JP2599800Y2 - Substrate cleaning device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an immersion type substrate cleaning apparatus used for cleaning the surface of a thin substrate to be processed (hereinafter simply referred to as a substrate) such as a semiconductor substrate or a glass substrate for liquid crystal. is there.

[0002]

2. Description of the Related Art Generally, a clean room for manufacturing a substrate includes:
As shown in FIG. 7, a diffusion step and a CVD
A maintenance work area 31 (hatched portion in FIG. 7) for each process such as a process, a metallization process, a lithography process, a cleaning process, and an inspection process is laid out. Are laid out in a branched shape to form a clean room work area 30 (white area in FIG. 7). As shown in FIG. 8, a conventional cleaning apparatus 50 that performs the above-described substrate cleaning step includes an alkali cleaning, a water cleaning, a hydrogen fluoride cleaning, an acid cleaning, a water cleaning, a final rinsing, etc. A large number of cleaning tanks 1 for performing various types of cleaning processing are arranged in series, and a substrate is sequentially moved to the cleaning tank group to perform a plurality of types of cleaning processing using various cleaning liquids.

[0003]

Problems with the prior art In the above prior art, since it is necessary to arrange the substrate cleaning tanks 1 by the number of various cleaning liquid treatments,
The work area occupied by the cleaning process is widened, and the entire clean room cannot be used effectively.

[0004]

[Prior art] Therefore, the present applicant has filed Japanese Utility Model Application No. 3-936.
A substrate cleaning apparatus according to No. 35 was previously proposed (see FIGS. 5 and 6). That is, in the prior proposed technology, the number of cleaning tanks 1 of a large number of types as in the above-described prior art is reduced by configuring the substrate cleaning tank 1 so that a cleaning liquid can be replaced for each of a plurality of types of cleaning processes (total processing). Can be processed in a single cleaning tank), while effectively utilizing the space in the clean room, and allowing the cleaning liquid in the substrate cleaning tank 1 to overflow from above so that multiple types of cleaning processing can be performed without discharging the entire cleaning liquid. The substrate W is not exposed to air until a series of cleaning processes are completed, preventing the formation of an oxide film on the substrate surface and the attachment of impurities in the air. It is something to do.

[0005]

FIG. 5 shows the cleaning processing mode of the above-mentioned prior art. For example, the above-mentioned conventional cleaning processing is performed in each of the cleaning tank groups of four substrate cleaning apparatuses 50 which are separated on the left and right. The processing may be performed collectively, and the processing may be performed in parallel in four groups.
0 may be regarded as one pair, and all the cleaning processing may be performed in the two cleaning tanks before and after the pair of substrate cleaning apparatuses 50, and the two groups of left and right may be processed in parallel.
In any case, since a large number of cleaning tanks 1 of the prior art are omitted and the working area of the cleaning step can be made compact, the space of the clean room can be effectively used.

However, focusing on one substrate cleaning apparatus 50 of the prior art, as shown in FIG. 6, various types of cleaning are provided on one side of the substrate transfer section 60, the substrate cleaning tank 1 and the substrate drying section 70. , And a supply / discharge piping chamber 20 connecting these to the substrate cleaning tank 1 occupy a large space, so to speak, the substrate cleaning apparatus 5.
0 is laid out over a wide area. Therefore, in practice, a maintenance space 90 for performing maintenance and inspection of the cleaning processing unit 65 is provided between the substrate cleaning apparatuses 50 and between the substrate cleaning apparatus 50 and the stop 32 of the substrate storage cassette C. It is necessary (see FIG. 5), and the effective use efficiency of the space in the clean room is not always high. An object of the present invention is to further improve the efficiency of use of the space in a clean room, irrespective of the above-mentioned prior art and prior art.

