JP2000153463A - Manufacture of electrodeposition tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain abrasion of a polishing pad, to uniformly keep surface state of the pad, and to reduce falling-off of abrasive grains by temporarily fixing the abrasive grains on a dotted adhesive after applying an adhesive in a plural-dot shape to the action surface of base metal, to plate such a temporarily fixed abrasive gain group for securing. SOLUTION: An adhesive 2 is applied in a plural dot shape with a desired interval on the action surface of base metal 1, for example, by a screen printing method. Next, abrasive grains 3 are temporarily fixed on the respective dotted adhesives 2. Next, a metallic plating layer 4 is formed by plating to secure the abrasive grains 3. Afterwards, when necessary, the metallic plating layer 4 is covered with a resin layer 5 by an electrodeposition coating method. Thus, abrasion of a polishing pad for CMP can be particularly restrained, a surface state of the pad can be always held constant so as to obtain a desired polishing speed, falling-off of the abrasive grains is reduced, and mesh-clogging of the pad can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method for manufacturing an electrodeposition tool. More specifically, the present invention has a low abrasive grain density, little clogging during grinding, and can arbitrarily adjust the processing efficiency. For example, including conditioning of a polishing pad for CMP, plastic, glass, metal The present invention relates to a method for efficiently manufacturing an electrodeposition tool used for grinding of ceramics and the like.

[0002]

2. Description of the Related Art Conventionally, there has been an electrodeposition tool in which superabrasive grains such as diamond and cBN (cubic boron nitride) are placed on the surface of an electrically conductive base metal and firmly held by electrodeposition nickel plating or the like. Are known. Since such an electrodeposition tool can perform high-efficiency grinding, it can be used in various applications such as CMP.
Including conditioning of polishing pad for (chemical mechanical polishing), plastic,
It is used for grinding of glass, metal, ceramics, etc. However, in such an electrodeposition tool, when the abrasive grain density is high, for example, the height of the abrasive layer is 20 to 3 mm.
When about 0% of the abrasive grains are worn, the grinding resistance is significantly increased and the life may be shortened. Therefore, in order to solve such a problem, for example, the surface of the base metal is subjected to masking of an electrical insulator having a non-masking portion, and abrasive grains are electrodeposited on the non-masking portion, thereby reducing the abrasive grain fixing area. Let
A method for producing an electrodeposited grindstone with a reduced abrasive grain density has been proposed (JP-A-57-66864, JP-A-5-285).
No. 846). However, in these methods, a complicated operation is required to perform the masking of the electrical insulator having the non-masking portion on the surface of the base metal, and after the abrasive grains are fixed to the non-masking portion by electrodeposition, A step of removing masking by immersion in a solvent or the like is required, resulting in poor productivity and unavoidable increase in cost. In general, in a wafer processing apparatus for polishing the surface of a semiconductor wafer, a polishing polishing pad is attached on a disk-shaped surface plate, and one or more wafers are placed on the surface of the surface plate. Chemical mechanical polishing is performed by supplying fine abrasive particles and a polishing liquid between the polishing pad and the wafer while forcibly rotating the polishing pad with a carrier, and performing chemical mechanical action at the interface. As the polishing pad, a velor-type pad in which a polyester nonwoven fabric is impregnated with a polyurethane resin, a suede-type pad in which a foamed polyurethane layer is formed on a polyester nonwoven fabric as a base material, or a foamed polyurethane pad having closed cells, and the like. These multilayer structures are used. The abrasive particles are selected from iron oxide, alumina, barium carbonate, cerium oxide, colloidal silica, and the like. The polishing liquid is an alkaline solution such as a potassium hydroxide solution, an acidic solution such as dilute hydrochloric acid, and furthermore. It is appropriately selected from a hydrogen oxide solution, an aqueous solution of iron nitrate, and the like according to the type of the object to be polished. For example, when polishing an oxide film of silicon, colloidal silica or the like is usually used as abrasive particles, and an alkaline solution is used as a polishing solution.
On the other hand, when polishing a metal film such as tungsten, copper, or aluminum, an acidic solution is usually used as a polishing liquid. As these wafers are repeatedly polished, abrasive particles and debris enter the fine holes of the polishing pad and cause clogging, and the heat of the chemical reaction between the abrasive particles and the polishing liquid causes the surface of the polishing pad to be mirror-finished. As a result, the polishing rate decreases. For this reason, it is necessary to constantly or regularly perform an operation called conditioning, which regenerates the polishing pad surface to recover the polishing rate, and a tool called a CMP conditioner is used for such an operation. . Diamond abrasive grains are excellent conditioning materials, and conditioning of polishing pads for polishing semiconductor wafers using diamond abrasive grains has been put to practical use. For such a conditioner for a polishing pad for CMP, the wear of the polishing pad can be suppressed as much as possible, and the surface state of the pad can be kept constant so that a desired polishing rate can always be obtained. It is required that the abrasive grains do not fall off and that the pads are not clogged. In the conditioner of the conventional polishing pad for CMP, in order to prevent the abrasive grains from falling off during use, the abrasive grains are firmly fixed by nickel plating by electrodeposition, etc. Measures have been taken to remove unstable abrasive grains. However,
The conditioner of the conventional polishing pad for CMP has disadvantages such as the pad density being too high, the pad being deformed at the time of conditioning, the regenerating efficiency of the pad surface being poor, and the performance being uneven. are doing.

