JP2000208356A - Electronic component and wiring board mounted with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component for simplifying mounting, and for resisting vibration, and for lowering the height of a part in mounting, and a wiring board on which this electronic component is mounted. SOLUTION: Substantially symmetric differences in level are formed at the both edges of a horizontal capacitor 22, and boundary faces 15 and 16 of the differences in level are formed as mounting faces on a wiring board 19. Thus, a capacitor 22 can be stuck large in a hole 20 of the wiring board 19. Therefore, it is not necessary to provide fixing tools or the like, and the height of the part on the wiring board 19 can be lowered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component which is mounted on a wiring board in a horizontal state and is mainly used for thin electric products such as personal computers and mobile phones, and a wiring board on which the electronic component is mounted.

[0002]

2. Description of the Related Art In recent years, as electronic devices have been miniaturized, electronic components mounted thereon have also been significantly reduced in size.
In particular, in mobile phones, personal computers, and digital VTRs, the thickness of the set becomes extremely thin. As a countermeasure against this, it is required that electronic components on both sides of the wiring board be reduced to the thickness of the LSI package. Further, in the case of electronic components used for automobiles, since vibrations are applied, it is necessary to take measures for the method of mounting the electronic components on the wiring board.

FIG. 8 shows a mounting state of an electronic component, which is an example of an electrolytic capacitor, on a wiring board. An electrolytic capacitor 1 is sandwiched between a fixed base 2 formed of a metal plate,
And a lead wire 4 for external lead-out of the electrolytic capacitor 1 are fixed to the wiring board 5 by soldering.
By adopting such a mounting method, mounting that is resistant to vibration has been enabled.

[0004]

However, in the above-mentioned conventional method for mounting electronic components, the fixing base 2 is separately required for mounting the electrolytic capacitor 1 on the wiring board 5, which not only increases the component cost but also increases the cost. It took a lot of time and effort to attach them. Further, since the thickness of the fixed base 2 is added to the outer diameter of the electrolytic capacitor 1, there is a problem that the thickness cannot be reduced.

The present invention solves such a conventional problem,
It is an object of the present invention to provide an electronic component that can be easily mounted, is resistant to vibration, and can be mounted at a low height on a wiring board, and a wiring board on which the electronic component is mounted.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method of housing an element in a bottomed cylindrical case, sealing an opening, and mounting the element horizontally on a wiring board. In the electronic component, a substantially symmetrical step is provided at both ends of the horizontally laid electronic component by providing a projection or a depression on a part of the bottom surface of the case and a part of the upper surface of the sealing member, and a boundary surface of the step is formed. It has a configuration that is a mounting surface to a wiring board.

[0007] According to the present invention, it is possible to reduce the height when mounting on a wiring board while being resistant to vibration by simple mounting.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a bottomed cylindrical case containing an element having a pair of external lead-out leads, and a through-hole through which the element leads penetrate. An electronic component comprising a sealing member having a hole and sealing the opening of the case, and being mounted on the wiring board in a horizontal state, wherein a part of a bottom surface of the case and a part of an upper surface of the sealing member are provided. Providing projections or depressions, a substantially symmetrical step is provided at both ends of the horizontally placed electronic component, and the surface of the boundary of the step is used as an attachment surface to the wiring board, and is a simple electronic component. It has an effect that it is resistant to vibration by mounting and can be lowered in height when mounted on a wiring board.

According to a second aspect of the present invention, in the first aspect of the present invention, a taper having an upwardly larger taper is provided on the side of the smaller dimension of the substantially symmetrical step provided at both ends of the electronic component. With this configuration, it is easy to insert the electronic component into the hole provided in the wiring board, and it has an effect that the workability of mounting can be improved.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the direction of increasing the size is provided at a predetermined position on the smaller side of the substantially symmetrical step provided at both ends of the electronic component. It is configured to have a projection for locking toward the electronic component. When the electronic component is inserted into the hole provided in the wiring board, the electronic component can be prevented from coming off, and the soldering work is facilitated. It has the effect of being able to.

According to a fourth aspect of the present invention, in the first aspect of the present invention, at least one of the substantially symmetrical steps provided at both ends of the electronic component on the side of the smaller dimension is provided.
It has a configuration in which a buffer part with elasticity protruding in the direction of increasing the size is provided. When the electronic component is inserted into the hole provided in the wiring board, the electronic component is accurately positioned and temporarily fixed. It has the effect of being able to.

According to a fifth aspect of the present invention, in the first aspect of the present invention, an adhesive or a pressure-sensitive adhesive is provided on the surface of the boundary between the substantially symmetric steps provided at both ends of the electronic component. Is provided, and has an effect that the electronic component can be more reliably fixed to the wiring board.

