CN109600982A - Shadow shield method and PCB layout structure suitable for DC-DC driving - Google Patents
Shadow shield method and PCB layout structure suitable for DC-DC driving Download PDFInfo
- Publication number
- CN109600982A CN109600982A CN201910066275.8A CN201910066275A CN109600982A CN 109600982 A CN109600982 A CN 109600982A CN 201910066275 A CN201910066275 A CN 201910066275A CN 109600982 A CN109600982 A CN 109600982A
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- driving
- pcb
- shadow shield
- driving chip
- main inductance
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 10
- 235000014676 Phragmites communis Nutrition 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
Abstract
The present invention relates to a kind of shadow shield methods and PCB layout structure suitable for DC-DC driving, its main feature is that the main inductance of the switching signal output of DC-DC driving chip and the connection DC-DC driving chip is arranged adjacent each other on PCB, in the top of all or part of main inductance, metal baffle is set, or metal baffle is set in whole upper areas of the main inductance and the DC-DC driving chip, the dew copper pad of polarity of ground is arranged by PCB layout mode on the pcb, metallic ground connector is connected by welding manner on the dew copper pad, the metal baffle is set to keep being mechanically fixed and being electrically connected with the metallic ground connector.The present invention can greatly reduce the space occupied needed for shielding case while guaranteeing EMC shield effectiveness, while material needed for saving metallic shield.
Description
Technical field
The present invention relates to a kind of methods and corresponding PCB layout for realizing that PCB is locally electromagnetically shielded, and are mainly used for automobile-used
LED drive mould group, especially for be automobile-used LED DC-DC drive modular circuit.
Background technique
LED car lamp can play the role of illumination or signal prompt when driving, play key work to traffic safety
With.With development in science and technology, electronic equipment is more and more in automobile, with increasing for electronic equipment, while also bringing complexity
Electromagnetic compatibility problem.The electronic circuit and PCB layout for how designing LED module, for LED module Electro Magnetic Compatibility to Guan Chong
It wants.
Middle power and high-power LED light source mostly use DC-DC formula LED driving power supply, DC-DC formula in car light industry at present
LED driving is easy external Radiative EMI, is unfavorable for the rectification of EMC test.Conventional EMC amelioration method are as follows: whole
A LED drive module one grounded metallic shield cover of outer covering, metallic shield design have several pins, and pin is inserted on PCB
In reserved hole slot structure, the pad design around hole slot is ground polarity, and metallic shield is welded in PCB by welding manner
It is communicated on plate and with ground polarity, DC-DC formula LED is shielded with this and drives external radiated noise.Common metallic shield be by
Monolith PCB cover gets up, and volume needed for usually such metallic shield is larger, and metal materials are more.Common metallic shield is past
Toward some special assembling structure situations, such as the LED driving mould group 1 shown in FIG. 1 for car light is not suitable for, because LED drives
Close installation optical lens 2 is needed above dynamic model group, therefore without space to installation bulk metal shielding case in LED driving mould group.
Summary of the invention
The object of the present invention is to provide a kind of shadow shield methods and PCB layout structure suitable for DC-DC driving, are protecting
The space occupied needed for shielding case can be greatly reduced while demonstrate,proving EMC shield effectiveness, while being saved needed for metallic shield
Material.
Main technical schemes of the invention have:
A kind of shadow shield method suitable for DC-DC driving drives DC-DC driving chip and the connection DC-DC
The main inductance of the switching signal output of dynamic chip is arranged adjacent each other on PCB, is set above all or part of main inductance
Metal baffle is set, or metal baffle is set in whole upper areas of the main inductance and the DC-DC driving chip,
The dew copper pad for arranging polarity of ground on the PCB by PCB layout mode is connected on the dew copper pad by welding manner
Metallic ground connector is connect, the metal baffle is made to keep being mechanically fixed and being electrically connected with the metallic ground connector.
Output filter capacitor is arranged on the pcb adjacent to the position of the DC-DC driving chip and the main inductance.
The DC-DC driving chip and the output filter capacitor preferably make three position respectively adjacent to the main inductance
Layout and cabling current loop are triangular in shape.
Can making the metal baffle, mask drives in the main inductance, the output filter capacitor and the DC-DC simultaneously
The top of dynamic chip.
