JP2006234466A - Device for measuring temperature and structure for measuring temperature - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and structure for measuring temperature that conducts heat appropriately from an object whose temperature is measured to a temperature sensor at low total manufacturing costs in application to equipment that is manufactured in a small number. <P>SOLUTION: A glass epoxy plate (planar spacer) 4 having a through hole 7 that becomes a gap for arranging a temperature detection IC (temperature sensor) 1 is provided between a printed circuit board (board) 2 for packaging the temperature detection IC (temperature sensor) 1 and the object 3 whose temperature is measured. The printed circuit board (board) 2 is mounted to a condensation curing type silicone (heat transfer material) 10 applied to an opening formed by the object 3 whose temperature is measured and the sidewall surface of the opening of the glass epoxy plate (planar spacer) 4 so that the temperature detection IC (temperature sensor) 1 comes into contact, thus dispensing with molds and heating processes and adhering the heat transfer material to the object whose temperature is measured and the temperature sensor appropriately. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a temperature measurement device and a temperature measurement structure, and more particularly to a technique for conducting heat well from a temperature measurement object to a temperature sensor attached to a substrate in the temperature measurement device and the temperature measurement structure.

The conventional temperature measuring device and structure is a part in which a heat transfer material having high thermal conductivity is arranged between the temperature measurement object and the temperature sensor, and the shape of the heat transfer material is in contact with the temperature measurement object and the temperature sensor. It is assumed to be in line with the shape. In order to make the shape of the heat transfer material, prepare a mold with the same shape as the contact part of the object to be measured, and attach a substrate with a temperature sensor attached to the mold, between the mold and the substrate. After injecting a liquid heat transfer material, it is hardened. Thereby, a substrate in which the temperature sensor is covered with a heat transfer material having a desired shape is obtained and attached to the temperature-measured object with good adhesion (for example, refer to Patent Document 1. In Patent Document 1, it is mounted on the substrate). It is shown as a technology that conducts heat from electronic components to the base and dissipates it, but it is essentially the same from the viewpoint of good heat conduction between the two materials.)
JP 2003-101270 A

  However, in the conventional configuration, since it is necessary to prepare a mold having the same shape as the contact portion of the object to be measured, it is said that the cost is generally increased in application to an industrial device having a small production quantity. Had problems.

  The present invention solves the above-mentioned conventional problems, and provides a temperature measuring device and structure that conducts heat from a temperature-measured object to a temperature sensor at a low total manufacturing cost in application to equipment with a small production quantity. The purpose is to provide.

  In order to solve the above-described conventional problems, a temperature measuring device according to the present invention is provided between a substrate on which a temperature sensor is attached and a substrate to be measured facing the temperature measurement object to be measured by the temperature sensor. And a plate-like spacer having a predetermined thickness having a through-hole serving as a gap for arranging the temperature sensor, and the substrate faces the surface of the temperature-measured part via the plate-like spacer. A heat transfer material for injecting heat of the object to be measured and fixing the temperature sensor to an opening formed by the surface of the object to be measured and a through hole of the plate-like spacer is provided. The temperature sensor is housed in the opening and the substrate is fixed to the object to be measured.

  Further, in the temperature measuring device, the heat transfer material is a condensation curable silicone.

  Further, in the temperature measuring apparatus, the substrate has a through hole for allowing an excess heat transfer material to escape in a portion corresponding to the opening of the plate-like spacer.

  In addition, the present invention includes a substrate on which a temperature sensor is attached, and a plate-like spacer having a predetermined thickness that is disposed to face a surface of a temperature object to be measured by the temperature sensor. Is provided so as to face the surface of the temperature measurement part via the plate-shaped spacer, and the plate-shaped spacer forms a predetermined gap with the surface of the temperature-measured object for arranging the temperature sensor. A through hole to be formed, for fixing the temperature sensor to an opening formed by the surface of the object to be measured and the through hole of the plate spacer, and for conducting the heat of the object to be measured It is a temperature measurement structure in which a heat transfer material is injected, the temperature sensor is housed in the opening, and the substrate is fixed to the object to be measured.

  According to the apparatus and structure of the present invention, it is possible to provide a temperature measuring apparatus and structure that conducts heat from a temperature-measured object to a temperature sensor satisfactorily at a low total manufacturing cost in application to equipment with a small production quantity. .

  Embodiments of a temperature measuring device according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is an exploded perspective view for explaining the structure of the temperature measuring device according to the first embodiment of the present invention.

