JP2002239905A - Pad conditioner for cmp, and method for manufacturing the same - Google Patents
Pad conditioner for cmp, and method for manufacturing the sameInfo
- Publication number
- JP2002239905A JP2002239905A JP2001044860A JP2001044860A JP2002239905A JP 2002239905 A JP2002239905 A JP 2002239905A JP 2001044860 A JP2001044860 A JP 2001044860A JP 2001044860 A JP2001044860 A JP 2001044860A JP 2002239905 A JP2002239905 A JP 2002239905A
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- pad conditioner
- diamond abrasive
- plating layer
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、パッドコンディシ
ョナーに関し、特に、半導体基板加工に用いるＣＭＰ
（Chemical Mechanical Polishing）装置のパッドコン
ディショナーに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pad conditioner, and more particularly, to a CMP used for processing a semiconductor substrate.
The present invention relates to a pad conditioner of a (Chemical Mechanical Polishing) apparatus.
【０００２】[0002]
【従来の技術】一般に、半導体ウエハ上に形成された微
細配線或いは、層間絶縁膜の表面を研磨する加工装置
は、研磨パッドを貼り付けて回転する定盤と、ウエハを
保持し一定の圧力を加えることのできる研磨ヘッドとで
構成されており、ウエハと研磨パッドとの間に研磨液を
供給してウエハと研磨パッドを回転させながら界面の化
学的機械的作用によって研磨を行っている。研磨パッド
の材質としては、主に発砲ポリウレタンが使用されてい
る。研磨液には、過酸化水素水、硝酸鉄及び水酸化カリ
ウムなどの水溶液が、また、研磨粒子としては、酸化セ
リウム、コロイダルシリカなどが適用する半導体プロセ
スによって使い分けられている。また、ウエハの研磨を
繰り返し行っていくと研磨パッドの切り屑や、研磨粒子
の凝集物などが、研磨パッドの微細な孔に入り込んで目
詰まりを起こし、パッド面の平坦性が劣化したり、切削
力が劣化するため、パッド面のコンディショニングを定
期的に行っている。2. Description of the Related Art In general, a processing apparatus for polishing fine wiring formed on a semiconductor wafer or a surface of an interlayer insulating film includes a platen which is rotated by attaching a polishing pad, and a constant pressure while holding the wafer. The polishing head comprises a polishing head which can be added to the polishing pad, and supplies polishing liquid between the wafer and the polishing pad to rotate the wafer and the polishing pad, thereby performing polishing by a chemical mechanical action at the interface. Foamed polyurethane is mainly used as the material of the polishing pad. Aqueous solutions such as aqueous hydrogen peroxide, iron nitrate, and potassium hydroxide are used as the polishing liquid, and cerium oxide, colloidal silica, and the like are used as the abrasive particles. In addition, if the wafer is repeatedly polished, chips and agglomerates of abrasive particles of the polishing pad enter fine holes in the polishing pad and cause clogging, thereby deteriorating the flatness of the pad surface, Since the cutting force is deteriorated, the pad surface is regularly conditioned.
【０００３】このコンディショニングには、主として台
金にダイヤモンド砥粒をめっき層により単層固着したパ
ッドコンディショナーが使用されている。しかし、使用
する研磨液によっては、研磨中あるいはコンディショニ
ング中に、めっき層や台金が化学反応により溶出しウエ
ハを汚染するため、研磨液に接触する部分に金属溶出防
止層（耐食性のある層）を施す手段が採られている。金
属溶出防止層として一般的には、フッ素樹脂粒子等によ
るスプレー塗装法或いは静電塗装法によってパッドコン
ディショナー表面を塗装し、これを焼成して樹脂層５を
設けている。しかし、これらの方法では、図２の如く、
樹脂層５の厚みを均一に形成できないばかりか、ダイヤ
モンド砥粒３の先端部まで被覆されてしまう。このた
め、パッドコンディショナー表面をラップ加工などによ
り石出しを行って作用面を形成する必要がある。ところ
が、酸化セリウムやコロイダルシリカなどの研磨粒子で
目詰まりしたパッド面をコンディショニングすれば、こ
れらの研磨粒子によるラッピング作用でパッドコンディ
ショナー作用面の樹脂層が摩耗し、短時間でめっき層が
露出してしまうため再度塗装を必要とする。For this conditioning, a pad conditioner in which diamond abrasive grains are fixed to a base metal in a single layer by a plating layer is mainly used. However, depending on the polishing liquid used, during polishing or conditioning, the plating layer or the base metal elutes due to the chemical reaction and contaminates the wafer. Therefore, the metal elution prevention layer (corrosion-resistant layer) is placed on the part that comes into contact with the polishing liquid. Means is applied. Generally, the surface of the pad conditioner is coated as a metal elution preventing layer by a spray coating method or an electrostatic coating method using fluororesin particles or the like, and is baked to form a resin layer 5. However, in these methods, as shown in FIG.
