JPS61124117A - Manufacture of printed coil - Google Patents
Manufacture of printed coilInfo
- Publication number
- JPS61124117A JPS61124117A JP24511384A JP24511384A JPS61124117A JP S61124117 A JPS61124117 A JP S61124117A JP 24511384 A JP24511384 A JP 24511384A JP 24511384 A JP24511384 A JP 24511384A JP S61124117 A JPS61124117 A JP S61124117A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- metal
- coil
- metal foil
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、小型モーターなどに用いることができる、平
面タイプで高密度・高性能々両面構造のプリントコイル
の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a printed coil of a flat type, high density, high performance, and double-sided structure, which can be used for small motors and the like.
従来例の構成とその問題点
近年、ＩＣやＬＳＩなどの開発に伴なってプレヤーや磁
気記録再生装置など、モーターを使用した電子機器の小
型・軽量化や高性能化に対する要求はますます高まって
おり、それに伴なってモーター自体の小型・高性能化が
重要な課題となっている。Conventional configurations and their problems In recent years, with the development of ICs and LSIs, there has been an increasing demand for smaller, lighter, and higher performance electronic devices that use motors, such as players and magnetic recording/reproducing devices. As a result, miniaturization and higher performance of the motor itself have become important issues.
特に薄型化の要求が高いダイレクトドライブモ３ｔ・
一ターなどにおいては、その主な構成要素の１つである
コイルを薄型・高性能化することが最も重要な課題の１
つになっている。その要求にこたえるためには、薄型で
なおかつコイルのインダクタンスを大きくし直流抵抗値
を小さくするという相反する条件を満たさなければなら
ず、それにはコイルパターンの断面積を大きく、ターン
数、すなわち配線密度を高める必要があった。その１つ
の対策として昨今、従来の巻線方式のコイルにかわって
より薄型化が図れるフレキシブルなプリントコイルが利
用されつつある。しかしこのプリントコイルも、従来の
エツチング法によって製造しようとする場合、第１図に
示す基板１上の金属箔２にエツチングレジスト３により
、図中の破線で示すようなエツチングを望んでもサイド
エツチングにより金属箔２は第１図に示す部分のみが残
るだめ、配線密度を高め、なおかつ断面積を減少させず
にプリントコイルを製造することは困難であった。また
、めっき法によって製造しようとする場合、第２図に示
すように、基板４上のめっきレジスト５を設けた部分以
外に形成される析出金属６に厚みより幅方向への太りが
生じるため、配線密度を高めることは困難であった。さ
らに、この場合、基板６の上にたとえばスパッタリング
や無電解銅めっきなどで金属薄膜を形成しなければなら
ないなどの問題点を有していた。Particularly in direct drive motors, such as 3T and 3T motors, where there is a strong demand for thinness, one of the most important issues is to make the coil, which is one of the main components, thinner and higher in performance.
It has become. In order to meet these demands, it is necessary to satisfy the contradictory conditions of making the coil thinner, increasing the inductance of the coil, and decreasing the DC resistance value. It was necessary to increase As one measure against this, flexible printed coils, which can be made thinner, have recently been used in place of conventional wire-wound coils. However, when this printed coil is also manufactured by the conventional etching method, etching resist 3 is applied to the metal foil 2 on the substrate 1 shown in FIG. Since only the portion of the metal foil 2 shown in FIG. 1 remained, it was difficult to manufacture a printed coil without increasing the wiring density and reducing the cross-sectional area. In addition, when manufacturing by plating, as shown in FIG. 2, the deposited metal 6 formed on the substrate 4 other than the part where the plating resist 5 is provided becomes thicker in the width direction than in the thickness. It has been difficult to increase wiring density. Further, in this case, there is a problem that a metal thin film must be formed on the substrate 6 by, for example, sputtering or electroless copper plating.
発明の目的
この発明の目的は、前記従来例の問題点を解決するもの
であシ、薄型で配線密度が高く、なおかつコイルパター
ンの断面積の大きいプリントコイルの製造方法を提供す
ることにある。OBJECTS OF THE INVENTION An object of the present invention is to solve the problems of the conventional example, and to provide a method for manufacturing a printed coil that is thin, has high wiring density, and has a large cross-sectional area of the coil pattern.