[0007]

The present invention is configured as follows to solve the above-mentioned problems. That is, the claims
1 devised, indexer part of a cassette accommodating a plurality of substrates are mounting location, a substrate transfer unit for loading a plurality of substrates from the cassette to a plurality of the substrate was taken out, or cassette, collectively a plurality of substrates A substrate drying section for drying, a cleaning processing section for cleaning a plurality of substrates at once, a cassette transfer robot for transferring a cassette between the loading / unloading section and the substrate transfer section are provided, A transfer unit, a substrate drying unit, and a moving unit of the substrate transfer robot are formed along the direction in which the cleaning unit is arranged. the substrate transfer robot for transporting the substrate drying section provided, and the substrate cleaning bath in the cleaning section, and the supply and discharge pipe chamber of the cleaning liquid, the cleaning solution reservoir, was placed in three vertical stages, upper Ki搬 input longitudinal direction, the substrate transfer portion of the unloading unit, The drying direction of the plate drying section and the cleaning processing section are crossed with each other, and the loading / unloading section and the substrate transfer section, the substrate drying section and the cleaning processing section are formed in an L-shape along two sides which are in contact with each other on the square installation surface. A substrate cleaning apparatus is provided, wherein a maintenance space is formed in the remaining portion. In addition, the invention of claim 2 is based on the base described in claim 1.
In the plate cleaning device, the maintenance space is cleaned.
Characterized in that it is formed on the part facing the purification section.
It is.

[0008]

According to a first aspect of the present invention, there is provided a substrate cleaning apparatus including a loading / unloading section, a substrate transfer section, a cassette transfer robot, a cleaning processing section, a substrate drying section, and a substrate transport robot. A tank, a piping chamber for supplying and discharging the cleaning liquid,
A cleaning solution reservoir, was placed in three vertical stages, the longitudinal direction of the upper Ki搬 inlet unloading unit, the substrate transfer unit, crossed and the direction of arrangement of the substrate drying unit, and the cleaning unit, indexer part By arranging the substrate transfer section, the substrate drying section and the cleaning section in an L-shape along two sides of the rectangular installation surface that are in contact with each other, a maintenance space can be secured in the remaining portion.

For this reason, when the invention of claim 1 is applied to a conventional substrate cleaning apparatus in which a large number of cleaning tanks of various cleaning liquids are arranged in series, maintenance is performed while facing one side of the serial cleaning tank.・ The space can be organized in a strip,
The work area of the cleaning process can be made more compact than that of the conventional layout. Further, even when the invention of claim 1 is applied to the replacement type substrate cleaning apparatus of the above-mentioned prior art in which a plurality of types of cleaning processes are shared by one cleaning tank, a plurality of substrate cleaning apparatuses or cassette storage tables are used. Since there is no need to provide a maintenance space between the substrate cleaning device and the maintenance space can be incorporated in the substrate cleaning apparatus, the cleaning work area can be made compact. According to the invention of claim 2, according to claim 1
In the cleaned substrate cleaning apparatus, the maintenance space
Is formed on the part facing the cleaning part,
Substrate cleaning tank arranged in upper and lower three stages in processing unit, supply and discharge
The piping room for cleaning and the chemical storage container for cleaning are all maintainers.
Will face the dance space. This allows
These substrate cleaning tanks, supply / drain piping room, and cleaning chemical storage
Maintenance inspection of the container becomes easier.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic perspective view of an immersion type substrate cleaning apparatus, FIG. 2 is a schematic vertical sectional view of the cleaning apparatus, FIG. 3 is a schematic system diagram of a substrate cleaning processing unit of the cleaning apparatus, and FIG. It is the layout figure which was arranged. The substrate cleaning apparatus 50 stops providing a plurality of types of substrate cleaning tanks in parallel, and
Forms a series of surface processing of multiple species purification tank 1, 1 ... in are intended compactness of the entire apparatus. That is, FIG.
As shown in FIG. 2, the substrate cleaning apparatus 50 includes a carry-in / carry-out unit 51 for the substrate storage cassette C, a substrate transfer unit 60 for taking out the substrate W from the cassette C or loading the substrate W into the cassette C, A cassette transfer robot 55 that transfers the cassette C between the loading / unloading unit 51 of the cassette C and the substrate transfer unit 60; an immersion-type substrate cleaning processing unit 65 that collectively cleans a plurality of substrates; Liquid drying substrate drying unit 70
And a substrate transfer robot 75 that collectively holds a plurality of substrates W taken out of the cassette C by the substrate transfer unit 60 and transfers the substrates W to the cleaning processing unit 65 and the substrate drying unit 70.