Not only cannot the resin layer 5 be formed with a uniform thickness, but also the tip of the diamond abrasive grains 3 is covered. For this reason, it is necessary to form a working surface by excavating the surface of the pad conditioner by lapping or the like. However, if the pad surface clogged with abrasive particles such as cerium oxide or colloidal silica is conditioned, the lapping action of these abrasive particles causes the resin layer on the pad conditioner function surface to wear, and the plating layer is exposed in a short time. Therefore, painting is necessary again.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、パッドコン
ディショナーの作用面を電着塗装法により、均一な厚み
で塗装ができ、且つ、樹脂層形成後の石出し加工を不要
とするものであり、さらには、より耐摩耗性のある樹脂
層を形成することで、長時間の使用に耐えるパッドコン
ディショナーとするものである。SUMMARY OF THE INVENTION According to the present invention, the working surface of a pad conditioner can be coated with a uniform thickness by an electrodeposition coating method, and lithography after forming a resin layer is not required. Furthermore, a pad conditioner that can withstand long-time use is formed by forming a more wear-resistant resin layer.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の課題
を解決すべく鋭意研究を重ねた結果、台金の作用面にダ
イヤモンド砥粒をめっき層により単層固着したのち、耐
食性があり、樹脂の中で最も耐摩耗性に優れたポリイミ
ド樹脂を、電着塗装法により上記めっき金属の析出面お
よび台金全面に析出被覆させることによりコンディショ
ニング中の金属の溶出を長時間に渡り防止できることを
見出した。また、電着塗装法により被覆すると、電気的
に絶縁体であるダイヤモンド砥粒にはポリイミド樹脂が
析出しないため、新たにダイヤモンド砥粒の石出し加工
を施すことが不要となることも見出した。Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that a single layer of diamond abrasive grains is fixed to the working surface of the base metal by a plating layer, and the corrosion resistance is high. It is possible to prevent the elution of metal during conditioning for a long time by depositing and coating the most wear-resistant polyimide resin on the deposition surface of the plating metal and the entire base metal by electrodeposition coating method. Was found. In addition, it has been found that when coated by the electrodeposition coating method, no polyimide resin is precipitated on diamond abrasive grains, which are electrically insulating, so that it is not necessary to perform a new stone grinding process of the diamond abrasive grains.
【０００６】本発明のパッドコンディショナーの第１の
特徴は、台金と、前記台金の表面上に形成されためっき
層と、前記めっき層によって、前記台金の表面に固着さ
れたダイヤモンド砥粒と、前記めっき層の表面を被覆す
るように前記めっき層の表面上に形成された樹脂層とを
備えたパッドコンディショナーであって、前記樹脂層
は、電着塗装法により被覆されたポリイミド樹脂とした
ことである。A first feature of the pad conditioner of the present invention is that a base metal, a plating layer formed on a surface of the base metal, and diamond abrasive grains fixed to the surface of the base metal by the plating layer. And a pad conditioner comprising a resin layer formed on the surface of the plating layer so as to cover the surface of the plating layer, wherein the resin layer is a polyimide resin coated by an electrodeposition coating method. It was done.
【０００７】第２の特徴として、前記ダイヤモンド砥粒
の径は＃６０／７０〜＃３２５／４００、前記めっき層
の厚みは前記ダイヤモンド砥粒径の５０％以上７０％未
満、前記樹脂層の厚みは５〜３０μｍとしたことであ
る。As a second feature, the diameter of the diamond abrasive grains is # 60/70 to # 325/400, the thickness of the plating layer is 50% or more and less than 70% of the diamond abrasive grain diameter, and the thickness of the resin layer is Is 5 to 30 μm.
