JP3517135B2 - Substrate processing equipment - Google Patents

Substrate processing equipment

Info

Publication number
JP3517135B2
JP3517135B2 JP34374898A JP34374898A JP3517135B2 JP 3517135 B2 JP3517135 B2 JP 3517135B2 JP 34374898 A JP34374898 A JP 34374898A JP 34374898 A JP34374898 A JP 34374898A JP 3517135 B2 JP3517135 B2 JP 3517135B2
Authority
JP
Japan
Prior art keywords
processing
liquid
tank
passage
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP34374898A
Other languages
Japanese (ja)
Other versions
JP2000173973A (en
Inventor
健一郎 新居
修治 長良
賢治 天久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP34374898A priority Critical patent/JP3517135B2/en
Publication of JP2000173973A publication Critical patent/JP2000173973A/en
Application granted granted Critical
Publication of JP3517135B2 publication Critical patent/JP3517135B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、半導体基板、液晶
表示器やプラズマ表示器用基板等のFPD(FlatPanel
Display)用基板、フォトマスク用ガラス基板等の基板
を所定の処理液に浸漬させて処理する基板処理装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPD (Flat Panel) such as a semiconductor substrate, a liquid crystal display or a plasma display substrate.
The present invention relates to a substrate processing apparatus for processing a substrate such as a display substrate and a photomask glass substrate by immersing the substrate in a predetermined processing liquid.

【0002】[0002]

【従来の技術】従来、例えば、処理槽内に貯留した処理
液に半導体基板等の基板を浸漬させ、この状態で、処理
槽に接続された循環経路を通じて処理槽内の処理液を循
環させることにより、処理槽から処理液をオーバーフロ
ーさせながら基板を処理する装置は一般に知られてい
る。
2. Description of the Related Art Conventionally, for example, a substrate such as a semiconductor substrate is immersed in a processing solution stored in a processing tank, and in this state, the processing solution in the processing tank is circulated through a circulation path connected to the processing tank. Therefore, an apparatus for processing a substrate while causing a processing solution to overflow from a processing tank is generally known.

【0003】この種の装置では、処理液の処理能力が一
定レベル以下になると、処理槽内の処理液を新たな処理
液と入替えるが、この際、使用済みの処理液は、処理槽
に接続された排液通路を通じて装置外部に設けられた廃
液回収設備に送液される。
In this type of apparatus, when the processing capacity of the processing liquid falls below a certain level, the processing liquid in the processing tank is replaced with a new processing liquid. At this time, the used processing liquid is stored in the processing tank. Liquid is sent to a waste liquid recovery facility provided outside the apparatus through the connected drain passage.

【0004】特に、処理液として高温の処理液を用いる
ような装置では、排液通路や廃液回収設備に冷却設備が
付設されていて、これにより処理済みの処理液を冷却し
つつ回収したり、あるいは回収後に冷却することが行わ
れている。
Particularly, in an apparatus that uses a high-temperature treatment liquid as a treatment liquid, a cooling facility is attached to a drainage passage and a waste liquid recovery facility, whereby a treated treatment liquid can be recovered while being cooled, Alternatively, cooling is performed after the collection.

【0005】[0005]

【発明が解決しようとする課題】ところが、上記のよう
な従来の装置では、強酸の処理液等、特別な処理が必要
なため、そのままの状態では廃液回収設備以外の場所に
排出することができないような処理液を用いる場合、廃
液回収設備に故障が生じると、直ちに処理液を排出する
場所が無くなり、その結果、装置を停止させざるを得な
くなる。
However, since the conventional apparatus as described above requires special treatment such as a treatment solution of strong acid, it cannot be discharged as it is to a place other than the waste liquid recovery facility. When such a treatment liquid is used, if the waste liquid recovery equipment fails, there is no place to discharge the treatment liquid immediately, and as a result, the apparatus must be stopped.

【0006】また、冷却設備を有する装置では、冷却設
備に故障が生じると、安全を確保する必要性から処理液
を排出することができず、同様に装置を停止させざるを
得なくなる。
Further, in an apparatus having a cooling facility, if a failure occurs in the cooling facility, the processing liquid cannot be discharged due to the necessity of ensuring safety, and the apparatus must be stopped in the same manner.

【0007】すなわち、廃液回収設備や冷却設備に異常
が生じると、基板の処理を進行することができなくなる
という問題がある。
That is, if an abnormality occurs in the waste liquid recovery equipment or the cooling equipment, there is a problem that the processing of the substrate cannot proceed.

【0008】そこで、廃液回収設備等に異常が生じた場
合でも基板の処理を続行できるようにすべく、例えば、
廃液回収設備等を有した複数の排液系統を設け、これら
の排液系統に択一的に処理液を導入できるようにするこ
とが考えられる。しかし、廃液回収設備等は大型で高価
な設備であるため、そのような構成では、装置の大型化
やコスト高を招くこととなり必ずしも得策とはいえな
い。
Therefore, in order to be able to continue the processing of the substrate even if an abnormality occurs in the waste liquid recovery equipment, for example,
It is conceivable to provide a plurality of drainage systems having a wastewater recovery facility or the like so that the treatment liquid can be introduced selectively into these drainage systems. However, since the waste liquid recovery facility and the like are large and expensive facilities, such a configuration is not necessarily a good measure because it causes an increase in the size of the device and a high cost.

【0009】本発明は、上記問題を解決するためになさ
れたものであり、廃液回収設備や冷却設備に故障等が生
じた場合でも基板の処理を続行することができ、しか
も、装置の大型化やコスト高を回避することができる基
板処理装置を提供することを目的としている。
The present invention has been made to solve the above problems, and can continue the processing of a substrate even when a waste liquid recovery facility or a cooling facility fails, and the size of the apparatus is increased. It is an object of the present invention to provide a substrate processing apparatus capable of avoiding high cost.

