JP2000299300A5 - - Google Patents
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- Publication number
- JP2000299300A5 JP2000299300A5 JP1999104881A JP10488199A JP2000299300A5 JP 2000299300 A5 JP2000299300 A5 JP 2000299300A5 JP 1999104881 A JP1999104881 A JP 1999104881A JP 10488199 A JP10488199 A JP 10488199A JP 2000299300 A5 JP2000299300 A5 JP 2000299300A5
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- semiconductor device
- manufacturing
- substrate
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims 26
- 239000002184 metal Substances 0.000 claims 26
- 238000004519 manufacturing process Methods 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 16
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 15
- 238000005498 polishing Methods 0.000 claims 13
- 239000007788 liquid Substances 0.000 claims 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000000126 substance Substances 0.000 claims 7
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 5
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 5
- 239000001630 malic acid Substances 0.000 claims 5
- 235000011090 malic acid Nutrition 0.000 claims 5
- 239000007800 oxidant agent Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 238000001035 drying Methods 0.000 claims 4
- 229910044991 metal oxide Inorganic materials 0.000 claims 4
- 150000004706 metal oxides Chemical class 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 3
- 229920002125 Sokalan® Polymers 0.000 claims 3
- 239000012964 benzotriazole Substances 0.000 claims 3
- 229920000058 polyacrylate Polymers 0.000 claims 3
- 239000004584 polyacrylic acid Substances 0.000 claims 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 150000007524 organic acids Chemical class 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 2
- 239000005749 Copper compound Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims 1
- 150000001880 copper compounds Chemical class 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11104881A JP2000299300A (ja) | 1999-04-13 | 1999-04-13 | 研磨方法及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11104881A JP2000299300A (ja) | 1999-04-13 | 1999-04-13 | 研磨方法及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000299300A JP2000299300A (ja) | 2000-10-24 |
| JP2000299300A5 true JP2000299300A5 (enExample) | 2005-02-24 |
Family
ID=14392541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11104881A Pending JP2000299300A (ja) | 1999-04-13 | 1999-04-13 | 研磨方法及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000299300A (enExample) |
-
1999
- 1999-04-13 JP JP11104881A patent/JP2000299300A/ja active Pending
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