JP2007035759A - Optical communication module and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical communication module in which the occurrence of cracks can be prevented on a resin package, and to provide a manufacturing method thereof. <P>SOLUTION: An infrared data communication module A1 has a substrate 1; a light-emitting element 21 and a light-receiving element 22 mounted on the substrate 1; and the resin package 3 having dome-like lens portions 31A and 31B formed on the front of the light-emitting element 21 and the light-receiving element 22, and covering the light-emitting element 21 and the light-receiving element 22. In the resin package 3, an inclined portion 32B linking to one part of the external peripheral edge of the lens portion 31B and forming an obtuse angle with the portion linking to the external peripheral edge of the lens portion 31B. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical communication module used for two-way communication in an electronic device and a method for manufacturing the same.

  An optical communication module including a light emitting element and a light receiving element is used for bidirectional communication in electronic devices such as notebook computers, mobile phones, and electronic notebooks. Such optical communication modules include, for example, IrDA compliant infrared data communication modules.

  An example of this type of conventional infrared data communication module is shown in FIG. The infrared data communication module X shown in the figure includes a light emitting element 92, a light receiving element 93, a driving IC 94, and a resin package 95 mounted on a substrate 91. The resin package 95 is formed with two lens portions 95 a and 95 b positioned in front of the light emitting element 92 and the light receiving element 93. The light emitting element 92 is configured to emit infrared light. Infrared rays emitted from the light emitting element 92 are emitted upward in the figure with the directivity enhanced by the lens portion 95a. On the other hand, the infrared rays traveling from above in the figure are condensed onto the light receiving element 93 by the lens portion 95b. In this way, bidirectional communication using infrared rays by the infrared data communication module X is performed.

  FIG. 11 shows one process in manufacturing the infrared data communication module X. This manufacturing method is a method of manufacturing a plurality of infrared data communication modules X in a lump by using a collective substrate 91A that can take a plurality of substrates 91. A plurality of resin molded bodies 95A are formed on the illustrated collective substrate 91A. The resin molded body 95A is formed using, for example, a transfer mold method. Two lens portions 95a and 95b are formed on each resin molded body 95A. In each resin molded body 95A, a pair of element groups each composed of a light emitting element 92, a driving IC 94, and a light receiving element 93 arranged in the x direction are arranged apart from each other in the y direction. As described with reference to FIG. 10, the lens portions 95 a and 95 b are located in front of the light emitting element 92 and the light receiving element 93. A plurality of infrared data communication modules X are obtained by cutting the collective substrate 91A and the resin molded body 95A so that each resin molded body 95A is divided into two.

  When the resin molded body 95A is formed by the transfer molding method, a resin material is injected into the mold cavity in a state where the molds are pressed against the collective substrate 91A, and then the resin molded body 95A is removed from the mold. Perform the process. This process is performed by projecting the resin molded body 95A with an ejector pin provided in the mold. Generally, since there is a relatively wide space between the lens portions 95a and 95b, the ejector pin is pressed against the region 95c. However, an excessive force may act on the driving IC 94 through the region 95c due to the pressing. As a result, the drive IC 94 may be damaged, or a wire (not shown) for conducting the drive IC may be broken.

  Further, as shown in FIG. 10, the lens portions 95a and 95b have root portions that are substantially perpendicular to the surrounding surface. This portion is easily held firmly by the mold. For this reason, when the resin molded body 95A is removed from the mold, only the lens portions 95a and 95b may be held by the mold. In this state, when the ejector pin is pressed against the resin molded body 95A, excessive stress acts on the root portions of the lens portions 95a and 95b. Due to this stress, there is a problem that cracks occur in the base portions of the lens portions 95a and 95b.

JP 2001-77404 A

  The present invention has been conceived under the above-described circumstances, and an object thereof is to provide an optical communication module capable of preventing a resin package from being cracked and a method for manufacturing the same. .

  In order to solve the above problems, the present invention takes the following technical means.

  An optical communication module provided by the first aspect of the present invention includes a substrate, a light emitting element and a light receiving element mounted on the substrate, and at least one formed on the front surface of at least one of the light emitting element and the light receiving element. An optical communication module comprising a resin package having the dome-shaped lens portion and covering the light emitting element and the light receiving element, wherein the resin package includes at least one outer periphery of the lens portion. And an inclined portion that forms an obtuse angle with the portion connected to the outer peripheral edge of the lens portion.

