JP2000173972A - Wafer processing apparatus - Google Patents

Wafer processing apparatus

Info

Publication number
JP2000173972A
JP2000173972A JP10343747A JP34374798A JP2000173972A JP 2000173972 A JP2000173972 A JP 2000173972A JP 10343747 A JP10343747 A JP 10343747A JP 34374798 A JP34374798 A JP 34374798A JP 2000173972 A JP2000173972 A JP 2000173972A
Authority
JP
Japan
Prior art keywords
processing
tank
liquid
processing liquid
aspirator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10343747A
Other languages
Japanese (ja)
Other versions
JP3517134B2 (en
Inventor
Kenichiro Arai
健一郎 新居
Shuji Nagara
修治 長良
Kenji Amahisa
賢治 天久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP34374798A priority Critical patent/JP3517134B2/en
Publication of JP2000173972A publication Critical patent/JP2000173972A/en
Application granted granted Critical
Publication of JP3517134B2 publication Critical patent/JP3517134B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To efficiently operate a wafer processing apparatus which ejects using an aspirator a processing solution stored in a processing bath, by changing processing solutions inside the processing bath swiftly. SOLUTION: A processing solution is stored in a processing bath 12, and wafers are processed by dipping the wafers in this processing solution. To the processing bath 12, a solution ejecting passage for a processing solution composed of discharging pipes 20, 22, a joining and discharging pipe 24 etc., is connected. By connecting this to the inlet 58 of an aspirator 46, the processing solution is sucked and ejected. Besides, it is possible to transfer the whole processing solution inside the processing bath 12 to the inside of a buffer tank 40 once by pump operation, by providing a pump 26 and the buffer tank 40 in the ejecting passage for this processing solution.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体基板、液晶
表示器やプラズマ表示器用基板等のFPD(FlatPanel
Display)用基板、フォトマスク用ガラス基板等の基板
を所定の処理液に浸漬させて処理する基板処理装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPD (Flat Panel) for a semiconductor substrate, a substrate for a liquid crystal display or a plasma display.
The present invention relates to a substrate processing apparatus that performs processing by immersing a substrate such as a substrate for display and a glass substrate for a photomask in a predetermined processing solution.

【0002】[0002]

【従来の技術】従来、例えば、処理槽内に貯留した処理
液に半導体基板等の基板を浸漬させ、この状態で、処理
槽に接続された循環経路を通じて処理槽内の処理液を循
環させることにより、処理槽から処理液をオーバーフロ
ーさせながら基板を処理する装置は一般に知られてい
る。
2. Description of the Related Art Conventionally, for example, a substrate such as a semiconductor substrate is immersed in a processing liquid stored in a processing tank, and in this state, the processing liquid in the processing tank is circulated through a circulation path connected to the processing tank. An apparatus for processing a substrate while overflowing a processing solution from a processing bath is generally known.

【0003】この種の装置では、処理液の処理能力が一
定レベル以下になると、処理槽内の処理液を新たな処理
液と入替えるが、例えば、水流により流体を吸引するア
スピレータを排液管に接続し、その負圧で処理槽内の処
理液を吸引しながら、アスピレータに供給される水と共
に処理液を排出することが行われている。
In this type of apparatus, when the processing capacity of the processing liquid falls below a certain level, the processing liquid in the processing tank is replaced with a new processing liquid. For example, an aspirator for sucking a fluid by a water flow is connected to a drain pipe. And discharging the processing liquid together with the water supplied to the aspirator while sucking the processing liquid in the processing tank with the negative pressure.

【0004】このようにアスピレータを用いて処理液を
排出する装置によると、アスピレータにより処理液を吸
引しつつ排出することができ、しかも、アスピレータに
供給される水により処理液を冷却、希釈しながら排出す
ることができるため、例えば、処理液として高温、強酸
等の処理液を用いる場合に特に有効となる。
According to the apparatus for discharging a processing liquid using an aspirator as described above, the processing liquid can be discharged while being sucked by the aspirator, and the processing liquid is cooled and diluted by water supplied to the aspirator. Since it can be discharged, it is particularly effective when, for example, a processing liquid such as a high temperature, a strong acid or the like is used as the processing liquid.

【0005】[0005]

【発明が解決しようとする課題】ところが、アスピレー
タを用いて処理液を排出する上記のような装置は、例え
ば電気駆動式のポンプ等を用いて処理液を排出する装置
に比べると、処理液の送液量が小さく、そのため、処理
槽内の処理液を迅速に排出することができない。
However, such an apparatus for discharging the processing liquid using an aspirator is, for example, compared with an apparatus for discharging the processing liquid using an electrically driven pump or the like. The amount of liquid sent is small, so that the processing liquid in the processing tank cannot be quickly discharged.

【0006】従って、処理槽内の処理液を入替えるのに
時間がかかり、装置を効率良く稼動させる上でのマイナ
ス要素となっている。
Therefore, it takes time to replace the processing liquid in the processing tank, which is a negative factor in operating the apparatus efficiently.