As shown in FIG. 1, the cassette transfer robot 55 is configured to be movable up and down, rotatable, and movable in the direction of arrow A, and to transfer the cassette C, which has been loaded into the loading / unloading section 51, to the substrate transfer section. The cassette C containing the cleaned substrates is transferred from the table 61 to the loading / unloading section 51.
As shown in FIG. 1, the substrate transfer robot 75 is provided so as to be movable in the direction of arrow B, and the plurality of substrates W received from the lifter of the substrate transfer unit 60 are transferred by the substrate holding arm 76 of the substrate transfer robot 75. It is configured to be held and transported sequentially along the moving section 77 into the cleaning processing section 65 and into the substrate drying section 70.

The immersion type substrate cleaning processing section 65 is provided in FIG.
As shown in FIG. 3, the overflow type cleaning unit 6
5a and an acid cleaning section 65b for performing acid cleaning without overflowing. The substrate cleaning tank 1 of each of the cleaning processing units 65a and 65b includes a substrate holder 66 that is provided to be movable up and down.
A plurality of substrates W received from the substrate holder 66 are held by the substrate holder 66 and immersed in the substrate cleaning tank 1.

The overflow-type cleaning section 65a
As shown in FIG. 3A, two substrate cleaning tanks 1a, 1a for cleaning a surface of a substrate W by immersing a plurality of substrates W in a cleaning liquid at a time, and a lower part of each substrate cleaning tank 1a. A cleaning liquid supply unit 4 for supplying a plurality of types of cleaning liquids;
and a cleaning liquid discharging section 40 for discharging the cleaning liquid overflowing from a. As shown in FIG. 3 (A), this overflow type substrate cleaning tank 1a is made of quartz glass and is formed in a substantially V shape in a side view and a substantially rectangular shape in a plan view, and a pure water supply pipe 3 is connected to a lower portion thereof. The surface of the substrate W is formed by forming a uniform ascending flow of the cleaning liquid in the substrate cleaning tank 1a, and is configured as an overflow tank capable of quickly replacing the cleaning liquid for each of a plurality of types of cleaning processing.

The substrate cleaning tank 1a is not limited to quartz glass. For example, when hydrofluoric acid or the like that corrodes quartz glass is used as a cleaning solution, the substrate cleaning tank 1a is made of a resin such as ethylene tetrafluoride resin having corrosion resistance. It may be formed of a material. In addition, the substrate processing tank 1a has a cleaning liquid discharging section 40.
Is provided, and the overflowing cleaning liquid is configured to flow down to the drainage drain 43 through the drainage pipe 42.

As shown in FIG. 3 (B), the acid cleaning section 65b includes one acid cleaning tank 1b for collectively cleaning a plurality of substrates W with an acid, and an acid cleaning liquid from the lower part of the acid cleaning tank 1b. It comprises an acid cleaning liquid supply section 4b for supplying and an acid cleaning liquid recovery section 40b for recovering the acid cleaning liquid from the acid cleaning tank 1b. However, the substrate cleaning tank 1a of the overflow type processing unit 65a.
Is not limited to one in which a plurality of cleaning tanks (two cleaning tanks in FIG. 1) are combined in series, and may be a single cleaning tank. The acid cleaning tank 1b of the acid cleaning section 65b is not limited to a single tank, but may be a plurality of tanks. Furthermore,
The cleaning processing unit 65 may be configured with only one of the overflow type processing unit 65a and the acid cleaning processing unit 65b.

Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 1-255227 proposed by the present applicant, the substrate drying section 70 uses a liquid near the center of the main plane of the substrate as the center of rotation and the liquid is centrifugally rotated. It consists of a drying tank for cutting and drying. Note that, instead of the centrifugal substrate drying unit 70, a device that promotes drying by using a solvent or a device that promotes drying by a decompression method may be employed.

The layout of the substrate cleaning apparatus 50 is shown in FIG.
As shown in FIG. 4, the loading / unloading section 51 of the cassette C, the substrate transfer section 60, the substrate drying section 70, and the cleaning section from the front facing the clean room work area 30 to the rear facing the maintenance work area 31. 65 are arranged in order. Also,
As shown in FIG. 2, the cleaning liquid supply / discharge piping chamber 20 is provided below the three substrate cleaning tanks 1 of the cleaning processing unit 65, and the cleaning chemical liquid storage container 6 is provided below the supply / discharge piping chamber 20. As shown in FIG. 1, a moving part 77 of a substrate transport robot 75 is formed in the front and rear direction on the right side of the substrate transfer part 60, the substrate drying part 70, and the cleaning part 65 as shown in FIG. In the left space, a space behind the substrate transfer unit 60 is formed as a maintenance space 90. still,
As shown in FIGS. 1 and 2, a plurality of pipes, valves, and the like are laid on a floor portion 91 of the maintenance space 90.

That is, in the present embodiment, in the substrate cleaning apparatus 50, the substrate cleaning tank 1, the supply / discharge piping chamber 20, and the cleaning chemical storage container 6 of the cleaning processing section 65 are stacked up and down in three stages. By laying out (that is, laying out vertically), a maintenance space 90 is secured in an area facing the left side of these three-stage stacked units. In other words,
The cassettes are arranged in the cassette loading / unloading section 51.
Direction, substrate transfer unit 60, substrate drying unit 70, and cleaning
The processing unit 65 intersects the arrangement direction, and the loading / unloading unit 51
The substrate transfer unit 60, the substrate drying unit 70, and the cleaning processing unit 65
Are arranged in an L-shape along two sides of the square installation surface
The remaining part becomes the maintenance space 90
It is formed .

For this reason, the substrate cleaning apparatus (see FIG. 5) of the above-mentioned prior art of the chemical liquid replacement system has a cleaning tank 1 for performing various cleaning.
A conventional substrate cleaning device in which a number of are arranged in series (see FIG. 8)
However, the substrate cleaning apparatus of the present embodiment (see FIG. 4) can be improved between the plurality of substrate cleaning apparatuses 50 and the cassette C even when compared with the prior art.
There is no need to provide a maintenance space 90 between the base 32 and the
Since the space can be incorporated, the washing work area can be further compacted, and the space saving of the entire clean room can be more effectively achieved. This means that the substrate cleaning device 50
As the number of installations increases, it means that the effective use efficiency of the space in the clean room is improved.

The substrate cleaning tank 1 of the cleaning section 65 is also provided.
As for the layout of the substrate drying unit 70, as shown in FIG. 1, one acid cleaning tank 1b and two overflow tanks are arranged from the back side facing the maintenance work area 31 to the front side facing the clean room work area 30. Substrate cleaning tanks 1a and 1
a and the drying unit 70 are arranged in this order, and the drying unit 70 faces the substrate transfer unit 60. Normally, an acid with a raised temperature is used in the acid cleaning treatment, so that vapor or mist of the acid is likely to be generated. In this embodiment, the acid cleaning tank 1b is disposed at the farthest side farthest from the clean room work area 30. Therefore, it is possible to prevent adverse effects on the clean room work area 30 and to ensure the safety of the work.

Further, since the substrate drying unit 70 is located between the cleaning processing unit 65 and the substrate transfer unit 60, the cleaned substrate W is dried as quickly as possible, returned to the cassette C, and loaded and unloaded. 51 can be efficiently carried out. On the other hand, the substrate drying process is not strongly restricted by the time for returning to the cassette C, and the substrate transfer unit 60
Since the waiting time is taken during the return to the substrate, the substrate drying unit 70 provided adjacent to the substrate transfer unit 60 can also serve as a buffer in the work process.