  In FIG. 1, a temperature detection IC (temperature sensor) 1 is a semiconductor integrated circuit that outputs an output corresponding to the temperature of an IC chip, and is mounted on a printed circuit board (substrate) 2 on which a circuit pattern is formed by soldering. ing. On the surface of the printed circuit board (substrate) 2 opposite to the surface on which the temperature detection IC (temperature sensor) 1 is mounted, a connector for signal output and power supply of the temperature detection IC (temperature sensor) 1 is provided. Circuit components (not shown) such as resistors and resistors are mounted.

  Between the printed circuit board (board) 2 and the object to be measured 3, there is a through hole 7 that becomes a gap for placing the temperature detection IC (temperature sensor) 1, and further penetrates the shaft portion of the screw. A glass epoxy plate (plate-like spacer) 4 having a hole is provided, positioned according to a screw hole provided in the object to be measured 3, and fixed to the object to be measured 3 with the spacer fixing screw 5. Is done.

  A portion of the surface of the object to be measured 3 exposed by the through hole 7 of the glass epoxy plate (plate spacer) 4, that is, the object to be measured 3 and a glass epoxy plate (plate spacer) attached thereto. ) Condensation-curable silicone (heat transfer material, not shown) is applied to a space formed by the side wall surface of the through-hole 7 of 4 and opened upward.

  Silicone has excellent electrical properties, heat resistance / cold resistance, insulation properties, and the like, so it is often used as a heat transfer material by adding a filler such as alumina or boron nitride to enhance thermal conductivity. Among them, the condensation-curing type reacts with moisture in the air at room temperature, cures while releasing a small amount of by-products such as acetone and acetic acid, and becomes a rubber elastic body after curing and exhibits excellent adhesion. Since it cures at room temperature, there is no need to heat for curing.

  The printed circuit board (board) 2 has a surface on which the temperature detection IC (temperature sensor) 1 is mounted facing the glass epoxy board (plate spacer) 4 side, and the temperature detection IC (temperature sensor) 1 is a glass epoxy board (board). It is attached to the glass epoxy plate (plate-like spacer) 4 with a substrate fixing screw 6 so as to fit in the through hole 7 of the spacer. At this time, since the notches are provided in the two corners of the printed circuit board (substrate) 2 so that the heads of the spacer fixing screws 5 do not interfere with each other, the printed circuit board (substrate) 2 and the glass epoxy plate (plate spacer) 4) is attached in a state of close contact with no gap.

  FIG. 2 shows a shape diagram of the plate-like spacer of the temperature measuring device in Embodiment 1 of the present invention.

  In FIG. 2, the through hole 7 is a temperature detection IC (temperature sensor) when the glass epoxy plate (plate spacer) 4 is attached so as to be sandwiched between the printed circuit board (substrate) 2 and the temperature-measured object 3. 1 is a space (opening) in which the temperature detection IC (temperature sensor) 1 is accommodated.

  The spacer fixing screw hole 8 and the substrate fixing screw hole 9 penetrate the spacer fixing screw shaft and the substrate fixing screw shaft, respectively.

  FIG. 3 is a cross-sectional view before mounting the substrate for explaining the structure of the temperature measuring device according to the first embodiment of the present invention.

  In FIG. 3, the condensation-curing silicone (heat transfer material) 10 is formed by the object to be measured 3 and the side wall surface of the through hole of the glass epoxy plate (plate spacer) 4 attached thereto, and the upper part is opened. It is applied to the space.

  FIG. 4 is a cross-sectional view after mounting the substrate for explaining the structure of the temperature measuring device according to the first embodiment of the present invention.

  In FIG. 4, the condensation-curing silicone (heat transfer material) 10 is sealed by the object to be measured 3, the side wall surface of the through hole of the glass epoxy plate (plate spacer) 4, and the printed circuit board (substrate) 2. In such a state, the condensation curable silicone (heat transfer material) 10 is in close contact with the temperature detection IC (temperature sensor) 1 and the object to be measured 3.

  The heat transfer silicone may be processed into a sheet or a compound, but if a condensation-curing silicone is used, it is a paste in an uncured state at the time of application, so a temperature detection IC (temperature sensor) 1 It is possible to improve the adhesion to the object to be measured 3 and to become a rubber elastic body after curing, so that damage to the temperature detection IC (temperature sensor) 1 due to stress during temperature change can be prevented. The heat transfer material itself is not scattered. In addition, since it is a condensation-curing type, it reacts with moisture in the air and cures at room temperature, so that the glass epoxy plate (plate spacer) 4 and the printed circuit board (substrate) 2 are attached to the object to be measured 3. There is no need for a heating step to the condensation curable silicone (heat transfer material) 10, and the influence on the temperature-measured object 3 is small.

