JP2000173427A5 - - Google Patents
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- Publication number
- JP2000173427A5 JP2000173427A5 JP1998344216A JP34421698A JP2000173427A5 JP 2000173427 A5 JP2000173427 A5 JP 2000173427A5 JP 1998344216 A JP1998344216 A JP 1998344216A JP 34421698 A JP34421698 A JP 34421698A JP 2000173427 A5 JP2000173427 A5 JP 2000173427A5
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- resistor
- protective device
- fixed
- soluble alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 22
- 239000000956 alloy Substances 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 20
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 20
- 230000001681 protective Effects 0.000 description 17
- 239000000155 melt Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10344216A JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10344216A JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000173427A JP2000173427A (ja) | 2000-06-23 |
| JP2000173427A5 true JP2000173427A5 (US06168655-20010102-C00055.png) | 2006-01-19 |
Family
ID=18367540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10344216A Pending JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000173427A (US06168655-20010102-C00055.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5586380B2 (ja) * | 2009-11-28 | 2014-09-10 | 京セラ株式会社 | 抵抗温度ヒューズパッケージおよび抵抗温度ヒューズ |
| JP6231324B2 (ja) * | 2013-08-07 | 2017-11-15 | デクセリアルズ株式会社 | 保護回路基板 |
| US10032583B2 (en) | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
-
1998
- 1998-12-03 JP JP10344216A patent/JP2000173427A/ja active Pending
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