[0003]

SUMMARY OF THE INVENTION Under such circumstances, the present invention can reduce the wear of a polishing pad as much as possible, and can always obtain a desired polishing rate by controlling the surface condition of the pad. The purpose of the present invention is to provide a method for efficiently manufacturing an electrodeposition tool suitable as a conditioner for a polishing pad for CMP, which can keep the abrasive grains at a constant level, causes less abrasive grains to fall off, and hardly causes clogging of the pad. It was done.

[0004]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, in the conditioner of the polishing pad for CMP, a part of the polishing pad surface is not regenerated. Focusing on the fact that only the abrasive grains contributed effectively, it was found that by keeping the abrasive grain density low, an electrodeposition tool having desired performance suitable as a conditioner for a polishing pad for CMP could be obtained. In the conventional method for lowering the abrasive grain density, the operation is complicated and the productivity is low. As a result of further research to develop, first, an adhesive was applied to the working surface of the base metal by screen printing etc. in a plurality of dots with desired intervals, and abrasive grains were temporarily fixed to this Thereafter, it has been found that the above object can be achieved and the processing efficiency can be arbitrarily adjusted by fixing by plating. The present invention has been completed based on such findings. That is, the present invention provides (1) a method in which an adhesive is applied to a working surface of a base metal in a plurality of dots having a desired interval, and abrasive grains are temporarily fixed on each of the dot adhesives, and then temporarily fixed. A method for manufacturing an electrodeposited tool, comprising fixing the group of abrasive grains by plating,
(2) The method for manufacturing an electrodeposited tool according to (1), wherein the temporarily fixed abrasive grains are fixed by plating, and the metal part is further covered with a resin layer. (3) Temporarily fixed on a point-like adhesive. In fixing the obtained abrasive grains by plating, a second step (1) in which abrasive grains having a smaller diameter than the abrasive grains are further fixed in the gaps between the abrasive grains.
Or (2) the method for producing an electrodeposited tool according to (2) or (4), wherein the electrodeposited tool is used as a conditioner for a polishing pad for CMP. The production method, and (5) the projected area of the abrasive grains temporarily fixed on the point adhesive is 2.5 to 45% with respect to the working area of the tool.
(4) The method for producing an electrodeposited tool according to the above (4). In a preferred aspect of the present invention, (6) the first (1), (2), (3), or (2) in which an adhesive is applied to the working surface of the base metal by screen printing in a plurality of dots having desired intervals.
(4) The method for producing an electrodeposited tool according to (5), and (7).
Abrasive grains are diamond abrasive grains and / or cBN abrasive grains
(1), (2), (3), (4), (5) and (6).