発明の構成
前記目的を達成するために本発明のプリントコイルの製
造方法は、金属箔の一主面上の所望のコイルパターン以
外の部分にめっきレジストを形成するレジスト形成工程
と、前記金属箔の他方の面全面に保護膜を形成する保護
膜形成工程と、前記金属箔の一主面上のめっきレジスト
を形成してい々い部分に電気めっきで導電金属層厚付け
を行う第１のめっき工程と、前記金属箔２枚を、前記の
５べ
めっき厚付は面が対向しあうように絶縁性接着剤を介し
て接着する接着工程と、前記金属箔の他方の面全面に形
成した保護膜を除去した後、前記金属箔をエツチングに
よって除去するエツチング法程と、エツチングによって
金属箔を除去した後の前記めっき金属の露出部分にさら
に電気めっきによって導電金属層の厚付けを行う第２の
めっき工程とから成ることを特徴とするものである。こ
れにより、めっきを行う前に金属薄膜を形成するなどの
工程が不要であシ、まためっきを２回にわけることによ
って幅方向への太シも軽減できるため、配線密度が高く
、かつコイルパターンの断面積の大きいプリントコイル
を製造できるものである。Structure of the Invention In order to achieve the above object, the printed coil manufacturing method of the present invention includes a resist forming step of forming a plating resist on a portion other than the desired coil pattern on one main surface of the metal foil, and a protective film forming step in which a protective film is formed on the entire surface of the other surface; and a first plating step in which a plating resist is formed on one main surface of the metal foil and a thick conductive metal layer is applied to the most important portions by electroplating. , an adhesion step in which the two sheets of metal foil are bonded together using an insulating adhesive so that the 5-layer thick plating surfaces face each other, and a protective film is formed on the entire surface of the other surface of the metal foil. an etching step in which the metal foil is removed by etching after removing the metal foil; and a second plating step in which a conductive metal layer is further thickened by electroplating on the exposed portion of the plated metal after the metal foil is removed by etching. It is characterized by consisting of a process. This eliminates the need for processes such as forming a metal thin film before plating, and by dividing the plating into two steps, the thickness in the width direction can be reduced, allowing for high wiring density and coil pattern. It is possible to manufacture a printed coil with a large cross-sectional area.
実施例の説明
以下本発明の一実施例について、図面を参照しながら説
明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第３図Ａ−Ｅは、本発明の一実施例における、プリント
コイルの製造方法の各工程の断面図であり、以下その工
程を説明する。まず、第３図Ａに示すように片面全面に
耐めっき保護膜７を形成し６ペ
た３５μｍ銅箔８のもう１方の面にめっきフォトレジス
ト（たとえば、コダック社製コダソクマイクロレジス）
７５２）を塗布し、コイルパターン以外の部分にレジス
トパターン９を形成する。このときのレジストパターン
９の幅は２５０７１ｍ、レジストパターン９の間隔、す
なわち銅箔８の露出幅は５０μｍにした。これは、最終
パターン幅２５０μｍ 、パターン間隔５０１ｔｒｎ、
パターン厚２００μｍのコイルを製造することを目標と
して設計したレジストパターン９であり、このレジスト
パターン９の設計にあたっては、次の工程の電気めっき
における析出金属の厚みと横方向への広がシとの関係を
十分考慮したうえでその寸法関係を厳密に設定する必要
がある。次に、第３図Ｂに示すようにめっきレジストパ
ターン９を形成した銅箔７に、電気めっきを行い、コイ
ルパターン状に第１の銅めっき層１０を形成する。この
ときの第１の銅めっき層１ｏのパターン厚は１００μｍ
、パターン幅は２５０μｍ 、 パターン間隔は５０μ
ｍであったが、さらに厚付けを行うことによって、より
線７ ・＼−
間隔の狭い断面積の大きいパターンを形成することも可
能である。また、ここでは、電気銅めっき浴として硫酸
鋼めっき浴を使用しだが、これは硫酸銅に限られるもの
ではない。次に、第３図Ｃに示すように前記第３図Ｂに
示す工程で得られた電気めっきを行なった２枚の銅箔７
の、コイルパターン状に銅めっき層１０を形成した面に
、絶縁性の接着剤層１１としてエポキシ樹脂を塗布し、
コイルパターンが互いに対向しあう様に位置合わせをし
てはりあわせる。その後、第３図りに示すように最初に
形成した保護膜７を除去し、銅箔８をエツチングで除去
した後、表裏を接続するだめ、パンチング、あるいはド
リリングなどでスルーホール１２を形成する。これに第
３図Ｅに示すように新たに電気めっきを行って第２の銅
めっき層１３を形成する。このときの銅めっき層１３の
パターン厚は２００μｍ、パターン幅は２５０μｍ、パ
ターン間隔は５０μｍであったが、第１の銅めっき層１
０、第２の銅めっき層１３ともにさらに厚付けを行うこ
とによって、より線間隔の狭い、断面積の大きなパター
ンを形成することも可能である。FIGS. 3A to 3E are cross-sectional views of each step of a printed coil manufacturing method according to an embodiment of the present invention, and the steps will be explained below. First, as shown in FIG. 3A, a plating-resistant protective film 7 is formed on the entire surface of one side, and a plating photoresist (for example, Kodasoku Microresist manufactured by Kodak) is applied to the other side of the 35 μm copper foil 8.
