JP2000332154A - Multiple connected semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To exactly position a frame-like substrate on a metal frame by providing protrusions on the mounting frame, which contacts the frame inside a substrate or fits in holes of the frame for mounting the substrate on the metal frame by means of the protrusions. SOLUTION: This multiple connected semiconductor device comprises protrusions 1 on a metal frame 6, which contact the four corners of an inner frame of a frame-like substrate 5 for positioning the substrate 5. The protrusions 1 contacting the corners of the inner frame of the substrate 5 slope down to contact the top surface of the frame 6, so that the substrate 5 can be adhered with its center aligned with the center of a semiconductor chip 7 fixed previously to an exact position of the frame 6, or the substrate 5 is guided by the protrusions 1 to be positioned and adhered to an exact position on the frame 6, thereby mounting the semiconductor chip 7 in the frame of the substrate 5 on the precisely intermittently fed frame 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a band-shaped metal frame.
The present invention relates to a multi-connection type semiconductor device in which a semiconductor chip is mounted in a frame of a frame-like member arranged in a longitudinal direction in a system.

[0002]

2. Description of the Related Art Normally, a semiconductor device of a cavity-down type ball grid array package has a semiconductor chip mounted on each frame from the viewpoint of reducing the cost of the package and shortening the assembly process. Instead, a multi-connection type semiconductor device in which a large number of semiconductor chips are arranged side by side on a long metal frame and assembled is required.

FIGS. 5A and 5B are a side view and a plan view for explaining a method of assembling a conventional multi-connection type semiconductor device. In order to assemble the multi-connection type semiconductor device, as shown in FIG. 5, first, a target mark (not shown) on a long metal frame 6 such as copper is aligned and bonded. Plastic frame-shaped substrates 5 are arranged side by side via an epoxy resin as a material and bonded. Next, the semiconductor chip 7
Are positioned in the frame of the substrate 5 with reference to the target mark, and the frame is fixed to the semiconductor chip 7 with silver paste resin.

On the contrary, the semiconductor chip 7 is connected to the frame 6
A method has been adopted in which the substrate 5 is placed after the substrate 5 is mounted.
In any case, the substrate 5 and the semiconductor chip 7 were bonded and fixed to the frame 6 based on the mark printed on the metal frame 6.

[0005] The assembled multi-connection type semiconductor device is divided into individual semiconductor devices by cutting the frame 6, and the electrode pads of the semiconductor chip, the electrode pads of the substrate and the wires of the separated semiconductor device are individually separated. And sealed with resin to complete the assembly of the semiconductor device.

[0006]

However, according to the above-described assembling method, as shown in FIG.
Of the semiconductor chip 7 and the center of the semiconductor chip 7 in many cases. Although the mounting of the semiconductor chip 7 can be accurately positioned and mounted by a die mounter, the substrate 5 bonded to the frame 6 is displaced by a slight external force while the adhesive is hardened. May be.

[0007] A semiconductor device having such a position shift generates a defective product in a subsequent step such as a wire bonding step or a ball bonding step. For example, in the wire bonding step, since the relative positions of the electrode pads of the semiconductor chip 7 and the electrode pads of the substrate 5 are shifted, the wire is loosened where the distance between the electrode pads is short, and the distance between the electrode pads is long. However, there is a problem that the wires cannot reach and cannot be connected.

Accordingly, an object of the present invention is to provide a metal frame.
An object of the present invention is to provide a multi-connection type semiconductor device in which a frame-shaped substrate is precisely positioned on a system.

[0009]

SUMMARY OF THE INVENTION The present invention is characterized in that a plurality of resin frame members are arranged and adhered to a strip-shaped metal frame in a longitudinal direction, and the frame member is inserted into the frame member. −
A multi-connection semiconductor device having a semiconductor chip fixed to a frame, the multi-connection semiconductor device having a plurality of projections formed on the frame and in contact with an inner frame of the frame member. In addition, it is preferable that a surface of the protrusion that contacts the inner frame portion of the frame-shaped member is inclined so as to descend from top to bottom, or that a cross-sectional shape of the protrusion is conical. More preferably, the cross-sectional shape of the projection is hemispherical. On the other hand, it is desirable to have four of the protrusions in contact with the corners of the inner frame of the frame member, or to have four of the protrusions in contact with each of the sides of the inner frame facing the frame member.