  According to such a configuration, even if an external force acts on the resin package, it is possible to avoid an excessive stress from being generated at the base of the lens portion. Therefore, it is possible to avoid a crack from occurring at the base of the lens portion.

  In preferable embodiment of this invention, the angle with respect to the surface in which the said lens part was formed among the said resin parts of the said inclination part is 40-50 degrees. Such a configuration is suitable for preventing cracks from occurring at the base of the lens.

  In a preferred embodiment of the present invention, an arbitrary point on the boundary between the plane of the resin package including the surface on which the lens portion is formed and the optical axis of the lens portion, and the boundary between the lens portion and the inclined portion. The angle formed by the straight line connecting the two points and the plane including the surface on which the lens portion is formed is 20 ° or less. According to such a configuration, the light condensing effect by the lens can be sufficiently exhibited while preventing the above-described cracks.

  The method for manufacturing an optical communication module provided by the second aspect of the present invention includes a step of mounting an element group including a light emitting element and a light receiving element on a substrate, covering the element group, and the light emitting element and the above Forming a resin molded body having at least one lens portion located in front of at least one of the light receiving elements, and a method of manufacturing the optical communication module, wherein the resin molded body is formed An inclined portion connected to at least a part of the outer peripheral edge of the at least one lens portion is formed.

  According to such a configuration, it is possible to prevent a crack from occurring at the base of the lens portion in the manufacturing process of the optical communication module.

  In the method for manufacturing an optical communication module provided by the third aspect of the present invention, a pair of element groups each including a light emitting element and a light receiving element arranged in the first direction are orthogonal to the first direction. Mounting on the substrate so as to be spaced apart in the second direction, and covering the pair of element groups and in front of the pair of light emitting elements and light receiving elements included in the pair of element groups, respectively. A method of manufacturing an optical communication module, comprising: a step of forming a resin molded body having four lens portions positioned; and a step of dividing the resin molded body so that the pair of element groups are separated from each other. In the step of forming the resin molded body, a mold is used, and the mold includes two ejector pins positioned between the four lens portions arranged in the second direction. Equipped Ri, in the step of forming the resin molded body, the above two ejector pin by advancing toward the resin molded body, is characterized by removing the resin molded body from the mold.

  According to such a configuration, when the resin molded body is removed from the mold, even if an external force acts on the resin molded body by the ejector pins, no excessive stress is generated in the element group. . Therefore, the element group can be appropriately protected.

  In a preferred embodiment of the present invention, the pair of element groups further includes an integrated circuit element for driving and controlling the light emitting element and the light receiving element, respectively. In the mounting step, the integrated circuit element is mounted between the light emitting element and the light receiving element. Such a configuration is suitable for protecting the integrated circuit element.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 show a first embodiment of an infrared data communication module according to the present invention. The illustrated infrared data communication module A1 includes a substrate 1, an element group 2, and a resin package 3, and is configured to be capable of bidirectional communication using infrared rays.

  The board | substrate 1 is formed in planar view long rectangular shape as a whole with resin, such as glass epoxy. A wiring pattern (not shown) is formed on the upper surface of the substrate 1 in the drawing. On the substrate 1, an element group 2 including a light emitting element 21, a light receiving element 22, and a driving IC 23 is mounted.

  The light emitting element 21 is made of, for example, an infrared light emitting diode capable of emitting infrared light, and is mounted in the recess of the substrate 1. The light emitting element 21 is connected to the wiring pattern by wire bonding (not shown).

  The light receiving element 22 is composed of, for example, a PIN photodiode capable of sensing infrared rays, and is connected to the wiring pattern by wire bonding (not shown). The light receiving element 22 is configured to be able to output an output signal corresponding to the amount of light when it receives infrared rays.

  The drive IC 23 is for controlling the transmission / reception operation by the light emitting element 21 and the light receiving element 22, and corresponds to an example of an integrated circuit element in the present invention. The drive IC 23 is connected to the wiring pattern by wire bonding (not shown), and is connected to the light emitting element 21 and the light receiving element 22 through the wiring pattern.

  The resin package 3 is formed of, for example, an epoxy resin containing a pigment, and has no translucency for visible light, but has translucency for infrared rays. The resin package 3 is formed by a transfer molding method or the like, and is provided on the substrate 1 so as to cover the light emitting element 21, the light receiving element 22, and the driving IC 23.