【0007】本発明は、上記問題を解決するためになさ
れたものであり、処理槽に貯留された処理液をアスピレ
ータを用いて排出する基板処理装置において、処理槽内
の処理液の入替えを迅速に行えるようにし、これにより
装置を効率良く稼動させることができる基板処理装置を
提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in a substrate processing apparatus for discharging a processing liquid stored in a processing tank using an aspirator, the processing liquid in the processing tank can be quickly replaced. It is an object of the present invention to provide a substrate processing apparatus capable of efficiently operating the apparatus.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、処理液を貯留して基板を浸漬させる処理
槽と、この処理槽に接続される処理液の排液通路と、こ
の排液通路に介設されて処理液を吸引するアスピレータ
とを備えた基板処理装置において、処理槽とアスピレー
タとの間に、排液通路を通じて排出される処理液を貯留
可能なタンクと、アスピレータによる送液能力よりも高
い送液能力を有し、処理槽からタンクに排液通路を通じ
て処理液を送液する送液手段とを設けたものである(請
求項1)。
In order to solve the above problems, the present invention provides a processing tank for storing a processing liquid and immersing a substrate, a processing liquid drain passage connected to the processing tank, In a substrate processing apparatus provided with an aspirator interposed in the drain passage and sucking a processing liquid, a tank capable of storing a processing liquid discharged through a drain passage is provided between a processing tank and an aspirator; And a liquid feeding means for feeding the processing liquid from the processing tank to the tank through the drainage passage.

【0009】この装置では、処理槽内の処理液を、送液
手段により一旦処理槽内からタンクに移した後、新しい
処理液の処理槽への供給を直ちに実行することができる
一方、タンクに貯留された処理済みの処理液について
は、このタンクからアスピレータにより吸引しつつ排出
することができる。そのため、従来装置同様に処理液を
希釈、冷却しながら装置外部に排出しながらも、処理槽
内の処理液を速やかに入替えることが可能となる。
In this apparatus, the processing liquid in the processing tank is once transferred from the processing tank to the tank by the liquid sending means, and then the supply of a new processing liquid to the processing tank can be immediately executed. The stored processed liquid can be discharged from this tank while being suctioned by an aspirator. Therefore, it is possible to quickly replace the processing liquid in the processing tank while diluting and cooling the processing liquid and discharging it to the outside of the apparatus as in the conventional apparatus.

【0010】特に、送液手段として、アスピレータによ
る送液能力よりも高い送液能力を有するポンプを用いれ
ば(請求項2)、処理槽内の処理液を速やかに排出する
ことが可能となる。この場合、上記タンクによる処理液
の貯留容量を、少なくとも処理槽に貯留される処理液量
以上に設定すれば(請求項3)、処理槽の処理液を全て
タンクに貯留することができる。そのため、速やかに処
理槽内を空の状態にすることが可能となる。
In particular, if a pump having a higher liquid sending capacity than the aspirator is used as the liquid sending means (claim 2), the processing liquid in the processing tank can be quickly discharged. In this case, if the storage capacity of the processing liquid in the tank is set to be at least the amount of the processing liquid stored in the processing tank (claim 3), all the processing liquid in the processing tank can be stored in the tank. Therefore, the inside of the processing tank can be quickly emptied.

【0011】また、上記タンクに、貯留された処理液を
冷却する冷却手段を設けるようにすれば(請求項4)、
アスピレータにより吸引、排出されるまでの期間を利用
して、処理液を冷却することができ、高温の処理液等を
排出する場合にさらに有効となる。
Further, if the tank is provided with a cooling means for cooling the stored processing liquid (claim 4),
The processing liquid can be cooled by utilizing the period until suction and discharge by the aspirator, which is more effective when discharging a high-temperature processing liquid or the like.

【0012】さらに、排液通路から分岐するとともに、
アスピレータにより処理液が排出される第1の受入部と
は異なる第2の受入部に接続される分岐通路を設け、処
理槽から排出される処理液をアスピレータに導く状態と
分岐通路に導く状態とに切替える通路切替手段を設ける
ようにすれば(請求項5)、アスピレータを通じて処理
液を希釈、冷却しながら第1の受入部に回収する回収形
態と、そのままの状態(未冷却、未希釈の状態)で処理
液を第2の受入部に回収する回収形態とを択一的に行わ
せることができる。そのため、処理液の回収形態の自由
度が高まる。
Further, while branching from the drain passage,
A branch passage connected to a second receiving portion different from the first receiving portion from which the processing liquid is discharged by the aspirator, and a state in which the processing liquid discharged from the processing tank is guided to the aspirator and a state in which the processing liquid is guided to the branch passage. If the passage switching means for switching the processing liquid is provided (claim 5), the recovery liquid is recovered in the first receiving portion while diluting and cooling the processing liquid through the aspirator, and the processing liquid is left unmodified (uncooled and undiluted). The method of collecting the processing liquid in the second receiving section can be performed alternatively. Therefore, the degree of freedom in the recovery form of the processing liquid is increased.

【0013】[0013]

【発明の実施の形態】本発明の実施の形態について図面
を用いて説明する。図1は、本発明に係る基板処理装置
の一の実施の形態を概略的に示している。この図に示す
基板処理装置10は、処理槽に各種薬液や純水等の処理
液Sを貯留し、この処理液Sに半導体基板等の複数の基
板Wを浸漬させて表面処理を行う基板処理装置であっ
て、基板処理部である処理槽12と、これに対する処理
液の給排系とを備えている。
Embodiments of the present invention will be described with reference to the drawings. FIG. 1 schematically shows an embodiment of the substrate processing apparatus according to the present invention. A substrate processing apparatus 10 shown in FIG. 1 stores a processing solution S such as various chemical solutions or pure water in a processing tank, and immerses a plurality of substrates W such as semiconductor substrates in the processing solution S to perform a surface processing. The apparatus includes a processing bath 12 as a substrate processing unit and a processing liquid supply / discharge system for the processing bath.

