JP2000124367A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure an accurate temperature of a CPU main body since a gas is generated between the body and a substrate. SOLUTION: This electronic equipment is equipped with a substrate 1, a CPU unit which is electrically connected to the substrate 1 and fitted and a gas is left between a CPU-3 main body and substrate 1, an elastic member, and a temperature sensor which is adhered nearly at the center of one surface of the member, and the thickness when the temperature sensor is fitted to the member is larger than the gap, and the temperature sensor is arranged between the substrate 1 and CPU unit in contact with the CPU-3 main body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to temperature measurement of a CPU used in electronic equipment such as a personal computer and a word processor, and more particularly to a temperature measurement configuration of a PGA type CPU.

[0002]

2. Description of the Related Art The speed of CPUs mounted on electronic devices has been increasing year by year, and accordingly, a method of managing the temperature at which the CPU generates heat has also become important. Conventionally, a temperature sensor such as a thermistor is used to control the temperature.
The temperature of U was being measured.

FIG. 4 shows a temperature measurement configuration when a conventional PGA type CPU is used in electronic equipment. On the substrate 1, PG
An A socket 2 is provided, and a CPU 3 is provided substantially in the center of the PGA socket 2. When the PGA socket 2 is mounted on the substrate 1, a gap of about 3 mm is generated. Further, a heat sink 4 is attached to the upper part of the PGA socket 2. Thermistor 5 is a CPU
3 is mounted directly on the substrate 1 substantially opposed to the substrate 3.
With such a configuration, the temperature of the PGA type CPU 3 was measured.

As described above, when the PGA CPU is arranged on the substrate 1, a gap of about 3 mm generally occurs.
There was a problem that the accurate temperature of the CPU 3 could not be measured.

[0005]

As described above, the temperature of the conventional PGA type CPU cannot be measured accurately because a gap is formed between the CPU and the substrate. Therefore, the temperature management method using the measured temperature information of the CPU also needs to be designed in consideration of the gap and the temperature inside and outside the electronic device housing, which is very complicated.

[0006]

In order to solve the above-mentioned problems, an electronic apparatus according to the present invention is provided with a board, a board electrically connected to the board, and a gap provided between the CPU body and the board. A CPU unit to be attached, a member having elasticity, and a temperature sensor adhered to substantially one center of one surface of the member, wherein the thickness when the temperature sensor is attached to the member is thicker than the gap. And the temperature sensor is arranged between the substrate and the CPU unit so as to be in contact with the CPU main body. Accordingly, even in an electronic device having a configuration in which a gap is provided between a substrate and a CPU
The temperature of the main body can be accurately measured.

Further, the member is formed by attaching a hardening member to the one surface. In this way, the temperature of the CPU could be correctly measured at the beginning of manufacture because of the contact, but it is possible to solve the problem that a gap is generated after a lapse of time and the temperature of the CPU cannot be measured correctly.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. Elements having the same configuration and operation as those shown in the related art are denoted by the same reference numerals, and description thereof is omitted.

FIG. 1 is a side view showing a configuration of a PGA type CPU mounted on a substrate of an electronic apparatus.
FIG. 2 is a diagram showing the configuration of FIG. 1 from above. The thermistor holding member 6 with the thermistor 5 attached thereto
The PGA socket 2 is bonded and disposed at a position substantially facing the center of the PGA socket 2. The thermistor holding member 6 is an insulating and elastic member, and is made of, for example, a sponge.
The thermistor 5 is disposed substantially at the center of the upper surface of the thermistor holding member 6 and is electrically connected to the substrate 1 via a lead wire 9. Thermistor 5 is attached to the thermistor holding member 6.
The height (thickness) after mounting the PGA socket 2 is equal to or greater than the gap when the PGA socket 2 is mounted on the substrate 1.

As described above, the thermistor 5 is a PGA type CP.
Since it is in direct contact with the CPU 3 provided in U, the temperature of the CPU 3 can be accurately measured. Next, another embodiment of the thermistor holding member 6 will be described with reference to FIG.

The thermistor holding member 6 is formed by attaching an insulator 8 made of a hard material to the upper surface of a sponge 7 having a high elasticity. And, to the insulator 8,
Thermistor 5 electrically connected to substrate 1 by lead wire 9
Is attached. The height (thickness) after the thermistor 5 is attached to the thermistor holding member 6 is the PGA socket 2
Has a thickness equal to or greater than the gap when the substrate is mounted on the substrate 1.

With the thermistor holding member 6 configured as described above, it is possible to prevent the sponge 7 from aging due to the weight of the thermistor itself and a gap or the like caused by being embedded in the sponge 7. As a result, the temperature of the CPU 3 can be correctly measured at the beginning of the manufacturing process, but it is possible to solve the problem that the temperature cannot be correctly measured after a lapse of time.

[0013]

As described above, since the gap between the CPU main body and the substrate is filled with an elastic member and the temperature sensor directly contacts the CPU main body, the temperature of the CPU main body can be accurately measured. Will be able to

Further, since the member is made of a member having a hardened member attached to the one surface, the temperature of the CPU could be measured correctly at the beginning of manufacture because the member was in contact with the member. It is possible to solve the problem that a gap is generated and the temperature of the CPU cannot be measured correctly.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration when a PGA CPU is mounted on a substrate of an electronic device.

FIG. 2 is a top view illustrating a configuration in which a PGA CPU is mounted on a substrate of an electronic device.

FIG. 3 is a view showing another embodiment relating to a thermistor pressing member 6;

FIG. 4 is a diagram showing a temperature measurement configuration when a conventional PGA type CPU is used in an electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 PGA socket 3 CPU 4 Heat sink 5 Thermistor 6 Thermistor holding member 7 Sponge 8 Insulator 9 Lead wire

Claims (2)

[Claims] 1. A board, a CPU unit electrically connected to the board and provided with a gap between the CPU body and the board, an elastic member, and one surface of the member. A temperature sensor adhered near the center of the member, the thickness when the temperature sensor is attached to the member has a thickness greater than the gap, and between the substrate and the CPU unit. An electronic device, wherein the temperature sensor is arranged to be in contact with the CPU main body. 2. The electronic device according to claim 1, wherein said member has a hardened member attached to said one surface.