JP2000124266A - Method and apparatus for bonding semiconductor reinforcing plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid generation of stress in an anisotropic conductive tape and also generation of air bubbles in a bonding part at bonding the tape on a reinforcing plate. SOLUTION: An anisotropic conductive tape 4 is bent and held, in such a condition that the bonding part of the tape 4 is sandwiched by bending/holding means, including a tape holding rail 11 and a guide block 12 and is compressed between an arcuate-surface pressing member 6 of an upper pressing part 6 and a lower pressing part 2, whereby the air in the bonding surface is expelled by the arcuate surface of the pressing part 6 outward, from a central part of the reinforcing plate, thus realizing compression bonding thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for attaching a semiconductor reinforcing plate to an anisotropic conductive tape such as a TCP tape or a TAB tape in a semiconductor assembling apparatus.

[0002]

2. Description of the Related Art Conventionally, for example, as shown in the front view of FIG. 6 and the side view of FIG. The upper pressing unit 5 and the lower pressing unit 2 provided with are provided. The upper pressing unit 5 is provided with a pressing unit guide 8, and the lower pressing unit 2 is provided via a pressing unit guide 7. It can be moved up and down.

When the reinforcing plate 3 is adhered to the TCP tape by this apparatus, the reinforcing plate 3 to which an adhesive has been applied is placed on the pressing surface of the lower pressing unit 2 and then the surface of the reinforcing plate 3 is Is raised and stopped to a position on the back surface of the TCP tape 4 fixed so as not to move up and down, back and forth, and left and right, and then the upper pressing unit is lowered to lower the lower pressing unit 2. And the reinforcing plate 3 was pressure-adhered to the TCP tape 4.

[0004]

However, in the above-mentioned conventional apparatus, when the reinforcing plate 3 is placed on the heated lower pressing portion 2 and raised, the TCP tape 4 is not thermally deformed or bent. By applying pressure as it is,
Air is trapped in the portion where the thermal deformation or deflection has occurred, and air bubbles are generated in the sticking portion. This lowers the yield as a product. In order to prevent such a problem, T
It is necessary to finely adjust the ascending position of the heating unit for each size of the CP tape 4 and the reinforcing plate 3, and there is a problem that a work load is large.

[0005] In the case of the conventional device in which the semiconductor reinforcing plate is attached to the TAB tape in the conventional device, the pressure attachment is performed in a state where the upper surface of the lower pressing portion and the vertical position of the TAB tape are fixed. Therefore, depending on the product type, it is necessary to adjust the vertical relative positional relationship between the upper surface of the lower pressing portion and the lower surface of the TAB tape before applying pressure.

[0006] In this case, the relative position is determined by sequentially starting pressurization from the center of the sticking part at the time of sticking in order to prevent air bubbles and uneven strength of the whole sticking part from occurring on the sticking surface. Since the method of pressing outward is adopted, there is a problem that a certain interval or more is required. However,
Since the TAB tape is stuck under pressure in a fixed state,
If the TAB tape and the upper surface of the lower pressing unit are not at a certain position in the vertical direction at the end of the sticking, the TAB tape may be deformed and possibly broken,
Subtle adjustments were needed.

[0007] Accordingly, the present invention has been made in view of the above-mentioned problems, and when a reinforcing plate is attached to an anisotropic conductive tape, stress is not applied to the anisotropic conductive tape and the attachment is performed. It is an object of the present invention to provide a method and an apparatus for attaching a semiconductor reinforcing plate, which can be attached without generating air bubbles in a portion.

[0008]

According to the first aspect of the present invention, a reinforcing plate is attached to an anisotropic conductive tape or the like between a heated upper pressing portion and a lower pressing portion. In the bonding method for pressure bonding, while positioning the anisotropic conductive tape or the like at the bonding position, the upper and lower surfaces thereof are curved and held in an arcuate shape curving upward by a pair of upper and lower curved holding members, and the lower side is applied. The reinforcing plate placed on the pressure part is lifted to the lower surface of the lowermost point of the curved part, and the spherical pressing surface of the upper pressing member made of an elastic body is brought into contact with the upper surface of the lowermost point of the curved part, thereby lowering the lower part of the curved part. A point, that is, the center of the sticking portion is set as a sticking start point, and the entire sticking portion is sequentially pressure-applied outward.

