CN107566558B - Method for manufacturing electronic assembly - Google Patents
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- CN107566558B CN107566558B CN201710731192.7A CN201710731192A CN107566558B CN 107566558 B CN107566558 B CN 107566558B CN 201710731192 A CN201710731192 A CN 201710731192A CN 107566558 B CN107566558 B CN 107566558B
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Abstract
The invention discloses a manufacturing method of an electronic component, which comprises the following steps: providing a front shell module, wherein the front shell module comprises a front shell and a main circuit board arranged on the front shell; providing a support plate module, wherein the support plate module comprises a support circuit board, a flash lamp fixed on the support circuit board and a protective ring arranged on the support circuit board and surrounding the flash lamp, and the protective ring is convexly arranged on the top surface of the flash lamp; the support plate module is fixed on one surface of the main circuit board far away from the front shell in a lap joint mode through the support circuit board; and removing the guard ring from the support plate module, thereby obtaining the electronic assembly. According to the manufacturing method of the electronic assembly, the electronic assembly and the electronic device, the protective ring is convexly arranged on the top surface of the flash lamp, so that the probability that the flash lamp is touched in the transportation and assembly processes of the support plate module can be reduced, the flash lamp is not easy to damage, and the production cost of the electronic assembly is low. The invention also discloses an electronic component and an electronic device.
Description
Technical Field
The present invention relates to the field of electronic terminals, and in particular, to a method for manufacturing an electronic component, and an electronic device.
Background
Flash lamps of terminals such as mobile phones are easily touched and damaged in the assembly process of the terminals, so that the production cost of the terminals is high.
Disclosure of Invention
The invention provides a manufacturing method of an electronic assembly, the electronic assembly and an electronic device.
The manufacturing method of the electronic component of the embodiment of the invention comprises the following steps:
providing a front shell module, wherein the front shell module comprises a front shell and a main circuit board arranged on the front shell;
providing a support plate module, wherein the support plate module comprises a support circuit board, a flash lamp fixed on the support circuit board and a protective ring arranged on the support circuit board and surrounding the flash lamp, and the protective ring is convexly arranged on the top surface of the flash lamp;
the support plate module is fixed on one surface, far away from the front shell, of the main circuit board in a lap joint mode through the support circuit board, the support circuit board comprises a first surface and a second surface which are opposite to each other, the second surface faces the front shell, the flash lamp is arranged on the first surface, and the flash lamp is electrically connected with the main circuit board through the support circuit board; and
and removing the guard ring from the support plate module to obtain the electronic assembly.
In some embodiments, the step of providing a plating module comprises:
fixing the flash lamp on the first surface;
fixing a light shielding member on the branch circuit board, and enabling the light shielding member to surround the flash lamp;
and arranging the protective ring on the branch circuit board, and enabling the protective ring to surround the shading piece.
In some embodiments, the step of disposing the guard ring on the supporting circuit board comprises:
and arranging the protective ring on the branch circuit board through glue.
In some embodiments, the step of providing a plating module comprises:
providing a telephone receiver;
and fixing the telephone receiver on the second surface.
In some embodiments, the method of making further comprises the steps of:
providing a display screen;
and installing the display screen on one side of the front shell, which is opposite to the main circuit board, wherein the display screen and the receiver are partially overlapped in the thickness direction of the main circuit board.
In some embodiments, the method of making further comprises the steps of:
providing a cover plate;
and arranging the cover plate on the front shell, wherein the cover plate covers the display screen.
In some embodiments, the step of fixing the board module on the side of the main circuit board away from the front shell by the step of lap-jointing the branch circuit board comprises the following steps:
and the branch circuit board is fixed on one surface of the main circuit board far away from the front shell in a lap joint mode in a welding mode.
The present invention provides an electronic component, comprising:
a front housing;
a main circuit board disposed on the front case;
the branch circuit board is fixed on one surface, far away from the front shell, of the main circuit board in a lap joint mode, and comprises a first surface and a second surface which are opposite to each other, and the second surface faces the front shell;
the flashlight is fixed on the first surface and electrically connected with the main circuit board through the branch circuit board.
In some embodiments, the electronic assembly includes a light shield disposed on the supporting circuit board and surrounding the flash.
In some embodiments, the electronic component includes a receiver fixed on the second surface, and the receiver is electrically connected to the main circuit board through the branch circuit board.
