JPH10294546A - Mounting structure and mounting method for chip type component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure and method that are suitable for a chip type component like a bare chip SAW filter which has a low tolerance to a shock and is easy to break. SOLUTION: A hole 13 is bored in a wiring board 11, on which a projection part 17 is formed of an elastic material such as conductive paste so that at least part of the hole 13 is filled up. After conductive paste 21 is applied covering the projection part 17, the chip type component 20 is mounted on the wiring board 11 through the conductive paste 21 while a specific gap is held by the projection part 17 between the chip type component 20 and wiring board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for a chip-shaped component, and more particularly to a mounting structure and a mounting method suitable for a chip-shaped component susceptible to shock and fragile, such as a bare chip SAW filter. Things.

[0002]

2. Description of the Related Art FIG. 6 is a sectional view showing an example of a conventional mounting structure applied to a chip-shaped component 1. As shown in FIG. An electrode 3 is formed on a wiring board 2 such as a printed circuit board, and the chip-shaped component 1 is electrically connected and mechanically joined to the electrode 3 by using solder 4. Is implemented as follows. Further, in order to prevent the chip-shaped component 1 from peeling, the resin 5 may be applied and cured so as to cover the end of the chip-shaped component 1.

Although not shown, a chip-like component may be mounted on a wiring board using a conductive paste instead of solder.

[0004]

However, in the case where the chip-like component 1 shown in FIG. 6 is a chip-like component that is vulnerable to impact and is easily broken, such as a bare chip SAW filter, a product provided with such a chip-like component 1 is used. , The chip-shaped component 1 may be broken. On the other hand, when a chip-shaped component is mounted using a conductive paste, such impact can be reduced to some extent because the conductive paste has elasticity, but the following problems are encountered. May be.

[0005] First, in order to prevent the conductive paste from protruding from the electrodes, the amount of the conductive paste to be used must be necessarily reduced, and as a result, sufficient elasticity cannot be obtained. . Therefore, the effect of reducing the impact and preventing damage to the chip-shaped component cannot be expected much. On the other hand, in order to obtain sufficient elasticity by using a conductive paste in order to enhance the effect of alleviating the impact, the amount of the conductive paste must be increased. When the chip-shaped component is placed on the chip-shaped component, the conductive paste may protrude to an undesired region, and may cause an electrical short circuit with other components, electrodes, and the like in the vicinity.

An object of the present invention is to provide a mounting structure and a mounting method of a chip-like component which can solve the above-mentioned problems.

[0007]

SUMMARY OF THE INVENTION The present invention is directed to a structure for mounting a chip-like component on a wiring board using a conductive paste. A convex portion made of an elastic material is formed in a region facing the chip-shaped component, and the conductive paste is applied to the chip-shaped component at a predetermined distance from the wiring board by the convex portion. And is mounted on a wiring board through the intermediary.

[0008] The present invention is also directed to a method of mounting a chip-shaped component on a wiring board using a conductive paste. In order to solve the above-described technical problem, the mounting method of a chip-shaped component according to the present invention forms a convex portion made of an elastic material on a wiring board, and the convex portion forms a convex portion between the chip-shaped component and the wiring substrate. The method is characterized in that the method includes the steps of mounting a chip-shaped component on the wiring board via a conductive paste while maintaining a predetermined interval.

In the present invention, the elastic material forming the projection may be provided by a conductive paste. In this case, the conductive paste for forming the projections may be used as it is as the conductive paste for mounting the chip-shaped component. As described above, when the conductive paste for forming the convex portion is used as it is as the conductive paste for mounting the chip-shaped component, it is preferably included in the chip-shaped component mounting method according to the present invention. In the step of forming the convex portion, a frame surrounding a region where the convex portion is to be formed is formed, and a conductive paste is applied in the frame. The chip-shaped component is placed on the conductive paste inside, and after the conductive paste is cured, the frame is removed.

In the present invention, the conductive paste for mounting the chip-shaped component may be applied so as to cover the projection, or may be applied to a position different from the projection. In the present invention, preferably, a hole is provided in a region of the wiring board where the protrusion is formed, and a part of the elastic material forming the protrusion fills at least a part of the hole. You.

