JP2000239034A - Cutting of glass substrate and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut a glass substrate in a short time. SOLUTION: A block 25 having a scriber 28 and a piezoelectric element 26 is attached through leaf springs 24 to a movable guide member 23. A pressure in the downward direction is applied through the movable guide member 23, etc., to the scriber 28 by driving the piezoelectric element 26 and further driving a second cylinder 33. A marking-off line can be formed on the top surface of a glass substrate 36 by the scriber 28 to which the pressure is applied in the downward direction. Furthermore, the glass substrate 36 can be cut along the marking-off line with a shock produced by vibration of the scriber 28 in the vertical directions. That is, the glass substrate 36 can be cut along the marking-off line nearly simultaneously with the formation of the marking-off line on the top surface of the glass substrate 36.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for cutting a glass substrate.

[0002]

2. Description of the Related Art For example, when manufacturing a liquid crystal display panel having a glass substrate, there is a method of obtaining a plurality of glass substrates for a liquid crystal display panel by cutting a relatively large glass substrate.

FIG. 2 is a schematic diagram showing an example of such a conventional glass substrate cutting apparatus. This glass substrate cutting device includes a ball screw 1. The upper and lower portions of the ball screw 1 are rotatably mounted on an upper mounting plate 2 and a lower mounting plate 3. The ball screw 1 is rotated by a torque of the motor 5 via a belt 8 wound around a pulley 4 provided at an upper end thereof and a pulley 7 provided on a shaft 6 of the motor 5 mounted on the upper mounting plate 2. By being transmitted, it is designed to rotate.

[0004] A ball nut 8 is mounted on the ball screw 1 so as to be able to move up and down while rotation is restricted. A bracket 9 is attached to the ball nut 8.
A block 10 is provided on the lower surface of the bracket 9. An adjustment screw 11 is inserted through the block 10 rotatably and vertically. A mounting portion 12 is provided at a lower end portion of the adjusting screw 11. A scriber 13 made of a diamond chip is attached to the attachment portion 12.

When a relatively large glass substrate 14 is cut by this glass substrate cutting apparatus, first, the adjusting screw 11 is operated to set the height position of the scriber 13 (that is, the cut amount of the scriber 13 into the glass substrate 14). ) Is set. Next, the ball screw 1 is rotated in the forward direction by the forward rotation of the motor 4, whereby the ball nut 8 located at the upper limit position (initial position) is lowered by a predetermined amount. Then, the scriber 13 located at the upper limit position (initial position) also lowers by a predetermined amount.

In this state, the scriber 1
When the glass substrate 14 is sent to the lower side of the scriber 3,
3, a scribe line (not shown) having a predetermined depth is formed on the upper surface of the glass substrate 14. Next, the glass substrate 14 is cut along the scribe line by applying an impact to a scribe line portion of the glass substrate 14 by a break portion (impact portion) not shown.

[0007]

However, in such a conventional glass substrate cutting method, a scribing step of forming a scribe line and a break step of applying an impact to the scribe line portion of the glass substrate 14 are separate. Therefore, there is a problem that it takes time. An object of the present invention is to enable a glass substrate to be cut in a short time.

[0008]

According to a first aspect of the present invention, there is provided a glass substrate cutting method, comprising: vibrating a scriber in a vertical direction; and applying a downward pressure to the scriber, whereby the glass is cut by the scriber. A scribe line is formed on the upper surface of the substrate, and the glass substrate is cut along the scribe line. The scribing board cutting device according to the invention according to claim 4, comprising a scriber, a vibrating means for vibrating the scriber in a vertical direction, and a pressurizing means for applying a downward pressure to the scriber,
The scriber is vibrated by the vibrating means, and a downward pressure is applied to the scriber by the pressurizing means, thereby forming a scribe line on the upper surface of the glass substrate by the scriber and forming the glass substrate on the glass substrate. It is designed to cut along the scribe line. According to the present invention, it is possible to form a scribe line on the upper surface of the glass substrate by the scriber that is pressed downward, and to scribe the glass substrate by the shock generated by the vertical vibration of the scriber. Can be cut along the scribe line almost simultaneously with forming the scribe line on the upper surface of the glass substrate, thus cutting the glass substrate in a short time be able to.

