KR20170080207A - The polishing pad for polishing a polishing pad manufactured by the method and a method for polishing - Google Patents

The polishing pad for polishing a polishing pad manufactured by the method and a method for polishing Download PDF

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Publication number
KR20170080207A
KR20170080207A KR1020150191509A KR20150191509A KR20170080207A KR 20170080207 A KR20170080207 A KR 20170080207A KR 1020150191509 A KR1020150191509 A KR 1020150191509A KR 20150191509 A KR20150191509 A KR 20150191509A KR 20170080207 A KR20170080207 A KR 20170080207A
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KR
South Korea
Prior art keywords
plating layer
fabric
abrasive
polishing
polishing pad
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Application number
KR1020150191509A
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Korean (ko)
Inventor
최정열
Original Assignee
최정열
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Publication date
Application filed by 최정열 filed Critical 최정열
Priority to KR1020150191509A priority Critical patent/KR20170080207A/en
Publication of KR20170080207A publication Critical patent/KR20170080207A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention relates to a polishing pad for a polishing disk and a polishing pad for a polishing disk manufactured by the method. The polishing pad detachably attached to the front surface of the polishing wheel through a Velcro tape is fixed on a fabric woven with Teflon It is an object of the present invention to reduce manufacturing cost by manufacturing a pattern by attaching an abrasive through masking and electroplating. A method of manufacturing a polishing pad detachably attached to a front surface of a polishing wheel constituting a polishing disk through a Velcro tape, comprising the steps of: (a) forming a pattern on a surface of a fabric woven by weaving and weaving Masking; (b) depositing a patterned masked pattern on the metal plate to coat the unmasked surface of the fabric with electroplating to form a primary metal plating layer; (c) spraying the abrasive on top of the plated primary metal plating layer on the fabric of the step (b); (d) attaching the abrasive to the primary metal plating layer by fixing the abrasive agent on the primary metal plating layer by forming a secondary metal electrodeposition layer through the secondary electrodeposition with the abrasive agent dispersed in the step (c); (e) attaching and fixing the Velcro tape to the back side of the fabric to which the abrasive of step (d) is adhered; And (f) cutting the fabric to which the velcro tape of the step (e) is attached and fixed according to the shape and size of the grinding wheel.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad for a polishing disk and a polishing pad for a polishing disk,

The present invention relates to a polishing pad for a polishing disk, and more particularly, to a polishing pad for a polishing disk, in which a polishing pad detachably attached to a front surface of a polishing wheel through a Velcro tape is fixed on a fabric woven with Teflon yarn by a certain pattern of masking and electroplating To a polishing pad for a polishing disk and a polishing pad for a polishing disk manufactured by the manufacturing method.

Generally speaking, polishing refers to smoothing the surface of a solid to the edges or surface of another solid, which is an abrasive (a very hard material that is mostly used to polish stones or metal). So that the surface of the object to be processed is smoothed.

In order to use the above-described abrasive, a polishing machine may be used to carry out a polishing operation by manually carrying out a polishing operation such as a manual polishing of an abrasive paper, or to polish a large amount of articles in a short time to obtain a high level of smoothness.

On the other hand, a most common type of grinding machine is a hand grinder configured to easily grasp by hand. Such a grinder is composed of a grinding machine body, a driving motor formed on the grinding machine body, and a grinding disk mounted on a driving shaft of the driving motor The polishing operation is performed by the polishing disk when the polishing disk is rotated by driving the driving motor.

The polishing disk according to the related art as described above is disclosed in the Utility Model No. 1998-059542, wherein the other surface of the polishing pad having the abrasive on one side can be detachably attached to the front surface of the disk holder through the Velcro tape . The surface of the object to be polished is polished according to the contact between the object to be polished and the polishing pad of the polishing pad when the disc holder is rotated.