According to a sixth aspect of the present invention, in the first aspect of the present invention, a part of a peripheral surface of a case which is an upper surface side in a state where the electronic component is placed horizontally is flat. The flat portion is used as an attraction surface to enable automatic mounting, and the flat portion enables easy display.

According to a seventh aspect of the present invention, in the first aspect of the present invention, a through hole of a lead wire provided in the sealing member is provided on a side having a large step. This has the effect that the height of the electronic component after being mounted on the wiring board can be further reduced.

According to an eighth aspect of the present invention, in the first aspect of the present invention, a pair of external lead-out lead wires pulled out from the element housed in the bottomed cylindrical case is provided. One is drawn out from the bottom surface of the case along the surface of the boundary of the step, and the lead wire is sandwiched between the case and the wiring board, so that the electronic components are securely fixed. It has the effect that it can be performed.

According to a ninth aspect of the present invention, in the first aspect of the present invention, a flat portion is provided on a lower surface of a tip of a lead wire for external drawing in a state where the electronic component is placed horizontally. Is provided, and has the effect of improving the stability of the electronic component mounted on the wiring board.

According to a tenth aspect of the present invention, in the ninth aspect of the present invention, a flat portion provided on the lower surface at the tip of a lead wire drawn out from the bottom surface of the case along the surface of the boundary of the step is wired. It is configured to be an attachment surface to a board, and has an effect that it can be reliably mounted on a wiring board.

The invention according to claim 11 is the invention according to claims 1 to 1.
0, wherein the electronic component is a capacitor, which has an effect that a horizontal type capacitor can be efficiently mounted on a wiring board.

The twelfth aspect of the present invention is the first aspect of the present invention.
A substrate on which the electronic component according to any one of the above items 1 is mounted, wherein the dimension of the substantially symmetrical step provided at both ends of the electronic component in a horizontally laid state is larger than that of the smaller side, and the size of the step is larger. This is a wiring board that has a hole with a smaller dimension than the side, and a wiring pattern on the periphery of this hole to which a pair of lead wires drawn from the element in the case are connected. It is strong and has the effect that the height when mounted on a wiring board can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking a capacitor as an example.

(Embodiment 1) FIG. 1 shows a state in which a capacitor according to a first embodiment of the present invention is mounted on a wiring board. In FIG. 1, reference numeral 22 denotes a horizontal type capacitor. The capacitor 22 has a bottomed cylindrical case 11 containing a capacitor element (not shown), a sealing member 13 that seals an opening of the case 11, and an external member that is drawn out of the capacitor element and penetrates the sealing member 13. It is constituted by a lead wire 18 for drawing out. 1
Reference numeral 9 denotes a wiring board. The wiring board 19 is provided with a hole 20 into which the case 11 of the capacitor 22 and a part of the sealing member 13 are fitted, and an electrode pattern 21 to which the lead wire 18 is connected.

The capacitor 22 is provided with depressions in a part of the bottom surface of the case 11 and a part of the upper surface of the sealing member 13, so that substantially symmetric steps are formed at both ends of the capacitor 22 when the capacitor 22 is placed in a horizontal state. On the side of the step having a small dimension, tapers 12 and 14 having a dimension increasing upward are provided, respectively, to facilitate insertion of the wiring board 19 into the hole 20 and to form the capacitor 22. The positioning accuracy is improved, and the boundary surface 1
Adhesives 17 are provided on the substrates 5 and 16 to secure the capacitor 22 to the wiring board 19.

As described above, according to the present invention, the capacitor 2
2 can be placed horizontally and mounted on the wiring board 19, the height of the parts protruding to one side of the wiring board 19 can be made lower than before, and other fixing means such as a conventional fixing base can be used. Therefore, it can be securely fixed to the wiring board 19.

Further, the step of the capacitor 22 formed so as to be smaller than the hole 20 of the wiring board 19 makes it easier for the capacitor 22 to enter the hole 20 of the wiring board 19 and the taper 12, 14 Therefore, even if the mounting position is slightly shifted, the positioning with respect to the wiring board 19 can be accurately performed.

Further, since the surface of the boundary between the steps of the case 11 can be fixed with the adhesive 17, it is possible to prevent the case 11 from being rubbed and worn by the vibration after mounting and the case 11 itself from being vibrated.

Furthermore, since the lead wires 18 can be soldered to the wiring board 19 with the shortest length, many effects can be obtained, such as high mounting strength and low electrical resistance up to the capacitor 22. Things.

(Embodiment 2) FIGS. 2A to 2D show a capacitor according to a second embodiment of the present invention. This embodiment is based on the first embodiment. On the smaller side of the step formed at both ends of the capacitor, there is provided a projection for locking toward the direction of increasing the size, and a flat part is provided on a part of the peripheral surface of the case. Since it is the same as the first embodiment, only different parts will be described, and detailed description of the other parts will be omitted.

