JP2000323703A5 - - Google Patents
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- Publication number
- JP2000323703A5 JP2000323703A5 JP1999134679A JP13467999A JP2000323703A5 JP 2000323703 A5 JP2000323703 A5 JP 2000323703A5 JP 1999134679 A JP1999134679 A JP 1999134679A JP 13467999 A JP13467999 A JP 13467999A JP 2000323703 A5 JP2000323703 A5 JP 2000323703A5
- Authority
- JP
- Japan
- Prior art keywords
- coupled device
- heat treatment
- charge coupled
- nitride
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13467999A JP4008152B2 (ja) | 1999-05-14 | 1999-05-14 | 電荷結合素子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13467999A JP4008152B2 (ja) | 1999-05-14 | 1999-05-14 | 電荷結合素子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000323703A JP2000323703A (ja) | 2000-11-24 |
| JP2000323703A5 true JP2000323703A5 (enExample) | 2005-04-07 |
| JP4008152B2 JP4008152B2 (ja) | 2007-11-14 |
Family
ID=15134046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13467999A Expired - Fee Related JP4008152B2 (ja) | 1999-05-14 | 1999-05-14 | 電荷結合素子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4008152B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9252237B2 (en) | 2012-05-09 | 2016-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistors, semiconductor devices, and methods of manufacture thereof |
-
1999
- 1999-05-14 JP JP13467999A patent/JP4008152B2/ja not_active Expired - Fee Related
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