The metal baffle is L-shaped, and the dew copper pad has at one, the position of the neighbouring main inductance is arranged in, by institute
The vertical edge for stating metal plate washer is mechanically fixed with the metallic ground connector to be electrically connected simultaneously, alternatively, the metal baffle is in
Gate, the dew copper pad have at two, are arranged in the neighbouring main inductance and DC-DC driving chip region
Two vertical edges of the metal plate washer are connect with the metallic ground on a dew copper pad by opposite two sides respectively
Part is mechanically fixed while being electrically connected, and is equivalent to the metal plate washer across in the upper of the main inductance and DC-DC driving chip
Side.
The metallic ground connector uses metallic ground reed, and the metallic ground reed is equipped at least one snap-on
The vertical edge of the metal plate washer is inserted into the latch catch, gold described in the elastic clamping using the latch catch by structure
Belong to baffle, to realize the relatively fixed and electrical connection of the metal baffle and the metallic ground reed.
The latch catch is two calvus being arranged symmetrically, and the overhanging end of two calvus is bent outwardly outer, from
Under right state, the shortest distance of two calvus is less than the thickness of the vertical edge of the metal baffle.
It is preferred that round salient point is arranged in the opposed facing surface of two calvus in the latch catch, correspondingly, described
The round concave point that the vertical edge surface setting of metal plate washer can be matched with the round salient point.
Two latch catchs, the surface of the corresponding vertical edge of the metal plate washer is arranged in one metallic ground reed
The round concave point be also provided with two, and be respectively provided on two side surfaces of corresponding vertical edge.
A kind of shadow shield PCB layout structure suitable for DC-DC driving, including metal baffle, PCB and be arranged in described
The master of the switching signal output of DC-DC driving chip, output filter capacitor and the connection DC-DC driving chip on PCB
Inductance, the PCB are equipped with dew copper pad, and dew copper pad passes through PCB trace polarity of ground, is welded to connect on the dew copper pad
Metallic ground connector, the setting position of above-mentioned each component part and mode press any one described shadow shield method above-mentioned
It is arranged.
The metallic ground reed is preferably made of phosphor bronze, and surface layer is handled through tin coating.
The metal baffle keeps 0.5mm-5mm spacing to be advisable with by the top surface of its component covered.
The beneficial effects of the present invention are:
The present invention solves under certain special lamp body assembling structure, and DC-DC formula LED driving mould group can not install bulk metal
The problem of shielding case is to shield external radiated noise, is particularly suitable for some LED driving mould groups and light source and optical structure element are close
In the lamp body structure of cooperation.
This invention also solves bulk shielding cover metal materials are more, the bulky problem of occupied space.
Installation process of the present invention is convenient, and is conducive to the after-sales service of mould group, does not need as bulk metal shielding case mould group,
Must dismantle after metallic shield can repair circuit, this shadow shield method only needs metal plate washer out of metallic ground reed
Extraction, metal plate washer can dismount at any time.
The present invention has preferable EMC shield effectiveness, on this basis can be complete common with the use of inductance value series
Inductance equivalent substitution shields inductance and carries out circuit design, and the selectable leeway of inductance value is big, greatly facilitates the work of inductance type selecting,
Greatly reduce circuit design cost.
Detailed description of the invention
Fig. 1 is the LED driving mould group and optical lens installation position relation schematic diagram for car light；
Fig. 2 is a kind of schematic layout pattern of key components on the PCB；
Fig. 3 is the structural schematic diagram of one embodiment of the metal baffle set-up mode；
Fig. 4 is the structural schematic diagram of another embodiment of the metal baffle set-up mode；
Fig. 5 is the structural schematic diagram of one embodiment of the metallic ground reed；
Fig. 6 is the structural schematic diagram of one embodiment of the metal baffle.
Appended drawing reference: 1.LED drives mould group；1-1.PCB；1-2.DC-DC driving chip；1-3. main inductance；1-4. output
Filter capacitor；1-5. reveals copper pad；1-6. metal baffle；1-61. round concave point；The direct insertion welding connector of 1-7.；1-8. golden
Belong to grounding reed；1-81. claw；1-82. round salient point；1-83. welding pin；1-9. sealing rubber ring；1-10. radiator；2.