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of manufacturing an electrodeposited tool according to the present invention, first, an adhesive is applied on a working surface of a base metal in a plurality of dots having desired intervals. At this time, the material of the base metal to be used is not particularly limited, and can be appropriately selected from those made of a conductive material which is conventionally used in electrodeposition tools and which can be plated. Examples of such a base include those made of metals and alloys such as stainless steel, tungsten, titanium, and molybdenum. Also, the shape of the base metal is not particularly limited, and can be appropriately selected according to the use of the obtained electrodeposition tool. The adhesive to be applied on the working surface of the base metal is not particularly limited as long as it can temporarily fix abrasive grains described below, and is not particularly limited, and various adhesives such as an epoxy-based thermosetting adhesive and an ultraviolet-curable adhesive can be used. An adhesive or the like can be used, but an epoxy-based thermosetting adhesive is preferable in terms of temporary fixability and handleability. Note that a conductive adhesive can also be preferably used. In the present invention, on the working surface of the base metal, this adhesive is applied in a plurality of dots, but there is no particular limitation on the interval between each point-like adhesive, the application of the obtained electrodeposition tool,
It can be appropriately selected according to the use method, use conditions, and the like. The method of applying the adhesive is not particularly limited as long as it can be applied in a plurality of dots having a desired interval, and it is advantageous to apply the adhesive by screen printing from the viewpoint of workability and the like. It is. As for the size of the point-like adhesive, it is ideal to temporarily fix one abrasive grain to one point-like adhesive, as described later. %, Preferably 35 to 45%. In the method of the present invention,
Thus, the abrasive grains are temporarily fixed on the point-like adhesive applied on the working surface of the base metal. In this case, it is ideal to temporarily fix one abrasive grain to each point adhesive,
Preferably, 50% or more, more preferably 70% or more, and even more preferably 80% or more of the total number of the point-like adhesives temporarily fix one abrasive grain, so that a plurality of the point-like adhesives partially cover one point-like adhesive. May be temporarily fixed. The abrasive is not particularly limited, and examples thereof include sapphire, ruby, garnet, silicon carbide, boron carbide, natural diamond, synthetic diamond, and cBN. Among these, diamond abrasive grains and cBN abrasive grains can be suitably used because they have high hardness and excellent wear resistance. When the electrodeposition tool manufactured by the method of the present invention is used as a conditioner for a polishing pad for CMP, it is preferable that the abrasive grains are diamond abrasive grains, and a grain size of 230 defined in JIS B 4130.
More preferably, it is a diamond abrasive having a particle size of / 270 to 30/40. When the particle size of the abrasive grains is in the above range, the wear of the surface of the polishing pad for CMP can be suppressed, and the surface can be reproduced in a preferable state.

The electrodeposited tool obtained by the method of the present invention is C
When used as a conditioner for an MP polishing pad, the projected area of the abrasive grains temporarily fixed on the point adhesive is preferably 2.
When it is in the range of 5 to 45%, more preferably 5 to 30%, particularly preferably 10 to 25%, it is advantageous because the surface of the polishing pad for CMP can be efficiently regenerated.
Next, the group of abrasive grains temporarily fixed on each point adhesive is fixed by plating. The method for fixing the abrasive grains by plating is not particularly limited, and a conventionally known method can be used. For example, after covering the non-working surface of the base metal on which the abrasive grains are temporarily fixed with an insulating masking material, this is immersed in a plating bath solution containing metal ions such as copper, chromium, nickel, etc. By connecting a cathode and connecting an anode to a plating bath solution and energizing, the abrasive grain fixed surface is plated, the abrasive grains are fixed, and an abrasive grain layer is formed. As metal ions in the plating bath, nickel ions are preferable from the viewpoint of hardness and the like.In this case, as the plating bath, a nickel plating bath such as a nickel sulfamate bath or a Watt bath can be used. A nickel sulfamate bath solution is preferred in view of the strain and internal stress of nickel to be plated. The current density is not particularly limited, but is usually 0.1 to 20.
A / dm ² . When a nickel sulfamate bath is used as a plating bath solution, the hardness of nickel is HV40.
The elongation percentage is about 0 to 600 and the elongation is about 1 to 5%, and the nickel fixing layer has sufficient toughness. The thickness of the plating layer to which the abrasive grains are fixed is preferably 40% or more, more preferably 50% or more, of the grain size of the abrasive grains. If the thickness of the plating layer is less than 40% of the grain size of the abrasive grains, there is a possibility that the force for holding the abrasive grains is insufficient. After forming the abrasive layer, the masking material is peeled off and removed. In the present invention, for the purpose of improving the performance of the obtained electrodeposited tool, if desired, at the time of the plating treatment, an abrasive having a smaller diameter than the abrasive is provided in the gap between the abrasives on the point-like adhesive. Can be placed and fixed by plating. When the electrodeposited tool having the abrasive layer formed in this manner is used as a conditioner for a polishing pad for CMP, an alkaline solution is used as a polishing liquid if the applied polishing pad is for polishing a silicon oxide film. Therefore, the electrodeposition tool may be used as it is. However, if the polishing pad to be applied is for a metal film, an acidic solution is used as a polishing solution, so that if the electrodeposition tool is used as it is, metal plating may be eluted. Therefore, in such a case, it is advantageous to further cover the metal portion formed by plating as described above with a resin layer.