【0010】[0010]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、処理液を貯留して基板を浸漬させる処理
槽と、この処理槽内の処理液を排出可能な排液通路を備
え、この排液通路を通じて、使用済みの処理液を廃液回
収設備に排出可能となっている基板処理装置において、
処理槽内の処理液を排出可能な補助排液通路と、水流に
よって液体を吸引するアスピレータとを設け、補助排液
通路をアスピレータの吸入口に連通接続するとともに、
廃液回収設備に異常が生じたときに、処理槽内の処理液
を補助排液通路に導入させる排出流路切換え手段を設け
たものである(請求項1)。
In order to solve the above-mentioned problems, the present invention comprises a processing tank for storing a processing liquid and immersing a substrate therein, and a drain passage for discharging the processing liquid in the processing tank. In the substrate processing apparatus, which is equipped with, and through which the used processing liquid can be discharged to the waste liquid recovery facility,
An auxiliary drainage passage capable of discharging the treatment liquid in the treatment tank and an aspirator for sucking the liquid by the water flow are provided, and the auxiliary drainage passage is connected to the suction port of the aspirator.
A discharge passage switching means is provided for introducing the treatment liquid in the treatment tank into the auxiliary discharge passage when an abnormality occurs in the waste liquid recovery equipment (claim 1).

【0011】この装置においては、通常、処理槽内の使
用済みの処理液を排液通路を通じて廃液回収設備へと排
出する。そして、廃液回収設備に異常が生じた場合に
は、補助排液通路を通じてアスピレータにより処理液を
吸引しつつ排出する。このようにすると処理液が希釈、
冷却されるため、そのままの状態では廃液回収設備以外
の場所に排出できないような使用済みの処理液も、簡単
な構成で廃液回収設備以外の場所に排出することが可能
となる。
In this apparatus, the used processing liquid in the processing tank is normally discharged to the waste liquid recovery facility through the drain passage. When an abnormality occurs in the waste liquid recovery equipment, the aspirator sucks and discharges the processing liquid through the auxiliary drainage passage. This will dilute the treatment liquid,
Since it is cooled, it is possible to discharge the used processing liquid, which cannot be discharged to a place other than the waste liquid collecting facility in the state as it is, to a place other than the waste liquid collecting facility with a simple configuration.

【0012】上記課題を解決するために、本発明は、処
理液を貯留して基板を浸漬させる処理槽と、この処理槽
内の処理液を排出可能な排液通路とを備え、この排液通
路を通じて、使用済みの処理液を廃液回収設備に排出可
能となっているとともに、上記排液通路又は廃液回収設
備の少なくとも一方側に設けられる冷却設備により使用
済みの処理液を冷却する基板処理装置において、処理槽
内の処理液を排出可能な補助排液通路と、水流によって
液体を吸引するアスピレータとを設け、補助排液通路を
アスピレータの吸入口に連通接続するとともに、冷却設
備に異常が生じたときに、処理槽内の処理液を補助排液
通路に導入させる排出流路切換え手段を設けたものであ
る(請求項2)。
In order to solve the above-mentioned problems, the present invention comprises a processing bath for storing the processing liquid and immersing the substrate therein, and a drain passage for discharging the processing liquid in the processing bath. A substrate processing apparatus capable of discharging a used processing liquid to a waste liquid recovery facility through a passage and cooling the used processing liquid by a cooling facility provided on at least one side of the drain passage or the waste liquid recovery facility. , An auxiliary drainage passage for discharging the treatment liquid in the treatment tank and an aspirator for sucking the liquid by the water flow are provided, and the auxiliary drainage passage is connected to the suction port of the aspirator, and an abnormality occurs in the cooling equipment. In this case, a discharge passage switching means for introducing the treatment liquid in the treatment tank into the auxiliary discharge passage is provided (Claim 2).

【0013】この装置においては、通常、処理槽内の使
用済みの処理液を排液通路を通じて排出する。この際、
排液通路や廃液回収設備の冷却設備により使用済みの処
理液を冷却する。そして、冷却設備に異常が生じた場合
には、補助排液通路を通じてアスピレータにより処理液
を吸引しつつ排出する。このようにすると処理液が冷却
されるため、簡単な構成で本来の冷却設備によることな
く処理液を冷却して排出することが可能となる。
In this apparatus, the used processing liquid in the processing tank is normally discharged through the drainage passage. On this occasion,
The used processing liquid is cooled by the drainage passage and the cooling equipment of the waste liquid recovery equipment. When an abnormality occurs in the cooling equipment, the processing liquid is sucked and discharged by the aspirator through the auxiliary drainage passage. Since the treatment liquid is cooled in this way, it is possible to cool and discharge the treatment liquid with a simple configuration without using an original cooling facility.

【0014】上記各装置においては、上記排液通路から
流路分岐させることにより補助排液通路を構成すること
ができる(請求項3)。このようにすると、通常は、排
液通路のみを通じて処理槽から処理液が排出される。一
方、廃液回収設備や冷却設備に異常が生じた場合には、
排液通路から補助排液通路へと処理液が導入されて排出
される。この場合、特に、冷却設備を有する装置におい
ては、当該冷却設備として、補助排液流路の分岐部分と
処理槽との間に、排液通路を通じて排出される処理液を
貯留可能なタンクを設けるとともに、このタンク内の処
理液を冷却するための冷却媒体の通路を設けるのが好ま
しい(請求項4)。このようにすれば、冷却設備に異常
が生じたときの処理液の入替えの際には、処理槽内の処
理液を一旦処理槽内からタンクに移した後、新しい処理
液の処理槽への供給を直ちに実行することができる。そ
のため、処理槽内の処理液の入替えを速やかに行うこと
が可能となる。
In each of the above devices, an auxiliary drainage passage can be formed by branching the flow passage from the drainage passage (claim 3). In this way, normally, the processing liquid is discharged from the processing tank only through the drain passage. On the other hand, if an abnormality occurs in the waste liquid recovery equipment or cooling equipment,
The processing liquid is introduced and discharged from the drainage passage to the auxiliary drainage passage. In this case, particularly in an apparatus having a cooling facility, as the cooling facility, a tank capable of storing the treatment liquid discharged through the drainage passage is provided between the branch portion of the auxiliary drainage flow path and the treatment tank. At the same time, it is preferable to provide a passage for a cooling medium for cooling the processing liquid in the tank (claim 4). With this configuration, when the processing solution is replaced when an abnormality occurs in the cooling equipment, the processing solution in the processing tank is temporarily transferred from the processing tank to the tank, and then a new processing solution is transferred to the processing tank. The supply can be carried out immediately. Therefore, it is possible to quickly replace the processing liquid in the processing tank.