【０００８】本発明のパッドコンディショナーに用いる
ダイヤモンド砥粒は、ＪＩＳＢ４１３０に規定する粒度
＃６０／７０から＃３２５／４００の粒径を有するダイ
ヤモンド砥粒であることが好ましい。粒度が＃３２５／
４００未満であるとダイヤモンド砥粒を樹脂層より突出
させるため、樹脂層の厚みを薄くする必要があるが、こ
の場合耐食性が甚だ劣化する。また粒度が＃６０／７０
をこえると、コンディショニングしたパッド面が荒くな
りすぎＣＭＰが正常に行えない恐れがある。The diamond abrasive used in the pad conditioner of the present invention is preferably a diamond abrasive having a particle size of # 60/70 to # 325/400 specified in JIS B4130. Particle size is # 325 /
When it is less than 400, the diamond abrasive grains protrude from the resin layer, so that it is necessary to reduce the thickness of the resin layer. In this case, however, the corrosion resistance is significantly deteriorated. Also, the particle size is # 60/70
Exceeding the limit may cause the conditioned pad surface to be too rough, so that CMP cannot be performed normally.
【０００９】めっきする金属は、ＣＭＰに使用するにあ
たって極力研磨するウエハに金属汚染を与えないものが
良く、ニッケル、クロムが好ましい。めっき層の厚み
は、ダイヤモンド砥粒径の５０％以上が好ましく、砥粒
の保持力と研磨パッドに対する切削性とを考慮すると６
０％以上７０％未満とするのがより好ましい。The metal to be plated preferably does not cause metal contamination on the wafer to be polished as much as possible when used in CMP, and nickel and chromium are preferable. The thickness of the plating layer is preferably 50% or more of the diamond abrasive grain size.
It is more preferable that the content be 0% or more and less than 70%.
【００１０】また、本発明のパッドコンディショナーの
製造方法の特徴は、台金に超砥粒が固着されたパッドコ
ンディショナーの製造方法であって、（ｉ）台金にダイ
ヤモンド砥粒をめっき層により固着する工程、（ｉｉ）
前記台金を、ポリイミド樹脂と有機溶剤を含む水溶性エ
マルジョンに浸せきする工程、（ｉｉｉ）前記水溶性エ
マルジョン内で、前記めっき表面及び前記台金の露出面
にポリイミド樹脂層を電着塗装法により形成する工程、
とを有することである。A feature of the method for manufacturing a pad conditioner of the present invention is a method for manufacturing a pad conditioner in which superabrasive grains are fixed to a base metal, and (i) diamond abrasive grains are fixed to a base metal by a plating layer. (Ii)
Dipping the base metal into a water-soluble emulsion containing a polyimide resin and an organic solvent; (iii) applying a polyimide resin layer to the plating surface and the exposed surface of the base metal in the water-soluble emulsion by an electrodeposition coating method. Forming,
And
【００１１】本発明においてダイヤモンド砥粒をめっき
層により台金の作用面に固着させる方法としては、従来
の電着工具と同様の製造方法が適用できる。即ち以下の
手順で行うことができる。 １）ダイヤモンド砥粒を固着させる作用面以外の台金表
面に絶縁性のあるマスキング材を塗布する。 ２）作用面の清浄化と活性化のため電解脱脂洗浄と酸浸
せきを行う。 ３）めっき液の入っためっき槽に浸せきし、台金作用面
に所定のダイヤモンド砥粒を散布した後、台金を陰極、
析出金属と同類の金属を陽極としてめっきを行う。これ
によりダイヤモンド砥粒が台金作用面上に仮固定され
る。 ４）仮固定されなかった余剰の砥粒を除去し、仮固定さ
れたダイヤモンド砥粒を台金作用面に強固に固着するた
め、所定の厚みになるまでめっきを行って、メッキ層を
形成する。 ５）めっき完了後、マスキング剤を除去する。In the present invention, as a method of fixing the diamond abrasive grains to the working surface of the base metal by the plating layer, a manufacturing method similar to that of a conventional electrodeposition tool can be applied. That is, it can be performed in the following procedure. 1) An insulating masking material is applied to the surface of the base metal other than the surface on which the diamond abrasive grains are fixed. 2) Perform electrolytic degreasing and acid immersion to clean and activate the working surface. 3) Immerse in a plating tank containing a plating solution and spray predetermined diamond abrasive grains on the base metal working surface.