752) to form a resist pattern 9 in a portion other than the coil pattern. At this time, the width of the resist pattern 9 was 25071 m, and the interval between the resist patterns 9, that is, the exposed width of the copper foil 8 was 50 μm. This has a final pattern width of 250 μm, a pattern interval of 501 trn,
This resist pattern 9 was designed with the aim of manufacturing a coil with a pattern thickness of 200 μm. In designing this resist pattern 9, consideration was given to the thickness of the deposited metal and the horizontal spread in the next step of electroplating. It is necessary to strictly set the dimensional relationship after giving sufficient consideration to the relationship. Next, as shown in FIG. 3B, the copper foil 7 on which the plating resist pattern 9 has been formed is electroplated to form the first copper plating layer 10 in the shape of a coil pattern. The pattern thickness of the first copper plating layer 1o at this time is 100 μm
, pattern width is 250μm, pattern spacing is 50μm
However, by further increasing the thickness, it is also possible to form a pattern with narrow spacing between the strands 7 and a large cross-sectional area. Furthermore, although a sulfuric acid steel plating bath is used here as the electrolytic copper plating bath, this is not limited to copper sulfate. Next, as shown in FIG. 3C, the two electroplated copper foils 7 obtained in the step shown in FIG. 3B are
An epoxy resin is applied as an insulating adhesive layer 11 to the surface on which the copper plating layer 10 is formed in the shape of a coil pattern,
Align and attach so that the coil patterns are facing each other. Thereafter, as shown in the third diagram, the first formed protective film 7 is removed and the copper foil 8 is removed by etching, and then a through hole 12 is formed by punching or drilling to connect the front and back sides. As shown in FIG. 3E, electroplating is newly performed on this to form a second copper plating layer 13. At this time, the pattern thickness of the copper plating layer 13 was 200 μm, the pattern width was 250 μm, and the pattern interval was 50 μm.
By further thickening both the copper plating layer 13 and the second copper plating layer 13, it is also possible to form a pattern with a narrower strand spacing and a larger cross-sectional area.
以上のように本実施例では、めっきレジストパターン９
をはさんで上下に同じ厚さの銅メッキ層１０．１３を形
成することにより、断面積が極めて大きく、また配線密
度も高いコイルパターンを実現している。As described above, in this embodiment, the plating resist pattern 9
By forming copper plating layers 10 and 13 of the same thickness on both sides of the coil, a coil pattern with an extremely large cross-sectional area and high wiring density is realized.