【0014】処理槽12は、断面矩形の箱型に形成され
ているとともに、その開口周囲には、処理槽12からオ
ーバーフローした処理液Sを受け入れる液受け部12a
が一体に設けられており、例えば全体が石英等の耐薬品
性に優れた材料から構成されている。
The processing tank 12 is formed in a box shape having a rectangular cross section, and around the opening thereof, a liquid receiving portion 12a for receiving the processing liquid S overflowing from the processing tank 12.
Are integrally provided, for example, the whole is made of a material having excellent chemical resistance such as quartz.

【0015】一方、処理液の給排系は、以下のように構
成されている。すなわち、上記処理槽12の液受け部1
2aに、開閉バルブ18を具備した処理液の供給管16
が接続され、この供給管16の上流端が調製タンク14
に接続されることにより、上記調製タンク14で処理液
が調製されて供給管16を通じて液受け部12aに供給
されるようになっている。
On the other hand, the processing liquid supply / discharge system is configured as follows. That is, the liquid receiving section 1 of the processing tank 12
2a, a processing liquid supply pipe 16 having an opening / closing valve 18
The upstream end of the supply pipe 16 is connected to the preparation tank 14.
The processing liquid is prepared in the preparation tank 14 and supplied to the liquid receiving portion 12 a through the supply pipe 16.

【0016】また、処理槽12及び液受け部12aの内
底部に、開閉バルブ21,23を具備した処理液の流出
管20,22がそれぞれ接続され、これら流出管20,
22が合流流出管24に連通接続されている。合流流出
管24には、例えば電気駆動式のポンプ26が介設され
ているとともに、このポンプ26の吐出側が戻り管28
と排液管30とに分岐され、戻り管28が上記処理槽1
2の内底部に配設された液中パイプ29に、排液管30
がバッファタンク40にそれぞれ連通接続されている。
そして、戻り管28に開閉バルブ32、ヒータ34及び
フィルタ36が介設される一方、排液管30に開閉バル
ブ38が介設されている。なお、上記液中パイプ29
は、図1において紙面に直交する方向に延びているとと
もに、この方向に多数の液吐出口を備えており、後述す
る処理動作時には、この液吐出口を介して処理槽内に処
理液が吐出されるようになっている。
[0016] Outflow pipes 20 and 22 of processing liquid having opening and closing valves 21 and 23 are connected to the inner bottom of the processing tank 12 and the liquid receiving part 12a, respectively.
22 is connected to the merging outflow pipe 24. An electric drive type pump 26 is interposed in the merging outflow pipe 24, and the discharge side of the pump 26 is connected to a return pipe 28.
And a drain pipe 30, and the return pipe 28 is connected to the processing tank 1.
A drain pipe 30 is connected to a submerged pipe 29 provided at the inner bottom of the pipe 2.
Are connected to the buffer tank 40, respectively.
The return pipe 28 is provided with an open / close valve 32, a heater 34, and a filter 36, while the drainage pipe 30 is provided with an open / close valve 38. The submerged pipe 29
1 extends in a direction perpendicular to the plane of FIG. 1 and has a large number of liquid discharge ports in this direction. During a processing operation described later, the processing liquid is discharged into the processing tank through the liquid discharge ports. It is supposed to be.

【0017】上記バッファタンク40は、少なくとも処
理槽12以上の容量を有したタンクからなり、その内底
部には、開閉バルブ44を有した連結管42の一方端側
が連通接続され、この連結管42の他方端側が、水流に
よって処理液を吸引するアスピレータ46に連通接続さ
れている。具体的には、アスピレータ46の吸入口58
に接続されている。アスピレータ46は、その水流入口
48が開閉バルブ54を備えた水導入管52を介して加
圧水供給源に接続される一方、水流出口50が排液管5
6を介して図外の廃液タンク等に接続されている。
The buffer tank 40 comprises a tank having at least the capacity of the processing tank 12. One end of a connecting pipe 42 having an open / close valve 44 is connected to the inner bottom thereof. Is connected to an aspirator 46 for sucking the processing liquid by a water flow. Specifically, the suction port 58 of the aspirator 46
It is connected to the. The aspirator 46 has a water inlet 48 connected to a pressurized water supply source via a water introduction pipe 52 having an opening / closing valve 54, and a water outlet 50 connected to the drain pipe 5.
6 is connected to a waste liquid tank and the like (not shown).