Plating is performed using a metal similar to the deposited metal as an anode. Thereby, the diamond abrasive grains are temporarily fixed on the base metal working surface. 4) In order to remove excess abrasive grains that have not been temporarily fixed and to firmly fix the temporarily fixed diamond abrasive grains to the base metal working surface, plating is performed until a predetermined thickness is reached to form a plating layer. . 5) After plating is completed, the masking agent is removed.
【００１２】[0012]
【発明の実施の形態】本発明のパッドコンディショナー
は、台金作用面にダイヤモンド砥粒をめっき層により単
層固着したあと、電着塗装法によりポリイミド樹脂を析
出被覆する。図１は、本発明のパッドコンディショナー
の作用面の断面図である。本図に示すように、台金１の
作用面にめっき層２によりダイヤモンド砥粒３が固着さ
れ、台金１の表面及びめっき層２の表面が電着塗装法に
よって析出したポリイミド樹脂層４により被覆されてい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS In a pad conditioner of the present invention, a single layer of diamond abrasive grains is fixed to a base metal working surface by a plating layer, and then a polyimide resin is deposited and coated by an electrodeposition coating method. FIG. 1 is a sectional view of the working surface of the pad conditioner of the present invention. As shown in the figure, diamond abrasive grains 3 are fixed to the working surface of the base metal 1 by the plating layer 2, and the surface of the base metal 1 and the surface of the plating layer 2 are formed by the polyimide resin layer 4 deposited by the electrodeposition coating method. Coated.
【００１３】ポリイミド樹脂層４を電着塗装法で析出さ
せた場合、層の均一性が良く、またパッドコンディショ
ナーの耐食性を劣化させる気泡を著しく低減させること
ができる。また、電着塗装法により析出させるため、導
電性が低いダイヤモンド砥粒３の表面には析出しない。
このため、ラップ加工などによるダイヤモンド砥粒３の
石出し加工が全く不要となるので、パッドコンディショ
ナーの切削性能を損なうことがない。When the polyimide resin layer 4 is deposited by an electrodeposition coating method, the uniformity of the layer is good and the bubbles which deteriorate the corrosion resistance of the pad conditioner can be significantly reduced. In addition, since it is deposited by the electrodeposition coating method, it does not deposit on the surface of the diamond abrasive grains 3 having low conductivity.
Therefore, the lapping process or the like of the diamond abrasive grains 3 is not required at all, so that the cutting performance of the pad conditioner is not impaired.
【００１４】本発明に用いるポリイミド樹脂は、カチオ
ン型電着法で析出被覆させるのが、耐食性の見地から最
も有効である。It is most effective to deposit and coat the polyimide resin used in the present invention by a cationic electrodeposition method from the viewpoint of corrosion resistance.
【００１５】ポリイミド樹脂及び有機溶剤を含む水溶性
エマルジョンの入った樹脂電着槽にステンレス材を浸せ
きして陽極とし、ダイヤモンド砥粒３を固着した台金１
を陰極として浸せきして所定の電圧を加え、ダイヤモン
ド砥粒を固着しているめっき層２表面および台金１表面
にポリイミド樹脂を析出させた後、所定条件で乾燥させ
ると均一で、気泡がなく且つ密着性の良いポリイミド樹
脂層４を形成することができる。乾燥条件は、予備乾燥
として７０〜９０℃で１０〜１５分および本乾燥とし
て、２４０〜２６０℃で２０〜４０分程度が最も良い。A stainless steel material is immersed in a resin electrodeposition tank containing a water-soluble emulsion containing a polyimide resin and an organic solvent to form an anode, and a base metal 1 having diamond abrasive grains 3 fixed thereto.
Is applied as a cathode, a predetermined voltage is applied, and a polyimide resin is precipitated on the surface of the plating layer 2 and the surface of the base metal 1 on which the diamond abrasive grains are fixed. In addition, the polyimide resin layer 4 having good adhesion can be formed. The best drying conditions are about 10 to 15 minutes at 70 to 90 ° C. for preliminary drying and about 20 to 40 minutes at 240 to 260 ° C. for main drying.
