JP2000187823A - Suspension member for magnetic disk device - Google Patents

Suspension member for magnetic disk device

Info

Publication number
JP2000187823A
JP2000187823A JP10362412A JP36241298A JP2000187823A JP 2000187823 A JP2000187823 A JP 2000187823A JP 10362412 A JP10362412 A JP 10362412A JP 36241298 A JP36241298 A JP 36241298A JP 2000187823 A JP2000187823 A JP 2000187823A
Authority
JP
Japan
Prior art keywords
thin plate
magnetic disk
suspension member
insulating layer
disk device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10362412A
Other languages
Japanese (ja)
Inventor
Hidekatsu Sekine
秀克 関根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP10362412A priority Critical patent/JP2000187823A/en
Publication of JP2000187823A publication Critical patent/JP2000187823A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a suspension member for a magnetic disk device, capable of improving the adhesion of a stainless steel thin plate with a conductive thin film and an insulating layer, and reducing manufacturing costs by shortening a manufacturing time. SOLUTION: The surface of a stainless steel thin plate 11 used as the base material of a suspension member for a magnetic disk device is formed so as to be rough in a mat shape, a wiring member made of an insulating film 13, a wiring layer 14, terminal electrodes 15a and 15b and an insulating layer 16 is formed, the outer shape of the stainless steel thin plate is machined, the terminal electrodes 15a and 15b are plated with AU, and thus the suspension member for the magnetic disk device is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は磁気ディスク装置等
に用いられる磁気ヘッドサスペンションに係わり、さら
に詳しくは磁気ヘッド素子とリード・ライトアンプ基板
とを接続するための配線部材と一体的に形成された磁気
ディスク装置用サスペンション部材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head suspension used in a magnetic disk drive or the like, and more particularly, to a magnetic head suspension formed integrally with a wiring member for connecting a magnetic head element to a read / write amplifier board. The present invention relates to a suspension member for a magnetic disk drive.

【0002】[0002]

【従来の技術】従来の磁気ディスク装置用サスペンショ
ン部材の基材として、一般的にはSUS薄板が用いら
れ、そのSUS薄板表面は平滑なものであった。さら
に、SUS薄板上に配線層を形成する際、まずSUS薄
板上に絶縁層を形成し、SUS薄板と絶縁層上に電解め
っきの下地電極として導電性薄膜を無電解めっきにて形
成してセミアディティブ法にて配線層を形成する方法が
ある。この方法の場合導電性薄膜例えばCuめっき膜の
密着性が弱いため、無電解めっき中にCuめっき膜が剥
がれてしまうといった問題がある。その問題を解消する
方法として、スパッタリング法にてSUS薄板及び絶縁
層上にCu薄膜を設けて電解めっきの下地電極とする方
法がある。
2. Description of the Related Art A SUS thin plate is generally used as a base material of a conventional suspension member for a magnetic disk drive, and the SUS thin plate has a smooth surface. Furthermore, when forming a wiring layer on a SUS thin plate, first, an insulating layer is formed on the SUS thin plate, and a conductive thin film is formed on the SUS thin plate and the insulating layer as a base electrode for electrolytic plating by electroless plating. There is a method of forming a wiring layer by an additive method. In the case of this method, there is a problem that the Cu plating film is peeled off during the electroless plating because the adhesion of the conductive thin film, for example, the Cu plating film is weak. As a method for solving the problem, there is a method in which a Cu thin film is provided on a SUS thin plate and an insulating layer by a sputtering method to be used as a base electrode for electrolytic plating.

【0003】上記のような磁気ディスク装置用サスペン
ション部材の製造方法では、導電性薄膜の形成方法とし
て、スパッタリング法を用いているため、真空引き含め
て製造時間が長くかかるため、製造コストが高くなると
いう問題がある。また、SUS薄板表面は平滑であるた
め、SUS薄板上に形成する絶縁層との密着性が弱いと
いう問題も起こっている。
In the method of manufacturing a suspension member for a magnetic disk drive as described above, since a sputtering method is used as a method of forming a conductive thin film, a long manufacturing time including evacuation is required, resulting in high manufacturing costs. There is a problem. Further, since the surface of the SUS thin plate is smooth, there is a problem that the adhesion to an insulating layer formed on the SUS thin plate is weak.