However, in the conventional process of manufacturing the polishing pad as described above, the process of pre-treating the metal cloth or the copper foil, the process of masking the predetermined pattern on the surface of the pretreated metal cloth or the copper foil, A process of attaching the abrasive through a metal cloth or a copper foil, a process of cutting a metal cloth or a copper foil with an abrasive cloth to a shape and a size appropriate for the grinding wheel, and a process of attaching and fixing a Velcro tape to a rear surface of a cut metal cloth or a copper foil.

The process of pretreating the metal cloth or the copper foil in the process of manufacturing the polishing pad according to the related art as described above includes a process of electrolytically degreasing the metal cloth or the copper foil, a process of electrolytically degreasing the electrolytic degreased metal cloth or the copper foil And a strike plating process for preventing the abrasive from adhering to and detaching from the abrasive to improve abrasion resistance.

As described above, since the metal material of the metal cloth or the copper foil is used as the material of the scrub pad in the process of manufacturing the polishing pad according to the prior art, in order to prevent the abrasive from adhering to the abrasive, The process is pre-processed. As such, the prior art requires a preprocessing process, which causes a problem of cost increase.

In addition, since the polishing pad manufacturing process according to the related art is manufactured through a lot of processes as described above, there is a problem that the cost increases and the productivity decreases.

Korean Patent Publication No. 2005-0040146 (published on May 3, 2005) Korean Patent Publication No. 2003-0047915 (published on June 18, 2003) Korean Patent Laid-Open No. 2001-0035069 (published on May 7, 2001) Korea Public Utility Model Office 1998-059542 (released October 26, 1998)

The present invention has been conceived to solve all the problems of the prior art, and it is an object of the present invention to provide a polishing pad detachably attached to a front surface of a polishing wheel through a Velcro tape, The present invention also provides a polishing pad for a polishing disk, which can reduce the production cost by manufacturing a polishing pad for a polishing disk, and a polishing pad for a polishing disk manufactured by the manufacturing method.

Another object of the present invention is to provide a polishing pad, which is detachably attached to a front surface of a polishing wheel through a Velcro tape, by attaching an abrasive through a certain pattern of masking and electroplating on a fabric woven with Teflon yarn, So that the productivity can be improved.

The present invention configured to achieve the above-described object is as follows. That is, the method for manufacturing a polishing pad for a polishing disk according to the present invention is a method for manufacturing a polishing pad detachably attached to a front surface of a polishing wheel constituting a polishing disk via a Velcro tape, comprising the steps of: (a) Masking a pattern of a certain shape on the surface of the substrate; (b) depositing a patterned masked pattern on the metal plate to coat the unmasked surface of the fabric with electroplating to form a primary metal plating layer; (c) spraying the abrasive on top of the plated primary metal plating layer on the fabric of the step (b); (d) attaching the abrasive to the primary metal plating layer by fixing the abrasive agent on the primary metal plating layer by forming a secondary metal electrodeposition layer through the secondary electrodeposition with the abrasive agent dispersed in the step (c); (e) attaching and fixing the Velcro tape to the back side of the fabric to which the abrasive of step (d) is adhered; And (f) cutting the fabric to which the velcro tape of the step (e) is attached and fixed according to the shape and size of the grinding wheel.

In step (a) of the composition according to the present invention as described above, the fabric may be made of a fabric woven through a Teflon yarn.

And, in the step (a) of the constitution according to the present invention, the masking can be masked by either the double-sided adhesive tape, the double-sided adhesive sheet, the masking liquid or the silk printing ink.

In the step (b) of the composition according to the present invention as described above, the primary metal plating layer of the fabric is copper (Cu) obtained by reducing and precipitating copper (Cu) ions through electroplating from a solution containing copper ) The plating layer or the primary metal plating layer may be composed of a nickel (Ni) plating layer obtained by reducing and precipitating nickel (Ni) ions from a solution containing nickel (Ni) ions through electroplating.