【００１６】ポリイミド樹脂層４の厚みは、析出被覆す
るだけで、効果が認められるが、５〜３０μｍとすべき
である。樹脂層４の厚みが、３０μｍを越えるとダイヤ
モンド砥粒３の突出量が少なくなり、パッド表面と樹脂
層４がコンディショニング中に接触する頻度が高くな
り、パッドコンディショナーの切削性が落ちるので好ま
しくない。また、樹脂層４の厚みが５μｍ未満になると
所定の耐食性が得られ難くなる。The thickness of the polyimide resin layer 4 should be 5 to 30 μm, although the effect is recognized only by deposition coating. If the thickness of the resin layer 4 exceeds 30 μm, the protrusion amount of the diamond abrasive grains 3 decreases, the frequency of contact between the pad surface and the resin layer 4 during conditioning increases, and the cutting property of the pad conditioner decreases, which is not preferable. When the thickness of the resin layer 4 is less than 5 μm, it becomes difficult to obtain a predetermined corrosion resistance.
【００１７】[0017]
【実施例】以下に実施例をあげて、本発明のドレッサの
詳細を説明する。寸法が、φ１００Ｄ−７Ｗ−２０Ｔ−
３０Ｈのステンレス鋼（ＳＵＳ３０４）の台金１を使用
し、この台金１に電流を流すため通電部を設けた後、ダ
イヤモンド砥粒３をめっき層２で固着する部分（作用
面）以外を絶縁塗料でマスキングした。次に、ダイヤモ
ンド砥粒３を固着する部分（作用面）の清浄化と活性化
を図るため、アルカリ電解脱脂に浸せきし、電流密度３
Ａ／ｄｍ２で３分間電解脱脂を行い、水洗後、塩酸（１
７．５重量％）に３０秒間浸せきした。めっき層２と台
金１の密着力を上げるため、塩化ニッケル２００ｇ／
Ｌ、塩酸（３５重量％）１００ｇ／Ｌのニッケルめっき
液に浸せきし、ニッケル板を陽極、台金１を陰極とし
て、電流密度５Ａ／ｄｍ２で、常温で３分間ストライク
めっきを行った。その後、ワット浴で、電流密度１Ａ／
ｄｍ２で１５分間めっきを行って下地めっきを形成し、
この下地めっき上に粒度＃８０／１００のダイヤモンド
砥粒３を散布して、電流密度０．５Ａ／ｄｍ２で２時間
めっきを行い、ダイヤモンド砥粒３の仮固定めっきを行
った。仮固定されなかった余剰のダイヤモンド砥粒を除
去後、ダイヤモンド砥粒３を台金１作用面に強固に固着
するため電流密度０．５Ａ／ｄｍ２で、仮固定めっきの
厚みを含めて厚みが平均粒径（１５１μｍ）の６５％に
なるまで保持めっきを行った。その後、上記で塗布した
マスキング塗料を除去し水洗後乾燥した。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The dresser of the present invention will be described in detail below with reference to embodiments. Dimension is φ100D-7W-20T-
A base metal 1 made of 30H stainless steel (SUS304) is used. After a current-carrying part is provided to allow current to flow through the base metal 1, insulating portions other than the portion (working surface) where the diamond abrasive grains 3 are fixed by the plating layer 2 are insulated. Masked with paint. Next, in order to clean and activate the portion (working surface) to which the diamond abrasive grains 3 are fixed, it is immersed in alkaline electrolytic degreasing, and the current density 3
A / dm 2 was subjected to electrolytic degreasing for 3 minutes, washed with water, and then treated with hydrochloric acid (1
(7.5% by weight) for 30 seconds. To increase the adhesion between the plating layer 2 and the base metal 1, nickel chloride 200 g /
L and hydrochloric acid (35% by weight) were immersed in a nickel plating solution of 100 g / L, and strike plating was performed at room temperature for 3 minutes at a current density of 5 A / dm 2 using the nickel plate as an anode and the base metal 1 as a cathode. Then, the current density was 1 A /
dm 2 for 15 minutes to form a base plating,
Diamond abrasive grains 3 having a grain size of # 80/100 were sprayed on the base plating, plated at a current density of 0.5 A / dm 2 for 2 hours, and temporary fixed plating of the diamond abrasive grains 3 was performed. After removing the excess diamond abrasive grains that were not temporarily fixed, the thickness including the thickness of the temporarily fixed plating was applied at a current density of 0.5 A / dm 2 in order to firmly fix the diamond abrasive grains 3 to the base metal 1 working surface. Holding plating was performed until it reached 65% of the average particle size (151 μm). Thereafter, the masking paint applied above was removed, washed with water and dried.
