JP2000151081A - Discontinued wiring repairing method for wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a wiring repairing method for a wiring board by preventing excess application of conductive paste that causes short-circuiting in a manufacturing process of the wiring board for a computer and so on. SOLUTION: A repairing method for a discontinued wire of a wiring board is constituted to provide a step of forming resist 6 at a circuit pattern excepting the discontinued wiring part, a step of applying conductive paste 7 at the discontinued part on the resist 6 formed, a step of hardening the conductive paste 7 and a step of eliminating the resist 6 from the wiring board. The step of forming the resist 7 can form the resist 6 at a part excepting the discontinued wiring correctly and easily by using a step of applying the resist 6 on the wiring board, a step of again exposing the circuit pattern of the wiring board, and a step of developing the exposed region.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of correcting a disconnection of a wiring board, and more particularly to a method of correcting a disconnection of a circuit conductor in a process of manufacturing a wiring board of an electronic device.

[0002]

2. Description of the Related Art A multilayer wiring board used in a computer or the like is formed by alternately stacking insulating layers and wiring layers on a board. Also, in such a wiring board,
As the technical level in the electronic equipment industry has been improved in recent years, the circuit conductor pattern has been increased in density and narrower, and the line width of the circuit conductor has tended to become thinner.

For this reason, in a series of circuit pattern forming processes such as resist coating, exposure, development, etching and resist peeling, disconnection failure (pattern open) of the circuit pattern often occurs due to mixing of dust or foreign matter. . Conventionally, when a pattern open occurs in the manufacturing process of such a multilayer wiring board, each time a wiring layer is formed, the disconnection is connected by applying a conductive paste to the disconnection portion using a very fine brush. Had to fix it.

[0004]

However, in such a correction method of applying a conductor paste using a very fine brush,
In a circuit pattern environment with a high density and a narrow pitch as described above, a conductor paste is often applied to a wider area than a broken portion, and a short circuit may occur between adjacent patterns. In such a case, the newly created short-circuited portion is removed and corrected with a spatula, but it is difficult and troublesome work to remove the conductor paste once applied, and short-circuiting occurs because the conductor paste cannot be completely removed. May not be fixed.

According to the present invention, when a disconnection failure occurs in a manufacturing process of a wiring board of a computer or the like, even if the circuit pattern has a high density and a narrow pitch, an excessive application of a conductive paste that causes a short circuit is caused. It is an object of the present invention to provide a method for correcting a disconnection of a wiring board that corrects a disconnection while preventing the occurrence of a disconnection.

[0006]

In order to achieve the above object, a method for correcting a disconnection of a wiring board according to the present invention comprises the steps of forming a resist on a portion other than a circuit pattern including a disconnected portion, and forming the resist. A step of applying a conductive paste to the broken portion from above, a step of solidifying the conductive paste, and a step of removing the resist from the wiring board.

As described above, by masking by forming a resist in a portion where it is not desired to apply the conductive paste in advance, it is possible to prevent the applied conductive paste from adhering to an unnecessary portion and causing a short circuit. Can be prevented.

In the method of repairing a disconnection of a wiring board according to the present invention, the step of forming a resist on a portion other than the circuit pattern including the broken portion includes the steps of applying a resist to the wiring board, And a step of developing the exposed area.

As described above, the formation of the resist in a portion other than the disconnection can be easily realized by repeating the step of forming the circuit pattern having the disconnection again. That is,
After the resist is applied so as to cover the broken portion, the circuit pattern is exposed again, and further developed, so that the resist is accurately formed only in portions other than the circuit pattern including the broken portion. Therefore, even when the circuit pattern has a high density and a narrow pitch, it is possible to accurately mask other portions except for the circuit pattern portion including the broken portion, and this masking allows a circuit other than the pattern having the broken wire to be formed. The disconnection can be easily corrected without causing a short circuit.

Further, the method for correcting a disconnection of a wiring board according to the present invention is characterized in that the method further comprises a step of removing the excessively attached conductive paste after applying the conductive paste. As described above, if the conductive paste is applied from the top of the resist and the excess conductive paste is removed with a spatula or the like, a short circuit after the correction can be more reliably prevented.

In the step of solidifying the conductive paste, it is preferable that the wiring substrate is heated to solidify the conductive paste by blowing off the solvent. For example, if the wiring board is heated in an oven or the like to blow off and harden the solvent in the conductive paste, the repair process can be sped up.

In the step of removing the resist from the wiring board, a method of immersing the wiring board in a solvent capable of dissolving the resist and removing the resist can be suitably used.

Further, the method for correcting a disconnection of a wiring board according to the present invention is characterized in that the wiring board is a multilayer wiring board in which insulating layers and wiring layers are alternately laminated, and the disconnection portion is formed each time the wiring layer is formed. It is characterized by confirming the presence or absence of any breaks and correcting any breaks as needed to form a multilayer wiring board. As described above, even in the manufacturing process of the multilayer wiring board, if the disconnection is corrected each time a wiring layer is formed, a multilayer wiring board having no disconnection failure can be configured.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for correcting a disconnection of a wiring board according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing a configuration of the multilayer wiring board 1. As shown in FIG. 1, the multilayer wiring board 1 is formed by alternately stacking insulating layers 3 and wiring layers 4 on a substrate 2. In the manufacturing process of such a multilayer wiring board, a pattern open may occur in the wiring layer 4 due to attachment of dust or foreign matter during pattern formation. FIG. 2 is a front view showing a disconnection correcting step of the present invention, and FIG. 3 is a sectional view thereof.