In the above case, in the step of forming the projection, which is included in the method for mounting a chip-shaped component according to the present invention,
Preferably, an elastic material is provided in the hole from the surface of the wiring board opposite to the surface on which the convex portion is to be formed, and then the elastic material is passed through the hole to form the convex portion. Fluidization is performed.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view for explaining a mounting structure and a mounting method of a chip-like component according to a first embodiment of the present invention. Is shown. First, referring to FIG. 1A, an electrode 12 is formed on a wiring board 11, and a hole 13 is provided in a region where the electrode 12 is formed. Fig. 1 (1)
In FIG. 1, the wiring board 11 is illustrated with the surface on which the electrodes 12 are formed, that is, the mounting surface facing downward. The paste-like elastic material 14 is applied to the inside of the hole 13 from the surface of the wiring substrate 11 opposite to the mounting surface, that is, from the back surface side. As the elastic material 14, for example, a conductive paste is advantageously used.

Next, as shown in FIG. 1B, the elastic material 14 is caused to flow through the hole 13 and flow to the mounting surface side. At this time, a blow as indicated by an arrow 15 may be applied toward the hole 13 from above, or a simple gravity as indicated by an arrow 16 may be used.
The elastic material 14 is hardened as necessary, and forms a convex portion 17 having elasticity on the mounting surface side.

In the step shown in FIG. 1B, a vacuum as shown in FIG. 2 may be applied. That is, the vacuum nozzle 18 is provided on the mounting surface side of the wiring board 11.
The vacuum nozzle 18 applies a vacuum as shown by an arrow 19 toward the hole 13.
Thereby, the elastic material 1 is formed so as to form the convex portion 17.
4 flows to the mounting surface side through the hole 13.

Next, as shown in FIG. 1 (3), the mounting surface side of the wiring board 11 is turned upward to bond and electrically connect the chip-shaped component 20 to the electrode 12 of the wiring board 11. Conductive paste 2 for mounting
1 is provided so as to cover the convex portion 17. Then, the chip-shaped component 20 is placed on the conductive paste 21 as shown by an arrow 22, and as shown in FIG. The conductive paste 21 is hardened in this state.

As the chip-like component 20, a chip-like component, such as a bare chip SAW filter, which is vulnerable to impact and is easily broken, is advantageously applied, but any other chip-like component is similarly applied. be able to. As described above, when the chip-shaped component 20 placed on the conductive paste 21 is pressed toward the wiring board 11, the chip-shaped component 20 hits the projection 17 as shown in FIG. Since the projections 17 are in contact with each other, the projections 17 function as stoppers, and it is possible to prevent the chip-shaped component 20 from sinking due to weight or the like. Accordingly, the conductive paste 21 may flow to the surroundings, but since a predetermined space is maintained between the chip-shaped component 20 and the wiring board 11 by the projections 17, the flow of the conductive paste 21 Therefore, the protrusion of the conductive paste 21 to the periphery can be suppressed. In addition, since the conductive paste 21 can be thickened by the presence of the protrusions 17,
The elasticity of the conductive paste 21 and the protrusions 17 can be made to largely act.

In this embodiment, the wiring board 11
The hole 13 is provided in a region where the convex portion 17 is formed, and at least a part of the elastic material 14 constituting the convex portion 17 fills at least a part of the hole 13. , The stress as shown by the arrow 23
, The elastic material 14 can be easily displaced or deformed through the holes 13, as indicated by the arrows 24 and by the dashed lines. Therefore, the elasticity of the convex portion 17 can be more effectively exerted.

In this embodiment, each material of the elastic material 14 for the convex portion 17 and the conductive paste 21 for mounting is determined in consideration of adhesive strength, elasticity, electric conductivity, etc., depending on the use condition. Selected. For example, convex part 1
When a conductive paste is used also as the elastic material 14 for 7, it is preferable to use a conductive material having high elasticity. Also, a conductive paste for the projection 17 and a conductive paste 2 for mounting are provided.
1 may be the same type or different types. In addition, when it is desired to obtain a large adhesive strength in the mounted state of the chip-shaped component 20, a conductive paste 21 for mounting is used that can obtain a large adhesive strength, and when it is desired to obtain a high electrical conductivity. Is used, having excellent conductivity.

It should be noted that even if a conductive paste is not used as the elastic material 14 for the convex portion 17 and a non-conductive material is used, the conductive paste 21 for mounting is Since a desired electrical conduction path with the wiring board 11 is achieved, there is no problem. Also,
In the embodiment described above, the shape, size, number and the like of the holes 13 and the protrusions 17 are arbitrary, and
Can be arbitrarily changed as long as it is below the chip-like component 20 to be mounted.