【0015】[0015]

【発明の実施の形態】本発明の実施の形態について図面
を用いて説明する。図1は、本発明に係る基板処理装置
の一の実施の形態を概略的に示している。この図に示す
基板処理装置10は、処理槽に各種薬液や純水等の処理
液Sを貯留し、この処理液Sに半導体基板等の複数の基
板Wを浸漬させて表面処理を行う基板処理装置であっ
て、基板処理部である処理槽12と、これに対する処理
液の給排系とを備えている。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. FIG. 1 schematically shows an embodiment of a substrate processing apparatus according to the present invention. A substrate processing apparatus 10 shown in this figure stores a processing liquid S such as various chemicals or pure water in a processing tank, and immerses a plurality of substrates W such as semiconductor substrates in the processing liquid S to perform a surface treatment. The apparatus includes a processing tank 12 which is a substrate processing unit, and a supply / discharge system of a processing liquid for the processing tank 12.

【0016】処理槽12は、断面矩形の箱型に形成され
ているとともに、その開口周囲には、処理槽12からオ
ーバーフローした処理液を受け入れる液受け部12aが
一体に設けられており、例えば全体が石英等の耐薬品性
に優れた材料から構成されている。
The processing tank 12 is formed in a box shape having a rectangular cross section, and a liquid receiving portion 12a for receiving the processing liquid overflowing from the processing tank 12 is integrally provided around the opening of the box. Is made of a material having excellent chemical resistance such as quartz.

【0017】一方、処理液の給排系は、以下のように構
成されている。すなわち、上記処理槽12の液受け部1
2aに、開閉バルブ18を具備した処理液の供給管16
が接続され、この供給管16の上流端が調製タンク14
に接続されることにより、上記調製タンク14で処理液
が調製されて供給管16を通じて液受け部12aに供給
されるようになっている。
On the other hand, the processing liquid supply / discharge system is constructed as follows. That is, the liquid receiving portion 1 of the processing tank 12
2a, a processing liquid supply pipe 16 equipped with an opening / closing valve 18
Is connected, and the upstream end of the supply pipe 16 is connected to the preparation tank 14
The processing liquid is prepared in the preparation tank 14 and is supplied to the liquid receiving portion 12a through the supply pipe 16 by being connected to.

【0018】また、処理槽12及び液受け部12aの内
底部に、開閉バルブ21,23を具備した処理液の流出
管20,22がそれぞれ接続され、これら流出管20,
22が合流流出管24に連通接続されている。合流流出
管24には、例えば電気駆動式のポンプ26が介設され
ているとともに、このポンプ26の吐出側が戻り管28
と排液管30とに分岐され、戻り管28が上記処理槽1
2の内底部に配設された液中パイプ29に、排液管30
がバッファタンク40にそれぞれ連通接続されている。
そして、戻り管28に開閉バルブ32、ヒータ34及び
フィルタ36が介設される一方、排液管30に開閉バル
ブ38が介設されている。なお、上記液中パイプ29
は、図1において紙面に直交する方向に延びているとと
もに、この方向に多数の液吐出口を備えており、後述す
る処理動作時には、この液吐出口を介して処理槽内に処
理液が吐出されるようになっている。
Outflow pipes 20 and 22 of the processing liquid having on-off valves 21 and 23 are connected to the inner bottoms of the processing tank 12 and the liquid receiving portion 12a, respectively.
22 is communicatively connected to a merged outflow pipe 24. An electric drive type pump 26, for example, is interposed in the confluent outflow pipe 24, and the discharge side of the pump 26 is connected to a return pipe 28.
And a drain pipe 30, and a return pipe 28 is provided in the processing tank 1
The submerged pipe 29 disposed on the inner bottom of the
Are connected to the buffer tanks 40, respectively.
An open / close valve 32, a heater 34, and a filter 36 are provided in the return pipe 28, while an open / close valve 38 is provided in the drainage pipe 30. The submerged pipe 29
1 extends in a direction orthogonal to the paper surface in FIG. 1 and has a large number of liquid discharge ports in this direction. During the processing operation described later, the process liquid is discharged into the processing tank through the liquid discharge ports. It is supposed to be done.

【0019】上記バッファタンク40は、少なくとも処
理槽12以上の容量を有したタンクからなり、その内部
には、螺旋状管42(冷却媒体の通路)が設けられてい
る。この螺旋状管42の両端には水導入管44及び水導
出管46がそれぞれ連通接続されており、これら水導入
管44及び水導出管46がポンプを具備した図外の冷却
水貯留タンク及びラジエータを介して互いに接続されて
いる。すなわち処理槽12から排出される処理液をバッ
ファタンク40内に貯留するとともに、螺旋状管42に
冷却水(冷却媒体)を循環させ、これにより螺旋状管4
2内の冷却水と処理液との間で熱交換を行わせて処理液
を冷却するようになっている。つまり、このバッファタ
ンク40及び螺旋状管42等により処理液の冷却設備が
構成されている。
The buffer tank 40 is composed of a tank having a capacity of at least the processing tank 12, and a spiral tube 42 (cooling medium passage) is provided inside the tank. A water inlet pipe 44 and a water outlet pipe 46 are connected to both ends of the spiral pipe 42, respectively. The water inlet pipe 44 and the water outlet pipe 46 are equipped with a pump, and are provided in a cooling water storage tank and a radiator (not shown). Are connected to each other via. That is, the treatment liquid discharged from the treatment tank 12 is stored in the buffer tank 40, and cooling water (cooling medium) is circulated in the spiral pipe 42, whereby the spiral pipe 4
The processing liquid is cooled by causing heat exchange between the cooling water in 2 and the processing liquid. That is, the buffer tank 40, the spiral pipe 42, and the like constitute a cooling facility for the processing liquid.