In some embodiments, the electronic component includes a display screen disposed on the front shell, the display screen is located on a side of the front shell opposite to the main circuit board, and the display screen and the receiver partially overlap in a thickness direction of the main circuit board.
In some embodiments, the electronic assembly includes a cover plate disposed on the front housing, the cover plate covering the display screen.
The electronic component of the embodiment of the invention comprises the electronic component of any one of the above embodiments.
In the manufacturing method of the electronic assembly, the electronic assembly and the electronic device, the protective ring is convexly arranged on the top surface of the flash lamp, so that the protective ring can reduce the probability that the flash lamp is touched in the transportation and assembly processes of the support plate module, the flash lamp is not easy to damage, and the production cost of the electronic assembly is low.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic plan view of an electronic assembly according to an embodiment of the invention;
FIG. 2 is an exploded schematic view of an electronic assembly of an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the electronic assembly III-III of FIG. 1;
FIG. 4 is a schematic front view of an electronic device according to an embodiment of the invention;
FIG. 5 is a schematic rear view of an electronic device according to an embodiment of the invention;
FIG. 6 is a schematic flow chart diagram of a method of fabricating an electronic assembly in accordance with an embodiment of the present invention;
FIG. 7 is a process diagram of a method of making an electronic assembly according to an embodiment of the invention;
FIG. 8 is another schematic flow chart diagram of a method of making an electronic assembly in accordance with an embodiment of the present invention;
FIG. 9 is another process schematic of a method of making an electronic assembly according to an embodiment of the invention;
FIG. 10 is a further process diagram of a method of making an electronic assembly according to an embodiment of the invention;
FIG. 11 is a schematic process diagram of a method of making an electronic assembly according to an embodiment of the invention;
fig. 12 is still another process diagram of a method of making an electronic assembly according to an embodiment of the invention.
Description of the main element symbols:
the structure comprises a main circuit board 20, a first mounting hole 21, a unfilled corner 22, a first board body 23, a second board body 24 and a first bonding pad 25;
a branch circuit board 30, a first surface 31, a second surface 32, a second mounting hole 33, and a second land 34;
a receiver 40, a contact terminal 41;
a flash lamp 50;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1 to fig. 3, an electronic component 100 according to an embodiment of the present invention includes a display screen 10, a main circuit board 20, a branch circuit board 30, a receiver 40, and a flashlight 50.
The main circuit board 20 is disposed below the display screen 10. The sub circuit board 30 is fixed to the main circuit board 20 by being lapped. The supporting circuit board 30 and the display screen 10 are respectively located on two opposite sides of the main circuit board 20, the supporting circuit board 30 includes a first surface 31 and a second surface 32, which are opposite, and the second surface 32 faces the display screen 10. The receiver 40 is provided on the second surface 32, and the receiver 40 is partially overlapped with the display screen 10 in the thickness direction of the display screen 10. The flashlight 50 is disposed on the first surface 31, and both the flashlight 50 and the receiver 40 are electrically connected to the main circuit board 20 through the branch circuit board 30.
The electronic component 100 according to the embodiment of the invention can be applied to an electronic device 200, and the electronic device 200 is, for example, a mobile terminal such as a mobile phone or a tablet computer. Specifically, the electronic device 200 according to the embodiment of the invention includes a front shell 210 and the electronic component 100, the display screen 10 and the main circuit board 20 are both fixed on the front shell 210, and the display screen 10 and the main circuit board 20 are respectively located on two opposite sides of the front shell 210.
In the electronic component 100 and the electronic device 200 according to the embodiment of the invention, the receiver 40 and the display screen 10 are partially overlapped in the thickness direction of the display screen 10 to improve the screen occupation ratio of the electronic device 200. In addition, the branch circuit board 30 can fix the receiver 40 and the flash 50 well, and can avoid the receiver 40 from interfering with other components such as the flash 50, and the electronic device 200 can make the components below the display 10 work normally while satisfying the high screen ratio.
Specifically, the display screen 10 includes an upper surface 11 and a lower surface 12. The upper surface 11 faces the outside of the electronic device 200, and the lower surface 12 faces the inside of the electronic device 200. The main circuit board 20 is located on a side corresponding to the lower surface 12. It is understood that the branch circuit board 30, the receiver 40 and the flashlight 50 are all located below the display screen 10.