Meanwhile, in the step (b) of the constitution according to the present invention, the primary metal plating layer of the fabric is a copper (Cu) plating layer obtained by reducing copper (Cu) ions through electroplating from a solution containing copper And a nickel (Ni) plating layer obtained by reducing nickel (Ni) ions through electroplating from a solution containing nickel (Ni) ions on the surface thereof.

In addition, in the step (c) of the composition according to the present invention, the abrasive may be CBN, diamond, cemented carbide powder or ceramic powder.

In the step (d) of the constitution according to the present invention as described above, the secondary metal plating layer is formed by reducing and precipitating nickel (Ni) ions from a solution containing nickel (Ni) ions through secondary electroplating, (Ni) plating layer which is attached to the primary metal plating layer by fixing the abrasive to the primary metal plating layer.

Another feature of the technique according to the present invention is the production of a polishing pad for a polishing disk by the above-described manufacturing method.

According to the technique of the present invention, a polishing pad detachably attached to a front surface of a polishing wheel through a Velcro tape is manufactured by adhering an abrasive agent through a certain pattern of masking and electroplating on a fabric woven with a Teflon yarn, It is possible to reduce the burden of the cost of the system.

In addition, according to the present invention, a polishing pad detachably attached to a front surface of a polishing wheel through a Velcro tape is manufactured by adhering an abrasive to a fabric woven with a Teflon yarn through a certain pattern of masking and electroplating, Can be improved.

1 is a block diagram showing a polishing pad manufacturing process for a polishing disk according to the present invention;
FIG. 2 is a perspective view showing a polishing pad for a polishing disk according to the present invention. FIG.
3 is a cross-sectional view showing a polishing pad for a polishing disk according to the present invention.

Hereinafter, preferred embodiments of a polishing pad for a polishing disk according to the present invention and a polishing pad for a polishing disk manufactured by the method will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram showing a polishing pad manufacturing process for a polishing disk according to the present invention, FIG. 2 is a perspective view showing a polishing pad for a polishing disk according to the present invention, FIG. 3 is a perspective view showing a polishing pad for a polishing disk according to the present invention, Fig.

As shown in FIG. 1, the polishing pad 100 according to the present invention includes the steps of (a) masking a predetermined pattern 120 on the surface of the fabric 110 woven by weaving and weaving the yarn The patterned pattern 120 of the step (a) of the step (a) 100 is attached to the metal sheet to form a primary metal plating layer (not shown) on the unmasked surface of the fabric 110 by electroplating. A step S120 of spraying the abrasive 140 on the plated primary metal plating layer 130 on the fabric 110 in step (b) (S110) , and (d) forming a second metal dross layer (150) through the second electroplating on an upper portion of the polishing cloth (140) of the step (c) A step S14 of attaching and fixing the Velcro tape 160 to the back surface of the fabric 110 with the abrasive 140 attached thereto fixed in step (d) And cutting the fabric 110 to which the velcro tape 160 is attached and fixed according to the shape and size of the grinding wheel in step (S150).

The polishing pad 100 for a polishing disc according to the present invention is manufactured as follows. First, as in step (a), the yarn made of fibers is wound on the surface of the woven fabric 110 The mask pattern 120 is masked (S100). The reason for masking the pattern 120 in this manner is to attach and fix the abrasive 140 described later only to a portion where the pattern 120 is not masked.

In the case of masking a certain pattern 120 on the surface of the fabric 110 woven by weaving and weaving a yarn made of fibers as in the above-mentioned step (a), the material of the masking may be double-sided adhesive tape, double- A mask, a sheet, a masking solution, a silk printing ink, a paint, and a urethane coating.

After the pattern 120 is masked on the surface of the fabric 110 as described above, the pattern 120 of the fabric 110 is masked by attaching the masked fabric 110 of the pattern 120 to the metal plate. The first metal plating layer 130 is formed through electroplating (S110). At this time, the primary metal plating layer 130 may be formed of a copper plating layer or a nickel plating layer, as well as a copper plating layer and a nickel plating layer.