【0020】また、上記バッファタンク40の内底部に
は、連結管50が連通接続され、この連結管50が、開
閉バルブ54を有した第1排液管52と、開閉バルブ6
0を有した第2排液管58とに分岐され、第1排液管5
2が装置外部の廃液回収設備56に、第2排液管58
が、水流によって処理液を吸引するアスピレータ62に
連通接続されている。具体的には、アスピレータ62の
吸入口68に第2排液管58が接続されている。アスピ
レータ62は、その水流入口64が開閉バルブ72を備
えた水導入管70を介して加圧水供給源に接続される一
方、水流出口66が排液管74を介して図外の廃液タン
クに接続されている。
A connecting pipe 50 is connected to the inner bottom of the buffer tank 40. The connecting pipe 50 has a first drain pipe 52 having an opening / closing valve 54 and an opening / closing valve 6.
The second drain pipe 58 having the number 0 and the first drain pipe 5
2 is connected to a waste liquid recovery facility 56 outside the device, and a second drain pipe 58
Is connected to an aspirator 62 that sucks the treatment liquid by a water flow. Specifically, the second drain pipe 58 is connected to the suction port 68 of the aspirator 62. The water inlet 64 of the aspirator 62 is connected to a pressurized water supply source via a water introducing pipe 70 having an opening / closing valve 72, while the water outlet 66 is connected to a waste liquid tank (not shown) via a drainage pipe 74. ing.

【0021】なお、上記のような基板処理装置10に
は、図示を省略するが基板の処理動作を制御する制御装
置が設けられており、上記各バルブ等の開閉動作をこの
制御装置により統括的に制御することにより、以下のよ
うに基板の処理動作を行うようになっている。
Although not shown, the substrate processing apparatus 10 as described above is provided with a control device for controlling the processing operation of the substrate, and the opening / closing operation of each valve and the like is integrated by this control device. The substrate processing operation is performed as follows by controlling the above.

【0022】まず、基板処理の前準備として、開閉バル
ブ18を開き、調製タンク14において調製した処理液
を供給管16を通じて処理槽12の液受け部12aに供
給する。この際、流出管20及び戻り管28の各開閉バ
ルブ21,32を開いた状態とし、その他の開閉バルブ
38等は閉じた状態でポンプ26を駆動する。このよう
にすると、液受け部12aに供給された処理液が流出管
20、合流流出管24、戻り管28及び液中パイプ29
を介して処理槽12に導入、貯留され、さらに処理槽1
2から液受け部12aへとオーバーフローする。これに
より処理液Sが処理槽12に貯留され、さらに上記の経
路でオーバーフロー循環される。
First, as a preparation for substrate processing, the opening / closing valve 18 is opened, and the processing liquid prepared in the preparation tank 14 is supplied to the liquid receiving portion 12a of the processing tank 12 through the supply pipe 16. At this time, the pump 26 is driven with the open / close valves 21 and 32 of the outflow pipe 20 and the return pipe 28 opened and the other open / close valves 38 and the like closed. In this way, the processing liquid supplied to the liquid receiving portion 12a is the outflow pipe 20, the merged outflow pipe 24, the return pipe 28, and the submerged pipe 29.
Is introduced and stored in the treatment tank 12 via the
2 overflows into the liquid receiving portion 12a. As a result, the processing liquid S is stored in the processing tank 12 and is further circulated by overflow in the above path.

【0023】そして、このように処理液をオーバーフロ
ー循環させた状態で、処理槽12内の処理液Sに基板を
浸漬させて基板を処理する。つまり、処理に伴い発生す
る処理生成物やパーティクル等を処理液Sと共に処理槽
12からオーバーフローさせ、この処理生成物等を循環
途中にフィルタ36により捕捉することにより処理液S
を浄化するようになっている。なお、詳しく図示してい
ないが、各基板Wは、基板支持部材11により図中紙面
に直交する方向に互いに平行に支持された状態でこの基
板支持部材11と一体に処理液Sに浸漬される。
Then, the substrate is processed by immersing the substrate in the processing liquid S in the processing bath 12 in a state where the processing liquid is circulated in the overflow manner as described above. That is, processing products, particles, and the like generated during processing overflow together with the processing liquid S from the processing tank 12, and the processing products S and the like are captured by the filter 36 during circulation.
Is designed to purify. Although not shown in detail, each substrate W is immersed in the processing solution S integrally with the substrate supporting member 11 while being supported by the substrate supporting member 11 in parallel with each other in the direction orthogonal to the paper surface of the drawing. .

【0024】こうして基板の浸漬処理を行い、処理液S
の処理能力が所定レベル以下に劣化すると、処理槽12
に貯留されている処理液Sを全て新たな処理液と入替え
る。
In this way, the substrate is immersed, and the treatment liquid S
When the processing capacity of the processing tank deteriorates below a predetermined level, the processing tank 12
All of the processing liquid S stored in is replaced with a new processing liquid.