【0018】以上のような基板処理装置により基板を処
理するには、まず、前準備として、開閉バルブ18を開
き、上記調製タンク14において調製した処理液を供給
管16を通じて処理槽12の液受け部12aに供給す
る。この際、流出管20及び戻り管28の各開閉バルブ
21,32を開き、その他の開閉バルブ38等を閉じた
状態でポンプ26を駆動する。こうすると、液受け部1
2aに供給された処理液が流出管20、合流流出管2
4、戻り管28及び液中パイプ29を介して処理槽12
に導入、貯留され、さらに処理槽12から液受け部12
aへとオーバーフローする。これにより処理液が処理槽
12に貯留され、さらに上記の経路でオーバーフロー循
環される。
In order to process a substrate by the above-described substrate processing apparatus, first, as a preparation, the opening and closing valve 18 is opened, and the processing liquid prepared in the preparation tank 14 is supplied to the processing tank 12 through the supply pipe 16. To the unit 12a. At this time, the pump 26 is driven with the open / close valves 21 and 32 of the outflow pipe 20 and the return pipe 28 opened and the other open / close valves 38 and the like closed. In this case, the liquid receiver 1
2a is supplied to the outlet pipe 20 and the merging outlet pipe 2
4. Processing tank 12 via return pipe 28 and submerged pipe 29
Is introduced into and stored in
overflows to a. As a result, the processing liquid is stored in the processing tank 12, and is further circulated in the above-mentioned path.

【0019】このように処理液をオーバーフロー循環さ
せた状態で、処理槽12内の処理液Sに複数の基板Wを
浸漬させて複数の基板Wを処理する。つまり、処理に伴
い発生する処理生成物やパーティクル等を処理液Sと共
に処理槽12からオーバーフローさせ、この処理生成物
等を循環途中にフィルタ36により捕捉することにより
処理液Sを浄化するようになっている。なお、詳しく図
示していないが、各基板Wは、基板支持部材11により
図中紙面に直交する方向に互いに平行に支持された状態
でこの基板支持部材11と一体に処理液Sに浸漬され
る。
A plurality of substrates W are immersed in the processing liquid S in the processing bath 12 in a state where the processing liquid is circulated in the overflowing manner to process the plurality of substrates W. That is, processing products, particles, and the like generated during the processing are overflowed from the processing tank 12 together with the processing liquid S, and the processing liquid S is purified by trapping the processing products and the like by the filter 36 during the circulation. ing. Although not shown in detail, each substrate W is immersed in the processing liquid S integrally with the substrate support member 11 in a state where the substrates W are supported by the substrate support member 11 in parallel with each other in a direction perpendicular to the plane of the drawing. .

【0020】こうして複数の基板Wの浸漬処理を行い、
処理液Sの処理能力が所定レベル以下に劣化すると、処
理槽12に貯留されている処理液Sを全て新たな処理液
と入替える。
In this way, a plurality of substrates W are immersed,
When the processing capacity of the processing liquid S is reduced to a predetermined level or less, all the processing liquid S stored in the processing tank 12 is replaced with a new processing liquid.

【0021】具体的には、まず、ポンプ26を駆動した
ままの状態で、供給管16及び戻り管28の各開閉バル
ブ18,32を閉じるとともに、それ以外の全ての開閉
バルブを開く。これにより処理槽12の処理液Sが流出
管20,22、合流流出管24及び排液管30を介して
バッファタンク40に導入されるとともに、水導入管5
2からアスピレータ46を通じて排液管56へと水が流
れ、バッファタンク40内に導入された処理液が連結管
42を通じてアスピレータ46へと吸引される。そし
て、アスピレータ46に流入した処理液は、水導入管5
2からアスピレータ46を通じて排液管56へと流れる
水と共に排液管56に流れ込み、その後廃液タンク等に
排出される。
More specifically, first, while the pump 26 is being driven, the open / close valves 18 and 32 of the supply pipe 16 and the return pipe 28 are closed, and all other open / close valves are opened. Thereby, the processing liquid S in the processing tank 12 is introduced into the buffer tank 40 via the outflow pipes 20 and 22, the merged outflow pipe 24 and the drain pipe 30, and the water introduction pipe 5
Water flows from 2 through the aspirator 46 to the drain pipe 56, and the processing liquid introduced into the buffer tank 40 is sucked into the aspirator 46 through the connecting pipe 42. The processing liquid flowing into the aspirator 46 is supplied to the water introduction pipe 5
2 flows into the drain pipe 56 together with the water flowing to the drain pipe 56 through the aspirator 46, and is then discharged to a waste liquid tank or the like.

【0022】そして、処理槽12内の処理液が全て無く
なると、その時点で、流出管22及び排液管30の各開
閉バルブ23,38を閉じる一方、供給管16及び戻り
管28の各開閉バルブ18,21を開き、上述のように
調製タンク14で調製した新たな処理液を供給管16を
通じて液受け部12aに供給する。こうして処理槽12
内の処理液Sを入替える。また、新しい処理液の処理槽
12への供給とは無関係に、バッファタンク40内の処
理液が無くなった時点で連結管42及び水導入管52の
開閉バルブ44,54を閉じるようにする。
When all of the processing liquid in the processing tank 12 is exhausted, at that time, the opening / closing valves 23 and 38 of the outflow pipe 22 and the drain pipe 30 are closed, and the supply pipe 16 and the return pipe 28 are opened and closed. The valves 18 and 21 are opened, and the new processing liquid prepared in the preparation tank 14 as described above is supplied to the liquid receiving section 12a through the supply pipe 16. Thus, the processing tank 12
The processing liquid S in the inside is replaced. Further, regardless of the supply of the new processing liquid to the processing tank 12, when the processing liquid in the buffer tank 40 is exhausted, the open / close valves 44, 54 of the connecting pipe 42 and the water introducing pipe 52 are closed.