2 (a) to 2 (d), reference numeral 29 denotes a capacitor, 30 denotes a case, 31 denotes a locking projection provided on the side of the case 30 having a small step, and 32 denotes a sealing member made of an elastic material. Reference numeral 33 denotes a locking projection provided on the side of the sealing member 32 having a small step, and reference numeral 34 denotes a flat portion.
Reference numeral 4 is used as a suction surface for automatic mounting, and prints polarity and component display items. 35 is a lead wire, 3
Reference numeral 6 denotes an explosion-proof valve provided on the bottom surface of the case 30.

FIG. 3 shows a state in which the capacitor 29 shown in FIG. 2 is mounted on the wiring board 19. The mounting method of the capacitor 29 is the same as that of the above-described first embodiment, in addition to the method of the first embodiment. The capacitor 29 is fixed to the wiring board 19 by soldering the projection 33 of the sealing member 32 and the lead wire 35 made of an elastic material.

Since the engaging projection 33 formed on the sealing member 32 is elastic, the capacitor 29 is connected to the wiring board 1.
9 can be temporarily fixed by press-fitting the capacitor 29, so that the workability can be improved. With such a configuration, the components of the conventional capacitor can be obtained. By changing the shape of the above, it is possible to form the engagement projection 33 that can be joined to the wiring board 19,
It can be fixed to the wiring board 19 without adding new components.

(Embodiment 3) FIG. 4 shows a state in which a capacitor according to a third embodiment of the present invention is mounted on a wiring board. In this embodiment, the height of a step formed on the bottom surface of a case is reduced. The configuration is such that a buffer portion having elasticity is provided on the smaller dimension side. Since the configuration other than this configuration is the same as that of the first and second embodiments, only different portions will be described and detailed description will be omitted. Omitted.

In FIG. 4, reference numeral 38 denotes a buffer portion formed of a polymer material such as rubber or an elastic sheet at a portion of the step 37 formed on the bottom surface of the case 30 at least at a portion to be fitted to the wiring board 19. Is mounted on the wiring board 19 in the same manner as in the first or second embodiment.

According to this configuration, the case 30 can be protected by the buffer portion 38.
Can be prevented from being rubbed and worn.

The buffer 38 may be formed by wrapping a sleeve (or bag) made of polyester, vinyl, or the like around the case 30 and contracting the sleeve.

(Embodiment 4) FIGS. 5 (a) to 5 (d) show a capacitor according to a fourth embodiment of the present invention. They are arranged on the member side, respectively, and the lower surface of the lead wire is used as a mounting surface on a wiring board.

In FIG. 5, the electrode lead wire 43, which has a flat end and is also used as a surface to be mounted on a wiring board, is connected to the case 4.
The top surface of the sealing member 44 connected to the bottom surface of the base member 2 by welding or the like and having a step formed therein is flattened, and a lead wire 46 also serving as a mounting surface portion on a wiring board is provided to form a horizontal type capacitor 41. It is composed.

With this configuration, the sealing members 44 at both ends of the capacitor 41 and the lead wires 43 and 46 which also serve as the mounting surface of the bottom surface of the case 42 on the wiring board can be fixed to the wiring board by soldering. In addition, it is possible to prevent the case 42 from being rubbed and worn due to vibration and the case 42 itself from being vibrated.

(Embodiment 5) Hereinafter, other examples will be described as a fifth embodiment of the present invention.

FIG. 6 shows an example in which the lead wire is of the insertion type in the second embodiment, and the method of fixing the capacitor 50 is provided on the side of the step having the smaller dimension as in the second embodiment. The locking projection is used, and the detailed configuration of this portion is the same as that of the second embodiment, and a description thereof will be omitted. This embodiment is characterized in that a hole 53 for inserting a lead wire 52 is formed in a wiring board 55, and a horizontal type capacitor is formed on a wiring board 55 in which an electrode pattern 54 is formed in accordance with the lead wire 52 of the capacitor 50. After mounting the capacitor 50, the lead wire 52 and the electrode pattern 54 are soldered to form the capacitor 50.
And the wiring board 55 are connected.

According to this configuration and mounting method, since the capacitor 50 can be soldered while being fixed to the wiring board 55, the soldering operation can be easily performed without using another fixing means.

FIG. 7 shows a case where a convex fixing portion 64 is formed on the bottom of the case 60, and the lead wire 61 is connected to the fixing portion 64 on the bottom of the case 60 when the capacitor is mounted on the wiring board 62.
And an electrode pattern 63 of the wiring board 62.

