JPH08115942A - Solder ball mounting apparatus - Google Patents

Abstract

PURPOSE: To provide an apparatus for mounting a large number of solder balls for forming bumps simultaneously onto a work, e.g. a board, in which solder balls, vacuum to the lower surface of a head, can be mounted reliably onto the work. CONSTITUTION: An oscillator 22 is disposed on a clamper 9 at the positioning part for a board 10. When a head 11 lowers to mount solder balls 3, vacuum sucked to its lower surface through suction holes 21, onto the board 10 the head 11 touches the oscillator 22 to cause oscillation. Consequently, the solder ball 3 drop surely from the suction hole 21 and mounted on the board 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for mounting a solder ball for forming a bump on a work such as a substrate.

[0002]

2. Description of the Related Art As a means for forming bumps (protruding electrodes) on electrodes of a work such as a substrate or a chip, there is known a method of mounting a solder ball on the work and then heating and melting and solidifying the solder ball. Generally, a large number of bumps are formed on a work, and therefore a large number of solder balls are mounted on the work. Hereinafter, a conventional solder ball mounting apparatus for mounting a large number of solder balls on a workpiece all at once will be described.

FIG. 3 is a side view of a conventional solder ball mounting device. Reference numeral 1 is a solder ball supply unit, which is configured as follows. 2 is a container, and a solder ball 3
Is stored. Reference numeral 4 is a column of the container 2. A vibrator 5 is attached to the lower surface of the container 2. When the vibrator 5 is driven, the container 2 vibrates and the solder balls 3 inside are fluidized.

Reference numeral 6 denotes a board positioning portion, which is constructed as follows. Reference numeral 7 denotes a movable table, on which a pole 8 is erected. A clamper 9 is provided on the upper end of the pole 8 and the substrate 10 is clamped by the clamper 9. The position of the substrate 10 is adjusted by driving the movable table 7 to move the substrate 10 in the horizontal direction.

Reference numeral 11 denotes a head, which is held at the lower end of the shaft 12. The shaft 12 is held by the block 13. Vertical movement means (not shown) for vertically moving the shaft 12 is incorporated in the block 13.
When the vertical movement means is driven, the head 11 moves up and down. 14
Is a horizontally long moving table, and is a solder ball supply unit 1
And the positioning portion 6 of the substrate. The moving table 14 is provided with a horizontal feed screw 15. The nut 16 provided on the back surface of the block 13 is the feed screw 1
It is screwed to 5. Therefore, when the motor 17 drives and the feed screw 15 rotates, the block 13 and the head 11 move laterally along the moving table 14. Reference numeral 18 is a vacuum device, and the head 1 is connected via a tube 19.
Connected to 1. Although not shown, a suction hole for the solder ball 3 is formed on the lower surface of the head 11, and the vacuum ball 18 is driven to vacuum-suck the solder ball 3 in the suction hole.

This conventional solder ball mounting device is constructed as described above, and its operation will be described below. Motor 1
7 is moved to move the head 11 above the container 2, and the vertical moving means provided in the block 13 is driven there to lower and raise the head 11, thereby vacuum-adsorbing the solder ball 3 on the lower surface of the head 11. To do. At this time, the vibrator 5
When the solder balls 3 in the container 2 are made to flow by driving the container 2 to vibrate the container 2, the solder balls 3 are easily vacuum-adsorbed in the adsorption holes on the lower surface of the head 11. As means for fluidizing the solder balls in the container, means for pumping gas into the container is also known.

When the head 11 picks up the solder balls 3 by vacuum suction, the motor 17 is driven to move the head 11 above the substrate 10. Next, the head 11 is lowered to land the solder balls 3 on the lower surface thereof on the upper surface of the substrate 10, and the vacuum suction state of the solder balls 3 by the vacuum device 18 is released there. Next, when the head 11 is raised, the solder balls 3 drop off from the suction holes and are mounted on the substrate 10. The head 11 then moves above the container 2,
The above operation is repeated.

[0008]

As described above, in the solder ball mounting apparatus of this type, the head 11 is moved above the substrate 10, and the head is lowered there to drop the solder ball 3 into the solder ball 3.
The solder ball 3 by landing on the substrate 10, releasing the vacuum suction state, and then raising the head 11.
Was dropped from the adsorption hole and mounted on the substrate 10.