The lap-joint fixing of the branch circuit board 30 to the main circuit board 20 means that the edge portion of the branch circuit board 30 is overlapped and fixed with the edge of the main circuit board 20. For example, the edge portion of the branch circuit board 30 and the edge portion of the main circuit board 20 are fixed together by means of soldering or using a fastener. Therefore, the interference between the branch circuit board 30 and the electrical components on the main circuit board 20 can be avoided, and the overlapping area between the branch circuit board 30 and the main circuit board 20 can be reduced, so that the volumes of the branch circuit board 30 and the main circuit board 20 are smaller.
The sub circuit board 30 is positioned below the main circuit board 20 so that a large space can be formed between the sub circuit board 30 and the display screen 10 to mount the receiver 40. Note that the thickness direction of the sub circuit board 30 coincides with the thickness direction of the main circuit board 20, and is, for example, the up-down direction in fig. 3.
As shown in fig. 4, in the electronic device 200, a region of the outer surface of the electronic device 200 corresponding to the display screen 10 is a display region 202, another region of the outer surface of the electronic device 200 is a non-display region 204, and the screen occupation ratio of the electronic device 200 refers to a ratio of an area of the display region 202 to an area of the non-display region 204 of the electronic device 200.
In the related art, the display screen and the receiver are juxtaposed in the longitudinal direction of the display screen, and therefore, it can be understood that the lateral area of the outer surface of the electronic device corresponding to the receiver is a non-display area, which makes the screen of the electronic device smaller.
In the embodiment, the orthographic projection of the receiver 40 on the display screen 10 is partially overlapped with the display screen 10, so that the area of the display area 202 of the electronic device 200 is larger, and the area of the non-display area 204 is smaller, thereby improving the screen occupation ratio of the electronic device 200.
Note that the sound outlet of the receiver 40 is exposed through the outside of the display screen 10, a cover plate 230 is disposed above the display screen 10, and the cover plate 230 is opened with a sound outlet 232 corresponding to the sound outlet of the receiver 40, so that the sound emitted by the receiver 40 can be transmitted to the outside of the electronic device 200, as shown in fig. 1. It will be appreciated that the receiver 40 has a housing formed with a sound outlet through which sound emitted by the speaker can pass to the outside of the housing, and a speaker located within the housing.
Both the flashlight 50 and the receiver 40 can be electrically connected to the main circuit board 20 through a circuit formed on the sub circuit board 30. Note that the support Circuit Board 30 and the main Circuit Board 20 are both Printed Circuit Boards (PCBs).
In one example, when assembling the electronic component 100, the flashlight 50 and the receiver 40 may be fixed on the supporting circuit board 30 to form a supporting circuit board module, and then the supporting circuit board module is fixed on the main circuit board 20 by the supporting circuit board 30, and finally the display screen 10 is covered on the main circuit board 20, so as to obtain the electronic component 100.
The electronic device 200 further includes a rear cover 220, and the rear cover 220 is covered on the front case 210. The main circuit board 20 is located in a space formed by the rear cover 220 and the front case 210. The flash 50 is exposed through the rear cover 220, as shown in fig. 5. The flash 50 may supplement the light to the back of the electronic device 200, for example, the user may use the flash 50 to illuminate the surrounding scene during night activities. For another example, when the user uses the camera of the electronic device 200 to shoot, the flash 50 may supplement light for the shooting process to improve the shooting quality of the electronic device 200.
In some embodiments, the flashlight 50 includes a wick and a globe enclosing the wick, and the wick is secured to the first face 31. Therefore, the flash lamp 50 can emit light through the lamp wick, and the lamp wick can be protected by the lampshade due to the easy damage of the lamp wick, so that the service life of the flash lamp 50 can be prolonged.
It is understood that a processor of the electronic device 200 is disposed on the main circuit board 20, and the processor is used for controlling the operation of the electronic device 200.
In some embodiments, the receiver 40 and the flashlight 50 are disposed to overlap in the thickness direction of the supporting circuit board 30. Alternatively, the orthographic projection of the flash 50 on the receiver 40 is entirely on the receiver 40. This makes the fitting structure between the receiver 40 and the flashlight 50 more compact.
In the present embodiment, the receiver 40 and the flashlight 50 are both located at approximately the middle of the electronic device 200 in the lateral direction (the left-right direction in fig. 4).