According to this configuration, even when the capacitor is strongly pressed during mounting, the lead wire 61 is not deformed, and defective soldering due to the deformation of the lead wire 61 can be prevented.

[0043]

As described above, the electronic component according to the present invention and the wiring board on which it is mounted not only do not require a fixing jig or the like for mounting the electronic component on the wiring board. The height of the electronic component from above the wiring board can be reduced because it largely fits into the hole of the wiring board. Further, since the fixed position between the center of gravity of the electronic component and the wiring board becomes closer than before, the rotational moment to the electronic component is reduced, and there is an effect that the electronic component becomes strong against vibration.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional front view showing a state in which a horizontal type capacitor according to a first embodiment of the present invention is mounted on a wiring board.

2A is a front view of a capacitor according to a second embodiment of the present invention, FIG. 2B is a right side view, FIG. 2C is a left side view, and FIG.

FIG. 3 is a partial cross-sectional front view showing a state where the capacitor of FIG. 2 is mounted on a wiring board;

FIG. 4 is a partial cross-sectional front view showing a state where a capacitor according to a third embodiment of the present invention is mounted on a wiring board;

5A is a front view of a capacitor according to a fourth embodiment of the present invention, FIG. 5B is a right side view, FIG. 5C is a left side view, and FIG.

FIG. 6 is a partial cross-sectional front view showing a state in which a capacitor according to another embodiment of the present invention is mounted on a wiring board.

FIG. 7 is a partial cross-sectional front view showing a state in which a capacitor according to another embodiment of the present invention is mounted on a wiring board.

FIG. 8 is a front view showing a mounted state of a capacitor using a conventional mounting jig.

[Explanation of symbols]

 11, 30, 42, 60 Case 12 Taper 13, 32, 44 Sealing member 14 Taper 15, 16 Boundary surface 17 Adhesive 18 Lead wire 19 Wiring board 20 Hole 21, 54, 63 Electrode pattern 22, 29, 41, 50 Capacitor 31, 33 Projection 34 Flat part 35, 43, 46, 52, 61 Lead wire 36 Explosion-proof valve 38 Buffer part

Claims (12)

[Claims] 1. A closed-end cylindrical case accommodating an element having a pair of external lead-out lead wires, and a through-hole through which a lead wire of the element penetrates to seal an opening of the case. An electronic component comprising a member and mounted horizontally on a wiring board, wherein the electronic component is placed horizontally by providing projections or depressions on a part of the bottom surface of the case and a part of the upper surface of the sealing member. Provide approximately symmetric steps at both ends,
An electronic component in which the surface at the boundary of the step is used as a surface to be attached to a wiring board. 2. The electronic component according to claim 1, wherein a taper whose size is increased upward is provided on the side of the smaller dimension of the substantially symmetrical step provided at both ends of the electronic component. 3. The electronic device according to claim 1, wherein locking projections are provided at predetermined positions on smaller sides of the substantially symmetrical steps provided at both ends of the electronic component. Electronic components. 4. The electronic component according to claim 1, wherein at least one of the smaller sides of the substantially symmetrical steps provided at both ends of the electronic component is provided with a buffer portion having elasticity protruding in a direction of increasing the size. Electronic components according to one. 5. An adhesive or pressure-sensitive adhesive is disposed on the surface of the boundary between substantially symmetric steps provided at both ends of the electronic component.
4. The electronic component according to any one of 4. 6. A flat portion is provided on a part of a peripheral surface of a case which is an upper surface side in a state where an electronic component is placed horizontally.
Electronic component according to any one of the above. 7. The electronic component according to claim 1, wherein a through hole of a lead wire provided in the sealing member is provided on a side having a large dimension of the step. 8. One of a pair of external lead-out lead wires pulled out from an element housed in a bottomed cylindrical case,
The electronic component according to claim 1, wherein the electronic component is drawn from a bottom surface of the case along a surface of a boundary between the steps. 9. The electronic component according to claim 1, wherein a flat portion is provided on a lower surface of a distal end of the lead wire for external drawing in a state where the electronic component is placed horizontally. 10. The electronic component according to claim 9, wherein a flat portion provided on a lower surface of a leading end of a lead wire drawn out from a bottom surface of the case along a boundary surface of the step is used as a mounting surface to the wiring board. 11. The electronic component according to claim 1, wherein the electronic component is a capacitor.
An electronic component according to any one of claims 10 to 10. 12. A substrate on which the electronic component according to claim 1 is mounted, wherein the size of the substantially symmetrical steps provided at both ends of the electronic component in a horizontal state is small. A wiring board provided with a hole having a size larger than the side and smaller than the side having the same level difference, and a wiring pattern provided around the periphery of the hole to be connected to a pair of lead wires drawn out from an element in the case.