On the other hand, with respect to the cleaning process except the acid cleaning,
Since a relatively long time is required for the processing, a plurality of types of cleaning processing are performed by sharing the two overflow-type substrate cleaning tanks 1a and 1a. Speed does not decrease. In addition, in the acid cleaning process, since the substrate is shared by one acid cleaning tank 1b, the cleaning process efficiency and space saving are further improved together with the common use of the substrate drying unit 70.

On the other hand, the overflow type cleaning processing section 65a
Since the cleaning liquid overflows from the upper portion of the substrate cleaning tank 1a, the cleaning liquid can be replaced for each of a plurality of types of cleaning processing without discharging the cleaning liquid in the substrate cleaning tank 1a. Substrate W until processing is completed
Does not touch the air. Therefore, there is no fear that an oxide film is formed on the substrate surface or impurities in the air are attached. Further, the substrate W can be loaded or unloaded without discharging the cleaning liquid in the substrate cleaning tank 1 entirely.

The overflow type cleaning section 65a
As shown in FIG. 3 (A), the cleaning liquid supply section 4 is connected to a pure water supply pipe 3 connected to a lower portion of each substrate cleaning tank 1a, and to the pure water supply pipe 4 via an introduction valve connection pipe 16, respectively. A plurality of chemical liquid introduction valves 8 connected to each other, and a plurality of chemical liquid storage containers 6 connected to the respective chemical liquid introduction valves 8 via chemical liquid pressure feeding means 25, respectively.
Each chemical solution introduction valve 8 is selectively opened and closed to introduce a predetermined chemical solution into the pure water supply pipe 3.

The pure water supply pipe 3 is provided with a supply / drainage switching valve 13, a static mixer 14, an introduction valve connecting pipe 16, an on-off valve 27, and the like, which are sequentially arranged upstream of the substrate cleaning tank 1a. It is configured as a main passage of pure water for supplying pure water _DW at room temperature or heated to a predetermined temperature.
In order to prevent surface oxidation of the substrate, it is more preferable to use pure water _{DW that} has been subjected to a deoxidation treatment. The paper draining selector valve 13 is always supplied with pure water D _W and the treatment liquid to the substrate cleaning tank 1a, if necessary to drain the drain 43 of processing solution in the substrate cleaning tank 1a through the drain pipe 42 Configured to discharge. The static mixer 14, to fix the perforated twisting plate mixer conduit (not shown), configured to uniformly mix the pure water D _W and the chemical Q _A to Q _E. still,
Another mixer may be used in place of the static mixer, and if the pipe is long enough, such a mixer can be omitted.

The chemical liquid introducing valves 8 _A to 8 _E are fixed to an introducing valve connecting pipe 16 arranged on the upstream side of the static mixer 14 as shown in FIG.
Is connected to the pure water supply pipe 3 via the. The chemical solution introduction valve 8 is proposed by the present applicant in Japanese Utility Model Application No. 3-93634, and a chemical solution introduction chamber 81 and a valve drive chamber are provided in a valve body 80.
(Not shown) are formed, penetrate the valve shaft 83 between the chemical liquid introduction chamber 81 and the valve drive chamber, connect the chemical liquid supply pipe 7 of the chemical liquid pressure feeding means 25 to the chemical liquid introduction chamber 25, and In the valve seat 84, a valve body 84a is fixed to a distal end portion of a valve shaft 83, and the valve body 84a is formed in the introduction valve connecting pipe 16.
b, the valve body 84a is opened and closed with respect to the valve seat 84b by a combination of compressed air and a compression spring sent into the valve driving chamber, and a predetermined amount of the chemical solution Q is fed into the pure water supply pipe 3 by pressure. Be composed.