According to the first aspect of the present invention, the pressure is applied while being positioned and held by a pair of upper and lower curved holding members while being curved and held, so that the attaching position is accurately fixed and stress is applied to the anisotropic conductive tape. Can be adhered without causing the occurrence. In addition, since the pressure is gradually applied outward from the center of the curved portion of the anisotropic conductive tape, that is, from the center of the sticking portion, air trapped on the sticking surface is expelled from the center to the outside. No air bubbles are generated at the sticking part.

According to a second aspect of the present invention, there is provided a method for pressure-bonding a reinforcing plate to an anisotropic conductive tape or the like between a heated upper pressing portion and a lower pressing portion. Holds both ends of an arc formed by curving a conductive tape or the like upward in an arc shape, that is, two parallel sides of the anisotropic conductive tape, and places the reinforcing plate placed on the lower pressing portion at the bottom of the curved portion. Lifting to the lower surface of the point and bringing the spherical pressing surface of the upper pressing member made of an elastic body into contact with the upper surface of the lowermost point of the curved portion, and lowering the holding portions at both ends of the arc with the lowering of the upper pressing portion. By
With the lowermost point of the curved portion, that is, the central portion of the sticking portion as the sticking start point, the entire sticking portion is sequentially pressure-applied outwardly.

According to the second aspect, the end portion of the anisotropic conductive tape, which is curved in an arc shape that is warped upward, is gradually lowered with the lowering of the upper pressurizing portion, thereby providing anisotropic conductive tape. Since the tape is not stressed and the pressure is applied gradually from the center of the tape to the outside, the air trapped on the surface is expelled from the center to the outside, and the tape No air bubbles are generated.

According to a third aspect of the present invention, the relative position of the upper pressurizing unit and the both-end holding unit at the time of descent is determined by continuously detecting the pressing force from the start to the end of the pressurization by the pressure detecting means. Positioning is performed by continuously controlling the pressurizing position adjusting mechanism based on the detected value by automatic control.

According to the third aspect, the relative position of the upper pressing section and the both-end holding section at the time of lowering can be continuously controlled based on the detection value of the pressure detecting means. There is no need for manual adjustment, and the work load is reduced.

According to a fourth aspect of the present invention, the relative position of the upper pressurizing unit and the both ends holding unit at the time of descent is determined by the position of the upper pressurizing unit from the start to the end of pressurization by the vertical movement position detecting means. Positioning is performed by continuously controlling the pressurizing position adjusting mechanism by automatic control based on the detected value while detecting continuously.

According to the fourth aspect, the relative position of the upper pressing section and the both-end holding section at the time of lowering is continuously detected by the vertical movement position detecting means from the start to the end of pressing. The positioning is performed by continuously controlling the pressurizing position adjusting mechanism by automatic control based on the detected value, and the same operation as in the third aspect is obtained.

According to a fifth aspect of the present invention, there is provided a bonding apparatus for pressing a reinforcing plate to an anisotropic conductive tape between a heated upper pressing portion and a lower pressing portion. A guide block having a holding rail having an arc surface to be brought into contact with the upper surface of the anisotropic conductive tape, and a positioning means for positioning the same arc surface to be brought into contact with the lower surface of the anisotropic conductive tape and facing the tape holding rail. Thus, there is provided a bending holding means for bending and holding in an arc shape which is curved upward with the anisotropic conductive tape interposed therebetween.

According to the fifth aspect, the same operation as the first aspect is obtained.