Referring to fig. 2 and 3, in some embodiments, the edge of the main circuit board 20 is provided with a first bonding pad 25, the sub circuit board 30 is formed with a second bonding pad 34 corresponding to the first bonding pad 25, the sub circuit board 30 is fixed on the main circuit board 20 by welding the second bonding pad 34 and the first bonding pad 25, the first surface 31 is formed with a first circuit (not shown) connected to the second bonding pad 34, the second surface 32 is formed with a second circuit (not shown) connected to the second bonding pad 34, the receiver 40 is connected to the second circuit, and the flash 50 is connected to the first circuit.
Thus, after the receiver 40 and the flash 50 are connected to the circuits on the branch circuit board 30, the receiver and the flash can be connected to the main circuit board 20 through the first bonding pad 25 and the second bonding pad 34, and the first bonding pad 25 and the second bonding pad 34 can fix the branch circuit board 30 and the main circuit board 20 and can also connect the receiver and the flash to the main circuit board 20. It is understood that the circuit formed on the main circuit board 20 is connected to the first pad 25.
The flashlight 50 is connected with the main circuit board 20 through the branch circuit board 30, and the circuit on the main circuit board 20 can supply power to the flashlight 50 through the branch circuit board 30 and can also control the working mode of the flashlight 50. For example, the main circuit board 20 controls the flashlight 50 to be in a normally on mode through the branch circuit board 30, and for example, the main circuit board 20 controls the flashlight 50 to emit light intermittently through the branch circuit board 30.
Referring to fig. 2 again, in some embodiments, a first mounting hole 21 is formed in an edge of the main circuit board 20, a second mounting hole 33 corresponding to the first mounting hole 21 is formed in an edge of the branch circuit board 30, and the branch circuit board 30 is fastened to the main circuit board 20 by a fastening member 110 penetrating through the first mounting hole 21 and the second mounting hole 33.
Thus, the branch circuit board 30 is connected with the main circuit board 20 through the fastener 110, so that the branch circuit board 30 is convenient to disassemble and assemble and easy to maintain.
In one example, the receiver 40 and the flashlight 50 may be mounted on the branch circuit board 30, and then the branch circuit board 30 with the receiver 40 and the flashlight 50 may be fixed on the main circuit board 20 by the fastener 110, so as to complete the assembly of the main circuit board 20 and the branch circuit board 30.
In the present embodiment, the number of the first mounting holes 21 and the number of the second mounting holes 33 are two, so that the connection between the branch circuit board 30 and the main circuit board 20 is more stable and reliable.
In some embodiments, the receiver 40 includes a contact terminal 41, and the contact terminal 41 is in contact with the second circuit and is fixed on the second surface 32 by soldering.
In this way, the receiver 40 can be electrically connected to the main circuit board 20 through the contact terminal 41. The main circuit board 20 can supply power to the receiver 40 and control signals through the contact terminals 41.
The contact terminals 41 may be fixed on the second surface 32 by SMT (surface mounted technology).
In some embodiments, the main circuit board 20 is formed with a notch 22, and the sub circuit board 30 is located at the notch 22.
In this way, the main circuit board 20 forms an escape space for mounting the branch circuit board 30, and prevents the branch circuit board 30 from interfering with other components of the electronic device 200. In the present embodiment, the unfilled corner 22 is substantially rectangular.
In some embodiments, the main circuit board 20 includes a first board 23 and a second board 24 connected to the first board 23, the first board 23 and the second board 24 define a notch 22, and the branch circuit board 30 is fixed to the first board 23 and the second board 24 in a lap joint manner. Alternatively, one of the connection positions of the branch circuit board 30 and the main circuit board 20 is located on the first board 23, and the other connection position is located on the second board 24, so that the stability of the connection of the branch circuit board 30 can be improved.
In some embodiments, a light shield 106 is disposed on the supporting circuit board 30, and the light shield 106 surrounds the flash 50. Thus, the light shielding member 106 can prevent the light generated by the flash 50 from being emitted from the side of the flash 50 to affect the normal operation of other electronic devices.
Referring to fig. 6 and 7, a method for manufacturing an electronic component 100 according to an embodiment of the invention includes the steps of:
s10, providing a front shell 210 module, wherein the front shell 210 module comprises a front shell 210 and a main circuit board 20 disposed on the front shell 210;
s20, providing a fulcrum plate module, wherein the fulcrum plate module comprises a branch circuit board 30, a flash lamp 50 fixed on the branch circuit board 30 and a protective ring 104 arranged on the branch circuit board 30 and surrounding the flash lamp 50, and the protective ring 104 is convexly arranged on the top surface 52 of the flash lamp 50;
s30, the support plate module is fixed on one surface, far away from the front shell 210, of the main circuit board 20 through the support circuit board 30 in a lap joint mode, the support circuit board 30 comprises a first surface 31 and a second surface 32 which are opposite, the second surface 32 faces the front shell 210, the flash lamp 50 is arranged on the first surface 31, and the flash lamp 50 is electrically connected with the main circuit board 20 through the support circuit board 30; and
and S40, removing the protective ring 104 from the support plate module, thereby obtaining the electronic assembly 100.