In this embodiment, the valve element 84a is received by the valve seat 84b formed in the introduction valve connecting pipe 16, so that the space between the valve element 84a and the pure water supply pipe 3 is eliminated.
That is, the distance from the valve seat 84b to the pure water passage is reduced to substantially eliminate the dead water area. For this reason,
If you close the respective chemical liquid inlet valve 8 _A to 8 _E, the better the liquid out of the drug solution Q, unwanted chemical pure water supply pipe 3 is not being mixed for a long time, each relative to the supply amount of the pure water D _W the chemical Q _A ~
It is possible to control the supply amount of Q _E accurately to adjust to a predetermined chemical solution concentration. Further, when pure water is continuously supplied after the supply of the chemical solution, the problem of the purity of the pure water being reduced is eliminated, and the surface cleaning quality of the substrate W is improved. In addition, there is no possibility that pure water stays and bacteria are generated. However, chemical induction valve 8 _A to 8 _E is not limited to operating with compressed air, it may be used as appropriate solenoid valve or the like.

Each chemical liquid pressure feeding means 25 in the cleaning liquid supply section 4 of the overflow type cleaning processing section 65a is shown in FIG.
(A), the pumping pump 15 of the chemical one provided, is branched chemical supply pipe 7 _A discharge side of the feed pump 15 to one type of chemical storage container 6 chemical liquid supply pipe 7 was derived from _{A A} , branched respective chemical liquid supply pipe 7 _a · 7 the plurality of substrate cleaning tank 1a · 1 downstream portion through the respective said chemical introducing valve 8 _a of _a
connected to a, (specifically, the pressure gauge) pressure detector 26 on the upstream side of the chemical liquid supply pipe 7 _A of the branch portion 18 at the discharge side of the feed pump 15 is provided with the, from the pressure detector 26 A chemical liquid pressure feed control means 12 for controlling increase / decrease of the number of rotations of the pressure feed pump 15 based on the detection signal is provided, and a pressure detector 26 detects excess / deficiency with respect to a predetermined set pressure, and the control means 1
By driving and controlling the drive source 19 of the pressure pump 15 via the pressure pump 2, the chemical solution is pressure-fed to the plurality of substrate cleaning tanks 1 a at a predetermined set pressure.

That is, the control means 12, which has received the pressure detected by the pressure detector 26, controls the rotation speed of the pressure pump 15 to increase or decrease in accordance with the preliminarily set and inputted conveyance pressure. This allows
Regardless of whether the chemical solution is supplied to both of the two overflow-type substrate cleaning tanks 1a and 1a, or only one of them, the single pump 15
Accordingly, a predetermined set amount of a chemical solution at a constant flow rate can always be supplied. Note that, in the embodiment shown in FIG.
Has been described chemical pumping means 25 according to one type of chemical solution Q _A introduced by _A, other types of chemical _{Q B, Q C, Q D} ,
The chemical liquid pumping means relating to Q _E is similarly configured. Accordingly, it is sufficient to arrange one set of a plurality of types of chemical solution storage containers for the plurality of substrate cleaning tanks 1a.

[0030]

According to the first aspect of the present invention, in a substrate cleaning apparatus, a substrate cleaning tank, a cleaning liquid supply / discharge piping chamber, and a cleaning chemical storage container are arranged in three stages in a cleaning processing section. Record
The longitudinal direction of the transportable carrying in and carrying out unit, the substrate transfer unit, the substrate drying unit, and crossed with the alignment direction of the cleaning unit, indexer part and the substrate transfer section, square the substrate drying unit and the cleaning unit By arranging the installation surface in an L-shape along two sides that are in contact with each other, a maintenance space is formed in the remaining portion, so that the following effects are obtained. (1) When the present invention is applied to the above-mentioned conventional substrate cleaning apparatus in which a large number of cleaning tanks for a plurality of types of chemicals are arranged in series, a maintenance space can be secured in the substrate cleaning apparatus. The work area of the clean room in the process can be made smaller than before, and the space in the clean room can be effectively used.

