JP2000173427A - 保護装置組立構体および保護装置 - Google Patents
保護装置組立構体および保護装置Info
- Publication number
- JP2000173427A JP2000173427A JP10344216A JP34421698A JP2000173427A JP 2000173427 A JP2000173427 A JP 2000173427A JP 10344216 A JP10344216 A JP 10344216A JP 34421698 A JP34421698 A JP 34421698A JP 2000173427 A JP2000173427 A JP 2000173427A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- fusible alloy
- insulating substrate
- substrate
- protective device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 73
- 230000001681 protective effect Effects 0.000 claims description 53
- 238000002844 melting Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 239000003566 sealing material Substances 0.000 description 13
- 230000004907 flux Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10344216A JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10344216A JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000173427A true JP2000173427A (ja) | 2000-06-23 |
| JP2000173427A5 JP2000173427A5 (https=) | 2006-01-19 |
Family
ID=18367540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10344216A Pending JP2000173427A (ja) | 1998-12-03 | 1998-12-03 | 保護装置組立構体および保護装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000173427A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134700A (ja) * | 2009-11-28 | 2011-07-07 | Kyocera Corp | 抵抗温度ヒューズパッケージおよび抵抗温度ヒューズ |
| JP2015035280A (ja) * | 2013-08-07 | 2015-02-19 | デクセリアルズ株式会社 | 保護回路基板 |
| US10032583B2 (en) | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
-
1998
- 1998-12-03 JP JP10344216A patent/JP2000173427A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134700A (ja) * | 2009-11-28 | 2011-07-07 | Kyocera Corp | 抵抗温度ヒューズパッケージおよび抵抗温度ヒューズ |
| JP2015035280A (ja) * | 2013-08-07 | 2015-02-19 | デクセリアルズ株式会社 | 保護回路基板 |
| US10032583B2 (en) | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051125 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051125 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080319 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080509 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090106 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090304 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090324 |