board 1, and functions in the module board 2 are led out through stamp-hole pins 22 on the module board 2 and expansion interfaces on the bottom board 1 according to requirements. For the convenience of understanding, taking two vehicle-mounted devices with different functions as examples, one vehicle-mounted device needs to use part of functions in the module board 2 and the other vehicle-mounted device uses other functions in the module board 2, the two vehicle-mounted devices can use the same module board 2, only the expansion interfaces on the respective bottom boards 1 are required to be modified according to respective requirements, multiple functions can be met, the whole main control board is not required to be modified, time is saved, and production efficiency is improved.
Further, the shielding structure 3 includes a shielding frame 31 mounted on the module board 2, and a shielding cover 32 fastened to the shielding frame 31;
the shielding frame 31 is provided with a limiting rib for dividing the module board 2 into a plurality of integrated areas, and the components 21 are distributed in the integrated areas.
Specifically, as shown in fig. 2, the shielding structure 3 is composed of two parts of a shielding frame 31 and a shielding cover 32, the shielding frame 31 is a rectangular frame body, the shielding frame 31 is welded on the module board 2 through a chip mounter, a plurality of limit ribs are arranged in the middle of the rectangular frame body, the module board 2 is divided into a plurality of integrated areas by the limit ribs, components 21 are distributed in the integrated areas according to functions, after the shielding cover 32 is buckled with the shielding frame 31, the limit ribs are separated between the integrated areas, the top is the shielding cover 32, the shielding frame 31 and the shielding cover 32 are matched to seal the integrated areas, and the whole shielding structure 3 is made of metal materials so as to realize shielding signal interference among the components 21 in different integrated areas.
Further, a plurality of round holes are formed in the side edge of the shielding frame 31, protruding points corresponding to the round holes one by one are formed in the side edge of the shielding cover 32, and the shielding cover 32 is buckled with the shielding frame 31 through matching of the round holes and the protruding points.
Specifically, as shown in fig. 2, the shielding frame 31 is a rectangular frame body with a certain thickness, a plurality of round holes are formed in the side edge of the periphery of the shielding frame 31 facing outwards, the shielding cover 32 is a rectangular cover, the size of the shielding cover 32 is consistent with that of the shielding frame 31, the top of the shielding cover 32 is a metal plate, the metal plate extends downwards to be attached to the shielding frame 31, part of the length of the metal plate extending downwards is matched with the thickness of the shielding frame 31, the metal plate is provided with a plurality of protruding bumps facing the direction of the shielding frame 31, the positions of the protruding bumps and the round holes are in one-to-one correspondence, and the protruding bumps on the shielding cover 32 are buckled in the round holes on the shielding frame 31, so that the shielding cover 32 is buckled with the shielding frame 31 to cover the components 21 and the shielding frame 31 on the module board 2.
Further, the heat sink 4 includes the heat sink 43 provided on the component 21, and the heat sink 43 is bonded to the shield cover 32 and the component 21 after the shield cover 32 and the shield frame 31 are engaged.
Specifically, as shown in fig. 2, since the component 21 integrated on the module board 2 further includes a chip, in order to ensure that the chip with a large heat generation amount can stably operate for a long period of time, a heat sink 4 is further disposed on the chip, where the heat sink 4 is a heat sink 43 made of silica gel. After the shielding cover 32 and the shielding frame 31 are buckled, one end of the radiating fin 43 contacts with the chip which generates heat, and the other end contacts with the shielding cover 32 made of metal, and the chip is subjected to auxiliary heat dissipation through the shielding cover 32, so that heat generated by the chip is outwards diffused, and the heat dissipation effect on the module board 2 is improved.
In a specific embodiment, as shown in fig. 2 and fig. 5, two chips with high heat generation are arranged in the component 21 on the module board 2, the heat dissipation fins 43 are adhered on the two chips, the shielding structure 3 is arranged to be two parts of the shielding frame 31 and the shielding cover 32 for facilitating the chip mounting of the main control board, the first SMT chip welds the component 21 and the shielding frame 31 comprising the chips on the module board 2 through a chip mounter, the second SMT chip welds the module board 2 completed by the first chip mounting on the main board through the chip mounter, then the heat dissipation fins 43 are adhered on the chips, and finally the shielding cover 32 is covered on the module board 2. After the components 21 and the shielding frame 31 are attached to the module board 2, the module board 2 needs to be debugged, and after the debugging is normal, the module board 2 is attached to the bottom board 1, so that the two-time attaching treatment is performed. The reason why the heat sink 43 and the shield cover 32 are attached last is that if the shield cover 32 is deformed or the contact between the heat sink 43 and the shield cover 32 is poor during the SMT patch if it is attached in advance, the heat dissipation effect is affected.
In the description of the present application, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Further, the heat dissipating device 4 includes a first exposed heat dissipating copper 41 disposed on the base plate 1, and a second exposed heat dissipating copper 42 disposed on the module board 2, and after the base plate 1 is connected to the module board 2, the first exposed heat dissipating copper 41 contacts with the second exposed heat dissipating copper 42.
Specifically, as shown in fig. 1 and fig. 3, a heat dissipation device 4 is further arranged at the connection position between the module board 2 and the bottom board 1, a first heat dissipation exposed copper 41 is arranged on the surface of the bottom board 1, a second heat dissipation exposed copper 42 is arranged on the bottom surface of the module board 2, and after the module board 2 is welded to the bottom board 1 through a chip mounter, the first heat dissipation exposed copper 41 and the second heat dissipation exposed copper 42 are in contact, so that heat of the module board 2 can be dissipated to the bottom board 1, and heat dissipation treatment is further performed on the module board 2.
Further, the area of the base plate 1 is larger than that of the module plate 2, and the module plate 2 is welded on the base plate 1.