【００１８】次に、ダイヤモンド砥粒３を固着した台金
１に通電治具を取り付けた後、アルカリ電解脱脂液に浸
せきして脱脂した後、水洗及び乾燥させ、有機溶剤中に
ポリイミド樹脂粒子（粒子径０．４μｍ）を含む水溶性
エマルジョンの入った樹脂電着槽にステンレス（ＳＵＳ
３０４製）板を陽極として浸せきし、ダイヤモンド砥粒
３を固着した台金１を陰極として、電着塗装法によりポ
リイミド樹脂層４を析出被覆した。ポリイミド樹脂層４
を析出被覆させるために、液温２０℃、電圧（直流）２
０Ｖ一定で、６０秒間電着を行った。この後、樹脂電着
槽からポリイミド樹脂層４で被覆された台金１を引き上
げ、窒素雰囲気中で、８０℃で１０分の予備乾燥及び２
５０℃で３０分の本乾燥を行い、耐食性のある層厚２０
μｍのポリイミド樹脂層４をめっき層２及び台金１の露
出面全面に形成し、本発明のパッドコンディショナーを
完成した。完成したパッドコンディショナーは、ダイヤ
モンド砥粒３の突出量が平均でポリイミド樹脂層４表面
から３３μｍであった。Next, an energizing jig is attached to the base metal 1 to which the diamond abrasive grains 3 are fixed, immersed in an alkaline electrolytic degreasing solution, degreased, washed with water and dried, and the polyimide resin particles ( Stainless steel (SUS) is placed in a resin electrodeposition tank containing a water-soluble emulsion containing a particle diameter of 0.4 μm.
304) as an anode, and a polyimide resin layer 4 was deposited and deposited by an electrodeposition coating method using the base metal 1 on which the diamond abrasive grains 3 were fixed as a cathode. Polyimide resin layer 4
Liquid temperature 20 ° C, voltage (DC) 2
Electrodeposition was performed at 0 V constant for 60 seconds. Thereafter, the base metal 1 covered with the polyimide resin layer 4 is pulled up from the resin electrodeposition tank, and preliminarily dried at 80 ° C. for 10 minutes in a nitrogen atmosphere and
Main drying at 50 ° C for 30 minutes.
A μm polyimide resin layer 4 was formed on the entire exposed surface of the plating layer 2 and the base metal 1 to complete the pad conditioner of the present invention. In the completed pad conditioner, the protrusion amount of the diamond abrasive grains 3 was 33 μm from the surface of the polyimide resin layer 4 on average.
【００１９】比較例として、実施例と同手順で製作した
樹脂を被覆しないパッドコンディショナー（比較例１）
と、スプレー塗装法によりフッ素樹脂を被覆し、樹脂層
５の厚みを略２０μｍにした図２に示すようなパッドコ
ンディショナー（比較例２）を製作した。このパッドコ
ンディショナーは作用面をラップ加工して石出し加工を
行っている。As a comparative example, a pad conditioner not coated with a resin manufactured in the same procedure as the example (Comparative Example 1)
Then, a pad conditioner (Comparative Example 2) as shown in FIG. 2 in which the fluororesin was coated by a spray coating method and the thickness of the resin layer 5 was set to about 20 μm was manufactured. This pad conditioner performs lapping processing by lapping the working surface.
【００２０】これらのパッドコンディショナーを用い
て、耐食性と研磨パッドの切削性（研磨パッドの切削速
度）を試験した。耐食性の試験方法としては、タングス
テン配線のシリコンウエハのＣＭＰに一般的に使用され
る研磨液（硝酸鉄ｐＨ２＋過酸化水素水＋研磨粒子）
に、液温５０℃、浸せき時間２０時間の条件で浸せき
し、パッドコンディショナーより溶出する金属（ニッケ
ル）の研磨液中の濃度を分析した。また、切削性の試験
方法としては、パッドコンディショナーを研磨機（ビュ
ーラー社製、ＥＣＯＭＥＴ４）に取付け、パッドコンデ
ィショナー回転速度２０ｍｉｎ−１、パッドコンディシ
ョナー荷重５Ｋｇで、またパッド材としてロデールニッ
タ社製ＩＣ−１０００を用い、パッド回転速度１００ｍ
ｉｎ−１及び純水を研磨液として研磨バッドの切削速度
（ドレッシングレイト）を測定した。試験の結果を表１
に示す。Using these pad conditioners, the corrosion resistance and the cutting performance of the polishing pad (the cutting speed of the polishing pad) were tested. As a test method of corrosion resistance, a polishing liquid (iron nitrate pH2 + hydrogen peroxide water + abrasive particles) generally used for CMP of a silicon wafer of tungsten wiring is used.
