JP3505339B2 - Optical receiver - Google Patents
Optical receiverInfo
- Publication number
- JP3505339B2 JP3505339B2 JP04675497A JP4675497A JP3505339B2 JP 3505339 B2 JP3505339 B2 JP 3505339B2 JP 04675497 A JP04675497 A JP 04675497A JP 4675497 A JP4675497 A JP 4675497A JP 3505339 B2 JP3505339 B2 JP 3505339B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- light receiving
- optical receiver
- receiving element
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、いわゆるモールド
型受光モジュールと呼ばれる光受信器に関する。
【０００２】
【従来の技術】従来より、光リモコンの受信器などに用
いる光受信器においては、小型化の為にリードフレーム
を用いるようになっており、そのフレームに受光素子を
載置して、樹脂モールドしていた。この時、ノイズ対策
として受光素子にシールド処理をおこなうことがなさ
れ、例えば特開平９−１８０２５号公報では、リードフ
レームにもう一つ別のフレームを重ねてシールド板を構
成している。
【０００３】
【発明が解決しようとする課題】しかし、モールド樹脂
の内部に一枚のシールド板を挿入構成するのは、困難な
要素が多い。例えば、シールド板が狭い樹脂容積中で組
み立て配置時に傾斜したり、モールド樹脂の成形時の流
れでシールド板が振動すると、受光素子や駆動素子に当
接して内部回路を短絡させたり、損傷して不都合であ
る。その様な損傷まで至らなくとも、受光面に対するシ
ールド箇所がずれて、受光面を覆ったり、回路面を露出
させたりする事が生じ、効果が半減してしまうので不都
合である。
【０００４】
【課題を解決するための手段】本発明は上述の点を考慮
してなされたもので、受光素子と駆動回路とをフレーム
に配置し樹脂でモールドした光受信器において、前記フ
レームは、中央に面積の広い素子配置部を設け、その上
下に複数のリード線が配置されているとともに、前記リ
ード線の延在方向に略直交した方向に突出させた突起フ
レームを設け、この突起フレームを受光素子を挟み込む
ように折り曲げて構成していることを特徴とする。
【０００５】
【発明の実施の形態】図１は本発明の光受信器の斜視図
で、説明のため構成が複雑となる破線部は一部省略して
有り、その箇所の説明は他の図を援用して行う。図２は
本発明に用いるリードフレーム材の要部平面図、図３
ａ、ｂは組み立てを説明する要部平面図である。なお、
いずれの図でも、素子に配線を施すワイヤボンド線は省
略してある。この光受信器は、受光素子１と駆動回路２
（半導体素子）とをフレーム３に配置し樹脂４でモール
ドしてなる。
【０００６】このフレーム３は、リードフレーム材とし
て成形した時は図２に示すように、中央に比較的表面積
の広い素子載置部３１を設け、その上下、つまりリード
線橋絡部３０に向かって、複数のリード線３２が配置さ
れている。リード線は上下それぞれ２本、３本の所定間
隔の略直線状のものを図示しているが、例えば橋絡部３
０分離後、個別部品にしてから、どこかのリード線をフ
ォーミングして例えば間隔を広げたいことが判っている
場合、打ち抜き成形時からリード線３２が所望の形状に
なるように、予め変形させておいてもよい。
【０００７】フレーム３の受光素子１が載置された近傍
にはチップ部品５を固着してある。これは、駆動回路の
構成上必要なものとか、電源の安定化や雑音対策上必要
な抵抗やコイル、コンデンサーなどのもので、通常はフ
レーム間（リード線間）に跨って固着されるが、フレー
ムに絶縁膜などを積層する処理により対向電極が形成で
きる場合には単一のフレーム上に配置してよい。チップ
部品５の数は、一つ以上を必要に応じて用いればよい。
【０００８】また、受光素子１を載置したフレーム３の
載置部３１近傍から突出させた突起フレーム６を設け、
この突起フレーム６は受光素子１を挟み込むように折り
曲げて載置部３１と略平行になる様に構成している。こ
の突起フレーム６は、実質的に受光素子１のシールド板
となるもので、受光素子１の受光面（この例の場合、表
面中央部）を露出させる透孔６１を有し、一方、平板部
６２で駆動素子２を覆う様に構成される。
【０００９】このように突起フレーム６を設けた場合と
設けない場合との相違は、たとえば以下のようである。
まず３８ｋＨｚで変調した６００μ秒間隔の交番電圧に
よる電場を光受信機の近傍（３２０立方ｃｍ）に形成し
てその中央に光受信器を配置し、電場に近接した距離か
ら１ｃｍ単位で送信器を離していった時、信号が正確に
復調できる距離（遠い方が性能が良い）を測定し比較し
た。シールド板を設けない場合には、電場外に送信器を
配置しては復調出来ず、送受信器が会い対向して互いの
光学面がほぼ接触した時にしか信号が復調できなかっ
た。樹脂モールドした外側に金属メッシュのシールド板
を設けた場合、電場外の距離３〜４ｃｍのところで復調
出来たが、光軸が少し振れると受信不良が多発した。そ
れに対して上述した本発明にあっては、電場外２０ｃｍ
以上の箇所で復調でき、しかも光軸を振るように送信場
所を同心円上に少し移動させても受信できた。
【００１０】一方、突起フレーム６は、受光素子１を載
置したフレーム３のリード線３２の延在方向に略直交し
た方向に突出させ、幅の細い支持部３３で支持してお
り、支持部３３の無い開放端をチップ部品５の近傍で固
定している。この時、リード線３２延在方向に支持部３
３を設けると、リード線３２の幅や間隔が狭まったり、
突起フレーム６を起こす作業中にリード線３２を損傷し
たり不所望の屈曲を与えたりするので、好ましくない。
また、突起フレーム６の一端をチップ部品５の固着する
にあたっては、絶縁性接着剤とか、導電性接着剤とか、
半田、バンプなどで固定するか、またはチップ部品５近
傍のフレームにその様な接続材で固定すると良い。絶縁
性接着剤を用いる場合には、小さなチップ部品の接触不
良や短絡事故を発生させないので好ましい。一方導電性
接続材を用いる場合には、突起フレーム６は一層フレー
ム３と等電位が保たれ好ましい。しかし、支持部３３が
丈夫な時は、樹脂注入によって突起フレーム６が動かな