The method of coating with the resin layer is not particularly limited, and can be appropriately selected from conventionally known methods. Particularly, the metal part of the working surface is coated with the resin layer by an electrodeposition coating method. It is preferable to coat with. The coating of the resin layer by the electrodeposition coating method can be applied only to the metal portion of the working surface, or, if necessary, to the metal portion other than the working surface of the conditioner. According to the electrodeposition coating method, since the throwing power of the resin is good, minute gaps between the abrasive grains fixed to the working surface are surely covered with the resin layer. In addition, the thickness of the resin layer can be quantitatively controlled by the amount of electricity to be energized, and since the thickness of the resin layer is uniform and there is no difference depending on the place, the protrusion amount of the abrasive grains is set high and strictly. Can be controlled. Furthermore, since the resin adheres only to the metal portion and the non-conductive abrasive particles are not covered with the resin layer, there is no need to perform lithography. The electrodeposition coating method is not particularly limited, and any of an anionic electrodeposition coating method and a cationic electrodeposition coating method can be used. As the paint used in the anionic electrodeposition coating method,
For example, an acrylic resin in which a monomer having a carboxyl group such as acrylic acid and a monomer having a hydroxyl group such as hydroxyethyl acrylate are copolymerized with an acrylic resin, and a carboxyl group such as acrylic acid, In addition to side-chain fluororesins in which monomers and fluoroalkyl esters of acrylic acid are copolymerized, and fluororesins in which fine particles such as polyfluoroethylene are dispersed, maleated oils and maleated fatty acids Ester, a paint using maleated polybutadiene as a raw material, and the like. The carboxyl group contributes to the water-solubility of the resin by being neutralized with the organic base, and the hydroxyl group condenses with the amino resin as a crosslinking component and contributes to the curing of the coating film. Examples of the paint used in the cationic electrodeposition coating method include an epoxy resin in which an amine is added to an epoxy resin, neutralized with an acid, and a blocked isocyanate is bonded. The coating film is cured by the reaction between the amino group and the isocyanate group. Among the anion-type electrodeposition coating method and the cationic-type electrodeposition coating method, the anion-type electrodeposition coating method can be more suitably used because of good workability. Also, among the anionic electrodeposition coatings, acrylic resin coatings form a resin layer having excellent strength, adhesion and chemical resistance, and fluorine-based resin coatings are non-adhesive, have a low friction coefficient, and are repellent. Since a resin layer having excellent water and oil repellency is formed, it can be particularly preferably used.