【0023】以上説明した基板処理装置では、上記のよ
うに流出管20,22、合流流出管24、排液管30及
び連結管42により構成される排液通路において、処理
槽12とアスピレータ46との間にバッファタンク40
を介設し、処理液の入替えの際には、ポンプ駆動により
処理槽12内の処理液全てを一旦バッファタンク40に
高速排液し、それに続いて、処理槽12への新しい処理
液の供給を直ちに行うことができる。なお、バッファタ
ンク40に導入された処理液については、アスピレータ
46により吸引しながら、次の処理液交換までに排出す
るようにしている。そのため、処理槽から直接アスピレ
ータにより処理液を吸引しながら排出する従来のこの種
の装置に比べると、処理槽12内の処理液を速やかに排
出することができる。従って、従来同様に処理液を希
釈、冷却しながら排出しながらも、処理槽12内の処理
液の入替えを速やかに行うことができ、これにより装置
を効率良く稼動させることができる。
In the substrate processing apparatus described above, the processing tank 12 and the aspirator 46 are connected to the drainage passage constituted by the outflow pipes 20 and 22, the merged outflow pipe 24, the drainage pipe 30 and the connecting pipe 42 as described above. Between the buffer tank 40
When the processing liquid is exchanged, all of the processing liquid in the processing tank 12 is once drained to the buffer tank 40 at a high speed by pump driving, and subsequently, a new processing liquid is supplied to the processing tank 12. Can be done immediately. The processing liquid introduced into the buffer tank 40 is discharged by the next processing liquid exchange while being sucked by the aspirator 46. For this reason, the processing liquid in the processing tank 12 can be quickly discharged as compared with a conventional apparatus of this type in which the processing liquid is suctioned and discharged directly from the processing tank by an aspirator. Therefore, the processing liquid in the processing tank 12 can be promptly replaced while the processing liquid is diluted and discharged while being cooled as in the prior art, thereby enabling the apparatus to operate efficiently.

【0024】特に、上記バッファタンク40は、少なく
とも処理槽12以上の容量を有したタンクにより構成さ
れているため、処理槽12内の全ての処理液をバッファ
タンク40内に連続的に導入することが可能である。従
って、極めて速やかに処理槽12内の処理液を全て排出
することができ、これにより処理液の排出を開始してか
ら新たな処理液を供給するまでの時間をより一層短縮す
ることができる。
In particular, since the buffer tank 40 is constituted by a tank having at least the capacity of the processing tank 12, it is necessary to continuously introduce all the processing liquid in the processing tank 12 into the buffer tank 40. Is possible. Therefore, all of the processing liquid in the processing tank 12 can be discharged very quickly, whereby the time from the start of discharging the processing liquid to the supply of a new processing liquid can be further reduced.

【0025】ところで、上記の基板処理装置は、本発明
に係る基板処理装置の一の実施の形態であって、その具
体的な構成は、本発明の要旨を逸脱しない範囲で適宜変
更可能である。
The above-described substrate processing apparatus is one embodiment of the substrate processing apparatus according to the present invention, and its specific configuration can be changed as appropriate without departing from the spirit of the present invention. .

【0026】例えば、図2に示すように、バッファタン
ク40内に貯留された処理液を冷却する冷却手段を設け
るようにしてもよい。具体的には、バッファタンク40
に螺旋状管60を設け、この螺旋状管60の両端にそれ
ぞれ水導入管61及び水導出管62を連通接続して上記
螺旋状管60に冷水を循環させるように構成してもよ
い。すなわち、上述のようにアスピレータを用いて処理
液を排出する構成は、多くの場合高温の処理液を用いる
装置に適用されるので、図2に示すような構成によれ
ば、バッファタンク40内に処理液が貯留されている期
間を利用して処理液を冷却できるので、より効果的に処
理液を冷却して排出することが可能となる。なお、バッ
ファタンク40内に貯留された処理液を冷却する冷却手
段の構成はこれに限られるものではなく、例えば、バッ
ファタンク40の側壁に冷水の循環通路を一体形成して
その通路内に冷却水を通すようにしてもよく、要は、バ
ッファタンク40内の処理液を冷却できる構成を有しさ
えすれば、如何なる冷却手段を適用してもよい。
For example, as shown in FIG. 2, a cooling means for cooling the processing liquid stored in the buffer tank 40 may be provided. Specifically, the buffer tank 40
A spiral pipe 60 may be provided, and a water inlet pipe 61 and a water outlet pipe 62 may be connected to both ends of the spiral pipe 60 to circulate cold water through the spiral pipe 60. That is, since the configuration for discharging the processing liquid using the aspirator as described above is often applied to an apparatus using a high-temperature processing liquid, according to the configuration shown in FIG. Since the processing liquid can be cooled using the period in which the processing liquid is stored, the processing liquid can be cooled and discharged more effectively. The structure of the cooling means for cooling the processing liquid stored in the buffer tank 40 is not limited to this. For example, a cooling water circulation passage is integrally formed on the side wall of the buffer tank 40 and the cooling water is cooled in the passage. Water may be passed through. In short, any cooling means may be applied as long as the processing liquid in the buffer tank 40 can be cooled.