【0004】[0004]

【発明が解決しようとする課題】本発明は、前記問題点
を鑑みなされたものであり、その目的とするところは、
SUS薄板と導電性薄膜及び絶縁層との密着性向上を図
り、且つ製造時間を短縮して製造コストを低減させる磁
気ディスク装置用サスペンション部材を提供することに
ある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object the following:
An object of the present invention is to provide a suspension member for a magnetic disk drive, which improves the adhesion between a SUS thin plate, a conductive thin film, and an insulating layer, and reduces the manufacturing time and the manufacturing cost.

【0005】[0005]

【問題を解決するための手段】本発明は前記課題を解決
するために、磁気ヘッド素子とリード・ライトアンプ基
板とを接続するための配線部材と一体的に形成された磁
気ディスク装置用サスペンション部材であって、前記磁
気ディスク装置用サスペンション部材の基材として用い
られるSUS薄板の表面をマット状に粗面化して前記配
線部材を形成したことを特徴とする磁気ディスク装置用
サスペンション部材としたものである。
According to the present invention, there is provided a suspension member for a magnetic disk drive integrally formed with a wiring member for connecting a magnetic head element and a read / write amplifier board. Wherein the wiring member is formed by roughening a surface of a SUS thin plate used as a base material of the suspension member for the magnetic disk device into a mat shape to form the wiring member. is there.

【0006】[0006]

【発明の実施の形態】図1は本発明の磁気ディスク装置
用サスペンション部材の平面図を、図2(a)〜(e)
は本発明の磁気ディスク装置用サスペンション部材の製
造工程を工程順に示す模式平面図を、図3(a)〜
(e)は図2(a)〜(e)の模式平面図をA−A線で
切断した模式断面図をそれぞれ示す。
FIG. 1 is a plan view of a suspension member for a magnetic disk drive according to the present invention, and FIGS. 2 (a) to 2 (e).
FIGS. 3A to 3C are schematic plan views showing the steps of manufacturing a suspension member for a magnetic disk drive according to the present invention in the order of steps.
2E is a schematic cross-sectional view of the schematic plan view of FIGS. 2A to 2E taken along line AA.

【0007】本発明の磁気ディスク装置用サスペンショ
ン部材の基材として用いられているSUS薄板11の表
面はマット状に粗面化された面12になっている(図3
(a)参照)。このようにマット状に粗面化されたSU
S薄板11に配線層14を形成するための絶縁層13を
形成するとSUS薄板11のマット状に粗面化された面
12と絶縁層13を形成している樹脂が物理的に絡み合
って絶縁層13はSUS薄板11に強固に固着され、S
US薄板11上には接着性に優れた絶縁層13、配線層
14、端子電極15a、15b及び絶縁層16からなる
配線部材を形成できる。
The surface of a SUS thin plate 11 used as a base material of a suspension member for a magnetic disk drive according to the present invention is a surface 12 roughened into a mat shape (FIG. 3).
(See (a)). SU thus roughened in a mat shape
When the insulating layer 13 for forming the wiring layer 14 is formed on the S thin plate 11, the matte-roughened surface 12 of the SUS thin plate 11 and the resin forming the insulating layer 13 are physically entangled with each other. 13 is firmly fixed to the SUS thin plate 11,
On the US thin plate 11, a wiring member including the insulating layer 13, the wiring layer 14, the terminal electrodes 15a and 15b, and the insulating layer 16 having excellent adhesiveness can be formed.

【0008】以下、本発明の磁気ディスク装置用サスペ
ンション部材の製造方法ついて図面を用いて説明する。
まず、SUS薄板11を例えば塩化第2鉄液に浸せき
し、SUS薄板11表面を軽くエッチングして、マット
状に粗面化された面12を形成する(図2(a)及び図
3(a)参照)。ここで、マット状に粗面化する方法と
しては上記エッチング法の他に機械研磨法、サンドブラ
スト法等があり粗面化する表面状態に応じて適宜使い分
ける。
A method of manufacturing a suspension member for a magnetic disk drive according to the present invention will be described below with reference to the drawings.
First, the SUS thin plate 11 is immersed in, for example, a ferric chloride solution, and the surface of the SUS thin plate 11 is lightly etched to form a mat-shaped roughened surface 12 (FIGS. 2A and 3A). )reference). Here, as a method of roughening the surface into a mat shape, there are a mechanical polishing method, a sand blasting method and the like in addition to the etching method described above, and the method is appropriately selected according to the surface state to be roughened.