The formation of the primary metal plating layer 130 on the unmasked portion of the pattern 120 through electroplating as described above is advantageous in order to strengthen the fabric 110 and to secure the abrasive 140 to the abrasive 140 ) To prevent adhesion and dropout, thereby improving wear resistance.

After the primary metal plating layer 130 is formed through the primary electroplating as described above, the abrasive 140 is scattered on the surface of the primary metal plating layer 130 (S120). At this time, any one of CBN, diamond, carbide powder, and ceramic powder may be used as the abrasive 140.

After the abradant 140 is spread on the surface of the primary metal plating layer 130 as described above, the secondary metal plating layer 150 is plated on the surface of the primary metal plating layer 130 through the secondary electroplating S130). At this time, in the course of plating the secondary metal plating layer 150 on the surface of the primary metal plating layer 130 through the secondary electroplating, the abrasive 140 scattered on the surface of the primary metal plating layer 130 is separated from the secondary metal And is attached and fixed to the primary metal plating layer 130 by the plating layer 150.

After the abrasive 140 is attached and fixed to the fabric 110 having the pattern 120 masked by electroplating as described above, the Velcro tape 160 is attached and fixed to the rear surface of the fabric 110, The polishing pad 100 is detachably attached to a velcro tape (not shown) formed on the front surface of the polishing wheel (S140).

After the velcro tape 160 is attached and fixed to the rear surface of the fabric 110 as described above, the fabric 110 is cut in accordance with the shape and size of the polishing wheel (S150). The polishing pad 100 cut in accordance with the shape and size of the polishing wheel is the polishing pad 100 to be manufactured in the present invention.

Each component constituting the manufacturing process of the polishing pad 100 for a polishing disk according to the present invention will be described in more detail as follows. First, step (a) of forming the present invention is a process (S100) of forming a pattern 120 on the surface of the fabric 110, and step (a) The pattern 120 is masked on the surface of the fabric 110 as shown in FIG.

In the process of masking the pattern 120 on the surface of the fabric 110 as in the above-described step (a) (S100), the masking may be performed using any one of the double-sided adhesive tape, the double-sided adhesive sheet, It is done by one. The reason for masking the pattern 120 in this manner is to attach and fix the abrasive 140 described later only to a portion where the pattern 120 is not masked.

When the predetermined pattern 120 is masked on the surface of the woven fabric 110 by weaving and weaving the yarn made of fibers as in the above-described step (a) (S100) as described above, A masking liquid, a silk printing ink, a paint, and a urethane coating.

The fabric 110 used in the step (a) (S100) as described above uses a Teflon fabric made of Teflon yarn through the Teflon yarn. When the pattern 120 is masked through the masking liquid, the silk printing ink, the paint and the urethane coating on the surface of the fabric 110, the masking material is impregnated on the fabric 110 and the pattern 120 is masked.

Next, a step (b) of forming the present invention is a step (S110) of metal plating a part where the pattern 120 is not masked, and the step (b) The patterned pattern 120 of the step (a) S100 is adhered onto the metal sheet to attach the primary metal plating layer 130 to the unmasked surface of the fabric 110 through electroplating Enter.

In the step (b), since the fabric 110 itself is non-conductive, it is necessary to attach the fabric 110 to the metal plate in order to perform electroplating. After the fabric 110 is attached to the metal plate, electroplating is performed through the solution containing the metal ions to be plated so that plating can be performed on the fabric 110 of the unmasked portion of the pattern 120.

1, the primary metal plating layer 130, which is plated on the unmasked portion of the fabric 110 in the same step (b) (S110) as described above, (Cu) plating layer obtained by reducing copper (Cu) ions through electroplating from a solution containing nickel (Ni) ions. Alternatively, nickel (Ni) ions obtained by reducing and depositing nickel (Ni) ions through electroplating from a solution containing nickel Nickel (Ni) plating layer.