A predetermined amount of electricity is supplied by immersion in an electrodeposition tank,
After a resin is adhered to the metal portion of the working surface to a predetermined thickness, washing is performed with water. Since the resin adhered to the metal part by electrodeposition no longer has water solubility, it can be washed with a spray of washing water. The metal part of the working surface is covered with a resin layer, washed with water and baked. By baking, a crosslinking reaction of the resin proceeds, and a resin layer having excellent adhesion and high strength can be obtained. There are no particular restrictions on the baking conditions, and the optimum conditions can be selected for each resin.
By performing baking for about 0 minutes, a strong resin layer can be formed. In the method of the present invention, the thickness of the resin layer covering the metal part on the working surface is 10 to 100 μm.
And more preferably 30 to 80 μm. If the thickness of the resin layer is less than 10 μm, the coating may be incomplete and the metal may elute from the working surface. If the thickness of the resin layer exceeds 100 μm, the amount of protrusion of the abrasive grains decreases, and the sharpness as a conditioner may be reduced. Next, an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a partial cross-sectional view for explaining an example of the steps of the method of the present invention. In the method of the present invention, first, FIG. As shown in (), the adhesive 2 is applied to the working surface of the base 1 by a method such as screen printing, for example, in a plurality of dots having desired intervals. Then
As shown in FIG. 1B, abrasive grains 3 are temporarily fixed on each of the point-like adhesives 2. Next, as shown in FIG. 1C, a metal plating layer 4 is formed by plating, and the abrasive grains 3 are fixed. Thereafter, if necessary, as shown in FIG. 1D, the metal plating layer 4 is coated with a resin layer 5 by an electrodeposition coating method or the like. FIG. 2 is a partial cross-sectional view of one example of an electrodeposition tool manufactured by the method of the present invention. When the abrasive grains 3 are fixed by plating, the small-diameter abrasive grains 6 are fixed in the gaps between the three abrasive grains. The structure is shown. FIG. 3 is a perspective view of one example of an electrodeposited tool manufactured by the method of the present invention. In this electrodeposited tool, abrasive grains are fixed to the working surface of a cup-shaped base metal 1 and an abrasive layer 3 ′. Is formed.

[0009]

EXAMPLES Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. Example 1 Dimensions of 120D-8W-20T stainless steel (SUS
440) An epoxy-based thermosetting adhesive is screen-printed on the working surface of the base metal by screen printing, and diamond abrasive grains having a particle size of about 60 and an average particle size of 250 μm are substantially formed on each of the dot-shaped adhesives. The upper one was temporarily fixed. The density of the diamond abrasive grains was 245 / cm ² , and the projected area of the abrasive grains temporarily fixed on the point adhesive was 12% with respect to the working area of the tool. Next, the non-working surface of the metal base was masked with an insulating tape and a paint. Next, nickel chloride 240 g / liter and hydrochloric acid 100 g
/ L is immersed in a pretreatment liquid containing a pretreatment liquid and set on the anode side, and subjected to electrolytic etching at a current density of 10 A / dm ² at room temperature for 30 seconds. Then, the base metal is set on the cathode side. Strike plating was performed for 2 minutes. Next, a current density of 1 A /
Plating was performed at dm ² for 15 minutes, and further plating was performed at a current density of 0.5 A / dm ² for 20 hours in the same nickel sulfamate plating bath, plating was performed to a thickness of about 125 μm, and diamond abrasive grains were fixed. In this way, the masking of the base metal to which the diamond abrasive grains were fixed was peeled off, washed with water, and dried to obtain an electrodeposited tool having a diamond abrasive grain layer. Using the obtained electrodeposition tool, conditioning of the polishing pad for CMP was performed. Using a polishing machine [ECOMET4, manufactured by Buehler Co., Ltd.], a polishing pad [IC-1000, manufactured by Rodel-Nitta] and a polishing liquid [Semi-Sparse SS-25], a load of 34.3 k.
Conditioning was performed for 5 minutes under the conditions of Pa, a pad rotation speed of 100 min ^-1 , and a conditioner rotation speed of 56 min ^-1 . Next, the process proceeds to CMP, using quartz glass as a work material,
Using a polishing liquid [Semi-Sparse SS-25], load 3
4.3 kPa, pad rotation speed 100 min ^-1 , work material rotation speed 5
CMP was performed for 2 minutes under the condition of 6 min ^-1 . Thereafter, in the same manner, conditioning and polishing of the wafer were alternately repeated 10 times, and the average value of the pad conditioning speed and the average value of the wafer polishing speed were obtained.
Table 1 shows the results. Comparative Example 1 Stainless steel with dimensions of 120D-8W-20T (SUS
440) The surface was masked with an insulating tape and paint, leaving the diamond abrasive grain fixed surface of the base metal. The base metal was subjected to alkaline degreasing treatment, immersed in a pretreatment liquid containing 240 g / liter of nickel chloride and 100 g / liter of hydrochloric acid, and set at the current density of 10 A / dm ² at normal temperature on the anode side and electrolyzed for 2 minutes. After etching, a base metal was set on the cathode side, and strike plating was performed for 3 minutes. Then, a current density of 1 A /
Plating was performed at dm ² for 15 minutes to form a base plating layer of 3 μm. A diamond abrasive having a grain size of # 60 and an average particle size of 250 μm was placed on the diamond abrasive fixed surface, and a current density of 0.5 A / A was used using a nickel sulfamate plating bath to which an additive for adjusting plating stress and hardness was added. Plating was performed at dm ² for 3 hours, and one layer of diamond abrasive grains was temporarily fixed. Excessive diamond abrasive particles are washed off and current density is 1A / dm
After performing burying plating for ² hours at # ² , a # 100 alumina grindstone was applied to remove diamond abrasive grains serving as floating stones. Next, the base metal was immersed in a pretreatment liquid containing 240 g / liter of nickel chloride and 100 g / liter of hydrochloric acid, and was set on the anode side, and the current density was 10 A / dm ^2.
Then, the base metal was set on the cathode side and strike plating was performed for 2 minutes. Next, a current density of 1 A /
Plating was performed at dm ² for 15 minutes, and further plating was performed at a current density of 0.5 A / dm ² for 15 hours in the same nickel sulfamate plating bath, and plating was performed to a thickness of about 125 μm to fix diamond abrasive grains. In this way, the masking of the base metal to which the diamond abrasive grains were fixed was peeled off, washed with water, and dried to obtain an electrodeposited tool having a diamond abrasive grain layer. Using the obtained electrodeposition tool, conditioning of the polishing pad for CMP and CMP were performed in the same manner as in Example 1. Thereafter, in the same manner,
Conditioning and polishing of the wafer were alternately repeated 10 times each, and the average value of the pad conditioning speed and the average value of the wafer polishing speed were obtained. Table 1 shows the results.