Optical lens.
Specific embodiment
As shown in figures 2-6, the invention discloses it is a kind of suitable for DC-DC driving shadow shield method, this method be by
The adjacent cloth of main inductance 1-3 of the switching signal output pin SW of DC-DC driving chip 1-2 and the connection DC-DC driving chip
It sets on PCB1-1, keeps the switching signal output pin SW of LED driving IC as short as possible to the cabling of main inductance.Part or all of
The top of the main inductance metal baffle 1-6, or the whole in the main inductance and the DC-DC driving chip are set
Metal baffle is arranged in upper area, arranges the dew copper pad 1- of the rectangle of polarity of ground by PCB layout mode on the pcb
5, metallic ground connector is connected by welding manner on the dew copper pad, makes the metal baffle and the metallic ground
Connector holding is mechanically fixed and is electrically connected, and is grounded the metal baffle.
The DC-DC driving chip and main inductance are the main components for generating high-frequency switching signal, are electromagnetic radiation
Main interference source.The metal baffle is set by the upper section or whole region at them, electromagnetic radiation is shielded,
To reduce their external radiation interference.Due to the metal baffle only cover on PCB HF switch node region without
It is entire PCB, had not only played effective electromagnetic shielding action, but also reduce the required space hold of shielding, use is more flexible, energy
The EMC shielding demand for meeting cramped construction, so that being able to achieve and being driven for DC-DC formula LED under certain special lamp body assembling structure
Effective shielding of the external radiation noise of mould group, while the amount of metal of shielding is significantly reduced compared to traditional metallic shield.
The metal baffle covers the specific location of much regions and shaded areas, can determine according to EMC test result.
The metal baffle and the top surface of a shielded side keep 0.5mm-5mm spacing to be advisable.
The output filter capacitor is also the component part of HF switch node loop, will further preferably export filtered electrical
Hold the 1-4 arrangement position of neighbouring the DC-DC driving chip 1-2 and the main inductance 1-3 simultaneously on the pcb, so as to will
The loop of generation HF switch node is compressed to as small as possible.
In the embodiment shown in that figure, preferably the DC-DC driving chip and the output filter capacitor are arranged respective
The side of the neighbouring main inductance, keeps three's location layout and cabling current loop triangular in shape, and such arrangement is the compactest,
The switching noise loop that high-frequency voltage signal is formed can reach minimum.
In the case where the main inductance, the output filter capacitor and the DC-DC driving chip disposed adjacent, still
First choice by the metal baffle mask the top of all or part of main inductance or mask in the main inductance and
Whole upper areas of the DC-DC driving chip.Secondly, mask can also be filtered simultaneously in the main inductance, the output
The top of capacitor and the DC-DC driving chip.
The metal baffle can L-shaped (see Fig. 3) or gate (see Fig. 4).It is described when the metal baffle is L-shaped
Revealing copper pad only at setting one, can be arranged in the position of the neighbouring main inductance, by the vertical edge of the metal plate washer with it is described
Metallic ground connector is mechanically fixed while being electrically connected.When the metal baffle is in gate, the dew copper pad is at least
At two, the opposite two sides of the neighbouring main inductance and DC-DC driving chip region are arranged in, by the gold
Two vertical edges for belonging to plate washer are mechanically fixed simultaneously electrically with the metallic ground connector on a dew copper pad respectively
Connection, is equivalent to the metal baffle while covering the main inductance and DC-DC driving chip.
By the way that the vertical edge of the metal plate washer and metallic ground connector electrical connection are realized the metal baffle
Ground connection.
The metallic ground connector preferably uses metallic ground reed 1-8, and the metallic ground reed is equipped at least
The vertical edge of the metal plate washer is inserted into the latch catch, utilizes the elastic clip of the latch catch by one latch catch
The tight metal baffle, to realize that the relatively fixed and polarity of ground of the metal baffle and the metallic ground reed connects
It connects.