According to a sixth aspect of the present invention, the positioning means comprises:
It comprises a plurality of vertically erected pins for positioning a plurality of locations in the bonded portion of the anisotropic conductive tape.

According to the sixth aspect, two pins are erected on the upper surface of the guide block, and the pins are engaged with two predetermined portions of the anisotropic conductive tape at the same time as the guide block is raised. This enables positioning.

According to a seventh aspect of the present invention, there is provided a sticking apparatus for pressure-bonding a reinforcing plate to an anisotropic conductive tape between a heated upper pressing portion and a lower pressing portion. Curve holding means for bending the adhesive portion of the tapered portion in a loosened state and holding both ends of the curved portion with a tape positioning and fixing member, and arbitrarily setting a relative position in the vertical direction between the tape positioning and fixing member and the upper pressing portion. And a pressure adjusting mechanism for controlling the pressure.

According to the seventh aspect, the same operation as the second aspect is obtained.

According to an eighth aspect of the present invention, the pressing position adjusting mechanism comprises a pulse motor, a ball screw driven by the pulse motor, and a tape vertical moving member for vertically moving the tape positioning and fixing member via the ball screw. The mechanism includes: a mechanism; pressure detecting means for detecting a pressing force of the upper pressurizing portion; and control means for automatically controlling the operation of the vertical mechanism based on a detection value detected by the pressure detecting means.

According to the eighth aspect, the vertical positioning mechanism for vertically moving the tape vertical moving member via the ball screw driven by the pulse motor is controlled based on the detection value of the pressure detecting means, thereby fixing and positioning the tape. The relative position between the member and the upper pressing unit can be determined by automatic control. Therefore, fine adjustment by hand is not required.

According to a ninth aspect of the present invention, the pressure detecting means comprises:
It consists of a load cell.

According to the ninth aspect, the pressure can be detected with a simple structure by using the load cell as the pressure detecting means.

According to a tenth aspect of the present invention, the pressing position adjusting mechanism includes a pulse motor, a ball screw driven by the pulse motor, and a tape vertical moving member for vertically moving the tape positioning and fixing member via the ball screw. A vertical movement position detecting means for the upper pressurizing section; and a control means for automatically controlling the operation of the vertical movement mechanism based on a value detected by the vertical movement position detecting means.

According to the tenth aspect, in place of the pressure detecting means in the seventh aspect, the vertical movement position of the upper pressurizing section is detected by the vertical movement position detection means, and the vertical mechanism is operated based on the detected value. By performing the control, the relative position between the tape positioning / fixing member and the upper pressing portion can be positioned by automatic control, and the same operation as in the seventh aspect can be obtained.

According to an eleventh aspect of the present invention, the pressurizing member of the upper pressurizing portion is made of an elastic body, and the pressurizing surface is formed to be an arc surface or a spherical surface.

According to the eleventh aspect, the pressing member of the upper pressing portion is made of an elastic body, and the pressing surface is formed in an arc surface or a spherical surface. Pressurization can be started from the center of the portion, and the elastic body causes the spherical surface to be crushed at the time of pressurization, so that the adhesive portion is sequentially pressed outward from the center. As a result, the air trapped in the sticking surface is expelled outward, and no air bubbles are generated in the sticking portion.

[0030]

Embodiments of the present invention will be described below with reference to the drawings.

Elements common to those of the prior art are denoted by the same reference numerals, and redundant description will be omitted.

(Embodiment 1) FIGS. 1 and 2 show Embodiment 1 of the present invention. FIG. 1 is a front view of an apparatus for attaching a semiconductor reinforcing plate, and FIG. 2 is a side view of FIG.

In the apparatus for attaching a semiconductor reinforcing plate according to the present embodiment, the upper pressing portion 5 is provided above the anisotropic conductive tape 4 which is successively fed from the side while being supported by the transport rail 9. The side pressing unit 2 is disposed, and the upper pressing unit 5
Has a pressure member 6 whose lower end press surface is made of an elastic body having an arc shape, that is, rubber, and a heater 13 for heating.
Is provided, and can be moved up and down via a guide 8.

