JP2000299300A - 研磨方法及び半導体装置の製造方法 - Google Patents

研磨方法及び半導体装置の製造方法

Info

Publication number
JP2000299300A
JP2000299300A JP11104881A JP10488199A JP2000299300A JP 2000299300 A JP2000299300 A JP 2000299300A JP 11104881 A JP11104881 A JP 11104881A JP 10488199 A JP10488199 A JP 10488199A JP 2000299300 A JP2000299300 A JP 2000299300A
Authority
JP
Japan
Prior art keywords
polishing
metal film
substrate
polishing method
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11104881A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000299300A5 (enExample
Inventor
Seiichi Kondo
誠一 近藤
Yoshio Honma
喜夫 本間
Noriyuki Sakuma
憲之 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11104881A priority Critical patent/JP2000299300A/ja
Publication of JP2000299300A publication Critical patent/JP2000299300A/ja
Publication of JP2000299300A5 publication Critical patent/JP2000299300A5/ja
Pending legal-status Critical Current

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  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11104881A 1999-04-13 1999-04-13 研磨方法及び半導体装置の製造方法 Pending JP2000299300A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11104881A JP2000299300A (ja) 1999-04-13 1999-04-13 研磨方法及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11104881A JP2000299300A (ja) 1999-04-13 1999-04-13 研磨方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2000299300A true JP2000299300A (ja) 2000-10-24
JP2000299300A5 JP2000299300A5 (enExample) 2005-02-24

Family

ID=14392541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11104881A Pending JP2000299300A (ja) 1999-04-13 1999-04-13 研磨方法及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2000299300A (enExample)

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