FIG. 3 is a perspective view of a wiring board 31 for explaining a mounting structure and a mounting method of a chip component according to a second embodiment of the present invention. First,
Referring to FIG. 3A, electrodes 32 for mounting chip-shaped components are formed on wiring substrate 31, and a plurality of holes 33 are provided around electrodes 32. In these holes 33,
In the same manner as shown in FIG. 1A, a paste-like elastic material is applied from the back surface side of the wiring board 31. In FIG. 3A, this elastic material is not shown.

Next, by the same method as shown in FIG. 1 (2) or FIG. 2, the above-described elastic material is caused to flow through the hole 33 to the mounting surface side, and is cured as necessary. Thereby, as shown in FIG. 3B, the elastic material 34 forms a convex portion 35 having elasticity on the mounting surface side of the wiring board 31 and around the electrode 32. Also,
Similarly, as shown in FIG. 3B, the conductive paste 36 for mounting the chip-shaped component is applied to a position different from the convex portion 35, that is, on the electrode 32. Then, a chip-shaped component (not shown) is placed on the conductive paste 36. At this time, the chip-shaped component comes into contact with the projection 35. In this state, the conductive paste 36 is cured.

As described above, also according to this embodiment, when the chip-shaped component is placed on the wiring board 31, the chip-shaped component comes into contact with the projections 35, and these projections 35 act as stoppers, It is possible to prevent sinking due to the weight of the shaped parts. Therefore, the conductive paste 3
6 can be reduced, and the protrusion of the conductive paste 36 to the periphery can be suppressed.
In addition, since the conductive paste 36 can be thickened due to the presence of the convex portions 35, the elasticity of the conductive paste 36 and the convex portions 35 can be greatly exerted.

Also in this embodiment, a hole 33 is provided in a region of the wiring substrate 31 where the convex portion 35 is formed, and a part of the elastic material 34 forming the convex portion 35 is
Since at least a part of the inside is buried, the elasticity of the convex portion 35 can be more effectively exerted. Also in the second embodiment, the elastic material 34 for the protrusion 35 is formed in the same manner as in the first embodiment.
In addition, each material of the conductive paste 36 for mounting can be selected. Also in this embodiment, the shape, size, number, and the like of the holes 33 and the protrusions 35 are arbitrary, and the positions of the holes 33 and the protrusions 35 may be below the chip-like component 20 to be mounted. If the electrode 32
May be other than around.

FIG. 4 is a view for explaining a mounting structure and a method of mounting a chip-like component according to a third embodiment of the present invention, and shows a wiring board 41 in a perspective view. First,
Referring to FIG. 4A, an electrode 42 is formed on a wiring board 41, and a hole 43 is provided in a region where the electrode 42 is formed. On the mounting surface of this wiring board 41,
A frame 44 is formed around the electrode 42. Also, hole 4
In 3, a conductive paste is applied from the back side of the wiring board 41 in the same manner as shown in FIG. In this embodiment, the conductive paste is used as an elastic material for forming a convex portion described later, and is used for mounting a chip-shaped component. FIG. 4 (1)
Then, this conductive paste is not shown.

Next, as shown in FIG. 4B, the conductive paste 45 is applied to the frame 4 on the mounting surface side of the wiring board 41.
The conductive paste 45 on the rear surface side is passed through the inside of the hole 43 by a method similar to that shown in FIG. 1 (2) or FIG. Flow to the side. Note that the conductive paste 45 is
For example, the conductive paste 45 may be directly applied to the inside of the frame 44 by a dispenser or the like.

Next, the arrow 46 in FIG.
As shown in the figure, the chip-shaped component 47 is
5 and the conductive paste 45 is cured in that state. Next, the frame 44 is removed as shown in FIG. In this manner, in this embodiment, the conductive paste 45 forms the projections 48 and is used as it is as the conductive paste for mounting the chip-shaped component 47.

According to this embodiment, the conductive paste 4
In the uncured stage of 5, the conductive paste 45 defined by the frame 44 functions as the protrusion 48 and acts so as to keep a predetermined space between the chip-shaped component 47 and the wiring board 41. . The frame 44 is made of a conductive paste 45,
After the application, the chip-like component 47
Is advantageously suppressed from protruding to the surroundings due to the weight of the chip-shaped component 47 or the like. Also, frame 4
By using 4, the conductive paste 45 can be thickened, so that the elasticity of the conductive paste 45 can be largely exerted.

Also in this embodiment, a hole 43 is provided in a region of the wiring board 41 where the protrusion 48 is formed, and a part of the conductive paste 45 as an elastic material forming the protrusion 48 is formed. Is at least partially filled in the hole 43, so that the elasticity of the convex portion 45 can be more effectively exerted. Also in this embodiment, the shape, size, number and the like of the holes 43 are arbitrary.