  In the resin package 3, two lens portions 31A and 31B are integrally formed. Each of the lens portions 31A and 31B has a shape bulging upward in the drawing. The lens portion 31 </ b> A is located in front of the light emitting element 21 and is configured to emit the infrared rays emitted from the light emitting element 21 while collecting the infrared rays. The lens unit 31 </ b> B is located in front of the light receiving element 22, and is configured to collect the infrared light transmitted to the infrared data communication module A <b> 1 and enter the light receiving element 22. In the present embodiment, the lens unit 31A is smaller than the lens unit 31B.

  In the resin package 3, an inclined portion 32B is formed. The inclined portion 32B connects the outer peripheral edge of the lens portion 31B and the surface 30 provided with the lens portion 31B. As shown in FIG. 2, the angle β formed by the inclined portion 32B and the lower portion of the lens portion 31B in the drawing is an obtuse angle. In addition, the inclination angle α of the inclined portion 32B with respect to the plane including the surface 30 is 45 °. In addition, it is preferable that the inclination | tilt angle (alpha) shall be 40-50 degrees.

  In the present embodiment, the size of the inclined portion 32B is set as follows based on the size of the lens portion 31B. An intersection point P in the figure is an intersection point between the plane including the surface 30 and the optical axis O of the lens portion 31B. The upper end edge of the inclined portion 32B in the drawing, that is, an arbitrary point on the boundary line between the inclined portion 32B and the lens portion 31B and the intersection point P are connected by a straight line. An angle formed by the straight line and a plane including the surface 30 is defined as an angle θ. In the present embodiment, the size of the inclined portion 32B is set so that the angle θ is 20 ° or less.

  Next, an example of a method for manufacturing the infrared data communication module A1 will be described below with reference to FIGS.

  First, as shown in FIG. 3, a collective substrate 1A is prepared. The condensing substrate 1A is a plate made of a resin such as glass epoxy, and is sized so that a plurality of substrates 1 shown in FIGS. 1 and 2 can be taken. Next, a plurality of element groups 2 are mounted on the collective substrate 1A. In this figure, 4 rows in the x direction (first direction in the present invention), 6 columns in the y direction (second direction in the present invention), a total of 24 resin molded body formation scheduled regions 3A ′, Two element groups 2 are arranged respectively. In mounting each element group 2, the light emitting element 21, the driving IC 23, and the light receiving element 22 are arranged in series along the x direction. Further, the two element groups 2 are spaced apart in the y direction. These two element groups 2 are positioned in a resin molded body formation scheduled region 3A ′ represented by a rectangular imaginary line. The element group 2 is mounted by, for example, die bonding.

  Next, the resin molded body 3A shown in FIG. 7 is formed in the resin molded body formation planned area 3A ′. The resin molded body 3A is formed by a transfer mold method. FIG. 4 shows a mold M used in this transfer molding method. This figure is the figure which looked at the metal mold | die M from the opening side. The mold M is provided with a plurality of cavities C in a matrix. The cavity C is a substantially rectangular parallelepiped-shaped recess, and is a part that forms the resin molded body 3A shown in FIG. As shown in FIG. 4, two dome-shaped recesses C1A and C1B are formed in the cavity C. The concave portions C1A and C1B are portions that form the lens portions 31A and 31B shown in FIG. 7, respectively. As shown in FIG. 4, the concave portion C1B is surrounded by the inclined portion C2B. The inclined portion C2B is a portion that forms the inclined portion 32B shown in FIG. The mold M is provided with two ejector pins E for each cavity C. There are ejector pins E that are located between the two recesses C1A and those that are located between the two recesses C1B.

  In order to form the resin molded body 3A, the mold M is pressed against the collective substrate 1 as shown in FIG. FIG. 5 shows a cross section of the mold M and the collective substrate 1A along the line VV shown in FIG. In each cavity C, two element groups 2 are accommodated. In this state, a resin material is injected into the cavity C. When this resin material is cured, a resin molded body 3A shown in FIG. 6 is obtained. In the resin molded body 3A, the lens portions 31A and 31B and the inclined portion 32B are formed by the concave portions C1A and C1B and the inclined portion C2B formed in the cavity C.

  After the resin material is cured, the resin molded body 3A is removed from the mold M by moving the ejector pin E downward in the figure. Thereby, as shown in FIG. 7, a plurality of resin molded bodies 3A can be formed on the collective substrate 1A.