The latch catch is two calvus 1-81 being arranged symmetrically, and the claw has metallic elastic, two pawls
The overhanging end of piece is bent outwardly outer, and under natural conditions, the shortest distance of two calvus is less than the perpendicular of the metal baffle
The thickness on side, in order to which the vertical edge of metal plate washer can be tightly buckled in metallic ground reed.The institute of attached embodiment illustrated in fig. 5
The further introduction about the construction for stating metallic ground reed can be found in following illustrate.
The invention also discloses a kind of shadow shield PCB layout structures suitable for DC-DC driving, are above-mentioned are suitable for
The specific implementation of the shadow shield method of DC-DC driving, as shown in figures 2-6, including metal baffle 1-6, PCB1-1 and is arranged in
The switch letter of DC-DC driving chip 1-2, output filter capacitor 1-4 and the connection DC-DC driving chip on the PCB
Number output main inductance 1-3.The dew copper pad 1-5 of the rectangle of polarity of ground is disposed on the PCB by PCB layout mode,
Metallic ground connector is welded to connect on the dew copper pad.The setting position of above-mentioned each component part and mode press above-mentioned
A kind of shadow shield method of anticipating is arranged.
LED driving mould group can also include heat dissipation rubber mat, radiator 1-10, sealing rubber ring 1-9, screw, direct insertion
Weld other electronic components on connector 1-7 and PCB.Wherein the direct insertion welding connector is welded by welding manner
On the PCB with component, across the connector targeting port of the radiator, (dig in targeting port has one can make to connector
The slot that connector passes through) it is connected to outside.The heat dissipation rubber mat is pasted onto spreader surface, and PCB is placed in described dissipate
On hot glue pad, fastened by two screws and the radiator, the heat dissipation rubber mat, which is bonded, after fastening is clamped in the PCB
With the intermediate course of radiator platform.
It is preferably set on opposed facing two surfaces of two calvus of the latch catch on the metallic ground reed
There is round salient point 1-82, for blocking the vertical edge of the subsequent metal plate washer to be installed.The corresponding of the metal plate washer is erected
The surface on side is equipped with the round concave point 1-61 that can be matched with the round salient point, for on the metallic ground reed
Round salient point matches during installation, in order to which the vertical edge of the metal plate washer is stuck in metallic ground reed.
The single metallic ground reed is preferably provided with two latch catchs, correspondingly, the phase of the metal plate washer
The surface of vertical edge is answered then to be preferably provided two round concave points, it is opposite with the round salient point on a latch catch respectively
It answers.Further, two round concave points on same vertical edge are preferably respectively provided on two side surfaces of corresponding vertical edge,
As shown in fig. 6, getting up in this way with the round salient point collocation on the metal spring leaf two, metal baffle and metal spring leaf can be made
Matching and fixation are even closer.The circle concave point can be formed using impact style.
The thickness of the metal plate washer is preferably greater than 0.1mm.
The metallic ground reed is preferably made of phosphor bronze, and surface layer is preferably handled through tin coating.
The metallic ground reed has welding pin 1-83 in two sides design, described for metallic ground reed to be welded in
On the dew copper pad of polarity of ground on PCB.
Experiment proves that the present invention makes DC-DC formula by the setting of excellent circuit layout combination shielding metal baffle
LED drives mould group to have good performance in EMC EMC test, and shield effectiveness is similar to using the whole of existing shielding case
Body shield effectiveness, and space hold needed for shielding case can be greatly reduced while guaranteeing EMC shield effectiveness, same to time
Material needed for saving metallic shield.
In addition, under the premise of using method and layout structure of the invention, it can be complete with the use of inductance value series
Ordinary inductor flexibly substitutes the small shielding inductance in the optional leeway of inductance value and carries out circuit design, brings greatly to circuit design work
Convenience, also solve for certain special circuit characteristics must use some inductance value shielding inductance and not available ask
Topic, also reduces circuit cost and circuit design cost.
Claims (12)
1. a kind of shadow shield method suitable for DC-DC driving, it is characterised in that: by DC-DC driving chip and connection institute
The main inductance for stating the switching signal output of DC-DC driving chip is arranged adjacent each other on PCB, in all or part of main inductance
Top be arranged metal baffle, or whole upper areas of the main inductance and the DC-DC driving chip be arranged gold
Belong to baffle, arranges the dew copper pad of polarity of ground by PCB layout mode on the pcb, pass through on the dew copper pad
Welding manner connects metallic ground connector, makes the metal baffle and metallic ground connector holding is mechanically fixed and electricity
Gas connection.