In addition, in the same step (b) (S110) as described above, the primary metal plating layer 130, which is plated on the unmasked portion of the fabric 110, (Ni) ions from a solution containing nickel (Ni) ions on the surface of a copper (Cu) plated layer (S120-1) obtained by electroplating copper (Cu) And the nickel (Ni) plating layer (S120-2) obtained by precipitation may be double-plated.

As described above, when the primary metal plating layer 130 is composed of a double layer of nickel (Ni) plating layer on the surface of the copper (Cu) plating layer, the corrosion of the copper (Cu) plating layer S120-1 It is possible to prevent corrosion when the nickel (Ni) plating layer (S120-2) is formed on the surface of the copper (Cu) plating layer.

Next, step (c) of forming the present invention is a step (S120) of scattering the abrasive 140 on the primary metal plating layer 130, and step (c) (Ni) plating layer or a nickel (Ni) plating layer on the surface of a copper (Cu) plating layer or a copper (Cu) plating layer as shown in FIG. (140).

As described above, the abrasive 140 sprayed on the surface of the primary metal plating layer 130 may be any one of CBN, diamond, carbide powder, and ceramic powder. That is, the polishing pad 100 is manufactured by polishing the polishing pad 100 with any one of CBN, diamond, cemented powder, and ceramic powder depending on the application.

The step (d) constituting the present invention is a process of attaching and fixing the abrasive 140 scattered on the primary metal plating layer 130 (S130). This step (d) The secondary metal plating layer 150 is formed above the abrasive 140 scattered on the primary metal plating layer 130 as shown in FIG. 2 and FIG. 4, as in the step (c) And the abrasive 140 is attached and fixed to the surface of the secondary metal plating layer 130.

In other words, in the method of attaching the abrasive 140 to the surface of the primary metal plating layer 130 in the step (d) (S130) as described above, the primary metal plating layer 130 is formed by attaching the fabric 110 to the metal plate, And the abrasive 140 is attached and fixed to the surface of the polishing pad 140 by electroplating. That is, the abrasive 140 is attached and fixed to the surface of the primary metal plating layer 130 by electrodeposition by electrolysis.

On the other hand, in the abrasive 140 described above, CBN (borazon) abrasive is used for abrasion of ferrous metal, diamond abrasive for nonferrous metal abrasion, carbide powder abrasive for wood abrasion and ceramics powder abrasive for rust removal The abrasive 140 is attached and fixed to the surface of the primary metal plating layer 130 through the secondary metal plating with the abrasive 140 suitable for the object to be processed.

Next, step (e) constituting the present invention is a process of attaching and fixing the Velcro tape 160 to the fabric 110 (S140). This step (d) As shown in FIG. 4, the Velcro tape 160 is attached and fixed to the rear surface of the fabric 110 on which the abrasive 140 is fixed.

In the step (e) (S140), the Velcro tape 160, which is attached and fixed to the back surface of the fabric 110 having the abrasive 140 adhered on the surface of the primary metal plating layer 130, The polishing pad 100 is paired with a velcro tape (not shown) formed on the front surface of the polishing wheel. The polishing pad 100 according to the present invention is configured to be detachably attachable to the front surface of the polishing wheel through the Velcro tape 160.

Next, the step (f) constituting the present invention is a step (S150) of cutting according to the shape and the size of the grinding wheel, and the step (f) S150 is performed as shown in FIGS. 1, 2 and 4 The fabric 110 on which the Velcro tape 160 is attached and fixed is cut according to the shape and size of the grinding wheel.

The fabric 110 having the abrasive 140 attached and fixed to its surface and the back surface of which the velcro tape 160 is attached and fixed as in the step (f) When cut, the polishing pad 100 to be manufactured in the present invention is obtained.

As described above, according to the present invention, by manufacturing the polishing pad 100 by masking a predetermined pattern 120 on the surface of the fabric 110 and fixing the abrasive 140 by electroplating, It is possible to lower the production cost. Thereby, there is an effect that the cost burden of purchasing is reduced.