  As shown in FIG. 8, the resin molded body 3 </ b> A is formed with the lens portions 31 </ b> A and 31 </ b> B having a substantially perfect outer periphery. The inclined portion 32B is formed in a ring shape that surrounds the entire circumference of the lens portion 31B. Ejector pin marks 34 are formed between the two lens portions 31A and between the two lens portions 31B, respectively. When the resin molded body 3A is removed from the mold M described above, the ejector pins E are pressed against the ejector pin marks 34, so that a force for removing the resin molded body 3A acts on this portion.

  Thereafter, the collective substrate 1A and the resin molded body 3A are cut. In this cutting, cutting is performed along the cutting line L shown in FIG. Thus, the resin molded body 3A is divided into portions each including the element group 2 one by one. In the present embodiment, the portion of the resin molded body 3A where the ejector pin marks 34 are formed is discarded. For this reason, the ejector pin mark 34 does not remain in the infrared data communication module A1. Further, an appropriate place is cut along a cutting line (not shown) extending in the y direction. By the above cutting, each resin molded body 3A is divided into two resin packages 3, and the collective substrate 1A is divided into a plurality of substrates 1. As a result, a plurality of infrared data communication modules A1 shown in FIG. 1 are obtained.

  Next, the operation of the infrared data communication module A1 will be described.

  According to the present embodiment, as shown in FIGS. 1 and 8, the inclined portion 32B is formed between the lens portion 31B and the surface 30, and for example, a substantially right-angle corner is not formed. For this reason, in the process of removing the resin molded body 3A shown in FIG. 6, it is possible to avoid the occurrence of excessive stress at the base of the lens portion 31B. Therefore, it is possible to prevent a crack from occurring at the base of the lens portion 31B.

  In order to prevent the above-described cracks, it is preferable that the inclination angle α of the inclined portion 32B shown in FIG. 2 is 45 °. Further, in order to appropriately exhibit the effect of preventing cracks, the inclination angle α is preferably 40 to 50 °.

  As shown in FIG. 2, if the angle of the inclined portion 32B is set to be 20 ° or less, it is possible to avoid the surface area of the lens portion 31B from becoming unduly small. If the inclined portion 32B is unreasonably large, the lens portion 31B becomes small. In such a case, it becomes difficult to appropriately collect infrared rays toward the light receiving element 22. According to this embodiment, infrared rays can be appropriately condensed on the light receiving element 22 while exhibiting the above-described effect of preventing cracks.

  As can be understood from FIG. 8, the resin molded body 3 </ b> A is protruded from the mold M by the ejector pin E at the ejector pin mark 34. For this reason, an external force acts on the ejector pin mark 34. Each ejector pin mark 34 is located between two lens portions 31A and 31B. When the external force acts, the resin molded body 3A bends so that the periphery of the ejector pin mark 34 is displaced downward in the figure while the two lens portions 31A and 31B are supported. However, the element group 2 is not arranged below the ejector pin E in the figure. Therefore, even if the bending occurs, a large stress does not act on the element group 2, and the element group 2 can be appropriately protected. In particular, the drive IC 23 is likely to be damaged by bending deformation, such as a long rectangular shape. In the present embodiment, the ejector pin E of the mold M is arranged so that the ejector pin mark 34 is located away from the drive IC 23. This is preferable for protecting the drive IC 23.

  FIG. 9 shows a second embodiment of the infrared data communication module according to the first aspect of the present invention. In FIG. 9, the same or similar elements as those in the above-described embodiment are denoted by the same reference numerals as those in the above-described embodiment, and description thereof will be omitted as appropriate.

  The infrared data communication module A2 shown in FIG. 9 is different from the first embodiment described above in that it includes an inclined portion 32A and the shapes of the inclined portions 32A and 32B. In the present embodiment, the lens portions 31A and 31B have a shape having a perfect outer periphery. The inclined portions 32A and 32B are ring-shaped inclined surfaces surrounding the lens portions 31A and 31B, respectively.

  Even in such an embodiment, it is possible to prevent cracks from occurring around the lens portions 31A and 31B in the manufacturing process. Further, the element group 2 can be protected. In particular, for the purpose of increasing the directivity of infrared rays from the light emitting element 21, the crack prevention effect is remarkable when the lens portion 31 </ b> A has a shape that largely protrudes upward in the drawing.

  The optical communication module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the optical communication module according to the present invention can be modified in various ways.

  The number of element groups included in the resin molded body is not limited to two, and may be three or more. The light emitting element and the light receiving element are not limited to those capable of emitting or receiving infrared rays, and those capable of emitting or receiving visible light may be used. That is, the optical communication module is not limited to the infrared data communication module, and may be a communication system using visible light.