  In order to avoid damaging the temperature detection IC (temperature sensor) 1 due to interference with the object to be measured 3 when the printed circuit board (substrate) 2 is attached, the thickness of the glass epoxy plate (plate-like spacer) 4 is the temperature detection IC. (Temperature sensor) 1 The maximum value of the height (thickness) itself and the maximum value of the floating value of the temperature detection IC (temperature sensor) 1 from the printed circuit board (substrate) 2 by soldering Although larger, it is preferred that it be slightly larger than its dimensions for better heat conduction.

  As described above, in the first embodiment, the temperature detection IC (temperature sensor) 1 is provided between the printed circuit board (substrate) 2 on which the temperature detection IC (temperature sensor) 1 is mounted and the temperature measurement object 3. A space formed by a glass epoxy plate (plate-like spacer) 4 having a through-hole serving as a gap for placement, and a temperature-measured object 3 and a side wall surface of the through-hole of the glass epoxy plate (plate-like spacer) 4 Curing at mold and room temperature by attaching printed circuit board (substrate) 2 so that temperature detection IC (temperature sensor) 1 is in contact with condensation-curing silicone (heat transfer material) 10 applied to (opening) This eliminates the need for a heating process and allows the heat transfer material and the object to be measured and the heat transfer material and the temperature sensor to be in good contact with each other. Temperature from temperature measurement The good heat to the sensor it is possible to provide a temperature measuring device and a structure for conduction.

  In the first embodiment, as the temperature sensor, a temperature detection IC that outputs an output corresponding to the temperature of the IC chip is used, but the output may be either analog or digital. Further, the temperature threshold value may be set at the time of manufacturing the IC, or may be a temperature switch type having a temperature threshold value that can be set by an external resistor or the like. Further, a temperature sensitive element such as a thermistor may be used instead of the IC.

  In the printed circuit board (board) 2, circuit components such as connectors and resistors are mounted on the surface opposite to the surface on which the temperature detection IC (temperature sensor) 1 is mounted. If it is small, such as a resistor, that fits into the gap between the through hole of the glass epoxy plate (plate spacer) 4 and the temperature detection IC (temperature sensor) 1, the temperature detection IC (temperature sensor) 1 is mounted. It may be mounted at a location corresponding to the through hole of the glass epoxy plate (plate spacer) 4 on the surface.

  Further, although a glass epoxy plate is used as the plate-like spacer 4, it is not limited to this as long as it can be easily processed. However, for accurate temperature measurement, it takes heat away from the object to be measured 3. Difficult, low thermal conductivity is desirable. Further, if insulation is required between the circuit of the printed circuit board (substrate) 2 and the temperature-measured object 3, one having a large insulation resistance must be used.

  Further, as a shape of the printed circuit board (substrate) 2, a notch is provided in order to avoid interference with the head of the spacer fixing screw 5, but the notch is not necessarily required. The size itself can be made small so as not to interfere with the head of the spacer fixing screw 5, and a simpler shape can be obtained.

  FIG. 5 is a diagram showing the shape of the substrate of the temperature measuring device according to the second embodiment of the present invention. In FIG. 5, a temperature detection IC (temperature sensor) 1 is soldered to a printed circuit board (substrate) 2 provided with a board fixing screw hole 9. The difference from the substrate of Example 1 is that a heat transfer material buffering hole 11 is provided.

  The hole 11 for buffering the heat transfer material corresponds to a through hole that becomes a gap for placing the temperature detection IC (temperature sensor) 1 of the glass epoxy plate (plate-like spacer) 4 that is overlapped with the printed circuit board (substrate) 2. Within the range (inside the broken line portion), the temperature detection IC (temperature sensor) 1 is provided in a place that does not interfere with the mounting or circuit pattern.

  The amount of the condensation curable silicone (heat transfer material) 10 applied to the temperature detection IC (temperature sensor) 1 in a state where the printed circuit board (substrate) 2 is attached to the glass epoxy plate (plate spacer) 4. It is only necessary to ensure a contact area sufficient for heat conduction, and it is preferable to determine an appropriate amount by trial or the like in advance and apply the predetermined amount (appropriate amount) during assembly.