However, even if the vacuum suction state is released, all the solder balls 3 are not necessarily dropped from the suction holes and mounted on the substrate 10, and some of the solder balls 3 remain attached to the lower surface of the head 11. There was a problem that mounting mistakes such as being easy to occur occur. If all the solder balls are not mounted on the substrate 10 in this way, the substrate 10 becomes a defective product with insufficient solder balls.

Therefore, an object of the present invention is to provide a solder ball mounting apparatus capable of surely mounting all the solder balls vacuum-adsorbed on the lower surface of the head on a work.

[0011]

To this end, according to the present invention, a vibrator is arranged at a positioning portion of a work such as a substrate or a chip, and the head releases the vacuum suction state of the solder ball to place the solder ball on the work. When mounted, the head makes contact with the vibrator to vibrate.

[0012]

According to the above construction, when the head mounts the solder balls on the work, the head vibrates, so that all the solder balls vacuum-adsorbed on the lower surface of the head surely drop off from the lower surface of the head. Mounted on the work.

[0013]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a head and a substrate on which the solder balls are mounted. 1 and 2, the same parts as those of the conventional example shown in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted.

In FIG. 2, a large number of suction holes 21 for vacuum-sucking the solder balls 3 are formed in a matrix on the lower surface of the head 11. A rod-shaped vibrator 22 is erected on one clamper 9. This vibrator 22
It is driven by the drive circuit 23 and vibrates. As the vibrator 22, for example, a piezoelectric element or the like is used.

The solder ball mounting device is constructed as described above, and its operation will be described below. The motor 11 is driven to move the head 11 above the container 2, and the vertical moving means provided in the block 13 is driven there to drive the head 1.
The solder balls 3 are vacuum-sucked on the lower surface of the head 11 by lowering and raising 1. At this time, the vibrator 5 is driven to vibrate the container 2 so that the solder balls 3 in the container 2 flow.

When the head 11 picks up the solder balls 3 by vacuum suction, the motor 17 is driven to move the head 11 above the substrate 10. Next, the head 11 is lowered to land the solder balls 3 on the lower surface thereof on the upper surface of the substrate 10, and the vacuum suction state of the solder balls 3 by the vacuum device 18 is released there. When the head 11 is lowered, the head 11 contacts the vibrator 22. At this time, the vibrator 22 is being vibrated by being driven by the drive circuit 23. Therefore, this vibration is transmitted to the head 11 and
Also vibrates, so that the solder ball 3 is surely dropped from the suction hole 21 and mounted on the substrate 10. Although the vibration frequency of the vibrator 22 can be set arbitrarily, it is preferable from the experimental results that ultrasonic vibration is used for the effect of dropping the solder balls.

Next, the head 11 moves up, moves above the container 2, and the above-described operation is repeated. It is also possible to integrally mount the vibrator on the head, but in this case, the vibrator becomes a load for the vertical movement and horizontal movement of the head, which impedes the high speed operation. Therefore, as in the present invention, it is desirable to separate the vibrator from the head and provide it on the work positioning portion.

[0018]

As described above, according to the present invention, when the head mounts the solder balls on the workpiece, the head contacts the vibrator and vibrates, so that all the solder balls are surely dropped from the suction holes. Can be mounted on the work.

[Brief description of drawings]

FIG. 1 is a side view of a solder ball mounting device according to an embodiment of the present invention.

FIG. 2 is a side view of a head and a substrate on which a solder ball according to an embodiment of the present invention is mounted.

FIG. 3 is a side view of a conventional solder ball mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball supply part 3 Solder ball 6 Substrate positioning part 10 Substrate (work) 11 Head 14 Moving table (moving means) 21 Adsorption hole 22 Vibrator

Claims (1)

[Claims] 1. A solder ball supply section, a workpiece positioning section, a head having a suction hole for vacuum-sucking the solder ball formed on the lower surface, and the head is moved between the supply section and the positioning section. A solder ball of the supply unit is vacuum-sucked to the suction hole of the head to move the head above the work positioned by the positioning unit, and the vacuum suction state of the solder ball is released there. A solder ball mounting device configured to mount a solder ball on the work by disposing a vibrator in the positioning portion, and the head releases the vacuum suction state of the solder ball, A solder ball mounting apparatus, wherein the head is adapted to come into contact with the vibrator and vibrate when mounted on a work.