Further, the peripheral edge of the module board 2 is provided with stamp-hole pins 22 connecting the integrated area with the base plate 1.
Further, the base plate 1 is provided on the side with a plurality of external interfaces 11 and fitting holes 12.
Specifically, as shown in fig. 6, the area of the bottom plate 1 is larger than that of the module plate 2, the module plate 2 is welded on the bottom plate 1 through a chip mounter, and a plurality of stamp-hole type pins 22 are further arranged at the peripheral edge of the module plate 2.
Because the module board 2 is highly integrated, the required functions are provided in the smallest possible size, so that the number of layers on the bottom board 1 can be reduced, and only an expansion interface is required to be arranged to lead out the functions required by the bottom board 1 through stamp hole type pins 22 on the module board 2; if the complex chips on the modules are directly placed on the bottom plate 1, the number of layers on the bottom plate 1 is increased, the lower the number of layers with the same area is, the lower the cost is, the manufacturing cost can be reduced through the integrated design of the module plate 2, the product design is simplified, different products can use the same module plate 2, and only the expansion interfaces on the bottom plate 1 are needed to be modified according to different needs.
The external interface 11 of the base plate 1 includes an antenna with WiFi, bluetooth and GPS functions, a TYPE-C interface for charging, and a SIM card holder for inserting a phone card, and the base plate 1 and the module plate 2 are connected and then mounted on the vehicle-mounted device through the assembly hole 12.
The application also discloses vehicle-mounted equipment, which is provided with the main control board applied to the vehicle-mounted equipment. The original main screen functions of the automobile type are fewer, such as navigation, audio and video playing and other functions are not provided, the module board provided by the application is integrated with various chips for realizing functions of the vehicle-mounted equipment, and rich expansion interfaces, such as I2C, UART, SD card interfaces, GPIO ports, MIPI interfaces and the like, can meet expansion requirements of various customized products, is also provided with a mature and stable android 13 system, and shortens the development period of software and hardware of users. Because not the original home screen of all motorcycle types can connect the cell-phone, but can be connected with the on-vehicle equipment that this application put forward through bluetooth, can adorn some third party applications, such as audio and video broadcast APP etc. also can install some navigation APP, can extend the function of original home screen.
Compared with the prior art, the main control board provided by the application is divided into the module board and the bottom board, the functions required by the main control board are integrated on the module board with small area, the bottom board only needs to use the interface to lead out the functions of the module board, the main control boards with different functions can use the same module board, only needs to modify the interface on the bottom board, and the applicability is better; the front and back surfaces of the main control board are subjected to heat dissipation treatment, so that the heat dissipation effect is better; also provided with a shielding structure capable of preventing signal interference between components and assisting heat dissipation
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (9)
1. Be applied to on-vehicle equipment's main control board, including the bottom plate, its characterized in that still includes:
the module board is arranged on the bottom plate, and a plurality of components for adjusting the running state of the vehicle-mounted equipment are integrated on the module board;
the shielding structure is arranged on the module board and is positioned on the same side face of the module board as the components and used for shielding electromagnetic interference among the components;
and the heat dissipation device is arranged between the bottom plate and the module plate and/or between the module plate and the shielding structure and is used for dissipating heat of the module plate.
2. The main control board for vehicle-mounted equipment according to claim 1, wherein the shielding structure comprises a shielding frame mounted on the module board and a shielding cover buckled with the shielding frame;
and the shielding frame is provided with limiting ribs for dividing the module plate into a plurality of integrated areas, and the components are distributed in the integrated areas.
3. The main control board applied to the vehicle-mounted equipment according to claim 2, wherein a plurality of round holes are formed in the side edge of the shielding frame, protruding points corresponding to the round holes in a one-to-one mode are arranged on the side edge of the shielding cover, and the shielding cover is buckled with the shielding frame through the cooperation of the round holes and the protruding points.
4. The main control board for vehicle-mounted equipment according to claim 2, wherein the heat dissipating device comprises a heat dissipating fin arranged on the component, and the heat dissipating fin is attached to the shielding cover and the component after the shielding cover and the shielding frame are buckled.
5. The main control board for vehicle-mounted equipment according to claim 1, wherein the heat dissipating device comprises a first heat dissipating exposed copper arranged on the bottom board and a second heat dissipating exposed copper arranged on the module board, and after the bottom board is connected with the module board, the first heat dissipating exposed copper is in contact with the second heat dissipating exposed copper.
6. The main control board for vehicle-mounted equipment according to claim 1, wherein the area of the bottom plate is larger than that of the module board, and the module board is welded on the bottom plate.
7. The main control board for vehicle-mounted equipment according to claim 2, wherein the module board peripheral edge is provided with stamp-hole pins connecting the integrated area and the bottom board.
8. The main control board for vehicle-mounted equipment according to claim 1, wherein the side surface of the bottom plate is provided with a plurality of external interfaces and assembly holes.
9. Vehicle-mounted device, characterized in that it has a main control board according to any one of claims 1 to 8 applied to the vehicle-mounted device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321780892.2U CN220511476U (en) | 2023-07-07 | 2023-07-07 | Main control board applied to vehicle-mounted equipment and vehicle-mounted equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321780892.2U CN220511476U (en) | 2023-07-07 | 2023-07-07 | Main control board applied to vehicle-mounted equipment and vehicle-mounted equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511476U true CN220511476U (en) | 2024-02-20 |
Family
ID=89881053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321780892.2U Active CN220511476U (en) | 2023-07-07 | 2023-07-07 | Main control board applied to vehicle-mounted equipment and vehicle-mounted equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511476U (en) |
-
2023
- 2023-07-07 CN CN202321780892.2U patent/CN220511476U/en active Active
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