1 is an overall perspective view showing a first embodiment of an infrared data communication module according to the present invention. It is sectional drawing which follows the II-II line | wire of FIG. FIG. 7 is a plan view of a principal part showing a step of mounting the element group on the collective substrate in the example of the method for manufacturing the infrared data communication module shown in FIG. 1. FIG. 2 is a plan view of a principal part showing a mold used to form a resin molded body in an example of a method for manufacturing the infrared data communication module shown in FIG. 1. FIG. 3 is a cross-sectional view of a main part showing a step of forming a resin molded body in an example of a method for manufacturing the infrared data communication module shown in FIG. 1. FIG. 3 is a cross-sectional view of a principal part showing a step of removing a resin molded body from a mold in an example of the method for manufacturing the infrared data communication module shown in FIG. 1. FIG. 2 is a plan view of a principal part showing a state where a resin molded body is formed on a collective substrate in an example of a method for manufacturing the infrared data communication module shown in FIG. 1. FIG. 3 is an enlarged perspective view of a main part showing a resin molded body formed on a collective substrate in an example of a method for manufacturing the infrared data communication module shown in FIG. 1. It is a whole perspective view which shows 2nd Embodiment of the infrared data communication module which concerns on this invention. It is sectional drawing which shows an example of the conventional infrared data communication module. In an example of the manufacturing method of the infrared data communication module shown in FIG. 10, it is a principal part top view which shows the state in which the resin molding was formed in the aggregate substrate.

Explanation of symbols

A1, A2 Infrared data communication module (optical communication module)
C Cavity C1A, C1B Recess C2B Inclined portion E Ejector pin L Cutting line M Mold O Optical axis α Inclination angle θ Angle 1 Substrate 1A Assembly substrate 2 Element group 3 Resin package 3A Resin molded product 3A ′ Resin molded product formation planned region 21 Light emitting element 22 Light receiving element 23 Driving IC (integrated circuit element)
30 Surface 31A, 31B Lens part 32A, 32B Inclined part 34 Ejector pin mark

Claims (6)

A substrate,
A light emitting element and a light receiving element mounted on the substrate;
A resin package having at least one dome-shaped lens portion formed on the front surface of at least one of the light emitting element and the light receiving element, and covering the light emitting element and the light receiving element;
An optical communication module comprising:
The resin package is formed with an inclined portion that is connected to at least a part of the outer peripheral edge of at least one or more of the lens portions and that forms an obtuse angle with a portion of the lens portions connected to the outer peripheral edge. An optical communication module is characterized.   The optical communication module according to claim 1, wherein the inclined portion has an angle of 40 to 50 degrees with respect to a surface of the resin package on which the lens portion is formed. A straight line connecting an intersection of a plane including the surface on which the lens part is formed in the resin package and an optical axis of the lens part, and an arbitrary point on a boundary line between the lens part and the inclined part,
A plane including the surface on which the lens portion is formed;
The optical communication module according to claim 1, wherein the angle formed by the is less than or equal to 20 °. Mounting an element group including a light emitting element and a light receiving element on a substrate;
Forming a resin molding that covers the element group and has at least one or more lens portions located in front of at least one of the light emitting element and the light receiving element;
An optical communication module manufacturing method comprising:
In the step of forming the resin molded body, an inclined portion connected to at least a part of the outer peripheral edge of at least one or more of the lens portions is formed. Mounting a pair of element groups each including a light emitting element and a light receiving element arranged in a first direction on a substrate so as to be separated in a second direction orthogonal to the first direction;
Forming a resin molded body that covers the pair of element groups and includes four lens portions located respectively in front of the pair of light emitting elements and light receiving elements included in the pair of element groups;
Dividing the resin molded body so that the pair of element groups are separated from each other;
An optical communication module manufacturing method comprising:
In the step of forming the resin molded body, a mold is used, and
The mold is provided with two ejector pins positioned between the four lens portions arranged in the second direction,
In the step of forming the resin molded body, the resin molded body is removed from the mold by advancing the two ejector pins toward the resin molded body. Method. Each of the pair of element groups further includes an integrated circuit element for driving and controlling the light emitting element and the light receiving element, respectively.
6. The method of manufacturing an optical communication module according to claim 5, wherein in the step of mounting the pair of element groups on the substrate, the integrated circuit element is mounted between the light emitting element and the light receiving element.

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