Then, the sample was immersed at a solution temperature of 50 ° C. for 20 hours, and the concentration of metal (nickel) eluted from the pad conditioner in the polishing solution was analyzed. As a test method of the cutting property, a pad conditioner was attached to a grinder (ECOMET4, manufactured by Buehler Co., Ltd.), pad conditioner rotation speed was 20 min −1 , pad conditioner load was 5 kg, and Rodel Nitta IC-1000 was used as pad material. Use, pad rotation speed 100m
The cutting speed (dressing rate) of the polishing pad was measured using in- 1 and pure water as a polishing liquid. Table 1 shows the test results.
Shown in
【００２１】[0021]
【表１】 [Table 1]
【００２２】表１に見られるように、本発明のパッドコ
ンディショナーは、ポリイミド樹脂層を被覆することに
より、比較例１の樹脂被覆をしないパッドコンディショ
ナーに比べニッケル溶出量が１／８、比較例２のフッ素
樹脂被覆のパッドコンディショナーに比べ１／３となっ
た。また、切削性については、樹脂層を被覆したことに
よりダイヤモンド砥粒の突出量が減少したにも関わら
ず、比較例と遜色ないレベルの切削速度を維持している
ことがわかる。As can be seen from Table 1, the pad conditioner of the present invention has a nickel elution amount of 1/8 and a comparative example 2 by coating a polyimide resin layer as compared with the pad conditioner without resin coating of Comparative Example 1. Of the pad conditioner coated with a fluorine resin. Further, regarding the machinability, it can be seen that, despite the fact that the protrusion amount of the diamond abrasive grains was reduced by coating the resin layer, the cutting speed was maintained at a level comparable to that of the comparative example.
【００２３】[0023]
【発明の効果】本発明のパッドコンディショナーは、耐
摩耗性が最も優れたポリイミド樹脂を被覆したものであ
るから、硬質砥粒で目詰まりした研磨パッドのコンディ
ショニングを長時間行っても作用面のめっき層の露出が
なく耐食性を持続する。また、電着塗装法による作用面
の被覆は、作用面を均一厚みで被覆することができ、且
つ、電気的に絶縁体であるダイヤモンド砥粒には析出し
ないので、他の塗装法による場合に生じる石出し加工を
必要としない。Since the pad conditioner of the present invention is coated with a polyimide resin having the highest abrasion resistance, even if the polishing pad clogged with hard abrasive grains is subjected to conditioning for a long time, the plating of the working surface is performed. There is no exposure of the layer and the corrosion resistance is maintained. In addition, the coating of the working surface by the electrodeposition coating method can coat the working surface with a uniform thickness, and does not precipitate on the diamond abrasive grains that are electrically insulating. There is no need for the resulting stoning.
【図１】本発明のパッドコンディショナーの作用面の部
分断面図FIG. 1 is a partial cross-sectional view of a working surface of a pad conditioner of the present invention.
【図２】従来の塗装法で樹脂被覆したパッドコンディシ
ョナーの作用面の部分断面図FIG. 2 is a partial sectional view of a working surface of a pad conditioner coated with a resin by a conventional coating method.
１ 台金 ２ めっき層 ３ ダイヤモンド砥粒 ４ ポリイミド樹脂層 ５ 従来の塗装法による樹脂層 1 base metal 2 plating layer 3 diamond abrasive grain 4 polyimide resin layer 5 resin layer by conventional coating method
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２４Ｄ 3/06 Ｂ２４Ｄ 3/06 Ｂ Ｈ０１Ｌ 21/304 ６２２ Ｈ０１Ｌ 21/304 ６２２Ｍ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B24D 3/06 B24D 3/06 B H01L 21/304 622 H01L 21/304 622M
Claims (3)
イヤモンド砥粒と、 前記めっき層の表面を被覆するように前記めっき層の表
面上に形成された樹脂層とを備えたパッドコンディショ
ナーであって、 前記樹脂層は、電着塗装法により被覆されたポリイミド
樹脂であることを特徴とするパッドコンディショナー。1. A base metal, a plating layer formed on a surface of the base metal, diamond abrasive grains fixed to a surface of the base metal by the plating layer, and a surface of the plating layer. And a resin layer formed on the surface of the plating layer, wherein the resin layer is a polyimide resin coated by an electrodeposition coating method.