(2) When the invention of claim 1 is applied to the replacement type substrate cleaning apparatus of the above-mentioned prior art, in which a plurality of types of chemical solutions are processed in one cleaning tank, the conventional technology of (1) is applied. Since the number of cleaning tanks can be reduced, the space in the clean room can be used more effectively.However, by incorporating the maintenance space into the substrate cleaning device as in the present invention, the maintenance space can be reduced outside the substrate cleaning device. Since there is no need to provide the space, the efficiency of using the space in the clean room is further improved. Further, in the present invention, the substrate cleaning apparatuses can be arranged adjacent to each other without any gap, so that the more the number of the installed substrate cleaning apparatuses is increased, the more the effective use of space is improved. (3) In the invention of claim 2, the maintenance space is provided.
Is formed on the part facing the cleaning part,
Substrate cleaning tank arranged in upper and lower three stages in processing unit, supply and discharge
The piping room for cleaning and the chemical storage container for cleaning are all maintainers.
You will be facing
Maintenance inspection becomes easier.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a substrate cleaning apparatus according to the present invention.

FIG. 2 is a schematic longitudinal sectional view of the substrate cleaning apparatus.

FIG. 3 is a schematic system diagram of a substrate cleaning processing unit of the cleaning apparatus.

FIG. 4 is a layout diagram in which a plurality of the substrate cleaning apparatuses are arranged.

FIG. 5 is a diagram corresponding to FIG. 4, showing the prior proposed technology;

FIG. 6 is a diagram corresponding to FIG. 1 showing the same proposed technology.

FIG. 7 is a layout diagram of a clean room.

FIG. 8 is a diagram corresponding to FIG. 4 showing a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate washing tank, 2 ... Cleaning liquid, 6 ... Chemical storage container, 7 ...
Chemical liquid supply pipe, 20: supply / drain piping room, 30: clean room work area, 31: maintenance work area, 51: carry-in / out section, 5
5: cassette transfer robot, 60: substrate transfer section, 65:
Cleaning processing unit, 70: substrate drying unit, 75: substrate transfer robot, 90: maintenance space , W: substrate, C: cassette.

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Hiroyuki Araki 2426-1, Kuchinogawara, Mikami, Yasu-cho, Yasu-gun, Shiga Prefecture Inside the Yasu Works of Dainippon Screen Mfg. Co., Ltd. (56) References JP-A-4- 233729 (JP, A) JP-A-58-7830 (JP, A) JP-A-1-164039 (JP, A) JP-A-1-71440 (JP, U)

Claims (2)

(57) [Scope of request for utility model registration] 1. A carry-out section of the cassette accommodating a plurality of substrates are mounting location, a substrate transfer unit for loading a plurality of substrates from the cassette to a plurality of the substrate was taken out, or cassette, collectively a plurality of substrates A substrate drying unit for drying, a cleaning processing unit for cleaning a plurality of substrates at a time, and a cassette transfer robot for transferring a cassette between the carry-in / out unit and the substrate transfer unit; A transfer unit, a substrate drying unit, and a moving unit of the substrate transfer robot are formed along the direction in which the cleaning unit is arranged. the substrate transfer robot for transporting the substrate drying section provided, and the substrate cleaning bath in the cleaning section, and the supply and discharge pipe chamber of the cleaning liquid, the cleaning solution reservoir, was placed in three vertical stages, upper Ki搬 input the longitudinal direction of the unloading unit, the substrate transfer , The substrate drying section, and the cleaning processing section are arranged in an intersecting direction, and the carry-in / out section, the substrate transfer section, the substrate drying section, and the cleaning processing section are L-shaped along two sides which are in contact with each other on the rectangular installation surface. Placed in
A substrate cleaning apparatus characterized in that a maintenance space is formed in the remaining part. 2. The substrate cleaning apparatus according to claim 1, wherein
hand, Part where the maintenance space faces the cleaning section
A substrate cleaning apparatus characterized in that it is formed in a substrate.