The embodiment of the invention provides an electronic component 100, and the electronic component 100 can be manufactured by the manufacturing method of the electronic component 100.
Specifically, the electronic component 100 of the embodiment of the present invention includes a front case 210, a main circuit board 20, a sub circuit board 30, and a flash 50. The main circuit board 20 is disposed on the front case 210. The supporting circuit board 30 is fixed on a surface of the main circuit board 20 away from the front case 210 in a lap joint manner, the supporting circuit board 30 includes a first surface 31 and a second surface 32 which are opposite, and the second surface 32 faces the front case 210. The flashlight 50 is fixed on the first surface 31, and the flashlight 50 is electrically connected with the main circuit board 20 through the branch circuit board 30.
In the manufacturing method of the electronic component 100 and the electronic component 100 according to the embodiment of the invention, the protective ring 104 is protruded on the top surface 52 of the flash lamp 50, so that the protective ring 104 can reduce the probability that the flash lamp 50 is touched in the transportation and assembly processes of the support plate module, the flash lamp 50 is not easily damaged, and the production cost of the electronic component 100 is low. In addition, the branch circuit board 30 can fix the flash lamp 50 well, and avoid the interference of the flash lamp 50 with other components.
The protection ring 104 can be made of a softer material such as foam, so that after an external element collides with the protection ring 104, the protection ring 104 can deform to buffer impact force, and the protection ring 104 is prevented from being damaged.
Referring to fig. 8 and 9, in some embodiments, step S20 includes:
s21, fixing the flash lamp 50 on the first face 31;
s22, fixing the light-shielding member 106 on the sub circuit board 30, and making the light-shielding member 106 surround the flash lamp 50;
s23, the protection ring 104 is disposed on the sub circuit board 30, and the protection ring 104 surrounds the light shielding member 106.
Thus, the light-shielding member 106 can prevent light generated by the flash lamp 50 from being emitted from the side of the flash lamp 5050 to affect the normal operation of other electronic devices.
In certain embodiments, step S22 includes:
the guard ring 104 is disposed on the sub-circuit board 30 by adhesive.
In this manner, the guard ring 104 is secured to the sub-circuit board 30 by adhesive bonding, which allows the guard ring 104 to be easily removed from the sub-circuit board 30 during subsequent handling.
Referring to fig. 10, in some embodiments, the step of providing a pallet module includes:
providing a receiver 40;
the receiver 40 is fixed to the second face 32.
In this manner, the receiver 40 and the flashlight 50 are both disposed on the branch circuit board 30, which makes the structure between the receiver 40 and the flashlight 50 more compact, thereby making the electronic component 100 more compact.
Referring to fig. 11, in some embodiments, the method for manufacturing the electronic component 100 further includes the steps of:
providing a display screen 10; and
the display screen 10 is mounted on the side of the front case 210 opposite to the main circuit board 20, and the display screen 10 and the receiver 40 are partially overlapped in the thickness direction of the main circuit board 20.
In this way, the display screen 10 and the main circuit board 20 are partially overlapped in the thickness direction of the main circuit board 20, which can improve the screen occupation ratio of the electronic component 100.
Referring to fig. 12, in some embodiments, the method for manufacturing the electronic component 100 further includes the steps of:
providing a cover plate 230;
the cover plate 230 is disposed on the front case 210, and the cover plate 230 covers the display screen 10.
In this way, the cover plate 230 can protect the display screen 10 from being damaged by collision.
In certain embodiments, step S30 includes:
the branch circuit board 30 is fixed on the side of the main circuit board 20 away from the front shell 210 by soldering.
Thus, the connection between the branch circuit board 30 and the main circuit board 20 is more secure.