【0027】また、図2の二点鎖線に示すような構成を
つけ加えるようにしてもよい。すなわち、バッファタン
ク40と開閉バルブ44との間において連結管42から
分岐する排液管65を設け、この排液管65に開閉バル
ブ66を介設するとともに、この排液管65を、上記ア
スピレータ46の排液管56に接続される廃液タンク等
とは別の廃液タンク67等に接続するようにしてもよ
い。このようにすれば、高温、強酸等の危険性の高い処
理液については、開閉バルブ44を開いて開閉バルブ6
6を閉じることにより、アスピレータ46を通じて処理
液を冷却、希釈しながら回収することができる、一方、
その他の危険性の低い処理液については、開閉バルブ4
4を閉じて開閉バルブ66を開くことにより、排液管6
5を通じて処理液をそのままの状態で速やかに排出、回
収することができる。つまり、この構成よると、上記排
液管56に接続される廃液タンク等が本発明の第1の受
入部に、上記排液管65が本発明の分岐通路に、この排
液管65に接続される廃液タンク67等が本発明の第2
の受入部に、さらに開閉バルブ44,66が本発明の通
路切替手段にそれぞれ該当するものである。
Further, a configuration as shown by a two-dot chain line in FIG. 2 may be added. That is, a drain pipe 65 branched from the connecting pipe 42 is provided between the buffer tank 40 and the opening / closing valve 44, and the drain pipe 65 is provided with an opening / closing valve 66, and the drain pipe 65 is connected to the aspirator. It may be connected to a waste liquid tank 67 or the like different from a waste liquid tank or the like connected to the drain pipe 56 of 46. In this way, for a processing liquid having a high risk such as a high temperature and a strong acid, the opening / closing valve 44 is opened and the opening / closing valve 6 is opened.
By closing 6, the processing liquid can be collected while cooling and diluting through the aspirator 46.
For other low-risk processing liquids,
4 is closed and the opening / closing valve 66 is opened, so that the drainage pipe 6 is opened.
5, the processing liquid can be quickly discharged and collected in the same state. That is, according to this configuration, the waste liquid tank or the like connected to the drain pipe 56 is connected to the first receiving portion of the present invention, the drain pipe 65 is connected to the branch passage of the present invention, and the drain pipe 65 is connected to the drain pipe 65 of the present invention. The waste liquid tank 67 and the like are used in the second embodiment of the present invention.
And the opening / closing valves 44, 66 correspond to the passage switching means of the present invention.

【0028】なお、上記の基板処理装置10では、処理
槽12に対して処理液を循環させる通路の一部を処理液
の排液通路として共用しているが、処理液の循環通路と
排液通路とを別個独立に設けるようにしてもよい。この
場合、ポンプを設けることなく、処理液を自然にバッフ
ァタンク40内に流入させるようにしてもよい。なお、
このようにポンプを設けない場合には、排液通路の配管
径を十分に大きく設定し、処理槽12内の処理液Sが速
やかに(すなわち、アスピレータの送液能力よりも高
く)バッファタンク40内に排出されるように排液系統
を構成すればよい。
In the above-described substrate processing apparatus 10, a part of the passage for circulating the processing liquid to the processing tank 12 is commonly used as a drain passage for the processing liquid. The passage may be provided separately and independently. In this case, the processing liquid may naturally flow into the buffer tank 40 without providing a pump. In addition,
When the pump is not provided, the pipe diameter of the drainage passage is set to be sufficiently large, and the processing liquid S in the processing tank 12 is quickly (that is, higher than the liquid sending capacity of the aspirator) in the buffer tank 40. The drainage system may be configured to be discharged into the inside.

【0029】[0029]

【発明の効果】以上説明したように、本発明は、処理槽
に接続された処理液の排液通路にアスピレータを介設
し、このアスピレータにより処理液を吸引しつつ排出す
るようにした基板の処理装置において、処理槽とアスピ
レータとの間に、排液通路を通じて排出される処理液を
貯留可能なタンクとアスピレータによる送液能力よりも
高い送液能力を有する送液手段を設け、これにより処理
槽内の処理液を一旦、処理槽内からタンクに移し、その
後、直ちに新しい処理液を処理槽に供給可能とする一
方、一旦タンクに貯留した処理液については、このタン
クからアスピレータにより吸引しつつ排出させるように
したので、処理槽から直接アスピレータにより処理液を
吸引しながら排出する従来のこの種の装置に比べると処
理槽内の処理液を速やかに排出することができる。従っ
て、従来装置同様に処理液を希釈、冷却しながら排出し
ながらも、処理槽内の処理液の入替えを速やかに行うこ
とができ、これにより装置を効率良く稼動させることが
できる。
As described above, according to the present invention, a substrate is provided in which an aspirator is provided in a processing liquid drain passage connected to a processing tank, and the processing liquid is suctioned and discharged by the aspirator. In the processing apparatus, between the processing tank and the aspirator, a tank capable of storing the processing liquid discharged through the drainage passage and a liquid feeding unit having a liquid sending capacity higher than the liquid sending capacity by the aspirator are provided. The processing liquid in the tank is once transferred from the processing tank to the tank, and then a new processing liquid can be immediately supplied to the processing tank, while the processing liquid once stored in the tank is sucked from this tank by the aspirator. The processing liquid in the processing tank can be discharged more quickly than a conventional device of this type that discharges the processing liquid while sucking it from the processing tank directly using an aspirator. It can be discharged to. Accordingly, the processing liquid in the processing tank can be quickly exchanged while diluting and cooling the processing liquid and discharging the same as in the conventional apparatus, thereby enabling the apparatus to operate efficiently.