  However, the appropriate amount is not determined in advance by trial or the like, or the coating amount increases for some reason, and the side wall surface of the through-hole of the object to be measured 3 and the glass epoxy plate (plate spacer) 4 and the printed circuit board (substrate) 2 and the temperature detection IC (temperature sensor) 1, the condensation-curing silicone (heat transfer material) 10 is replaced with a printed circuit board (substrate) 2 and a glass epoxy board ( (Plate-like spacers) 4 may leak or protrude from the gap, but excessive heat of the condensation curable silicone (heat transfer material) 10 escapes from the heat transfer material buffer hole 11, so there is no such fear. .

  FIG. 6 is a cross-sectional view after mounting the substrate for explaining a state when the heat transfer material is excessive in the second embodiment of the present invention.

  In FIG. 6, the excess of the condensation curable silicone (heat transfer material) 10 escapes to the printed circuit board (substrate) 2 side through the heat transfer material buffer holes 11.

  As described above, in the second embodiment, the printed circuit board (substrate) 2 has a through-hole serving as a gap for arranging the temperature detection IC (temperature sensor) 1 of the glass epoxy plate (plate-like spacer) 4. By providing the heat transfer material buffering hole 11 in a range that corresponds to the hole and does not interfere with the mounting of the temperature detection IC (temperature sensor) 1 or the circuit pattern, the condensation curable silicone (heat transfer material) 10 is provided. Excessive buffering space can be secured, and even if the condensation-curing silicone (heat transfer material) 10 is applied excessively, it leaks or protrudes from the gap between the printed circuit board (substrate) 2 and the glass epoxy plate (plate spacer) 4. Therefore, it is possible to provide a temperature measuring device and a structure that are free from the risk of being lost.

  The temperature measuring device and the temperature measuring structure according to the present invention can satisfactorily thermally couple the temperature-measured object and the temperature sensor at a low total manufacturing cost, and can be applied to equipment with a small production quantity such as industrial equipment. Useful as measuring device and structure.

The exploded perspective view for demonstrating the structure of the temperature measuring apparatus in Example 1 of this invention Shape diagram of plate-like spacer of temperature measuring device in Embodiment 1 of the present invention Sectional drawing before board attachment for demonstrating the structure of the temperature measuring apparatus in Example 1 of this invention Sectional drawing after board attachment for demonstrating the structure of the temperature measuring apparatus in Example 1 of this invention Shape diagram of substrate of temperature measuring device in embodiment 2 of the present invention Sectional drawing after board | substrate attachment for demonstrating the state at the time of excessive heat-transfer material in Example 2 of this invention

Explanation of symbols

1 Temperature detection IC (temperature sensor)
2 Printed circuit board (board)
3 Object to be measured 4 Glass epoxy board (plate spacer)
5 Spacer fixing screw 6 Substrate fixing screw 7 Through hole that becomes a gap for placing temperature detection IC (temperature sensor) 1 8 Spacer fixing screw hole 9 Substrate fixing screw hole 10 Condensation-curing silicone (heat transfer material)
11 Heat transfer material buffer hole

Claims (4)

A substrate with a temperature sensor attached thereto;
A plate-like spacer having a predetermined thickness, which is provided between the substrate and the substrate to be measured by the temperature sensor, and has a through-hole serving as a gap for arranging the temperature sensor;
With
The substrate is provided to face the surface to be measured through the plate spacer,
The temperature sensor is fixed to an opening formed by the surface of the object to be measured and the through hole of the plate-like spacer, and a heat transfer material for injecting the heat of the object to be measured is injected into the temperature. A temperature measuring apparatus, wherein a sensor is housed in the opening and the substrate is fixed to the object to be measured. The temperature measuring device according to claim 1, wherein the heat transfer material is a condensation curable silicone. The temperature measurement apparatus according to claim 1, wherein the substrate has a through hole for allowing an excess heat transfer material to escape in a portion corresponding to the opening of the plate-like spacer. A substrate with a temperature sensor attached thereto;
A plate-like spacer having a predetermined thickness arranged opposite to the temperature-measured object surface to be measured by the temperature sensor;
With
The substrate is provided to face the surface to be measured through the plate spacer,
The plate-like spacer has a through hole that forms a predetermined gap with the surface of the temperature-measured object for arranging the temperature sensor,
The temperature sensor is fixed to an opening formed by the surface of the object to be measured and the through hole of the plate-like spacer, and a heat transfer material for injecting the heat of the object to be measured is injected into the temperature. A temperature measurement structure characterized in that a sensor is housed in the opening and the substrate is fixed to the object to be measured.

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