【0025】具体的には、ポンプ26を駆動したままの
状態で、供給管16、戻り管28、第2排液管58及び
水導入管70の各開閉バルブ18,32,60,72を
閉じた状態とするとともに、それ以外の全ての開閉バル
ブを開いた状態とする。これにより処理槽12の処理液
Sが流出管20,22、合流流出管24及び排液管30
を介してバッファタンク40に導入、貯留されつつここ
で冷却され、さらに連結管50及び第1排液管52を通
じて廃液回収設備56へと導入される。そして、廃液回
収設備56において処理液に所定の廃液処理が施され
る。
Specifically, the open / close valves 18, 32, 60, 72 of the supply pipe 16, the return pipe 28, the second drainage pipe 58, and the water introduction pipe 70 are closed while the pump 26 is still driven. In addition to the open state, all other open / close valves are opened. As a result, the processing liquid S in the processing tank 12 flows out into the outflow pipes 20, 22, the confluent outflow pipe 24, and the drainage pipe 30.
While being introduced and stored in the buffer tank 40 via the cooling tank, it is cooled here and further introduced into the waste liquid recovery facility 56 through the connecting pipe 50 and the first drainage pipe 52. Then, in the waste liquid recovery facility 56, the treatment liquid is subjected to a predetermined waste liquid treatment.

【0026】そして、処理槽12内の処理液が全て無く
なると、その時点で、流出管22及び排液管30の各開
閉バルブ23,38を閉じる一方、供給管16及び戻り
管28の各開閉バルブ18,21を開き、上述のように
調製タンク14で調製した新たな処理液を供給管16を
通じて液受け部12aに供給する。こうして処理槽12
内の処理液を入替える。
When all the processing liquid in the processing tank 12 is exhausted, the open / close valves 23 and 38 of the outflow pipe 22 and the drainage pipe 30 are closed while the open / close of the supply pipe 16 and the return pipe 28 is completed. The valves 18 and 21 are opened, and the new processing liquid prepared in the preparation tank 14 as described above is supplied to the liquid receiving portion 12a through the supply pipe 16. Thus the processing tank 12
Replace the processing solution inside.

【0027】なお、上記のような処理液の入替え動作に
おいて、廃液回収設備56に廃液を排出できない場合、
例えば廃液回収設備56自体が故障して廃液の処理がで
きない場合や廃液回収設備56内に設けられる図外の廃
液回収タンクの交換時等、あるいは上記冷却設備におい
て冷却水循環用のポンプが故障する等して処理液の冷却
が不能となった場合には、以下のようにして処理液を排
出する。
In the replacement operation of the processing liquid as described above, when the waste liquid cannot be discharged to the waste liquid recovery equipment 56,
For example, when the waste liquid recovery facility 56 itself fails to process the waste liquid, when a waste liquid recovery tank (not shown) provided in the waste liquid recovery facility 56 is replaced, or the cooling water circulation pump in the cooling facility fails. When the cooling of the treatment liquid becomes impossible, the treatment liquid is discharged as follows.

【0028】すなわち、第1排液管52の開閉バルブ5
4を閉じる一方、第2排液管58及び水導入管70の各
開閉バルブ60,72を開き、この状態で処理槽12内
の処理液を排出する。このようにすると、処理槽12か
らバッファタンク40に処理液が導入されるとともに、
水導入管70からアスピレータ62を通じて排液管74
へと水が流れ、バッファタンク40内に導入された処理
液が連結管50及び第2排液管58を通じてアスピレー
タ62へと吸引される。そして、アスピレータ62に流
入した処理液は、水導入管70からアスピレータ62を
通じて排液管74へと流れる水と共に排液管74に流れ
込む。これにより処理液は希釈、冷却されながら廃液タ
ンクへと排出されることとなる。つまり、強酸の処理液
等、そのままの状態では廃液回収設備以外の場所に排出
できないような処理液であっても、上記のように希釈す
ることで、処理液を廃液回収設備以外の場所(廃液タン
ク)へ安全に排出できるようになっている。また、高温
の処理液も、本来の冷却設備によることなく適切に冷却
して排出できるようになっている。
That is, the opening / closing valve 5 of the first drain pipe 52
While closing the valve 4, the opening / closing valves 60 and 72 of the second drainage pipe 58 and the water introduction pipe 70 are opened, and the treatment liquid in the treatment tank 12 is discharged in this state. In this way, the treatment liquid is introduced from the treatment tank 12 into the buffer tank 40, and
Drainage pipe 74 from the water introduction pipe 70 through the aspirator 62
The water flows into the buffer tank 40, and the processing liquid introduced into the buffer tank 40 is sucked into the aspirator 62 through the connecting pipe 50 and the second drain pipe 58. Then, the treatment liquid flowing into the aspirator 62 flows into the drain pipe 74 together with the water flowing from the water introduction pipe 70 to the drain pipe 74 through the aspirator 62. As a result, the processing liquid is discharged to the waste liquid tank while being diluted and cooled. In other words, even if it is a processing solution that cannot be discharged to a place other than the waste liquid collection facility as it is, such as a strong acid treatment liquid, by diluting it as described above, the treatment liquid can be stored in a place other than the waste liquid collection facility (the waste liquid collection facility). It can be safely discharged to the tank. Further, the high-temperature treatment liquid can be appropriately cooled and discharged without using the original cooling equipment.

【0029】このように、上記の基板処理装置10で
は、通常は、処理槽12内の使用済みの処理液を冷却し
つつ第1排液管52を通じて廃液回収設備56に導入す
る一方、廃液回収設備56や冷却設備に異常が生じる
と、排液の経路を第1排液管52から第2排液管58へ
と切り換え、アスピレータ62を介して処理液を排出す
るようにしているので、廃液回収設備等に異常が生じた
場合でも、従来のこの種の装置のように装置を停止させ
る必要がない。そのため、基板処理を良好に続行するこ
とができる。
As described above, in the above-described substrate processing apparatus 10, normally, while the used processing liquid in the processing tank 12 is being cooled and introduced into the waste liquid recovery facility 56 through the first drain pipe 52, the waste liquid recovery is performed. When an abnormality occurs in the equipment 56 or the cooling equipment, the drainage path is switched from the first drainage pipe 52 to the second drainage pipe 58, and the treatment liquid is discharged through the aspirator 62. Even if an abnormality occurs in the recovery facility, it is not necessary to stop the device like the conventional device of this type. Therefore, the substrate processing can be favorably continued.