In addition, the technique according to the present invention does not require a pre-treatment process as in the prior art, and thus the manufacturing process of the polishing pad 100 can be remarkably reduced, thereby improving the productivity.

While the present invention has been described with respect to specific embodiments, various modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the invention is not to be determined by the embodiments described, but should be determined by the appended claims and their equivalents.

100. Abrasive pad
110. Fabric
120. Pattern
130. Primary metal plating layer
140. Abrasive
150. Secondary metal plating layer
160. Velcro Tape

Claims (8)

A method of manufacturing a polishing pad detachably attached to a front surface of a polishing wheel constituting a polishing disk via a Velcro tape,
(a) masking a pattern of a certain pattern on the surface of the woven fabric by weaving and weaving the yarn;
(b) attaching the patterned masked pattern of the pattern of step (a) onto the metal plate to apply the primary metal plating layer to the unmasked portion of the fabric through electroplating;
(c) spraying an abrasive on top of the plated primary metal plating layer on the fabric in step (b);
(d) attaching and fixing an abrasive to the primary metal plating layer by forming a secondary metal plaster layer through secondary electroplating with the abrasive agent dispersed in step (c);
(e) attaching and fixing the Velcro tape to the back side of the fabric to which the abrasive is attached and fixed in step (d); And
(f) cutting the fabric to which the Velcro tape is attached and fixed in accordance with the shape and size of the grinding wheel in the step (e). The method of claim 1, wherein in step (a), the fabric is a woven fabric woven through a Teflon yarn. The method of manufacturing a polishing pad for a polishing pad according to claim 1, wherein the masking in the step (a) is masked by any one of a double-sided adhesive tape, a double-sided adhesive sheet, a masking solution and a silk printing ink. The method as claimed in claim 1, wherein in the step (b), the primary metal plating layer of the fabric is a copper (Cu) plating layer obtained by reducing copper (Cu) ions through electroplating from a solution containing copper Or the primary metal plating layer is a nickel (Ni) plating layer obtained by reducing and precipitating nickel (Ni) ions from a solution containing nickel (Ni) ions through electroplating. The method as claimed in claim 1, wherein in the step (b), the primary metal plating layer of the fabric is a copper (Cu) plating layer obtained by reducing copper (Cu) ions through electroplating from a solution containing copper Wherein a nickel (Ni) plating layer obtained by reducing and depositing nickel (Ni) ions through electroplating from a solution containing nickel (Ni) ions on the surface thereof is double plated. The method of claim 1, wherein the abrasive in the step (c) is one of CBN, diamond, cemented carbide, and ceramic powder. The method according to claim 1, wherein in the step (d), the secondary metal plating layer is formed by reducing nickel (Ni) ions through secondary electroplating from a solution containing nickel (Ni) Wherein the polishing pad is a nickel (Ni) plated layer for adhering and fixing the abrasive to the primary metal plating layer by being plated. A polishing pad for a polishing disk produced by the manufacturing method according to any one of claims 1 to 7.
KR1020150191509A 2015-12-31 2015-12-31 The polishing pad for polishing a polishing pad manufactured by the method and a method for polishing KR20170080207A (en)

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KR1020150191509A KR20170080207A (en) 2015-12-31 2015-12-31 The polishing pad for polishing a polishing pad manufactured by the method and a method for polishing

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KR1020150191509A KR20170080207A (en) 2015-12-31 2015-12-31 The polishing pad for polishing a polishing pad manufactured by the method and a method for polishing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101871225B1 (en) 2017-08-18 2018-06-27 가봉섭 Circular polishing pad automatic discharge collector and its automatic discharge collection method
KR101953553B1 (en) * 2018-05-18 2019-03-04 주식회사 에이엔텍 Surface processing method of ceramics products

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101871225B1 (en) 2017-08-18 2018-06-27 가봉섭 Circular polishing pad automatic discharge collector and its automatic discharge collection method
KR101953553B1 (en) * 2018-05-18 2019-03-04 주식회사 에이엔텍 Surface processing method of ceramics products

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