As shown in FIGS. 2A and 3A,
If there is a pattern open 5 on the circuit, first, a resist 6 is formed on a portion other than the circuit pattern including the pattern open 5. This step can be performed accurately and easily by using the step of forming the wiring pattern of the wiring layer again. That is, first, pattern open 5
After the resist 6 is applied over a wide area including the wiring pattern, the circuit pattern of this wiring layer is exposed, and then the development processing is performed. Then, the resist corresponding to the circuit pattern of this wiring layer is removed, and the wiring pattern other than the wiring pattern is removed. The resist 6 is formed only on the portion. Here, since the pattern open 5 exists on the circuit pattern, the resist 6 is accurately formed on a portion other than the circuit pattern including the pattern open 5 as shown in FIGS. 2B and 3B.

Next, as shown in FIGS. 2C and 3C, a conductive paste 7 is applied from above the resist 6 so as to bridge the pattern open 5. The conductive paste 7 is formed by kneading a conductive material such as copper with a solvent. Here, as shown in FIGS. 2D and 3D,
Excessive conductive paste 7 is removed with a spatula or the like so as not to remain on resist 6. By doing so, it is possible to reliably prevent a short-circuit between the correction location and the pattern adjacent thereto. After the conductive paste 7 is applied, the conductive paste 7 is heated in an oven or the like to remove the solvent of the conductive paste 7 and solidify.

Finally, as shown in FIGS. 2E and 3E, the substrate is immersed in a solvent to remove the resist 6 from the substrate. According to the above steps, only the portion where the pattern open 5 has occurred can be accurately connected, and the disconnection failure of the wiring board can be corrected without causing a short circuit.

As described above, in the manufacturing process of the multilayer wiring board, the presence or absence of occurrence of a pattern open is checked each time a wiring layer is formed, and if there is a pattern open, it is corrected as needed using the above-described method. I do. It is obvious that this disconnection correction method can be applied not only during the manufacturing process of the multilayer wiring substrate but also when the disconnection of a single-layer substrate having only one wiring layer formed on the substrate is corrected. Further, the repair method of the present invention can be used not only during the manufacturing process of the wiring board but also when the wiring board is repaired due to a disconnection failure of the wiring board in the electronic device in use.

[0019]

As described above in detail, according to the method for correcting a disconnection of a wiring board according to the present invention, when a disconnection failure due to adhesion of dust or foreign matter occurs during the manufacturing process of the wiring board. On the other hand, a resist is formed in a portion other than the disconnection in advance, and a conductive paste is applied thereon to bridge the broken portion, and then the excess applied conductive paste on the resist pattern is removed. Further, even in a wiring board having a pattern environment with a high density and a narrow pitch, disconnection can be surely corrected without causing a short circuit with an adjacent circuit conductor pattern.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration of a multilayer wiring board;

FIG. 2 is a front view showing steps of a disconnection correction method according to the present invention.

FIG. 3 is a cross-sectional view showing a step of the disconnection correction method of the present invention shown in FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer wiring board 2 Substrate 3 Insulating layer 4 Wiring layer 5 Pattern open 6 Resist 7 Conductor paste

Claims (6)

[Claims] 1. A method for repairing a broken portion of a wiring board, comprising the steps of: forming a resist on a portion other than a circuit pattern including the broken portion; and forming a conductive paste on the broken portion after forming the resist. A method for correcting a disconnection of a wiring board, comprising: a step of applying; a step of solidifying the conductive paste; and a step of removing the resist from the wiring board. 2. The method according to claim 1, wherein the step of forming a resist on a portion other than the circuit pattern including the broken portion includes the steps of: applying a resist to the wiring substrate; A step of exposing the circuit pattern again, and a step of developing the exposed area. 3. The method according to claim 1, further comprising a step of removing the excess conductive paste after applying the conductive paste. How to fix a broken board. 4. The method for correcting a disconnection of a wiring board according to claim 1, wherein the step of solidifying the conductive paste includes heating the wiring board to solidify the conductive paste by blowing a solvent component. Characteristic method of correcting disconnection of wiring board. 5. The method according to claim 1, wherein the step of removing the resist from the wiring board comprises immersing the wiring board in a solvent capable of dissolving the resist. A method for correcting a disconnection of a wiring board, the method comprising: 6. The method according to claim 1, wherein the wiring board is a multilayer wiring board in which insulating layers and wiring layers are alternately stacked. A method for correcting the disconnection of a wiring board, wherein the presence or absence of the disconnection portion is checked each time a pattern is formed, and if there is a disconnection, the multilayer wiring board is corrected as needed to form a multilayer wiring board.