[0009]

FIG. 1 is a schematic structural view of a glass substrate cutting apparatus according to an embodiment of the present invention. This glass substrate cutting apparatus includes a vertically arranged mounting plate 21. A fixed guide member 22 is attached to a predetermined location on the left side surface of the attachment plate 21. A movable guide member 23 is attached to the left side of the fixed guide member 22 so as to be vertically movable. A block 25 is provided on the left side of the movable guide member 23 via a plurality of, for example, two leaf springs 24.
Is attached. In this case, the leaf spring 24 is for allowing the block 25 to vibrate vertically with respect to the movable guide member 23, and other means may be used as long as they have such a function. A piezoelectric element 26 as a vibration source is provided at a predetermined position of the block 25. At the lower end of the block 25, an attachment portion 27 is provided. A scriber 28 made of a diamond chip is attached to the attachment portion 27.

A first cylinder 29 for adjusting the lower limit position of the scriber 28 is mounted at a predetermined position at the lower end of the left side surface of the mounting plate 21. First cylinder 2
Nine piston rods 30 project upward. First
The tip of the piston rod 30 of the cylinder 29 is brought into contact with the tip of a height-position regulating rod 31 provided in a cantilever manner at a predetermined position on the right side of the block 25.

A bracket 32 is mounted on the upper end of the left side surface of the mounting plate 21. A second cylinder 33 for applying a downward pressure to the scriber 28 is attached to a lower surface of the bracket 32. The piston rod 34 of the second cylinder 33 projects downward.
The tip of the piston rod 34 of the second cylinder 33 is
The pressed rod 3 provided on the upper surface of the movable guide member 23
5 is brought into contact with the tip end.

Next, the initial state of the glass substrate cutting apparatus will be described. The piston rod 30 of the first cylinder 29 is in a protruding state. Therefore, block 25
Is at the upper limit position together with the height position regulating rod 31, the scriber 28 is also at the upper limit position, and the movable guide member 23 is also at the upper limit position together with the leaf spring 24 and the pressed rod 35. On the other hand, the piston rod 34 of the second cylinder 33 is in a retracted state. Therefore, the distal end of the piston rod 34 of the second cylinder 33 is separated from the distal end of the pressed rod 35 at the upper limit position by a predetermined distance.

When a relatively large glass substrate 36 is cut by the glass substrate cutting apparatus, first, the piston rod 30 of the first cylinder 29 is retracted by a predetermined amount. Then, the block 25 is lowered by a predetermined amount together with the height position regulating rod 31 by its own weight, and accordingly, the scriber 28 is also lowered by a predetermined amount, and the movable guide member 23 is moved together with the leaf spring 24 and the pressed rod 35 by a predetermined amount. Just descend. Then, when the scriber 28 descends from the initial upper limit position by a predetermined amount, the height position of the scriber 28 (that is, the cut amount of the scriber 28 into the glass substrate 36) is set.

Next, the piezoelectric element 26 is driven. Then, the leaf spring 24 is elastically deformed in the vertical direction,
The block 25 vibrates up and down with respect to the movable guide member 23 together with the scriber 28 and the like. However, in this case,
The lower end position of the block 25 is regulated by the distal end portion of the height position regulating rod 31 abutting on the distal end portion of the piston rod 30 of the first cylinder 29, and accordingly, the lower limit position of the scriber 28 is also regulated. . As a result, the cut amount set for the glass substrate 36 by the scriber 28 is maintained.

Next, the piston rod 34 of the second cylinder 33 is appropriately protruded. Then, the tip of the piston rod 34 presses the tip of the pressed rod 35,
The upward movement of the movable guide member 23 together with the pushed rod 35 is regulated. The reason for restricting the upward movement of the movable guide member 23 will be described later.

In this state, the scriber 2
8, the glass substrate 36 is relatively fed into the lower side of the glass substrate 36, that is, when one of the scriber 28 and the like and the glass substrate 36 is moved in the horizontal direction, Since a scribing line (not shown) is formed and the scriber 28 is vibrating in the vertical direction, the glass substrate 36 is cut along the scribing line by the shock generated by the vibration.