2. the shadow shield method suitable for DC-DC driving as described in claim 1, it is characterised in that: filtered electrical will be exported
Hold arrangement on the pcb adjacent to the position of the DC-DC driving chip and the main inductance.
3. the shadow shield method suitable for DC-DC driving as claimed in claim 2, it is characterised in that: the DC-DC driving
Chip and the output filter capacitor make three's location layout and cabling current loop in triangle respectively adjacent to the main inductance
Shape.
4. the shadow shield method suitable for DC-DC driving as claimed in claim 3, it is characterised in that: keep off the metal
Plate simultaneously mask in the top of the main inductance, the output filter capacitor and the DC-DC driving chip.
5. the shadow shield method for being suitable for DC-DC driving as described in claim 1,2,3 or 4, it is characterised in that: the gold
Category baffle is L-shaped, and the dew copper pad has at one, is arranged in the position of the neighbouring main inductance, by the perpendicular of the metal plate washer
Side is mechanically fixed with the metallic ground connector and is electrically connected simultaneously, alternatively, the metal baffle is in gate, the dew brazing
Disk has at two, the opposite two sides of the neighbouring main inductance and DC-DC driving chip region is arranged in, by institute
Two vertical edges for stating metal plate washer are mechanically fixed simultaneously with the metallic ground connector on a dew copper pad respectively
Electrical connection.
6. the shadow shield method for being suitable for DC-DC driving as described in claim 1,2,3,4 or 5, it is characterised in that: described
Metallic ground connector uses metallic ground reed, and the metallic ground reed is equipped at least one latch catch, will be described
The vertical edge of metal plate washer is inserted into the latch catch, metal baffle described in the elastic clamping using the latch catch, is realized
The relatively fixed and electrical connection of the metal baffle and the metallic ground reed.
7. the shadow shield method suitable for DC-DC driving as claimed in claim 6, it is characterised in that: the latch catch
The calvus being arranged symmetrically for two, the overhanging end of two calvus are bent outwardly outer, under natural conditions, two calvus
The shortest distance be less than the metal baffle vertical edge thickness.
8. the shadow shield method suitable for DC-DC driving as claimed in claim 7, it is characterised in that: in the snap-on knot
Round salient point is arranged in the opposed facing surface of two calvus of structure, correspondingly, energy is arranged on the vertical edge surface of the metal plate washer
Enough round concave points matched with the round salient point.
9. the shadow shield method suitable for DC-DC driving as claimed in claim 8, it is characterised in that: a metal
Two latch catchs are arranged in grounding reed, and the round concave point on the surface of the corresponding vertical edge of the metal plate washer is also provided with
Two, and be respectively provided on two side surfaces of corresponding vertical edge.
10. it is a kind of suitable for DC-DC driving shadow shield PCB layout structure, it is characterised in that: including metal baffle, PCB and
DC-DC driving chip, output filter capacitor and the switch letter for connecting the DC-DC driving chip of arrangement on the pcb
The main inductance of number output, the dew copper pad of polarity of ground, the dew copper pad are disposed on the PCB by PCB layout mode
Upper welded connecting metallic ground connector, the setting position of above-mentioned each component part and mode are by any one in claim 1-9
Shadow shield method described in is arranged.
11. the shadow shield PCB layout structure suitable for DC-DC driving as claimed in claim 10, it is characterised in that: described
Metallic ground reed is made of phosphor bronze, and surface layer is handled through tin coating.
12. the shadow shield PCB layout structure as described in claim 10 or 11 suitable for DC-DC driving, it is characterised in that:
The metal baffle keeps 0.5mm-5mm spacing with by the top surface of its component covered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910066275.8A CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910066275.8A CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109600982A true CN109600982A (en) | 2019-04-09 |
| CN109600982B CN109600982B (en) | 2024-02-13 |
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ID=65965371
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|---|---|---|---|
| CN201910066275.8A Active CN109600982B (en) | 2019-01-24 | 2019-01-24 | Local shielding method suitable for DC-DC driving and PCB layout structure |
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