【0030】しかも、このような効果を得ながらも、装
置の大型化やコスト高を有効に回避することができる。
すなわち、廃液回収設備等に異常が生じた場合でも基板
の処理を続行できる構成として、廃液回収設備56及び
冷却設備を有した複数の排液系統を設け、これらの排液
系統に択一的に処理液を導入できるような構成が考えら
れる。しかし、廃液回収設備等は大型で高価な設備であ
るため、上記のような構成では、装置の大型化やコスト
高を招くこととなる。これに対し、上記基板処理装置1
0では、廃液回収設備56等に異常が生じた際に処理液
を排出するための系統が上述のように第2排液管58を
アスピレータ62に接続し、これをさらに廃液タンクに
接続しただけの極めて簡単な構成であるため、廃液回収
設備56等を有した複数の排液系統を設ける上記の構成
のように、いたずらに装置を大型化したり、コスト高を
招くようなことがない。
Moreover, it is possible to effectively avoid an increase in size and cost of the apparatus while obtaining such effects.
That is, a plurality of drainage systems having a wastewater recovery facility 56 and a cooling facility are provided as a configuration that allows the substrate processing to be continued even if an abnormality occurs in the wastewater recovery facility, etc. A configuration in which the treatment liquid can be introduced is conceivable. However, since the waste liquid recovery equipment and the like are large and expensive equipment, the above-mentioned configuration causes an increase in the size and cost of the apparatus. On the other hand, the substrate processing apparatus 1
In No. 0, the system for discharging the processing liquid when an abnormality occurs in the waste liquid recovery facility 56, etc., connects the second drain pipe 58 to the aspirator 62 as described above, and further connects this to the waste liquid tank. Since it has an extremely simple structure, unlike the above-described structure in which a plurality of drainage systems having the waste liquid recovery facility 56 and the like are provided, there is no need to unnecessarily increase the size of the device or increase the cost.

【0031】ところで、上記の基板処理装置10は、本
発明に係る基板処理装置の一の実施の形態であって、そ
の具体的な構成は、本発明の要旨を逸脱しない範囲で適
宜変更可能である。
By the way, the substrate processing apparatus 10 is one embodiment of the substrate processing apparatus according to the present invention, and its specific configuration can be appropriately changed without departing from the scope of the present invention. is there.

【0032】例えば、上記基板処理装置10では、バッ
ファタンク40に螺旋状管42を設けて冷却水を循環さ
せ、これによりバッファタンク40に貯留される処理液
を冷却するように冷却設備を構成しているが、例えば、
バッファタンク40の側壁に冷水の循環通路を一体形成
してその通路内に冷却水を通すような構成でもよい。要
は、使用済みの処理液を冷却できる構成であればよい。
従って、冷却設備を廃液回収設備56に一体に設け、バ
ッファタンク40を省略することもできる。但し、上記
基板処理装置10のような構成によれば、上記廃液回収
設備56に異常が生じた場合の処理液Sの入替えの際に
は、ポンプ駆動により処理槽12内の処理液全てを一旦
バッファタンク40に高速排液し、それに続いて、処理
槽12への新しい処理液の供給を直ちに行うことができ
る。そして、バッファタンク40に導入した処理液につ
いては、アスピレータ62により吸引しながら排出する
ことができる。そのため、処理槽から直接アスピレータ
により処理液を吸引しながら排出する場合に比べると、
処理槽12内の処理液を速やかに入替えることができる
という利点がある。
For example, in the substrate processing apparatus 10, the cooling pipe is provided in the buffer tank 40 to circulate the cooling water, and the cooling equipment is configured to cool the processing liquid stored in the buffer tank 40. However, for example,
A configuration may be adopted in which a cooling water circulation passage is integrally formed on the side wall of the buffer tank 40 and cooling water is passed through the passage. The point is that the used processing liquid may be cooled.
Therefore, it is possible to provide the cooling facility integrally with the waste liquid recovery facility 56 and omit the buffer tank 40. However, according to the configuration of the substrate processing apparatus 10, when the processing liquid S is replaced when the waste liquid recovery facility 56 has an abnormality, all the processing liquid in the processing tank 12 is temporarily driven by the pump drive. High-speed drainage can be performed in the buffer tank 40, and then a new treatment liquid can be immediately supplied to the treatment tank 12. Then, the processing liquid introduced into the buffer tank 40 can be discharged while being sucked by the aspirator 62. Therefore, compared with the case where the processing liquid is directly sucked and discharged from the processing tank by the aspirator,
There is an advantage that the processing liquid in the processing tank 12 can be quickly replaced.

【0033】また、上記の基板処理装置10では、流出
管20,22、排液管30、連結管50及び第1排液管
52等により本発明の排液通路を構成し、連結管50か
ら第2排液管58を分岐させ、この第2排液管58によ
り本発明の補助排液通路を構成しているが、例えば、補
助排液通路として、上記第2排液管58の代わりに、処
理槽12から開閉バルブを介して直接アスピレータ62
に至る補助排液通路を設けるようにしてもよい。
Further, in the substrate processing apparatus 10 described above, the drainage passage of the present invention is constituted by the outflow pipes 20 and 22, the drainage pipe 30, the connection pipe 50, the first drainage pipe 52, etc. The second drain pipe 58 is branched, and the auxiliary drain passage of the present invention is configured by the second drain pipe 58. For example, instead of the second drain pipe 58, the auxiliary drain passage is used. , The aspirator 62 directly from the processing tank 12 through the opening / closing valve.
You may make it provide the auxiliary drainage path to.