０〜＃３２５／４００、前記めっき層の厚みが前記ダイ
ヤモンド砥粒径の５０％以上７０％未満、前記樹脂層の
厚みが５〜３０μｍであることを特徴とする請求項１記
載のパッドコンディショナー。2. The diamond abrasive has a diameter of # 60/7.
The pad conditioner according to claim 1, wherein 0 to # 325/400, the thickness of the plating layer is 50% or more and less than 70% of the diamond abrasive grain size, and the thickness of the resin layer is 5 to 30 m.
ィショナーの製造方法であって、（ｉ）台金にダイヤモ
ンド砥粒をめっき層により固着する工程、（ｉｉ）前記
台金を、ポリイミド樹脂と有機溶剤を含む水溶性エマル
ジョンに浸せきする工程、（ｉｉｉ）前記水溶性エマル
ジョン内で、前記めっき表面及び前記台金の露出面にポ
リイミド樹脂層を電着塗装法により形成する工程、とを
有するパッドコンディショナーの製造方法。3. A method of manufacturing a pad conditioner in which superabrasive grains are fixed to a base metal, comprising: (i) a step of fixing diamond abrasive grains to a base metal by a plating layer; (Iii) immersing in a water-soluble emulsion containing a resin and an organic solvent, (iii) forming a polyimide resin layer on the plating surface and the exposed surface of the base metal by an electrodeposition coating method in the water-soluble emulsion. Method for producing pad conditioner having.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001044860A JP2002239905A (en) | 2001-02-21 | 2001-02-21 | Pad conditioner for cmp, and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001044860A JP2002239905A (en) | 2001-02-21 | 2001-02-21 | Pad conditioner for cmp, and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002239905A true JP2002239905A (en) | 2002-08-28 |
Family
ID=18906775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001044860A Pending JP2002239905A (en) | 2001-02-21 | 2001-02-21 | Pad conditioner for cmp, and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002239905A (en) |
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|---|---|---|---|---|
| KR20050005958A (en) * | 2003-07-08 | 2005-01-15 | 매그나칩 반도체 유한회사 | Polishing pad conditioning disk in chemical mechanical polishing apparatus |
| WO2007026569A1 (en) * | 2005-08-30 | 2007-03-08 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8094456B2 (en) | 2006-01-10 | 2012-01-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8148441B2 (en) | 2005-03-08 | 2012-04-03 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and manufacturing method thereof |
| US8304467B2 (en) | 2005-05-17 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8303372B2 (en) | 2006-08-31 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
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| US8993648B2 (en) | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
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2001
- 2001-02-21 JP JP2001044860A patent/JP2002239905A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050005958A (en) * | 2003-07-08 | 2005-01-15 | 매그나칩 반도체 유한회사 | Polishing pad conditioning disk in chemical mechanical polishing apparatus |
| US8148441B2 (en) | 2005-03-08 | 2012-04-03 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and manufacturing method thereof |
| US8530535B2 (en) | 2005-05-17 | 2013-09-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8304467B2 (en) | 2005-05-17 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8779020B2 (en) | 2005-05-17 | 2014-07-15 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| WO2007026569A1 (en) * | 2005-08-30 | 2007-03-08 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2007061928A (en) * | 2005-08-30 | 2007-03-15 | Toyo Tire & Rubber Co Ltd | Grinding pad |
| KR100949561B1 (en) * | 2005-08-30 | 2010-03-25 | 도요 고무 고교 가부시키가이샤 | Polishing pad |
| US8309466B2 (en) | 2005-08-30 | 2012-11-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8094456B2 (en) | 2006-01-10 | 2012-01-10 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8993648B2 (en) | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US9358661B2 (en) | 2006-08-28 | 2016-06-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US8303372B2 (en) | 2006-08-31 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8865785B2 (en) | 2007-03-28 | 2014-10-21 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| CN109894989A (en) * | 2019-04-10 | 2019-06-18 | 贵州大学 | New pattern laser structuring diamond abrasive grain polishing pad and its grinding grain structure method |
| JP2022064826A (en) * | 2020-10-14 | 2022-04-26 | 中國砂輪企業股▲ふん▼有限公司 | Polishing pad dresser and method for manufacturing the same |
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