【0009】次に、表面がマット状に粗面化されたSU
S薄板11上に配線層及び端子電極を形成するための絶
縁層13を所定の形状で形成する(図2(b)及び図3
(b)参照)。
Next, SU whose surface is roughened in a mat shape is provided.
An insulating layer 13 for forming a wiring layer and a terminal electrode is formed in a predetermined shape on the S thin plate 11 (FIGS. 2B and 3).
(B)).

【0010】次に、無電解めっき法によりSUS薄板1
1及び絶縁層13上に導電性薄膜を形成した後セミアデ
ィティブ法により配線層14及び端子電極15a、15
bを形成する(図2(c)及び図3(c)参照)。
Next, the SUS thin plate 1 is formed by electroless plating.
1 and a conductive thin film formed on the insulating layer 13 and then a wiring layer 14 and terminal electrodes 15a and 15a by a semi-additive method.
b is formed (see FIGS. 2C and 3C).

【0011】次に、絶縁層13及び端子電極15a、1
5bを除く配線層14上に所定のパターンで絶縁層16
を形成する(図2(d)及び図3(d)参照)。
Next, the insulating layer 13 and the terminal electrodes 15a, 1
The insulating layer 16 in a predetermined pattern is formed on the wiring layer 14 except for the wiring layer 5b.
Is formed (see FIGS. 2D and 3D).

【0012】次に、SUS薄板11を所定の形状に外形
加工して、SUS薄板11a上に絶縁層13、配線層1
4、端子電極15a、15b及び絶縁層16からなる配
線部材が形成された本発明の磁気ディスク装置用サスペ
ンション部材を得ることができる(図1、図2(e)及
び図3(e)参照)。
Next, the outer shape of the SUS thin plate 11 is processed into a predetermined shape, and the insulating layer 13 and the wiring layer 1 are formed on the SUS thin plate 11a.
4. A suspension member for a magnetic disk drive according to the present invention on which a wiring member including the terminal electrodes 15a and 15b and the insulating layer 16 is formed (see FIGS. 1, 2 (e) and 3 (e)). .

【0013】本発明の磁気ディスク装置用サスペンショ
ン部材は、SUS薄板表面を粗面化処理して絶縁層及び
配線層を形成するため、電解めっきの下地層としての導
電性薄膜を無電解めっき法で形成しても所定の密着性が
得られ、スパッター等を使って導電性薄膜を形成しなく
ても良い。そのため製造時間を短縮することができ、製
造コストの低減を計ることができると共に、SUS薄板
と導電性薄膜及び絶縁層との密着性を向上させることが
できる。
In the suspension member for a magnetic disk drive of the present invention, a conductive thin film as an underlayer for electrolytic plating is formed by electroless plating in order to form an insulating layer and a wiring layer by roughening the surface of a SUS thin plate. Even if it is formed, a predetermined adhesiveness is obtained, and it is not necessary to form a conductive thin film using sputtering or the like. Therefore, the manufacturing time can be reduced, the manufacturing cost can be reduced, and the adhesion between the SUS thin plate and the conductive thin film and the insulating layer can be improved.

【0014】[0014]

【実施例】以下実施例により本発明を詳細に説明する。
20μm厚のSUS薄板11を30℃に加温された塩化
第2鉄液に1分間浸せきし、SUS薄板11表面をエッ
チング処理してマット状に粗面化された面12を形成し
た。
The present invention will be described in detail with reference to the following examples.
The SUS thin plate 11 having a thickness of 20 μm was immersed in a ferric chloride solution heated to 30 ° C. for 1 minute, and the surface of the SUS thin plate 11 was etched to form a mat-shaped roughened surface 12.

【0015】次に、SUS薄板11上に感光性絶縁樹脂
(エポキシ系)をロールコートにて塗布し、70℃・3
0分及び100℃・30分乾燥して感光層を形成し、所
定のパターンを露光・現像処理して、175℃・60分
加熱硬化して膜厚10〜30μmの絶縁層13を形成し
た。
Next, a photosensitive insulating resin (epoxy type) is applied on the SUS thin plate 11 by roll coating,
A photosensitive layer was formed by drying at 0 ° C. and 100 ° C. for 30 minutes, a predetermined pattern was exposed and developed, and heat-cured at 175 ° C. for 60 minutes to form an insulating layer 13 having a film thickness of 10 to 30 μm.