[0010]

[Table 1]

Example 2 The same operation as in Example 1 was performed, and the diamond was formed by plating.
The abrasive grains were fixed. In this way diamond abrasive
Peel off the masking of the base metal with the
After that, an anionic acrylic resin paint [Shimizu Co., Ltd.]
Electrodeposition coating using Elecoat AM-1].
This paint is placed in an electrodeposition tank and kept at 35 ° C. with stirring.
Immerse the base metal with diamond abrasive grains fixed on the working surface,
125V, initial current density 0.2A / dm^Two, End current density
0.02A / dm^Two, Electrodeposition coating under the condition of 4 minutes
Was. Raise the base metal from the electrodeposition tank and wash it with industrial water.
After performing twice, wash with deionized water, dry,
Was. Further, bake at 180 ° C. for 20 minutes in the air atmosphere.
The coating is completely cured and the resin layer
Was formed to obtain an electrodeposition tool. The thickness of the resin layer is 60 μm
And the protrusion of diamond abrasive grains is about 65 μm.
Was. Polishing for CMP using the obtained electrodeposition tool
Pad conditioning was performed. Polishing machine [View
ECOMMET4], polishing pad [b
-IC-1000, manufactured by Del Nitta Co., Ltd.]
Iron acid (pH 1.5) + alumina] with a load of 29.4 kP
a 、 Pad rotation speed 100min^-1, Conditioner rotation speed 5
6min^-1Condition for 3 minutes under the conditions of
Was. Then, it moves to CMP, and the silicon of the tungsten wiring
Polishing liquid [iron nitrate (pH 1.5)
+ Alumina], load 34.3kPa, pad rotation speed
100min ^-1, Tungsten wiring silicon wafer times
Turn number 56min^-1Was performed for 3 minutes under the conditions described above. Since
Similarly, exchange conditioning and wafer polishing.
Repeat with each other 10 times, pad condition
Average polishing speed and average wafer polishing speed
I did. Table 2 shows the results. Comparative Example 2 The same operation as in Comparative Example 1 was performed, and the diamond was formed by plating.
The abrasive grains were fixed. In this way diamond abrasive
Peel off the masking of the base metal with the
Thereafter, the resin layer is formed in the same manner as in Example 2.
To obtain an electrodeposition tool. Performed using the obtained electrodeposition tool
Condition of polishing pad for CMP in the same manner as in Example 2.
And CMP was performed. Since then
Conditioning and wafer polishing alternately
Repeat 10 times each for the pad condition
Calculate the average value of the polishing speed and the average value of the wafer polishing speed
Was. Table 2 shows the results.