なお本実施例では、金属箔として３５μｍ厚の銅箔８を
使用しているが、銅に限らず、導電性を有していて電気
めっきが可能であり、後でエツチング除去が可能なもの
ならなんでも良く、壕だ厚みも３５μｍに限るものでは
々い。また、めっきレジスト９は、コイルパターンの断
面積を大きくするためにもなるべくうすい方が良く、マ
ためっきした後、絶縁性の接着剤を塗布するだめ、硬化
後は化学的に安定で、熱にも強いレジスト（たとえば日
本合成ゴム社のＣＢＲＭ−９０１）を使用するとよシ精
密で精度の高いコイルが得られる。また耐めっき保護膜
９は、その性質上簡単に除去できるものが良く、アルカ
リ除去、あるいは溶剤除去型のドライフィルムレジスト
などがその作業性９ ”
の面から適しているが、これに限らずめっきに対して保
護膜となるものなら使用可能である。また本実施例では
、銅箔８の上に銅を析出させたが、析出させる金属と金
属箔は同種のものに限らず、選択エツチング性をもった
異種の金属にすることによって、金属箔をエツチングす
るときに、析出した金属まで過度にエツチングが進行す
るのを防ぐことも可能である。また、第１のめっき工程
において、銅箔８に、まずうすぐニッケルめっきを施し
た後、銅めっきを行うことによって、後で銅箔８をエツ
チングするときに、析出した銅まで過度にエツチングが
進行せず、寸だ性能的にも銅だけのものとほぼ同じであ
る。だだ、本実施例においては、コイルを構成する金属
材料として、導電性、加工性、コストなどの総合的観点
から銅が最も良いとされているため、銅以外の金属につ
いては特に考慮しなかった。また本実施例では、接着剤
としてエポキシ樹脂を用いたが、耐熱性や電気絶縁性に
すぐれたもの、たとえば、ポリイミド系。In this example, the copper foil 8 with a thickness of 35 μm is used as the metal foil, but it is not limited to copper, and any material that has conductivity, can be electroplated, and can be removed by etching later can be used. Anything is fine, and the thickness of the trench is not limited to 35 μm. In addition, the plating resist 9 should be as thin as possible in order to increase the cross-sectional area of the coil pattern. By using a resist that is resistant to heat resistance (for example, CBRM-901 manufactured by Nippon Synthetic Rubber Co., Ltd.), a coil with high precision and precision can be obtained. In addition, the plating-resistant protective film 9 should preferably be easily removable due to its nature, and alkali-removable or solvent-removable dry film resists are suitable from the viewpoint of workability, but they are not limited to these. In addition, in this example, copper was deposited on the copper foil 8, but the deposited metal and the metal foil are not limited to the same type, and any material with selective etching properties can be used. When etching the metal foil, it is also possible to prevent the etching from proceeding excessively to the deposited metal.In addition, in the first plating process, the copper foil 8 By first applying nickel plating immediately followed by copper plating, when etching the copper foil 8 later, excessive etching does not proceed to the deposited copper, and in terms of performance, only copper is used. However, in this example, since copper is considered to be the best metal material for the coil from a comprehensive viewpoint of conductivity, workability, cost, etc., other than copper was used. No particular consideration was given to the metal. In addition, in this example, an epoxy resin was used as the adhesive, but a material with excellent heat resistance and electrical insulation properties, such as a polyimide adhesive, could be used.
ポリアミド系、アクリル系、テフロン系、シリコ１ｏベ
ン系、ウレタン系、フェノール系など様々な樹脂が使用
可能である。また、絶縁性をより確実にするために、う
すい絶縁シート（たとえばポリイミドフィルムやポリエ
ステルフィルム）をはさんでめっき厚付けを行った金属
箔を接着しても良い。Various resins such as polyamide, acrylic, Teflon, silicoben, urethane, and phenol can be used. Furthermore, in order to ensure insulation, thickly plated metal foil may be bonded between thin insulating sheets (for example, polyimide film or polyester film).
発明の効果
以上の説明から明らかなように、本発明は、金属箔の一
主面上の所望のコイルパターン以外の部分にめっきレジ
ストを形成し、他方の面に耐めっき保護膜を形成した後
、電気めっきによって導電金属層の厚付けを行い、その
後前記金属箔２枚のめっき厚付けを行った面に絶縁性の
接着剤を塗布して接着した後、前記保護膜を除去して金
属箔をエツチング除去し、前記めっき金属の露出部分に
さらに電気めっきで導電金属層の厚付けを行って、コイ
ルパターンを製造することにより、配線密度が高く、か
つ断面積の大きなコイルパターンを得ることが可能であ
り、まためっきを行う前に金属薄膜を形成する々どの工
程も不要であり、簡易に、薄型で高密度、高性能な両面
構造のコイルを製造１１ぺ−
できるという優れた効果が得られた。Effects of the Invention As is clear from the above explanation, the present invention is capable of forming a plating resist on a portion other than the desired coil pattern on one main surface of a metal foil, and forming a plating-resistant protective film on the other surface. , a conductive metal layer is thickened by electroplating, then an insulating adhesive is applied to the thickly plated surfaces of the two metal foils to bond them together, and the protective film is removed to form a metal foil. A coil pattern with high wiring density and a large cross-sectional area can be obtained by removing the conductive metal by etching and further applying a thick conductive metal layer to the exposed portion of the plated metal by electroplating. This method has the excellent effect of easily producing thin, high-density, high-performance double-sided coils, without the need for any process of forming a metal thin film before plating. It was done.