The lower pressurizing unit 2 has an upper end surface on which a reinforcing plate 3 is placed, and is provided with a heater 1 for heating. ing.

Further, for the anisotropic conductive tape 4 located between the upper pressing part 5 and the lower pressing part 2, the reinforcing plate sticking part of the tape 4 is formed into an arcuate shape curved upward. A tape holding rail 11 having an arcuate surface 11a, an identical arcuate surface 12a corresponding to the arcuate surface 11a, and an opening 12b corresponding to the shape and size of the sticking portion in the center are provided as a curving holding means for curving and holding. And a guide block 12 in which positioning pins 10 and 10 for positioning and fixing the tape 4 are vertically arranged at two points at the lowest point of the arc.

At the same time, the guide block 12 is raised by the operation of the cylinder 14 so as to face the tape holding rail 11, and at the same time, the positioning pins 10, 10 of the tape 4 are engaged with the predetermined two positions of the tape 4 for sticking. The position is determined, and the tape 4 is bent and held while being sandwiched between the tape and the holding rail 11. Reference numeral 15 in the drawing denotes a driving mechanism of the pressing unit.

Next, a description will be given of a sticking method using the device having this configuration.

First, the anisotropic conductive tape 4 is
The guide block 12 is conveyed from the side to the sticking portion while being supported by the tape, and the guide block 12 is moved from below the anisotropic conductive tape 4 to the cylinder 14 against the tape holding rail 11 disposed above the anisotropic conductive tape 4. As a result, the positioning pins 10, 10 are simultaneously engaged with the predetermined positions of the anisotropic conductive tape 4 to perform positioning, and are positioned between the tape holding rail 11 and the circular arc surfaces 11a, 12a. And is clamped upward in an arc shape. Thereby, the anisotropic conductive tape 4 is curved and held.

In this state, the reinforcing plate 3 coated with an adhesive in advance on the upper end is placed on the lower pressing unit 2 heated by the heater 1, and the reinforcing plate 3 is operated by the operation of the pressing unit driving mechanism 15. To the position of the lowest point of the curved portion of the anisotropic conductive tape 4,
Stop at that position.

Next, the upper pressing unit 5 is connected to the pressing unit driving mechanism 15.
Is lowered through the pressing portion guide 8 to bring the arc surface of the pressing member 6 made of an elastic body into contact with the curved lowermost point of the anisotropic conductive tape 4, that is, the center of the sticking portion. Subsequently, by lowering the upper pressing portion 5, the arc surface of the pressing member 6 is crushed, and the pressure is sequentially applied outward from the first contact position, that is, from the center of the sticking portion. As a result, the air entrained on the sticking surface is expelled outward, so that the sticking surface can be stuck without bubbles. The arc surface of the pressing member 6 may be spherical.

According to the present embodiment, stress is not applied to the anisotropic conductive tape 4 by applying the reinforcing plate 3 under pressure while bending the anisotropic conductive tape 4 with the bending holding member. . Moreover, since the pressure is started from the lowermost point of the curved portion of the anisotropic conductive tape, that is, the center of the sticking portion, and the pressure is gradually applied outward, the air entrained on the sticking surface is at the center. Is expelled outward from the surface, and no air bubbles are generated at the sticking portion.

(Embodiment 2) FIGS. 3 to 5 show Embodiment 2 of the present invention, FIG. 3 is a side view showing an apparatus for attaching a semiconductor reinforcing plate, and FIG. 4 shows a process of an attaching method. FIG. 5 and FIG. 5 are flowcharts for explaining the sticking process.

In the device for attaching a semiconductor reinforcing plate according to the present embodiment, an upper pressing portion 5 is disposed above an anisotropic conductive tape 4 and a lower pressing portion 2 is disposed below the tape. ,
The upper pressing portion 5 has a pressing member 6 made of a spherical elastic body, that is, rubber at a lower end thereof, and a heater 13 for heating is provided, and can be moved up and down via a pressing portion guide 8. ing.