[0012]

[Table 2]

Example 3 A stainless steel having a size of 120D-8W-20T (SUS
440) An epoxy-based thermosetting adhesive is applied to the working surface of the base metal in a dot-like manner by screen printing, and then substantially one diamond abrasive having a grain size of # 60/80 is placed on each of the dot-like adhesives. Each was temporarily fixed. Next, the non-working surface of the metal base was masked with an insulating tape and a paint. Next, nickel chloride 240 g / liter and hydrochloric acid 100 g
/ L is immersed in a pretreatment liquid containing a pretreatment liquid and set on the anode side, and subjected to electrolytic etching at a current density of 10 A / dm ² at room temperature for 30 seconds. Then, the base metal is set on the cathode side. Strike plating was performed for 2 minutes. Next, in a nickel sulfamate plating bath, particle size # 100
/ 120 small diameter diamond abrasive grains are placed on the base metal,
Plating was performed at a current density of 0.5 A / dm ² for 2 hours, and the small-diameter diamond abrasive grains were temporarily fixed. After removing the non-fixed small-diameter diamond abrasive grains, plating was performed in the same nickel sulfamate plating bath at a current density of 0.5 A / dm ^{2 for} 18 hours to fix each diamond abrasive grain. The masking of the base metal to which the diamond abrasive grains were fixed was peeled off, washed with water, and dried to obtain an electrodeposited tool having a diamond abrasive grain layer as shown in FIG.

[0014]

According to the method of the present invention, in particular, the wear of the polishing pad for CMP can be suppressed as much as possible, and the surface condition of the pad can be kept constant so as to always obtain a desired polishing rate. An electrodeposition tool suitable as a conditioner for a polishing pad for CMP, in which abrasive grains are less likely to fall off and hardly cause clogging of the pad, can be efficiently and industrially advantageously produced. The electrodeposition tool obtained by the method of the present invention is suitably used not only as a conditioner for the polishing pad for CMP but also for grinding plastics, glass, metal, ceramics and the like.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view for explaining one example of the steps of the method of the present invention.

FIG. 2 shows one of the electrodeposited tools manufactured by the method of the present invention.
It is a partial sectional view of an example.

FIG. 3 shows one of the electrodeposition tools produced by the method of the present invention.
It is a perspective view of an example.

[Explanation of symbols]

 1 base metal 2 point adhesive 3 abrasive grains 3 'abrasive layer 4 metal plating layer 5 resin layer 6 small diameter abrasive grains

Continued on the front page (72) Inventor Yasunori Murata 787 Tao, Ichihara-shi, Chiba Prefecture Asahi Diamond Industrial Co., Ltd. Chiba Tsurumai Plant F-term (reference) 3C063 AA02 AB05 BA37 BB24 BH03 CC13 EE40 FF23

Claims (5)

[Claims] 1. An adhesive is applied to a working surface of a base metal in a plurality of dots having a desired interval, and abrasive grains are temporarily fixed on each of the point-like adhesives. A method for manufacturing an electrodeposited tool, comprising fixing a group by plating. 2. The method for manufacturing an electrodeposited tool according to claim 1, wherein the temporarily fixed abrasive grains are fixed by plating, and then a metal portion is covered with a resin layer. 3. The method according to claim 1, wherein when the abrasive grains temporarily fixed on the point-like adhesive are fixed by plating, abrasive grains having a smaller diameter than the abrasive grains are further fixed in gaps between the abrasive grains. 2
A method for producing the electrodeposited tool described in the above. 4. The method for producing an electrodeposited tool according to claim 1, wherein the electrodeposited tool is used as a conditioner for a polishing pad for CMP. 5. The method for producing an electrodeposited tool according to claim 4, wherein the projected area of the abrasive grains temporarily fixed on the point adhesive is 2.5 to 45% with respect to the working area of the tool.