Here, when the upward movement of the movable guide member 23 is not restricted, the scriber 28 vibrating in the vertical direction.
Bounce off the upper surface of the glass substrate 36. On the other hand, if the upward movement of the movable guide member 23 is restricted, that is, if a downward pressure is applied to the scriber 28 by the second cylinder 33, the scriber 28 that vibrates in the vertical direction becomes glass. It does not jump against the upper surface of the substrate 36. As a result, as described above, a scribe line is formed on the upper surface of the glass substrate 36 by the scriber 28, and the glass substrate 36
It will be cut along the scribe line.

As described above, in this glass substrate cutting method, a scribe line can be formed on the upper surface of the glass substrate 36 by the scriber 28 to which a downward pressure is applied, and the scriber 28 vibrates in the vertical direction. Can cut the glass substrate 36 along the scribe line, that is, almost simultaneously with forming the scribe line on the upper surface of the glass substrate 36.
6 can be cut along the scribe line, so that the glass substrate 36 can be cut in a short time. In addition, only by adjusting the retreat amount of the piston rod 30 of the first cylinder 29, the glass substrate 3 by the scriber 28 can be adjusted.
6 can be easily adjusted.

In the above embodiment, in the initial state, the distal end of the piston rod 34 of the second cylinder 33 is separated from the distal end of the pressed rod 35 by a predetermined distance. However, the present invention is not limited to this. , May be brought into contact. Even in this case, the block 25 and the like can be held at the initial upper limit position by the second cylinder 29. Further, instead of the second cylinder 33, a downward pressure may be applied to the movable guide member 23, that is, the scriber 28 by a weight having a predetermined weight.

In the above embodiment, the scriber 28
However, the present invention is not limited to this, and a diamond wheel may be used. In this case, for example, with reference to FIG. 1, a diamond wheel may be rotatably mounted on the mounting portion 27 via a shaft. In the above embodiment, the first cylinder 29 is used to adjust the lower limit position of the scriber 28. However, the present invention is not limited to this. For example, the upper and lower parts of the block 10 and the adjustment screw 11 shown in FIG. The reverse may be used.

Further, in the above embodiment, the case where one glass substrate is cut has been described, but the present invention is not limited to this. For example, as in the case of manufacturing a liquid crystal display panel, two glass substrates bonded to each other at a certain interval may be cut. In this case, one upper glass substrate of the two glass substrates may be cut, and then the other glass substrate which is turned upside down by cutting the two glass substrates may be cut.

[0022]

As described above, according to the present invention, the glass substrate is cut along the scribe line almost simultaneously with forming the scribe line on the upper surface of the glass substrate. Can be cut in a short time.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a glass substrate cutting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of an example of a conventional glass substrate cutting apparatus.

[Explanation of symbols]

 22 Fixed Guide Member 23 Movable Guide Member 24 Leaf Spring 25 Block 26 Piezoelectric Element 28 Scriber 29 First Cylinder 31 Height Position Control Bar 33 Second Cylinder

Claims (6)

[Claims] 1. A scriber is vibrated up and down and a downward pressure is applied to the scriber to form a scribe line on the upper surface of the glass substrate by the scriber and to scribe the glass substrate. A glass substrate cutting method, comprising cutting along a line. 2. The glass substrate cutting method according to claim 1, wherein a cut amount of the glass substrate by the scriber is adjusted by adjusting a lower limit position of the scriber. 3. The method according to claim 1, wherein
The glass substrate cutting method, wherein the glass substrate is an upper glass substrate among two glass substrates bonded to each other at a predetermined interval. 4. A scriber, vibrating means for vibrating the scriber in a vertical direction, and pressurizing means for applying downward pressure to the scriber, wherein the scriber is vibrated by the vibrating means, and Applying downward pressure to the scriber by the pressing means, thereby forming a scribe line on the upper surface of the glass substrate by the scriber and cutting the glass substrate along the scribe line. Glass substrate cutting equipment. 5. The invention according to claim 4, further comprising lower limit position adjusting means for adjusting a lower limit position of the scriber,
A glass substrate cutting apparatus, wherein a lower limit position of the scriber is adjusted by the lower limit position adjusting means, thereby adjusting a cut amount of the scriber with respect to the glass substrate. 6. The invention according to claim 4, wherein
The glass substrate cutting apparatus, wherein the glass substrate is an upper glass substrate among two glass substrates bonded to each other at a predetermined interval.