Another feature of the present invention is that a plurality of resin frame members are arranged and adhered in a longitudinal direction to a strip-shaped metal frame, and inserted into the frame member and fixed to the frame. A semiconductor chip having at least two projections for positioning the frame member on the frame, the projections being formed on the lower surface of the frame member. This is a multi-connection type semiconductor device in which a recess to be fitted is formed. Further, it is desirable that the cross-sectional shape of the projection is hemispherical.

[0011]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a side view and a plan view for explaining a multi-connection type semiconductor device according to an embodiment of the present invention. This multi-connection type semiconductor device is shown in FIG.
As shown in (1), a metal frame 6 is provided with a protrusion 1 for positioning the substrate 5 by contacting the four corners of the inner frame of the frame-shaped substrate 5. As will be described later, it is desirable that the surface of the protrusion 1 that comes into contact with the corner of the inner frame of the substrate 5 be sloped so as to descend from the top to the top of the frame 6.

FIG. 2 is an enlarged sectional view showing the protrusion and its vicinity in FIG. As shown in FIG. 2, the protrusion 1 in FIG. 1 is formed by press-forming a frame 5 which is a copper plate. The shape of the projection 1 may be any cross-sectional shape as long as only the surface in contact with the corner 2 is inclined.
The cross-sectional shape of the projection 1 is conical or hemispherical so as to facilitate press molding. Also, since the surface of the projection 1 that is in contact with the corner 2 of the inner frame of the frame-shaped substrate 5 is inclined by forming the projection 1 into the cross-sectional shape as described above,
The inclined surfaces of the four protrusions 1 serve as guide surfaces for the inner frame of the substrate 5, and there is an advantage that the substrate 5 can easily enter.

In an attempt, for example, when a circular boss was formed (hemispherical cross-sectional shape) on a frame 6 of a copper plate of 0.2 mm, the diameter of the bottom of the projection 1 was about 1 to 2 mm and the height was about 1 to 2 mm. When molded to a size of 0.5 mm or less, the frame 6 could be molded without warping or cracking. Also,
Since the height of the projections 1 was 0.5 mm or less, the substrate 5 could easily enter and the positioning of the substrate 5 could be performed smoothly.

By providing the four projections 1 on the frame 6 as described above, the center of the semiconductor chip 7 previously fixed at an accurate position of the frame 6 and the center of the substrate 5 are made to coincide with each other. On the contrary, as shown in FIG. 1, the substrate 5 is guided and guided by the projections 1 and positioned and adhered to the frame 6 at an accurate position. The semiconductor chip 7 may be mounted in the frame.

FIG. 3 is a plan view showing a modification of the multiple semiconductor device of FIG. This multiple semiconductor device is provided such that the root portions of the four protrusions 1a are in contact with the wall surfaces of the sides 3 of the inner frame of the substrate 5 facing each other. In addition, it is desirable that the protrusions 1 a be arranged at the center of each side 3.

The shape of the projection 1a is the same as that of the projection 1 in FIG.
As in the case of the above, it is desirable to make the shape of a cone or a hemisphere. The protrusion 1a is suitable when the substrate 5 and the semiconductor chip 7 are relatively small. It is considered that the protrusion 1a should be formed in the same length as the side 3 in parallel with the side 3 and two places should be provided on the opposite side 3, but it is necessary to form a long protrusion on the frame 6. May cause warping or distortion in the frame due to the increase in deformation.
Not a good idea.