【0016】次に、SUS薄板11及び絶縁層13上に
無電解銅めっきにて0.3μm厚の導電性薄膜を形成し
た。
Next, a conductive thin film having a thickness of 0.3 μm was formed on the SUS thin plate 11 and the insulating layer 13 by electroless copper plating.

【0017】次に、絶縁層13及び導電性薄膜が形成さ
れたSUS薄板11の両面にアルカリ可溶性の20μm
厚のドライフィルムレジストをラミネートし、所定のパ
ターンで露光し、現像処理して、配線層を電解めっきで
形成するためのレジストパターンを形成した。
Next, both sides of the SUS thin plate 11 on which the insulating layer 13 and the conductive thin film are formed are alkali-soluble 20 μm
A thick dry film resist was laminated, exposed to a predetermined pattern, and developed to form a resist pattern for forming a wiring layer by electrolytic plating.

【0018】次に、SUS薄板11をカソード電極にし
て電流密度3A/dm2でレジストパターンをマスクに
して導電性薄膜上に硫酸銅めっきを行い膜厚5〜10μ
mの銅めっき層を形成し、さらに、SUS薄板11をカ
ソード電極にして電流密度3A/dm2で膜厚1〜3μ
m程度のNiめっき層形成し、銅及びニッケル層からな
る2層の導体層を形成した。
Next, using the SUS thin plate 11 as a cathode electrode and a resist pattern as a mask with a current density of 3 A / dm 2 as a mask, the conductive thin film is plated with copper sulfate to a film thickness of 5 to 10 μm.
m, a copper plating layer having a thickness of 1 to 3 μm at a current density of 3 A / dm 2 using the SUS thin plate 11 as a cathode electrode.
An about m m Ni plating layer was formed, and two conductor layers composed of a copper layer and a nickel layer were formed.

【0019】次に、レジストパターンを剥離処理し、レ
ジストパターン下部にあった導電性薄膜とニッケル層表
面を硫酸でフラッシュエッチングして配線パターン間の
絶縁をとり、配線層14及び端子電極15a、15bを
形成した。
Next, the resist pattern is peeled off, the conductive thin film under the resist pattern and the surface of the nickel layer are flash-etched with sulfuric acid to insulate the wiring patterns, and the wiring layer 14 and the terminal electrodes 15a, 15b are separated. Was formed.

【0020】次に、配線層14及び端子電極15a、1
5bが形成されたSUS薄板11上に感光性絶縁樹脂
(エポキシ系)をロールコートにて塗布し、70℃・3
0分及び100℃・30分乾燥して感光層を形成し、所
定のパターンを露光し、現像処理して175℃・60分
加熱硬化して、端子電極15a、15bを除く絶縁層1
3上に膜厚5〜20μmの絶縁層16を形成した。
Next, the wiring layer 14 and the terminal electrodes 15a, 1
A photosensitive insulating resin (epoxy) is applied by roll coating on the SUS thin plate 11 on which 5b is formed, and the coating is performed at 70 ° C./3.
A photosensitive layer is formed by drying at 0 and 100 ° C. for 30 minutes, a predetermined pattern is exposed, developed, and heat-cured at 175 ° C. for 60 minutes to form an insulating layer 1 excluding the terminal electrodes 15a and 15b.
On 3, an insulating layer 16 having a thickness of 5 to 20 μm was formed.

【0021】次に、SUS薄板11の両面にアルカリ可
溶性の20μm厚のドライフィルムレジストをラミネー
トし、所定のパターンを露光し、現像処理してSUS薄
板11を外形加工するためのレジストパターンを形成
し、塩化第2鉄液にてエッチング処理して外形加工が施
されたSUS薄板11aを形成した。
Next, an alkali-soluble dry film resist having a thickness of 20 μm is laminated on both surfaces of the SUS thin plate 11, a predetermined pattern is exposed and developed to form a resist pattern for externally processing the SUS thin plate 11. Then, an SUS thin plate 11a having an outer shape processed by etching with a ferric chloride solution was formed.