The lower pressurizing section 2 has an upper end surface on which a reinforcing plate 3 is placed. The heater 1 for heating is provided in the same manner as described above. It is possible to move. Further, a load cell 25 is provided below the lower pressing unit 2 as pressure detecting means for detecting a pressing force at the time of sticking.

For the anisotropic conductive tape 4 located between the upper pressing part 5 and the lower pressing part 2, as a means for holding the tape 4 in a curved state, as shown in FIGS. A tape positioning and fixing member 20 is provided for holding both ends of an arc-shaped curved portion in which the tape 4 is warped upward, that is, two parallel sides of the tape 4 so as to be vertically movable.

The vertical movement of the tape positioning and fixing member 20 is performed by a pressing position adjusting mechanism. As shown in FIG. 3, the pressing position adjusting mechanism includes a pulse motor 22, a ball screw 23 that is driven to rotate by the pulse motor 22, and a tape upper and lower member 21 that vertically moves the tape positioning and fixing member 20 via the ball screw 23. Vertical mechanism 26
A load cell 25 provided as detecting means for detecting a pressing force at the time of application, and control means (not shown) for automatically controlling the operation of the vertical mechanism 26 based on a value detected by the load cell 25. While continuously detecting the pressing force from the start to the end of the pressure, the operation of the up-down mechanism 26 is automatically controlled based on the detected value, and the positioning fixing member 20 is lowered with the lowering of the upper pressurizing unit 5. Thus, the relative position between the positioning and fixing member 20 and the reinforcing plate 3 can be set continuously.

Next, the operation of the apparatus having this configuration will be described.

First, two parallel sides of the anisotropic conductive tape 4 conveyed from the side to the sticking portion while being supported by a conveying rail (not shown) are fixed by the tape positioning fixing member 20, and the tape 4 is formed in an arc shape. In a state of being bent upward.

On the other hand, the reinforcing plate 3 previously coated with an adhesive is
The lower pressing unit 2 is placed on the upper surface of the lower pressing unit 2 heated by the heater 1, and the lower pressing unit 2 is moved by the operation of the pressing unit driving mechanism 15 so that the reinforcing plate 3 becomes the curved end of the anisotropic conductive tape 4. Raise until the lower point is reached, and stop at that position. The relative position between the fixed position of the tape positioning and fixing member 20 and the raised position of the lower pressing unit 2 at this time is set as the initial setting value of the pressing position adjusting mechanism 26. That is, the initial set value is the value shown in FIG.
As shown in (2), the reinforcing plate 3 placed on the lower pressing portion 2 is in contact with or in proximity to only the lowest point of the curved tape 4, and the tape positioning and fixing member 20 has warped upward. The position of both ends of the tape 4 is held.

Next, the upper pressing unit 5 is connected to the pressing unit driving mechanism 15.
The lower part of the tape 4 in which the center of the spherical pressing member 6 made of the elastic body of the upper pressing part 5 is curved in an arc by lowering the tape 4 via the pressing part guide 8 by the operation of Then, by lowering the upper pressurizing portion 5, the spherical surface of the pressurizing member 6 is crushed, and the pressurization sequentially proceeds outward from the center portion as a start point of pressurization.

In this case, the pressing force is detected by a load cell 25 provided below the lower pressurizing section 2, and based on the detected value, the tape fixing position of the tape positioning and fixing member 20 and the reinforcing plate are controlled by control means (not shown). 3, the tape positioning and fixing member 20 is lowered in synchronization with the lowering of the upper pressing unit 5.