FIG. 5 is a cross-sectional view for explaining a mounting structure and a mounting method of a chip-shaped component according to a fourth embodiment of the present invention. FIG.
Referring to (1), an electrode 52 formed on a wiring board 51 is formed.
On the upper side, a convex portion 53 is provided. Such a convex part 5
In order to provide 3, a member made of an elastic material is prepared and this is adhered on the electrode 52.

Next, as shown in FIG. 5 (2), a conductive paste 54 is applied so as to cover the projection 53. Then, the chip-like component 55 is placed on the conductive paste 54, and in this state, the conductive paste 54 is cured. According to this embodiment also, when the chip-shaped component 55 is pressed toward the wiring board 51, the chip-shaped component 55 comes into contact with the projection 53, so that the projection 53 acts as a stopper, and Sinking due to weight or the like can be prevented. Therefore, the protrusion of the conductive paste 54 to the periphery can be suppressed. In addition, since the conductive paste 54 can be thickened due to the presence of the protrusions 53, the elasticity of the conductive paste 54 and the protrusions 53 can be greatly exerted.

The shape, size, number, and the like of the above-described protrusions 48 are arbitrary. The position of the protrusions 48 may be any position below the chip-like component 55 to be mounted. Is also good. As described above, the present invention has been described in relation to the illustrated embodiment. However, within the scope of the present invention,
Various modifications are possible.

For example, in the mounting structure and mounting method of the chip-shaped component according to each embodiment, the connection and connection between one terminal electrode of the chip-shaped component and one electrode on the wiring board have been described and illustrated. In this case, when a plurality of terminal electrodes of the chip-shaped component are connected to corresponding electrodes on the wiring board, the structure and method shown in the figure are employed for each of these terminal electrodes.

[0033]

As described above, according to the chip-shaped component mounting structure of the present invention, a protrusion made of an elastic material is formed on the wiring board in a region facing the chip-shaped component. Since the component is mounted on the wiring board via the conductive paste in a state where a predetermined distance is maintained with respect to the wiring board by the protrusion, the elasticity of the conductive paste and the protrusion is increased. Can work. Therefore, a mounting structure resistant to impact is obtained,
This mounting structure can be advantageously applied to mounting of a chip-like component that is vulnerable to impact and fragile, such as a bare-chip SAW filter.

Further, according to the method of mounting a chip-like component according to the present invention, a convex portion made of an elastic material is formed on the wiring board, and the convex portion has a predetermined distance between the chip-like component and the wiring substrate. Mounting the chip-like component on the wiring board via the conductive paste in a state in which the chip-like component is placed on the conductive paste when the chip-like component is placed on the conductive paste. The distance from the substrate can be maintained by the protrusions. Therefore, since the conductive paste can be prevented from protruding to the surroundings, even a small amount of the conductive paste can be thickened, and the elasticity of the conductive paste and the protrusions can be greatly exerted. At the same time, it is possible to prevent undesired electrical short-circuiting with other nearby electrical elements.

In the present invention, when the elastic material forming the projection is made of a conductive paste, an electrical conduction path is also provided by the projection. Therefore, in this case, even if the conductive paste for mounting the chip-shaped component is applied so as to cover the convex portion, or is applied at a position different from the convex portion, the convex portion serves as an auxiliary Since it can be made to function as an electrical conduction path, the reliability of electrical conduction can be improved.

In the above case, the conductive paste for forming the projections can be used as it is as the conductive paste for mounting the chip component. At this time,
In the step of forming the convex portion, a frame surrounding the region where the convex portion is to be formed is formed, and a conductive paste is applied to the frame. After placing the chip-shaped component on the conductive paste, curing the conductive paste, and then removing the frame, in the uncured stage of the conductive paste,
The conductive paste defined by the frame serves as a convex part, acts to keep a predetermined distance between the chip-shaped component and the wiring board, and the frame serves to undesirably spread the conductive paste. Acts to suppress
The conductive paste can be thickened.

In the present invention, a hole is provided in a region of the wiring board where the protrusion is formed, and a part of the elastic material constituting the protrusion fills at least a part of the hole. Then, when stress is applied to the chip-shaped component, the elastic material can be easily displaced or deformed through the hole, so that the elasticity of the projection can be more effectively exerted.