【0022】次に、専用の剥離液によりレジストパター
ンを剥離し、無電解めっき法により端子電極15a、1
5bにAuめっきを施して、外形加工が施されたSUS
薄板11a上に絶縁層13、配線層14、端子電極15
a、15b及び絶縁層16からなる配線部材が形成され
た本発明の磁気ディスク装置用サスペンション部材を得
た。
Next, the resist pattern is stripped with a dedicated stripper, and the terminal electrodes 15a, 15a,
SUS with Au plating on 5b and external processing
Insulating layer 13, wiring layer 14, terminal electrode 15 on thin plate 11a
A suspension member for a magnetic disk drive according to the present invention, on which a wiring member composed of a, 15b and the insulating layer 16 was formed, was obtained.

【0023】[0023]

【発明の効果】上記したように、本発明の磁気ディスク
装置用サスペンション部材は、SUS薄板表面を粗面化
処理して絶縁層及び配線層を形成するため、下地層とし
ての導電性薄膜を無電解めっき法で形成しても所定の密
着性が得られ、スパッター等を使って導電性薄膜を形成
しなくても良い。そのため製造時間を短縮することがで
き、製造コストの低減を計ることができると共に、磁気
ディスク装置用サスペンション部材の基材として用いら
れるSUS薄板と絶縁層及び配線層との密着性を向上さ
せることができる。
As described above, in the suspension member for a magnetic disk drive of the present invention, the surface of the SUS thin plate is roughened to form the insulating layer and the wiring layer. Even if formed by an electrolytic plating method, a predetermined adhesiveness can be obtained, and it is not necessary to form a conductive thin film using sputtering or the like. Therefore, the manufacturing time can be reduced, the manufacturing cost can be reduced, and the adhesion between the SUS thin plate used as the base material of the suspension member for the magnetic disk device and the insulating layer and the wiring layer can be improved. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の磁気ディスク装置用サスペンション部
材の一実施例を示す模式平面図である。
FIG. 1 is a schematic plan view showing one embodiment of a suspension member for a magnetic disk drive of the present invention.

【図2】(a)〜(e)は、本発明の磁気ディスク装置
用サスペンション部材の一実施例の製造工程を工程順に
示す模式平面図である。
FIGS. 2A to 2E are schematic plan views showing a manufacturing process of one embodiment of a suspension member for a magnetic disk drive according to the present invention in the order of steps.

【図3】(a)〜(e)は、図2(a)〜(e)の模式
平面図をA−A線で切断した模式断面図である。
FIGS. 3A to 3E are schematic cross-sectional views of the schematic plan views of FIGS. 2A to 2E taken along line AA.

【符号の説明】[Explanation of symbols]

11……SUS薄板 11a……外形加工されたSUS薄板 12……マット状に粗面化された面 13……絶縁層 14……配線層 15a、15b……端子電極 16……絶縁層 11: SUS thin plate 11a: SUS thin plate whose outer shape is processed 12: Surface roughened into a mat shape 13: Insulating layer 14: Wiring layer 15a, 15b: Terminal electrode 16: Insulating layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】磁気ヘッド素子とリード・ライトアンプ基
板とを接続するための配線部材と一体的に形成された磁
気ディスク装置用サスペンション部材であって、前記磁
気ディスク装置用サスペンション部材の基材として用い
られるSUS薄板の表面をマット状に粗面化して前記配
線部材を形成したことを特徴とする磁気ディスク装置用
サスペンション部材。
A magnetic disk device suspension member integrally formed with a wiring member for connecting a magnetic head element and a read / write amplifier substrate, wherein the magnetic disk device suspension member has a base material. A suspension member for a magnetic disk drive, wherein the wiring member is formed by roughening the surface of a SUS thin plate used into a mat shape.
JP10362412A 1998-12-21 1998-12-21 Suspension member for magnetic disk device Pending JP2000187823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10362412A JP2000187823A (en) 1998-12-21 1998-12-21 Suspension member for magnetic disk device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10362412A JP2000187823A (en) 1998-12-21 1998-12-21 Suspension member for magnetic disk device

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112406A1 (en) * 2005-04-18 2006-10-26 Mitsui Chemicals, Inc. Metal laminate, method for manufacturing same and use thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112406A1 (en) * 2005-04-18 2006-10-26 Mitsui Chemicals, Inc. Metal laminate, method for manufacturing same and use thereof

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