This synchronization control will be described with reference to the process diagram of FIG. 4 and the block diagram of FIG. Reinforcement plate 3
(A), the vertical distance between the tape positioning and fixing member 20 and the reinforcing plate 3 is 1 mm as shown in FIG. When the pressure is started and 10% of the maximum pressing force is applied as shown in FIG. 3 (b), the tape positioning and fixing member 20 is lowered by 0.2 mm and the relative interval becomes 0.8 mm. At 50%, the relative spacing is 0.3 mm as shown in FIG. 7C, and at 80%, the relative spacing is 0 mm as shown in FIG. Have been.

A command is issued to the pulse motor 10 of the up / down mechanism 26 based on the calculation table and the pressure detection value from the load cell 25, and the tape positioning / fixing member 20 is lowered via the ball screw 23 and the tape up / down member 21. Appropriate relative intervals are set so that no stress is applied to the tape 4 during the entire pressing process.

According to the present embodiment, at the time of pressing and adhering, the tape positioning and fixing member is synchronized with an increase in the pressing force as the spherical surface of the pressing member 6 provided in the upper pressing portion 5 is crushed. By lowering the tape 20, the relative distance between the tape positioning and fixing member 20 and the reinforcing plate 3 is reduced.
Can be attached without giving any stress to the product.

Also, since the pressing is started from the lowermost point of the curved portion of the anisotropic conductive tape by the spherical pressing member 6, ie, from the center of the sticking portion, the pressing is gradually performed outward. The air entrained on the sticking surface is expelled outward and no air bubbles are generated at the sticking portion.

In the present embodiment, an example has been described in which the relative position is calculated based on the pressure detected value by the load cell 25. The same operation and effect can be obtained by providing a position detecting means for continuously detecting the position of the upper pressing portion 5 and automatically controlling the relative position between the reinforcing plate 3 and the tape positioning and fixing member 20 based on the detected value. can get. Further, the spherical surface of the pressing member 6 may be a spherical arc surface.

[0057]

The effects of the first, fourth, fifth and eleventh aspects are as follows. The anisotropic conductive tape is adhered by pressure while being held in a curved manner by a pair of upper and lower curved holding means. Stress does not occur on the conductive tape. In addition, since air that has been caught on the sticking surface is expelled by starting pressurizing from the center of the sticking portion and gradually pressing outward, air bubbles are not generated in the sticking portion.

The effect of the second, third, sixth, seventh, eighth, ninth and tenth aspects is that the tape positioning and fixing member holding the anisotropic conductive tape in a curved state is gradually lowered as the upper pressing portion is lowered. By applying pressure, stress does not occur in the anisotropic conductive tape. In addition, since air that has been caught on the sticking surface is expelled by starting pressurizing from the center of the sticking portion and gradually pressing outward, air bubbles are not generated in the sticking portion.

[Brief description of the drawings]

FIG. 1 is a front view of a device for attaching a semiconductor reinforcing plate according to a first embodiment of the present invention.

FIG. 2 is a side view of FIG. 1;

FIG. 3 is a side view of a device for attaching a semiconductor reinforcing plate according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a process of the attaching method.

FIG. 5 is a flowchart illustrating a sticking process.

FIG. 6 is a front view of a conventional device for attaching a semiconductor reinforcing plate.

FIG. 7 is a side view of a conventional device for attaching a semiconductor reinforcing plate.

[Explanation of symbols]

1, 13 heater 2 lower presser 3 reinforcing plate 4 anisotropic conductive tape 5 upper presser 6 presser 7, 8 presser guide 9 Conveying rail 10 Positioning pin 11 Tape holding rail 12 Guide block 14 Cylinder 15 Pressurizing unit drive mechanism 20 Tape positioning and fixing member 21 Tape vertical moving member 22 Pulse motor 23 …… Ball screw 24 …… Vertical movement guide 25 …… Load cell 26 …… Pressure position adjustment mechanism

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Osamu Matsumoto 25-1 Ekimae Honcho, Kawasaki-ku, Kawasaki-shi, Kanagawa F-term in Toshiba Microelectronics Corporation (reference) 5F044 NN00 NN19 NN19 NN22