In the above case, in the step of forming the convex portion included in the mounting method of the chip-shaped component according to the present invention,
An elastic material is applied in the hole from the surface of the wiring board opposite to the surface on which the convex portion is to be formed, and then the elastic material is caused to flow through the hole to the surface on which the convex portion is to be formed. By doing so, it is possible to easily and reliably obtain a state in which at least a part of the hole is filled with a part of the elastic material constituting the convex part.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a mounting structure and a mounting method of a chip-shaped component according to a first embodiment of the present invention, and representative examples included in this mounting method in (1) to (4). Are sequentially shown.

FIG. 2 is a cross-sectional view showing a step performed in place of the step shown in FIG. 1 (2).

FIG. 3 is a perspective view for explaining a mounting structure and a mounting method of a chip-shaped component according to a second embodiment of the present invention, wherein (1) and (2) show typical examples included in this mounting method. Are sequentially shown.

FIG. 4 is a perspective view for explaining a mounting structure and a mounting method of a chip-shaped component according to a third embodiment of the present invention, and representative examples included in this mounting method in (1) to (3). Are sequentially shown.

FIG. 5 is a cross-sectional view for explaining a mounting structure and a mounting method of a chip-shaped component according to a fourth embodiment of the present invention. In (1) and (2), typical examples included in this mounting method are shown. Are sequentially shown.

FIG. 6 is a cross-sectional view for explaining a mounting structure and a mounting method of a conventional chip-shaped component which is interesting for the present invention.

[Explanation of symbols]

 11, 31, 41, 51 Wiring board 12, 32, 42, 52 Electrode 13, 33, 43 Hole 14, 34 Elastic material 17, 35, 48, 53 Convex part 20, 47, 55 Chip-shaped part 21, 36, 45 , 54 conductive paste 44 frame

Claims (14)

[Claims] 1. A structure in which a chip-shaped component is mounted on a wiring board by using a conductive paste, and a region made of an elastic material is provided on a region of the wiring board facing the chip-shaped component. A portion is formed, wherein the chip-shaped component is mounted on the wiring board via a conductive paste in a state where a predetermined distance is maintained from the wiring board by the projection. Mounting structure. 2. The mounting structure according to claim 1, wherein the elastic material is provided by a conductive paste. 3. The conductive paste forming the projections,
The mounting structure of the chip-shaped component according to claim 2, which is used as it is as a conductive paste for mounting the chip-shaped component. 4. The mounting structure according to claim 1, wherein the conductive paste for mounting the chip component is applied so as to cover the projection. 5. A conductive paste for mounting the chip-shaped component is provided at a position different from the projection.
A mounting structure of the chip-shaped component according to claim 1. 6. A hole is provided in a region of the wiring board where the protrusion is formed, and a part of an elastic material forming the protrusion fills at least a part of the hole. 1
6. The mounting structure of the chip-shaped component according to any one of claims 5 to 5. 7. A method of mounting a chip-shaped component on a wiring board using a conductive paste, comprising forming a convex portion made of an elastic material on the wiring board, and forming the convex portion with the chip-shaped component by the convex portion. A method for mounting a chip-like component, comprising: mounting the chip-like component on the wiring board via a conductive paste while maintaining a predetermined distance from the wiring board. 8. The mounting method according to claim 7, wherein the projection is formed by applying a conductive paste on the wiring board. 9. In the step of mounting the chip-shaped component, the conductive paste for forming the projection is used as it is.
The method for mounting a chip-shaped component according to claim 8, wherein the method is used as a conductive paste for mounting the chip-shaped component. 10. The step of forming the projecting portion includes forming a frame surrounding a region where the projecting portion is to be formed, and applying a conductive paste in the frame, and mounting the chip-shaped component. The step of removing the frame after placing the chip-shaped component on the conductive paste in the frame, curing the conductive paste, and removing the frame, including the steps of, Implementation method. 11. The chip-shaped component according to claim 7, wherein in the step of mounting the chip-shaped component, a conductive paste for mounting the chip-shaped component is applied so as to cover the projection. Component mounting method. 12. In the step of mounting the chip-shaped component, a conductive paste for mounting the chip-shaped component is provided at a position different from the projection.
Or the mounting method of the chip-shaped component of 8. 13. In the step of forming the convex portion, a wiring substrate provided with a hole is prepared, and a part of the elastic material forming the convex portion fills at least a part of the hole. Claims 7 to 1
3. The mounting method of the chip-shaped component according to any one of 2. 14. The step of forming the convex portion includes applying the elastic material into the hole from a surface of the wiring board opposite to a surface on which the convex portion is to be formed, and then applying the elastic material. 14. The method of mounting a chip-shaped component according to claim 13, further comprising: flowing through the hole to the surface on which the convex portion is to be formed.