It should be noted that the explanation of the electronic component 100 in the above embodiment is applicable to the manufacturing method of the electronic component 100 in the present embodiment, and other unexplored parts of the manufacturing method of the electronic component 100 in the embodiment of the present invention refer to the same or similar parts in the electronic component 100 in the above embodiment, which are not repeated herein.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (5)
1. A method of making an electronic assembly, comprising the steps of:
providing a front shell module, wherein the front shell module comprises a front shell and a main circuit board arranged on the front shell, and an unfilled corner is formed on the main circuit board;
providing a support plate module, wherein the support plate module comprises a support circuit board, a flash lamp fixed on the support circuit board and a protective ring arranged on the support circuit board and surrounding the flash lamp, the protective ring is convexly arranged on the top surface of the flash lamp, the support circuit board comprises a first surface and a second surface which are opposite to each other, a receiver is provided, and the receiver is fixed on the second surface;
the supporting plate module is fixed on one surface, far away from the front shell, of the main circuit board in a lap joint mode through the supporting circuit board and located at the unfilled corner, the second surface faces the front shell, the flash lamp is arranged on the first surface and is overlapped with a position where a receiver is arranged in the thickness direction of the supporting plate module, the flash lamp is electrically connected with the main circuit board through the supporting circuit board, and the edge part of the second surface of the supporting circuit board is overlapped and fixed with the edge part of the unfilled corner of the main circuit board;
providing a display screen, wherein the display screen is arranged on one side of the front shell, which is opposite to the main circuit board, and the display screen and the telephone receiver are partially overlapped in the thickness direction of the main circuit board; and
and removing the guard ring from the support plate module to obtain the electronic assembly.
2. The method of making an electronic assembly of claim 1, wherein said step of providing a strip module comprises:
fixing the flash lamp on the first surface;
fixing a light shielding member on the branch circuit board, and enabling the light shielding member to surround the flash lamp;
and arranging the protective ring on the branch circuit board, and enabling the protective ring to surround the shading piece.
3. The method of making an electronic assembly according to claim 2, wherein said step of disposing said guard ring on said supporting circuit board comprises:
and arranging the protective ring on the branch circuit board through glue.
4. The method of fabricating an electronic assembly according to claim 2, wherein the method of fabricating further comprises the steps of:
providing a cover plate;
and arranging the cover plate on the front shell, wherein the cover plate covers the display screen.
5. The method of manufacturing an electronic assembly according to claim 1, wherein said step of securing said strip module to said main circuit board at a side of said main circuit board remote from said front housing by said supporting circuit board engaging with said supporting circuit board comprises:
and the branch circuit board is fixed on one surface of the main circuit board far away from the front shell in a lap joint mode in a welding mode.
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| CN201710731192.7A CN107566558B (en) | 2017-08-23 | 2017-08-23 | Method for manufacturing electronic assembly |
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| CN201710731192.7A CN107566558B (en) | 2017-08-23 | 2017-08-23 | Method for manufacturing electronic assembly |
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| CN107566558A CN107566558A (en) | 2018-01-09 |
| CN107566558B true CN107566558B (en) | 2020-03-24 |
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| CN209233878U (en) * | 2018-12-14 | 2019-08-09 | Oppo广东移动通信有限公司 | Shell component and mobile terminal |
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| CN106019771A (en) * | 2016-08-03 | 2016-10-12 | 广东欧珀移动通信有限公司 | Flash lamp lens assembly and mobile terminal |
-
2017
- 2017-08-23 CN CN201710731192.7A patent/CN107566558B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200944A (en) * | 2002-12-18 | 2004-07-15 | Nec Access Technica Ltd | Mobile terminal and fixed structure of camera unit used for the same |
| CN101350844A (en) * | 2007-07-18 | 2009-01-21 | 深圳富泰宏精密工业有限公司 | Portable electronic device |
| CN101141499A (en) * | 2007-09-11 | 2008-03-12 | Tcl天一移动通信（深圳）有限公司 | Mobile phone using two-in-one loudspeaker sinkage type structure |
| CN205033032U (en) * | 2015-10-09 | 2016-02-17 | 新乡市振英机械设备有限公司 | Guard ring that female net of sieve that shakes soon used when restoreing |
| CN105847651A (en) * | 2016-05-20 | 2016-08-10 | 广东欧珀移动通信有限公司 | Camera assembly and mobile terminal |
| CN106019771A (en) * | 2016-08-03 | 2016-10-12 | 广东欧珀移动通信有限公司 | Flash lamp lens assembly and mobile terminal |
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| CN107566558A (en) | 2018-01-09 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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