いように樹脂注入ゲートの位置と方向を適宜定めること
によって、接続材をフレーム間に流入したその樹脂とし
て、モールド樹脂４で突起フレーム６を固定する事が出
来る。
【００１１】このような突起フレーム６の構成は、図２
および図３を参照して説明するが、載置部３１に受光素
子１と駆動素子２を同じ面に載置固着し、チップ部品も
載置固着する。そして配線（図示せず）を施した後、突
起フレーム６を折り曲げることで構成できる。これは、
チップ部品は受光素子や駆動回路などの半導体ウエハよ
り高いか若しくは略等しい高さであり、フレーム部材は
多少の復元力を持っていることに着目してなされたもの
で、両フレームを完全な平行になる様に構成する様にと
特に努力しなくても、突起フレームの先端がチップ部品
に当接するように折り曲げてその後工具を離せば突起フ
レームはチップ部品から少しだけ離れた状態に留まる。
しかもその折曲げにあたっては、支持部３３の幅を広げ
るとひねって曲がる可能性は少ないが折り曲げ難くなる
ので幅を狭くし、更に支持部３３の両脇にスリットを設
けて折り曲げ易くしておくのが好ましい。しかし、それ
でも斜めに折り曲げないようにしなければならない。そ
こで本発明では、突起フレームの所定の箇所がチップ部
品などの所定の位置に来る様に折り曲げることで、たや
すく位置ぎめをすることが出来、透孔６１や平板部６２
の位置をずらさずに作業性が良く作業が出来る。
【００１２】
【発明の効果】以上の如く、本発明によれば、組み立て
やすく、堅牢であり、シールド効果の極めて高い光受信
機が提供できた。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical receiver called a so-called molded light receiving module. 2. Description of the Related Art Conventionally, in an optical receiver used for a receiver of an optical remote controller, a lead frame has been used for miniaturization, and a light receiving element is mounted on the frame. , Resin molding. At this time, a shield process is performed on the light receiving element as a noise countermeasure. For example, in Japanese Patent Application Laid-Open No. 9-18025, another shield frame is formed by superposing another frame on a lead frame. [0003] However, it is difficult to insert a single shield plate into the mold resin. For example, if the shield plate is inclined during assembly and placement in a narrow resin volume, or if the shield plate vibrates due to the flow of molding resin, it may come into contact with the light receiving element or drive element to short-circuit or damage the internal circuit. It is inconvenient. Even if such damage does not occur, the shield portion with respect to the light receiving surface is displaced, and the light receiving surface is covered or the circuit surface is exposed, which is inconvenient because the effect is reduced by half. SUMMARY OF THE INVENTION The present invention has been made in view of the above points. In an optical receiver in which a light receiving element and a drive circuit are arranged in a frame and molded with resin, the frame is A centrally disposed element disposing portion having a large area, a plurality of lead wires disposed above and below the component disposing portion, and a protruding frame protruding in a direction substantially orthogonal to the extending direction of the lead wire is provided. Are bent so as to sandwich the light receiving element. FIG. 1 is a perspective view of an optical receiver according to the present invention, in which a portion of a broken line, which is complicated for the sake of explanation, is partially omitted, and that portion is described in another drawing. With the help of FIG. 2 is a plan view of a main part of a lead frame material used in the present invention, and FIG.