FIGS. 4A and 4B are a plan view and an AA cross-sectional enlarged view for explaining a multi-connection type semiconductor device according to another embodiment of the present invention. In this multi-connection type semiconductor device, as shown in FIG. 4, two projections 1b are formed on a frame 6 and a hole 4 is provided on the bottom surface of a frame of a substrate 5 to receive the projections 1b.

The number of the protrusions 1b is two in the drawing, but may be three or four. However, as the number increases, the protrusion 1
If the clearance between b and the hole 4 is not increased, the protrusion 1b cannot enter the hole 4. Therefore, in the present embodiment, the distance between the two protrusions 1b is made as large as possible in order to improve the positioning accuracy by appropriately determining the clearance between the two protrusions 1b and the hole 4 with the minimum of two protrusions. A hole 4 was formed in the frame portions of the substrate 5 facing each other, and a projection 1b entering the hole 4 was formed on the frame 6.

As described above, the protrusion 1b is preferably formed in a conical shape or a hemispherical shape, but is formed into a hemispherical shape which can be easily formed. The diameter of the bottom of this hemispherical projection 1b is
For example, 1 to 2 mm, and the hole 4 is 1.5 to 2.5 m
m, clearance 0.5mm, height 0.5m
By setting m or less, the protruding portion 1b of the substrate 5 could enter the hole 4 very smoothly to position the substrate 5.

Since the projections described above can be handled by a small molding press or a hole molding press, these molding presses have the advantage that they can be incorporated into a frame transport line and a substrate transport line and can be easily automated.

[0022]

As described above, according to the present invention, the metal frame to be mounted is provided with a projection which comes into contact with the inside of the frame of the substrate or a projection which enters a hole of the frame, and is guided by each projection. Since the substrate is mounted on the frame, the substrate is precisely positioned at the position where the frame is to be mounted, which has the effect of improving the manufacturing yield of the subsequent wire bonding and ball bonding processes. .

[Brief description of the drawings]

1A and 1B are a side view and a plan view illustrating a multi-connection semiconductor device according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view showing a protrusion and its vicinity in FIG. 1;

FIG. 3 is a plan view showing a modification of the multiple semiconductor device of FIG. 1;

4A and 4B are a plan view and an AA cross-sectional enlarged view for explaining a multi-connection type semiconductor device according to another embodiment of the present invention.

5A and 5B are a side view and a plan view for explaining a conventional method of assembling a multi-connection semiconductor device.

[Description of Signs] 1, 1a, 1b Projection 2 Corner 3 Side 4 Hole 5 Substrate 6 Frame 7 Semiconductor chip

Claims (8)

[Claims] 1. A plurality of resin frame members which are adhered side by side in a longitudinal direction to a strip-shaped metal frame, and a semiconductor chip which is inserted into the frame member and fixed to the frame. A multi-connection type semiconductor device, comprising: a plurality of projections formed on the frame and in contact with an inner frame of the frame member. 2. The multi-connection type semiconductor device according to claim 1, wherein a surface of said projection in contact with an inner frame of said frame-like member is inclined from down to down. 3. The multiple semiconductor device according to claim 2, wherein the cross-sectional shape of the protrusion is conical. 4. The multiple semiconductor device according to claim 1, wherein a cross-sectional shape of said projection is hemispherical. 5. The multi-connection according to claim 1, wherein the plurality of projections have four projections that are in contact with corners of an inner frame of the frame member. Type semiconductor device. 6. The frame member according to claim 1, wherein said frame member has four said projecting portions which are in contact with respective sides of the inner frame facing each other. The multi-connection type semiconductor device according to the above. 7. A plurality of resin frame members which are adhered side by side in a longitudinal direction to a strip-shaped metal frame, and a semiconductor chip which is inserted into the frame member and fixed to the frame. In the multi-connection type semiconductor device, at least two projections for positioning the frame member on the frame are formed on the frame, and a recess is formed on a lower surface of the frame member so that the projection is fitted. And a multi-connection type semiconductor device. 8. The multi-connection type semiconductor device according to claim 7, wherein a cross-sectional shape of the protrusion according to claim 7 is hemispherical.