JP2000151086A5 - - Google Patents
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- Publication number
- JP2000151086A5 JP2000151086A5 JP1998320839A JP32083998A JP2000151086A5 JP 2000151086 A5 JP2000151086 A5 JP 2000151086A5 JP 1998320839 A JP1998320839 A JP 1998320839A JP 32083998 A JP32083998 A JP 32083998A JP 2000151086 A5 JP2000151086 A5 JP 2000151086A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- qfp
- solder paste
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000001678 irradiating effect Effects 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10320839A JP2000151086A (ja) | 1998-11-11 | 1998-11-11 | プリント回路ユニット及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10320839A JP2000151086A (ja) | 1998-11-11 | 1998-11-11 | プリント回路ユニット及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000151086A JP2000151086A (ja) | 2000-05-30 |
| JP2000151086A5 true JP2000151086A5 (enExample) | 2005-12-22 |
Family
ID=18125825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10320839A Pending JP2000151086A (ja) | 1998-11-11 | 1998-11-11 | プリント回路ユニット及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000151086A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358452A (ja) | 2000-06-15 | 2001-12-26 | Murata Mfg Co Ltd | 電子部品の実装方法 |
| JP4799997B2 (ja) * | 2005-10-25 | 2011-10-26 | 富士通株式会社 | 電子機器用プリント板の製造方法およびこれを用いた電子機器 |
| US20120171556A1 (en) | 2010-12-29 | 2012-07-05 | Jongpil Kim | Secondary battery |
| JP2015109397A (ja) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
| JP6155468B2 (ja) * | 2013-12-06 | 2017-07-05 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
| WO2021251985A1 (en) * | 2020-06-12 | 2021-12-16 | Ncc Nano, Llc | Method for connecting surface-mount electronic components to a circuit board |
-
1998
- 1998-11-11 JP JP10320839A patent/JP2000151086A/ja active Pending
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