FIGS. 4A and 4B are plan views of relevant parts for explaining assembly. In addition,
In each of the drawings, wire bond lines for wiring the elements are omitted. This optical receiver comprises a light receiving element 1 and a driving circuit 2
(Semiconductor element) are arranged on a frame 3 and molded with a resin 4. When the frame 3 is formed as a lead frame material, as shown in FIG. 2, an element mounting portion 31 having a relatively large surface area is provided in the center, and the upper and lower sides thereof, that is, toward the lead wire bridging portion 30, are provided. Thus, a plurality of lead wires 32 are arranged. The lead wires are shown in the form of two straight lines and three straight lines at predetermined intervals.
After separation, if it is known that it is desired to form some lead wires to increase the interval, for example, after forming the individual components, the lead wires 32 are deformed in advance so as to have a desired shape from the time of punching. You may keep it. A chip component 5 is fixed near the light receiving element 1 of the frame 3. This is necessary for the configuration of the drive circuit or for resistors, coils, capacitors, etc. necessary for stabilization of the power supply and noise countermeasures, and is usually fixed across the frames (between the lead wires). When a counter electrode can be formed by a process of laminating an insulating film or the like on a frame, the counter electrode may be arranged on a single frame. One or more chip components 5 may be used as needed. Further, a projection frame 6 is provided which protrudes from the vicinity of the mounting portion 31 of the frame 3 on which the light receiving element 1 is mounted,
The projecting frame 6 is bent so as to sandwich the light receiving element 1 so as to be substantially parallel to the mounting portion 31. The projecting frame 6 substantially serves as a shield plate of the light receiving element 1 and has a through hole 61 for exposing a light receiving surface (the center of the surface in this example) of the light receiving element 1, while a flat plate part It is configured to cover the drive element 2 at 62. The difference between the case where the projection frame 6 is provided and the case where it is not provided is, for example, as follows.
First, an electric field with an alternating voltage of 600 μsec modulated at 38 kHz is formed in the vicinity (320 cubic cm) of the optical receiver, and the optical receiver is arranged in the center of the electric field. When they were separated, the distance at which the signal could be accurately demodulated (the farther the better the better) was measured and compared. Without the shield plate, the transmitter could not be demodulated by placing the transmitter outside the electric field, and the signal could only be demodulated when the transmitters and receivers met and their optical surfaces almost contacted each other. When a metal mesh shield plate was provided on the outside of the resin mold, demodulation could be performed at a distance of 3 to 4 cm outside the electric field. In contrast, in the present invention described above, the electric field is 20 cm
The signal could be demodulated at the above location, and the signal could be received even if the transmission location was moved slightly concentrically so as to swing the optical axis. On the other hand, the projecting frame 6 is made to protrude in a direction substantially perpendicular to the extending direction of the lead wire 32 of the frame 3 on which the light receiving element 1 is mounted, and is supported by a narrow supporting portion 33. An open end without 33 is fixed near the chip component 5. At this time, the support portion 3 extends in the extending direction of the lead wire 32.
When 3 is provided, the width and interval of the lead wire 32 are reduced,
It is not preferable because the lead wire 32 is damaged or an undesired bend is given during the operation of raising the projection frame 6.
In fixing one end of the projection frame 6 to the chip component 5, an insulating adhesive, a conductive adhesive,
It is good to fix with solder, a bump, or the like, or to a frame near the chip component 5 with such a connecting material. The use of an insulating adhesive is preferable because it does not cause a contact failure of a small chip component or a short circuit accident. On the other hand, when a conductive connection material is used, the projection frame 6 is preferably kept at the same potential as the frame 3. However, when the supporting portion 33 is strong, the position and the direction of the resin injection gate are appropriately determined so that the projecting frame 6 does not move by the resin injection. Can fix the protruding frame 6. The structure of such a projection frame 6 is shown in FIG.
