JP2000150619A - 基板処理装置 - Google Patents
基板処理装置Info
- Publication number
- JP2000150619A JP2000150619A JP36778299A JP36778299A JP2000150619A JP 2000150619 A JP2000150619 A JP 2000150619A JP 36778299 A JP36778299 A JP 36778299A JP 36778299 A JP36778299 A JP 36778299A JP 2000150619 A JP2000150619 A JP 2000150619A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- transfer
- processing
- chamber
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36778299A JP2000150619A (ja) | 1999-01-01 | 1999-12-24 | 基板処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36778299A JP2000150619A (ja) | 1999-01-01 | 1999-12-24 | 基板処理装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21033298A Division JP3193904B2 (ja) | 1997-08-01 | 1998-07-09 | 基板搬送制御方法及び基板製品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000150619A true JP2000150619A (ja) | 2000-05-30 |
JP2000150619A5 JP2000150619A5 (fr) | 2005-05-19 |
Family
ID=18490184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP36778299A Pending JP2000150619A (ja) | 1999-01-01 | 1999-12-24 | 基板処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000150619A (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7630785B2 (en) | 2005-01-07 | 2009-12-08 | Tokyo Electron Limited | Substrate processing system for setting uniform module cycle length and access control time lag in two pipeline processing systems |
JP2010093227A (ja) * | 2008-09-12 | 2010-04-22 | Hitachi High-Technologies Corp | 真空処理装置 |
JP2010534940A (ja) * | 2007-07-24 | 2010-11-11 | アプライド マテリアルズ インコーポレイテッド | 薄膜ソーラー製造中に基板温度を制御する装置及び方法 |
KR101005882B1 (ko) | 2008-10-14 | 2011-01-06 | 세메스 주식회사 | 반도체 제조 설비 및 이의 제어 방법 |
WO2020161873A1 (fr) * | 2019-02-07 | 2020-08-13 | 株式会社日立ハイテクノロジーズ | Procédé pour faire fonctionner un dispositif de traitement sous vide |
JP2023045503A (ja) * | 2021-09-22 | 2023-04-03 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、及びプログラム |
-
1999
- 1999-12-24 JP JP36778299A patent/JP2000150619A/ja active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7630785B2 (en) | 2005-01-07 | 2009-12-08 | Tokyo Electron Limited | Substrate processing system for setting uniform module cycle length and access control time lag in two pipeline processing systems |
JP2010534940A (ja) * | 2007-07-24 | 2010-11-11 | アプライド マテリアルズ インコーポレイテッド | 薄膜ソーラー製造中に基板温度を制御する装置及び方法 |
JP2010093227A (ja) * | 2008-09-12 | 2010-04-22 | Hitachi High-Technologies Corp | 真空処理装置 |
KR101005882B1 (ko) | 2008-10-14 | 2011-01-06 | 세메스 주식회사 | 반도체 제조 설비 및 이의 제어 방법 |
WO2020161873A1 (fr) * | 2019-02-07 | 2020-08-13 | 株式会社日立ハイテクノロジーズ | Procédé pour faire fonctionner un dispositif de traitement sous vide |
JP6792098B1 (ja) * | 2019-02-07 | 2020-11-25 | 株式会社日立ハイテク | 真空処理装置の運転方法 |
TWI716275B (zh) * | 2019-02-07 | 2021-01-11 | 日商日立全球先端科技股份有限公司 | 真空處理裝置之運轉方法 |
JP2023045503A (ja) * | 2021-09-22 | 2023-04-03 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、及びプログラム |
JP7324811B2 (ja) | 2021-09-22 | 2023-08-10 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、及びプログラム |
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Legal Events
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A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040705 |
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Effective date: 20040705 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
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