JP2000208674A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2000208674A
JP2000208674A JP11009501A JP950199A JP2000208674A JP 2000208674 A JP2000208674 A JP 2000208674A JP 11009501 A JP11009501 A JP 11009501A JP 950199 A JP950199 A JP 950199A JP 2000208674 A JP2000208674 A JP 2000208674A
Authority
JP
Japan
Prior art keywords
elastic layer
semiconductor device
elastic
layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11009501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000208674A5 (enExample
Inventor
Noboru Sakaguchi
登 坂口
Yoichi Harayama
洋一 原山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP11009501A priority Critical patent/JP2000208674A/ja
Publication of JP2000208674A publication Critical patent/JP2000208674A/ja
Publication of JP2000208674A5 publication Critical patent/JP2000208674A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11009501A 1999-01-18 1999-01-18 半導体装置 Pending JP2000208674A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11009501A JP2000208674A (ja) 1999-01-18 1999-01-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11009501A JP2000208674A (ja) 1999-01-18 1999-01-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2000208674A true JP2000208674A (ja) 2000-07-28
JP2000208674A5 JP2000208674A5 (enExample) 2005-12-15

Family

ID=11721998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11009501A Pending JP2000208674A (ja) 1999-01-18 1999-01-18 半導体装置

Country Status (1)

Country Link
JP (1) JP2000208674A (enExample)

Similar Documents

Publication Publication Date Title
KR100484876B1 (ko) 반도체장치 및 그 제조방법
KR100844254B1 (ko) 반도체 장치 제조 방법
KR100252731B1 (ko) 반도체 디바이스 및 반도체 디바이스용 패키지
KR100411811B1 (ko) 반도체패키지
KR100510556B1 (ko) 초박형 반도체 패키지 및 그 제조방법
US6507095B1 (en) Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument
JP4103342B2 (ja) 半導体装置の製造方法
JP3356921B2 (ja) 半導体装置およびその製造方法
US20030173679A1 (en) Stacked dice standoffs
TW200950014A (en) Semiconductor package and method for manufacturing the same
JPH08167678A (ja) 半導体装置
WO2001059839A1 (fr) Structure de montage pour microcircuit a semi-conducteurs, dispositif a semi-conducteurs, et procede de fabrication de dispositif a semi-conducteurs
KR100370529B1 (ko) 반도체 장치
KR100608610B1 (ko) 인쇄회로기판과, 그의 제조 방법 및 그를 이용한 반도체패키지
JP2000208674A (ja) 半導体装置
JP3841135B2 (ja) 半導体装置、回路基板及び電子機器
JPH11284096A (ja) 半導体パッケージ
JP2001044234A (ja) 半導体装置
JP3707639B2 (ja) エリアアレイパッケージ型半導体装置の構造
JPH10303363A (ja) 電子部品及びその製造方法
JP4945341B2 (ja) パッケージ構造を有する機能デバイス及びその製造方法
US6686221B1 (en) Method for forming packaged semiconductor device having stacked die
JPH11330158A (ja) 半導体装置およびその製造方法
CN100463130C (zh) 倒装芯片封装工艺
JP2007158989A (ja) 電子部品

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051101

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051101

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060301

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070424

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070821