【0034】さらに、上記基板処理装置10では、第1
排液管52の開閉バルブ54および第2排液管58の開
閉バルブ60の開閉操作により排出される処理液の流路
を切り換えるようにしている、つまり、これら開閉バル
ブ54,60により本発明の排出流路切換え手段を構成
しているが、例えば、排出流路切換え手段として、連結
管50と両排液管52,58との間に単一の流路切換え
バルブを設けて構成を簡略化するようにしてもよい。
Further, in the substrate processing apparatus 10, the first
The opening and closing valve 54 of the drainage pipe 52 and the opening and closing valve 60 of the second drainage pipe 58 are opened and closed to switch the flow path of the processing liquid to be discharged, that is, the opening and closing valves 54 and 60 of the present invention are used. Although the discharge flow path switching means is configured, for example, as the discharge flow path switching means, a single flow path switching valve is provided between the connecting pipe 50 and the drainage pipes 52, 58 to simplify the configuration. You may do it.

【0035】[0035]

【発明の効果】以上説明したように、本発明は、処理槽
内の使用済みの処理液を排液通路を通じて廃液回収設備
へと導入する基板処理装置において、処理槽内の処理液
を排出可能な補助排液通路を設けてこれをアスピレータ
に接続するとともに、廃液回収設備に異常が生じたとき
に処理槽内の処理液を補助排液通路に導入させる排出流
路切換え手段を設け、廃液回収設備に異常が生じたとき
には、アスピレータを通じて処理液を冷却、希釈するこ
とにより、使用済みの処理液を廃液回収設備以外の場所
に排出できるようにしたので、廃液回収設備等に異常が
生じた場合でも、従来のこの種の装置のように装置を停
止させる必要がなく、基板の処理を続行することができ
る。しかも、補助排液通路を設けてこれをアスピレータ
に接続した極めて簡単な構成であるため、装置の大型化
やコスト高を有効に回避することができる。
As described above, according to the present invention, the processing liquid in the processing tank can be discharged in the substrate processing apparatus in which the used processing liquid in the processing tank is introduced into the waste liquid recovery facility through the drainage passage. A new auxiliary drainage passage is provided and connected to the aspirator, and a drainage flow path switching unit that introduces the processing liquid in the processing tank into the auxiliary drainage passage when an abnormality occurs in the waste liquid recovery equipment is provided to collect the waste liquid. When an abnormality occurs in the equipment, the used treatment liquid can be discharged to a place other than the waste liquid collection facility by cooling and diluting the treatment liquid through an aspirator. However, unlike the conventional apparatus of this type, it is not necessary to stop the apparatus, and the substrate processing can be continued. Moreover, since the auxiliary drainage passage is provided and connected to the aspirator, the configuration is extremely simple, so that it is possible to effectively avoid an increase in the size of the device and a high cost.

【0036】また、本発明は、処理槽内の使用済みの処
理液を排液通路を通じて排出するとともに、排液通路又
は廃液回収設備の少なくとも一方に設けられた冷却設備
により使用済みの処理液を冷却するようにされた基板処
理装置において、処理槽内の処理液を排出可能な補助排
液通路を設けてこれをアスピレータに接続するととも
に、冷却設備に異常が生じたときに処理槽内の処理液を
補助排液通路に導入させる排出流路切換え手段を設け、
冷却設備に異常が生じたときには、アスピレータを通じ
て処理液を冷却しながら排出することにより、本来の冷
却設備によることなく処理液を冷却して排出することが
できるようにしたので、冷却設備に異常が生じた場合で
も、従来のこの種の装置のように装置を停止させる必要
がなく、基板の処理を続行することができる。しかも、
補助排液通路を設けてこれをアスピレータに接続した極
めて簡単な構成であるため、装置の大型化やコスト高を
有効に回避することができる。
Further, according to the present invention, the used treatment liquid in the treatment tank is discharged through the drain passage, and the used treatment liquid is removed by the cooling equipment provided in at least one of the drain passage and the waste liquid recovery equipment. In a substrate processing apparatus that is designed to be cooled, an auxiliary drain passage that can discharge the processing liquid in the processing tank is provided and connected to the aspirator, and processing in the processing tank is performed when an abnormality occurs in the cooling equipment. A discharge flow path switching means for introducing the liquid into the auxiliary liquid discharge passage is provided,
When an abnormality occurs in the cooling equipment, the processing liquid is discharged while being cooled through the aspirator so that the processing liquid can be cooled and discharged without relying on the original cooling equipment. Even if it occurs, it is not necessary to stop the apparatus like the conventional apparatus of this type, and the processing of the substrate can be continued. Moreover,
Since the auxiliary drainage passage is provided and connected to the aspirator, the auxiliary drainage passage has an extremely simple structure, so that it is possible to effectively avoid an increase in size and cost of the device.

【0037】なお、上記の各装置においては、排液通路
から流路分岐させることにより補助排液通路を構成する
ことができ、この場合、特に冷却設備を有する装置にお
いては、当該冷却設備として、補助排液流路の分岐部分
と処理槽との間に、排液通路を通じて排出される処理液
を貯留可能なタンクを設けるとともに、このタンクに冷
却媒体の循環通路を設けるようにすれば、冷却設備に異
常が生じたときの処理槽内の処理液の入替えを速やかに
行うことができる。
In each of the above devices, the auxiliary drainage passage can be constructed by branching the flow path from the drainage passage. In this case, particularly in an apparatus having cooling equipment, the cooling equipment is If a tank capable of storing the processing liquid discharged through the drainage passage is provided between the branch portion of the auxiliary drainage flow passage and the processing tank, and a circulation passage for the cooling medium is provided in this tank, cooling is achieved. It is possible to quickly replace the processing liquid in the processing tank when an abnormality occurs in the equipment.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る基板処理装置の一の実施形態を示
す模式図である。
FIG. 1 is a schematic view showing an embodiment of a substrate processing apparatus according to the present invention.