【0030】特に、タンクと処理槽との間に、アスピレ
ータによる送液能力よりも高い送液能力を有するポンプ
を設け、このポンプにより処理槽内の処理液を上記タン
クに送液するようにすれば、処理槽内の処理液を極めて
速やかに排出することが可能となる。この場合、タンク
による処理液の貯留容量を、少なくとも処理槽に貯留さ
れる処理液量以上に設定すれば、処理槽の処理液を全て
タンクに貯留することができ、速やかに処理槽内を空の
状態にして新しい処理液の供給をより早い段階で開始す
ることができる。
In particular, a pump having a higher liquid sending capacity than the aspirator is provided between the tank and the processing tank, and the pump sends the processing liquid in the processing tank to the tank. In this case, the processing liquid in the processing tank can be discharged very quickly. In this case, if the storage capacity of the processing liquid in the tank is set to at least the amount of the processing liquid stored in the processing tank, all of the processing liquid in the processing tank can be stored in the tank, and the processing tank is quickly emptied. Thus, the supply of a new processing liquid can be started at an earlier stage.

【0031】また、上記タンクに、貯留された処理液を
冷却する冷却手段を設けるようにすれば、アスピレータ
により吸引、排出されるまでの期間を利用して、処理液
を冷却することができ、高温の処理液等を排出する場合
に特に有効となる。
Further, if the tank is provided with a cooling means for cooling the stored processing liquid, the processing liquid can be cooled by utilizing the period until suction and discharge by the aspirator. This is particularly effective when discharging a high-temperature processing solution or the like.

【0032】さらに、排液通路から分岐するとともに、
アスピレータにより処理液が排出される第1の受入部と
は異なる第2の受入部に接続される分岐通路を設け、処
理槽から排出される処理液をアスピレータに導く状態と
分岐通路に導く状態とに切替える通路切替手段を設ける
ようにすれば、処理液の回収形態の自由度を高めること
ができる。
Further, while branching off from the drain passage,
A branch passage connected to a second receiving portion different from the first receiving portion from which the processing liquid is discharged by the aspirator, and a state in which the processing liquid discharged from the processing tank is guided to the aspirator and a state in which the processing liquid is guided to the branch passage. If the passage switching means for switching the processing liquid is provided, the degree of freedom of the recovery form of the processing liquid can be increased.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る基板処理装置の一の実施形態を示
す模式図である。
FIG. 1 is a schematic diagram showing one embodiment of a substrate processing apparatus according to the present invention.

【図2】本発明に係る基板処理装置の他の実施形態を示
す模式図である。
FIG. 2 is a schematic view showing another embodiment of the substrate processing apparatus according to the present invention.

【符号の説明】[Explanation of symbols]

10 基板処理装置 12 処理槽 12a 液受け部 20,22 流出管 24 合流流出管 26 ポンプ 28 戻り管 29 液中パイプ 30 排液管 40 バッファタンク 42 連結管 46 アスピレータ 52 水導入管 56 排液管 S 処理液 W 基板 DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 12 Processing tank 12a Liquid receiving part 20,22 Outflow pipe 24 Merging outflow pipe 26 Pump 28 Return pipe 29 Liquid pipe 30 Drain pipe 40 Buffer tank 42 Connecting pipe 46 Aspirator 52 Water introduction pipe 56 Drain pipe S Processing liquid W Substrate