第１図は従来のエツチング法によるコイルの製造方法を
説明する要部断面図、第２図は同様に従来のめっき法に
よるコイルの製造方法を説明する要部断面図、第３図Ａ
−Ｅは本発明の一実施におけるプリントコイルの製造方
法の各工程を説明する要部断面図である。
７・・耐めっき保護膜、８・・・・・銅箔、９・・・・
・レジストパターン、１ｏ・・・・第１の銅めっき層、
１１、・・・接着剤層、１２−・・スルーホール、１３
・・・・第２の銅めっき層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
く 第 θＤＬＬ、ＩFig. 1 is a cross-sectional view of a main part explaining a method of manufacturing a coil using a conventional etching method, Fig. 2 is a cross-sectional view of a main part explaining a method of producing a coil using a conventional plating method, and Fig. 3A
-E is a sectional view of a main part explaining each step of a method for manufacturing a printed coil in one embodiment of the present invention. 7... Plating-resistant protective film, 8... Copper foil, 9...
・Resist pattern, 1o...first copper plating layer,
11,...Adhesive layer, 12-...Through hole, 13
...Second copper plating layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 θDLL, I
Claims (2)
の部分にめっきレジストパターンを形成するレジスト形
成工程と、前記金属箔の他方の面全面に耐めっき保護膜
を形成する保護膜形成工程と、前記金属箔のめっきレジ
ストパターンを形成した一主面上の、めっきレジストを
形成していない部分に電気メッキによって導電金属層の
厚付けを行う第１のめっき工程と、前記金属箔２枚を、
前記めっき厚付け面が対向しあうように絶縁性接着剤を
介して接着する接着工程と、前記金属箔の他方の面全面
に形成した保護膜を除去した後、前記金属箔をエッチン
グによって除去するエッチング工程と、エッチングによ
って金属箔を除去した後の前記めっき金属の露出部分に
さらに電気めっきによって導電金属層の厚付けを行う第
２のめっき工程とから成ることを特徴とする両面構造の
プリントコイルの製造方法。(1) A resist forming step in which a plating resist pattern is formed on a portion of one principal surface of the metal foil other than the desired coil pattern, and a protective film formation in which a plating-resistant protective film is formed over the entire other surface of the metal foil. a first plating step in which a conductive metal layer is thickened by electroplating on a part of the main surface of the metal foil on which the plating resist pattern is formed, on which the plating resist is not formed; and the metal foil 2 a piece,
An adhesion step of adhering the thick plated surfaces to each other through an insulating adhesive, and removing the protective film formed on the entire other surface of the metal foil, and then removing the metal foil by etching. A double-sided printed coil characterized by comprising an etching process and a second plating process in which a conductive metal layer is further thickened by electroplating on the exposed portion of the plated metal after the metal foil is removed by etching. manufacturing method.
いは電気めっきで、金属箔のエッチング剤に対してエッ
チングされにくい金属をうすくめっきした後、希望の金
属を電気めっきによって厚付けを行うことを特徴とする
特許請求の範囲第１項記載のプリントコイルの製造方法
。(2) In the first plating process, after plating the metal that is difficult to etch with the etching agent of the metal foil by electroless plating or electroplating, the desired metal is thickened by electroplating. A method for manufacturing a printed coil according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24511384A JPS61124117A (en) | 1984-11-20 | 1984-11-20 | Manufacture of printed coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24511384A JPS61124117A (en) | 1984-11-20 | 1984-11-20 | Manufacture of printed coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61124117A true JPS61124117A (en) | 1986-06-11 |
Family
ID=17128813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24511384A Pending JPS61124117A (en) | 1984-11-20 | 1984-11-20 | Manufacture of printed coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61124117A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0912079A1 (en) * | 1996-06-27 | 1999-04-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Thick-film conductor circuit and production method therefor |
| JP2004228306A (en) * | 2003-01-22 | 2004-08-12 | Asahi Kasei Electronics Co Ltd | Method of manufacturing printed coil and method of manufacturing printed wiring board |
| JP2008166391A (en) * | 2006-12-27 | 2008-07-17 | Tdk Corp | Method of forming conductor pattern and electronic component |
| JP2013008859A (en) * | 2011-06-24 | 2013-01-10 | Asahi Kasei Electronics Co Ltd | Coil for wireless power feeding/receiving and unit using the same |