【符号の説明】[Explanation of symbols]

10 基板処理装置 12 処理槽 12a 液受け部 20,22 流出管 24 合流流出管 26 ポンプ 28 戻り管 29 液中パイプ 30 排液管 40 バッファタンク 42 螺旋状管 50 連結管 52 第1排液管 56 廃液回収設備 58 第2排液管 62 アスピレータ 70 水導入管 74 排液管 W 基板 S 処理液 10 Substrate processing equipment 12 treatment tanks 12a Liquid receiving part 20,22 Outflow pipe 24 Combined outflow pipe 26 pumps 28 Return pipe 29 Submerged Pipe 30 drainage pipe 40 buffer tank 42 spiral tube 50 connecting pipe 52 First drainage pipe 56 Waste liquid recovery equipment 58 Second drainage pipe 62 Aspirator 70 Water introduction pipe 74 Drainage pipe W board S treatment liquid

───────────────────────────────────────────────────── フロントページの続き (72)発明者 天久 賢治 京都市上京区堀川通寺之内上る4丁目天 神北町1番地の1 大日本スクリーン製 造株式会社内 (56)参考文献 特開 平6−21036(JP,A) 特開 平6−132272(JP,A) 実公 昭62−10438(JP,Y1) (58)調査した分野(Int.Cl.7,DB名) H01L 21/304 648 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenji Amaku, Kenji Ameku, 1-chome, Tenjin Kita-cho, 4-chome Tenjin Kita-cho, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto (56) -21036 (JP, A) JP-A-6-132272 (JP, A) JP 62-10438 (JP, Y1) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/304 648

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 処理液を貯留して基板を浸漬させる処理
槽と、この処理槽内の処理液を排出可能な排液通路とを
備え、この排液通路を通じて、使用済みの処理液を廃液
回収設備に排出可能となっている基板処理装置におい
て、上記処理槽内の処理液を排出可能な補助排液通路
と、水流によって液体を吸引するアスピレータとを設
け、上記補助排液通路をアスピレータの吸入口に連通接
続するとともに、上記廃液回収設備に異常が生じたとき
に、上記処理槽内の処理液を補助排液通路に導入させる
排出流路切換え手段を設けたことを特徴とする基板処理
装置。
1. A treatment tank for storing a treatment liquid to immerse a substrate, and a drainage passage capable of discharging the treatment liquid in the treatment tank. The used treatment liquid is drained through the drainage passage. In a substrate processing apparatus that can be discharged to a recovery facility, an auxiliary liquid discharge passage that can discharge the processing liquid in the processing tank and an aspirator that sucks the liquid by a water flow are provided, and the auxiliary liquid discharge passage is connected to the aspirator. Substrate processing characterized in that it is connected to the suction port and is provided with a discharge flow path switching means for introducing the processing liquid in the processing tank into the auxiliary discharge passage when an abnormality occurs in the waste liquid recovery equipment. apparatus.
【請求項2】 処理液を貯留して基板を浸漬させる処理
槽と、この処理槽内の処理液を排出可能な排液通路とを
備え、この排液通路を通じて、使用済みの処理液を廃液
回収設備に排出可能となっているとともに、上記排液通
路又は廃液回収設備の少なくとも一方側に設けられる冷
却設備により使用済みの処理液を冷却する基板処理装置
において、上記処理槽内の処理液を排出可能な補助排液
通路と、水流によって液体を吸引するアスピレータとを
設け、上記補助排液通路をアスピレータの吸入口に連通
接続するとともに、上記冷却設備に異常が生じたとき
に、上記処理槽内の処理液を補助排液通路に導入させる
排出流路切換え手段を設けたことを特徴とする基板処理
装置。
2. A processing bath for storing the processing liquid and immersing the substrate therein, and a drainage passage capable of discharging the processing liquid in the treatment bath. Through the drainage passage, the used processing liquid is drained. In the substrate processing apparatus that is capable of discharging to the recovery facility and cools the used processing liquid by the cooling facility provided on at least one side of the drainage passage or the waste liquid recovery facility, the processing liquid in the processing bath is An auxiliary drainage passage that can be discharged and an aspirator that sucks the liquid by a water flow are provided, the auxiliary drainage passage is connected to the suction port of the aspirator, and when an abnormality occurs in the cooling facility, the processing tank A substrate processing apparatus comprising: a discharge flow path switching means for introducing the processing liquid therein into an auxiliary discharge passage.
【請求項3】 上記排液通路から流路分岐させることに
より上記補助排液通路を構成したことを特徴とする請求
項1又は2記載の基板処理装置。
3. The substrate processing apparatus according to claim 1, wherein the auxiliary drainage passage is formed by branching the flow path from the drainage passage.
【請求項4】 上記冷却設備として、上記補助排液流路
の分岐部分と処理槽との間に、上記排液通路を通じて排
出される処理液を貯留可能なタンクを設けるとともに、
このタンク内の処理液を冷却するための冷却媒体の通路
を設けたことを特徴とする請求項3記載の基板処理装
置。
4. As the cooling facility, a tank capable of storing the processing liquid discharged through the drainage passage is provided between the branch portion of the auxiliary drainage flow path and the processing tank,
4. The substrate processing apparatus according to claim 3, further comprising a cooling medium passage for cooling the processing liquid in the tank.
JP34374898A 1998-12-03 1998-12-03 Substrate processing equipment Expired - Lifetime JP3517135B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34374898A JP3517135B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34374898A JP3517135B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JP2000173973A JP2000173973A (en) 2000-06-23
JP3517135B2 true JP3517135B2 (en) 2004-04-05

Family

ID=18363940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34374898A Expired - Lifetime JP3517135B2 (en) 1998-12-03 1998-12-03 Substrate processing equipment

Country Status (1)

Country Link
JP (1) JP3517135B2 (en)

Also Published As

Publication number Publication date
JP2000173973A (en) 2000-06-23

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