───────────────────────────────────────────────────── フロントページの続き (72)発明者 長良 修治 京都市上京区堀川通寺之内上る4丁目天神 北町1番地の1 大日本スクリーン製造株 式会社内 (72)発明者 天久 賢治 京都市上京区堀川通寺之内上る4丁目天神 北町1番地の1 大日本スクリーン製造株 式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shuji Nagara 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori-Terauchi, Kamigyo-ku, Kyoto Within Dainippon Screen Mfg. Co., Ltd. (72) Inventor Kenji Amagu, Kyoto 4-chome Tenjin, Horikawa-dori Teranouchi, Ward 1 Kitamachi 1 Dainippon Screen Mfg. Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 処理液を貯留して基板を浸漬させる処理
槽と、この処理槽に接続される処理液の排液通路と、こ
の排液通路に介設されて処理液を吸引するアスピレータ
とを備えた基板処理装置において、上記処理槽とアスピ
レータとの間に、上記排液通路を通じて排出される処理
液を貯留可能なタンクと、上記アスピレータによる送液
能力よりも高い送液能力を有し、上記処理槽から上記タ
ンクに上記排液通路を通じて処理液を送液する送液手段
とを設けたことを特徴とする基板処理装置。
1. A processing tank for storing a processing liquid and immersing a substrate, a drain passage for the processing liquid connected to the processing tank, and an aspirator interposed in the drain passage for sucking the processing liquid. In the substrate processing apparatus provided with, a tank capable of storing the processing liquid discharged through the drain passage between the processing tank and the aspirator, and having a liquid sending capacity higher than the liquid sending capacity by the aspirator. And a liquid feeding means for feeding a processing liquid from the processing tank to the tank through the drain passage.
【請求項2】 上記送液手段は、上記アスピレータによ
る送液能力よりも高い送液能力を有するポンプであるこ
とを特徴とする請求項1記載の基板処理装置。
2. The substrate processing apparatus according to claim 1, wherein the liquid sending means is a pump having a liquid sending capacity higher than a liquid sending capacity by the aspirator.
【請求項3】 上記タンクによる処理液の貯留容量を、
少なくとも処理槽に貯留される処理液量以上に設定した
ことを特徴とする請求項1又は2記載の基板処理装置。
3. The storage capacity of the processing liquid in the tank is:
3. The substrate processing apparatus according to claim 1, wherein the amount is set to be at least the amount of the processing liquid stored in the processing tank.
【請求項4】 上記タンクに、貯留された処理液を冷却
する冷却手段を設けたことを特徴とする請求項1乃至3
のいずれかに記載の基板処理装置。
4. The tank according to claim 1, further comprising cooling means for cooling the stored processing liquid.
A substrate processing apparatus according to any one of the above.
【請求項5】 上記排液通路から分岐するとともに、上
記アスピレータにより処理液が排出される第1の受入部
とは異なる第2の受入部に接続される分岐通路を設け、
上記処理槽から排出される処理液を上記アスピレータに
導く状態と上記分岐通路に導く状態とに切替える通路切
替手段を設けたことを特徴とする請求項1乃至4のいず
れかに記載の基板処理装置。
5. A branch passage branching from the drain passage and connected to a second receiving part different from the first receiving part from which the processing liquid is discharged by the aspirator,
5. The substrate processing apparatus according to claim 1, further comprising a path switching unit configured to switch between a state in which the processing liquid discharged from the processing tank is guided to the aspirator and a state in which the processing liquid is guided to the branch path. .
JP34374798A 1998-12-03 1998-12-03 Substrate processing equipment Expired - Lifetime JP3517134B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34374798A JP3517134B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34374798A JP3517134B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JP2000173972A true JP2000173972A (en) 2000-06-23
JP3517134B2 JP3517134B2 (en) 2004-04-05

Family

ID=18363933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34374798A Expired - Lifetime JP3517134B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Country Status (1)

Country Link
JP (1) JP3517134B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202811A (en) * 2005-01-18 2006-08-03 Dainippon Screen Mfg Co Ltd Substrate processing equipment
JP2018160517A (en) * 2017-03-22 2018-10-11 株式会社Screenホールディングス Substrate processing device, substrate processing system, and substrate processing method
KR20200060483A (en) * 2017-10-23 2020-05-29 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus, cleaning method of substrate processing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202811A (en) * 2005-01-18 2006-08-03 Dainippon Screen Mfg Co Ltd Substrate processing equipment
JP4515269B2 (en) * 2005-01-18 2010-07-28 大日本スクリーン製造株式会社 Substrate processing equipment
JP2018160517A (en) * 2017-03-22 2018-10-11 株式会社Screenホールディングス Substrate processing device, substrate processing system, and substrate processing method
KR20200060483A (en) * 2017-10-23 2020-05-29 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus, cleaning method of substrate processing apparatus
KR102382902B1 (en) 2017-10-23 2022-04-04 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus, cleaning method of substrate processing apparatus

Also Published As

Publication number Publication date
JP3517134B2 (en) 2004-04-05

Similar Documents

Publication Publication Date Title
TW406330B (en) Apparatus for and method of cleaning object to be processed
US20150020968A1 (en) Substrate processing apparatus and substrate processing method
JP4828948B2 (en) Substrate processing equipment
TWI690979B (en) Substrate processing device and cleaning method of substrate processing device
KR19980025069A (en) Cleaning device and cleaning method
KR19980025068A (en) Cleaning device and cleaning method
JP2739419B2 (en) Substrate processing equipment
US6372051B1 (en) Positive flow, positive displacement rinse tank
US6273107B1 (en) Positive flow, positive displacement rinse tank
JP3171822B2 (en) Cleaning device and cleaning method
JPH0799177A (en) Immersion treatment apparatus for substrate
JP2000173972A (en) Wafer processing apparatus
JP2920165B2 (en) Overflow tank for single wafer cleaning
JP3243708B2 (en) Processing method and processing apparatus
JP3697063B2 (en) Cleaning system
JP2000058492A (en) Immersion processing system for substrate
JP3517135B2 (en) Substrate processing equipment
JP2000183024A (en) Substrate-processing apparatus
JPH11319737A (en) Apparatus for cleaning plate
JPH10321577A (en) Cleaning apparatus for semiconductor substrate
JP2920584B2 (en) Substrate cleaning device
JPH11176793A (en) Cleaning system
JPH09162155A (en) Treating method and treating system
JPH0831789A (en) Surface treatment apparatus for substrate
JP2599800Y2 (en) Substrate cleaning device

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040122

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090130

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090130

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100130

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100130

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100130

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110130

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110130

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120130

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120130

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130130

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130130

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130130

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140130

Year of fee payment: 10

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term