As will be described with reference to FIG. 3, the light receiving element 1 and the driving element 2 are mounted and fixed on the mounting section 31 on the same surface, and the chip component is also mounted and fixed. After wiring (not shown), the projection frame 6 can be bent. this is,
The chip parts are higher or almost equal in height to the semiconductor wafers such as light receiving elements and drive circuits, and the frame members are designed with a focus on having some restoring force. Even if no special effort is made to make the projection frame, if the tip of the projection frame is bent so as to be in contact with the chip component, and then the tool is released, the projection frame remains slightly separated from the chip component.
In addition, in the bending, if the width of the support portion 33 is increased, the possibility of twisting and bending is small, but it is difficult to bend. Therefore, the width is reduced, and slits are provided on both sides of the support portion 33 to facilitate bending. Is preferred. However, they must still not bend at an angle. Therefore, in the present invention, the projection frame is bent so that a predetermined portion of the projection frame comes to a predetermined position of a chip component or the like, whereby positioning can be easily performed.
Workability is good without shifting the position of As described above, according to the present invention, an optical receiver that is easy to assemble, robust, and has a very high shielding effect can be provided.
【図面の簡単な説明】
【図１】本発明の光受信器の斜視図である。
【図２】本発明に用いるリードフレーム材の要部平面図
である。
【図３】ａ、ｂとも組み立てを説明する要部平面図であ
る。
【符号の説明】
１ 受光素子
２ 駆動回路
３ フレーム
４ 樹脂
５ チップ部品
６ 突起フレームBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an optical receiver according to the present invention. FIG. 2 is a plan view of a main part of a lead frame material used in the present invention. FIGS. 3A and 3B are main part plan views for explaining assembly. [Description of Signs] 1 Light receiving element 2 Drive circuit 3 Frame 4 Resin 5 Chip component 6 Projection frame
───────────────────────────────────────────────────── フロントページの続き (72)発明者 村上 耕一 鳥取県鳥取市南吉方３丁目201番地 鳥 取三洋電機株式会社内 (72)発明者 田中 堅太郎 鳥取県鳥取市南吉方３丁目201番地 鳥 取三洋電機株式会社内 (72)発明者 前田 晋 鳥取県鳥取市南吉方３丁目201番地 鳥 取三洋電機株式会社内 (56)参考文献 特開 平７−288332（ＪＰ，Ａ) 特開 平５−72027（ＪＰ，Ａ) 特開 平10−74962（ＪＰ，Ａ) 実開 平２−133038（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 31/00 - 31/0392 H01L 31/08 - 31/09 G02B 6/42 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Koichi Murakami 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. (72) Inventor Kentaro Tanaka 3-201 Minamiyoshikata, Tottori City, Tottori Sanyo Electric Co., Ltd. (72) Inventor Susumu Maeda 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. (56) References JP-A-7-288332 (JP, A) JP-A-5-205 72027 (JP, A) JP-A-10-74962 (JP, A) JP-A-2-133838 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 31/00-31 / 0392 H01L 31/08-31/09 G02B 6/42
Claims (1)
樹脂でモールドした光受信器において、前記フレーム
は、中央に面積の広い素子配置部を設け、その上下に複
数のリード線が配置されているとともに、前記リード線
の延在方向に略直交した方向に突出させた突起フレーム
を設け、この突起フレームを受光素子を挟み込むように
折り曲げて構成していることを特徴とする光受信器。(57) [Claim 1] In an optical receiver in which a light receiving element and a drive circuit are arranged in a frame and molded with resin, the frame is provided with an element arrangement portion having a large area in the center. A plurality of lead wires are arranged above and below, and a projection frame projecting in a direction substantially perpendicular to the direction in which the lead wires extend is provided, and the projection frame is bent so as to sandwich the light receiving element. An optical receiver, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04675497A JP3505339B2 (en) | 1997-02-28 | 1997-02-28 | Optical receiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04675497A JP3505339B2 (en) | 1997-02-28 | 1997-02-28 | Optical receiver |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003312192A Division JP3754430B2 (en) | 2003-09-04 | 2003-09-04 | Optical receiver and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10242487A JPH10242487A (en) | 1998-09-11 |
| JP3505339B2 true JP3505339B2 (en) | 2004-03-08 |
Family
ID=12756125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04675497A Expired - Fee Related JP3505339B2 (en) | 1997-02-28 | 1997-02-28 | Optical receiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3505339B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4683826B2 (en) * | 2003-02-27 | 2011-05-18 | 三洋電機株式会社 | Lead frame and light receiving module including the same |
-
1997
- 1997-02-28 JP JP04675497A patent/JP3505339B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10242487A (en) | 1998-09-11 |
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