| JP2015032626A (en) * | 2013-07-31 | 2015-02-16 | 新光電気工業株式会社 | Coil substrate, method of manufacturing the same and inductor |
| WO2015107618A1 (en) * | 2014-01-14 | 2015-07-23 | 株式会社メイコー | Method for manufacturing printed wiring board |
| JP2015185589A (en) * | 2014-03-20 | 2015-10-22 | 新光電気工業株式会社 | Inductor, coil substrate, and method for fabricating coil substrate |
| JP2017204629A (en) * | 2016-05-13 | 2017-11-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil component and manufacturing method thereof |
| WO2018034161A1 (en) * | 2016-08-18 | 2018-02-22 | 株式会社村田製作所 | Laminated coil and method for manufacturing same |
| CN108337809A (en) * | 2018-03-01 | 2018-07-27 | 深圳市仁创艺电子有限公司 | A kind of production method of thickness copper printed circuit board |
| JP6486535B1 (en) * | 2017-12-11 | 2019-03-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Inductor and manufacturing method thereof |
| JP6485984B1 (en) * | 2017-12-07 | 2019-03-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil parts |
-
1984
- 1984-11-20 JP JP24511384A patent/JPS61124117A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0912079A1 (en) * | 1996-06-27 | 1999-04-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Thick-film conductor circuit and production method therefor |
| EP0912079A4 (en) * | 1996-06-27 | 2005-07-06 | Asahi Chemical Ind | Thick-film conductor circuit and production method therefor |
| JP2004228306A (en) * | 2003-01-22 | 2004-08-12 | Asahi Kasei Electronics Co Ltd | Method of manufacturing printed coil and method of manufacturing printed wiring board |
| JP2008166391A (en) * | 2006-12-27 | 2008-07-17 | Tdk Corp | Method of forming conductor pattern and electronic component |
| JP2013008859A (en) * | 2011-06-24 | 2013-01-10 | Asahi Kasei Electronics Co Ltd | Coil for wireless power feeding/receiving and unit using the same |
| JP2015032626A (en) * | 2013-07-31 | 2015-02-16 | 新光電気工業株式会社 | Coil substrate, method of manufacturing the same and inductor |
| WO2015107618A1 (en) * | 2014-01-14 | 2015-07-23 | 株式会社メイコー | Method for manufacturing printed wiring board |
| JPWO2015107618A1 (en) * | 2014-01-14 | 2017-03-23 | 株式会社メイコー | Method for manufacturing printed wiring board |
| JP2015185589A (en) * | 2014-03-20 | 2015-10-22 | 新光電気工業株式会社 | Inductor, coil substrate, and method for fabricating coil substrate |
| US9899136B2 (en) | 2016-05-13 | 2018-02-20 | Samsung Electro-Mechanics Co., Ltd. | Coil component and method of manufacturing the same |
| JP2017204629A (en) * | 2016-05-13 | 2017-11-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil component and manufacturing method thereof |
| WO2018034161A1 (en) * | 2016-08-18 | 2018-02-22 | 株式会社村田製作所 | Laminated coil and method for manufacturing same |
| JPWO2018034161A1 (en) * | 2016-08-18 | 2019-01-10 | 株式会社村田製作所 | Multilayer coil and manufacturing method thereof |
| US11688553B2 (en) | 2016-08-18 | 2023-06-27 | Murata Manufacturing Co., Ltd. | Multilayer coil and method for manufacturing the same |
| JP6485984B1 (en) * | 2017-12-07 | 2019-03-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil parts |
| JP2019102783A (en) * | 2017-12-07 | 2019-06-24 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil component |
| US11037718B2 (en) | 2017-12-07 | 2021-06-15 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
| JP6486535B1 (en) * | 2017-12-11 | 2019-03-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Inductor and manufacturing method thereof |
| JP2019106523A (en) * | 2017-12-11 | 2019-06-27 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Inductor and method for manufacturing the same |
| US11205538B2 (en) | 2017-12-11 | 2021-12-21 | Samsung Electro-Mechanics Co., Ltd. | Inductor and method of manufacturing the same |
| CN108337809A (en) * | 2018-03-01 | 2018-07-27 | 深圳市仁创艺电子有限公司 | A kind of production method of thickness copper printed circuit board |
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