Claims (11)

[Claims] 1. A bonding method for pressure-bonding a reinforcing plate to an anisotropic conductive tape or the like between a heated upper pressing portion and a lower pressing portion, wherein the anisotropic conductive tape or the like is bonded. While positioning at the loading position, the upper and lower surfaces are curved and held in an arcuate shape by warping upward with a pair of upper and lower bending holding members, and the reinforcing plate placed on the lower pressurizing unit to the lower surface of the lowermost point of the bending portion. Lift and bring the spherical pressing surface of the upper pressing member made of an elastic body into contact with the upper surface of the lowermost point of the curved portion. A method for attaching a semiconductor reinforcing plate, wherein the entirety of the attaching portion is pressure-applied toward the substrate. 2. A method of applying a reinforcing plate to an anisotropic conductive tape or the like under pressure between a heated upper pressing portion and a lower pressing portion, wherein the anisotropic conductive tape or the like is At both ends of an arc curved into an arc shape, ie, parallel 2 of anisotropic conductive tape
Hold the side, lift the reinforcing plate placed on the lower pressing part to the lower surface of the lowermost point of the curved part, and on the upper surface of the lowermost point of the curved part, press the spherical pressing surface of the upper pressing member made of an elastic body. By contacting and lowering both ends of the arc with the lowering of the upper pressing portion, the lowermost point of the curved portion, that is, the central portion of the sticking portion, is sequentially pasted outward as a sticking start point. A method for attaching a semiconductor reinforcing plate, wherein the entire attachment portion is attached under pressure. 3. The relative position of the upper pressurizing unit and the both-end holding unit at the time of lowering is determined by the detected value while continuously detecting the pressing force from the start to the end of pressurization by the pressure detection unit. The positioning is performed by continuously controlling the pressurizing position adjusting mechanism based on the automatic control based on the control.
The method for attaching a semiconductor reinforcing plate according to the above. 4. The relative position of the upper pressurizing section and the holding section at the time of lowering is determined by continuously detecting the position of the upper pressurizing section from the start to the end of pressurization by a vertical movement position detecting means. 3. The method for attaching a semiconductor reinforcing plate according to claim 2, wherein the positioning is performed by continuously controlling the pressing position adjusting mechanism by automatic control based on the detected value. 5. A bonding apparatus for pressing a reinforcing plate on an anisotropic conductive tape between a heated upper pressing portion and a lower pressing portion, wherein the reinforcing plate abuts on an upper surface of the anisotropic conductive tape. The guide block has a holding rail having an arc surface to be made, and a guide block having positioning means for positioning the same arc surface to be brought into contact with the lower surface of the anisotropic conductive tape from the lower surface of the anisotropic conductive tape in opposition to the tape holding rail. An apparatus for attaching a semiconductor reinforcing plate, comprising: a bending holding means for bending and holding an arc curved upward with a conductive tape therebetween. 6. The semiconductor reinforcing plate according to claim 5, wherein said positioning means comprises a plurality of vertically erected pins for locating a plurality of positions in an attaching portion of the anisotropic conductive tape. Sticking device. 7. A bonding apparatus for bonding a reinforcing plate to an anisotropic conductive tape between a heated upper pressing portion and a lower pressing portion, wherein the bonding portion of the anisotropic conductive tape is Bending holding means for bending the loosened state and holding both ends of the bent portion with a tape positioning and fixing member, and a pressing position for arbitrarily controlling the relative position in the vertical direction between the tape positioning and fixing member and the upper pressing portion. An attaching device for a semiconductor reinforcing plate, comprising: an adjusting mechanism. 8. The motor according to claim 8, wherein the pressing position adjusting mechanism includes: a motor;
An up-and-down mechanism including a ball screw driven by a motor, a tape vertical moving member that moves the tape positioning and fixing member up and down via the ball screw, pressure detecting means for detecting a pressing force of the upper pressing portion, and the pressure detecting means 8. The apparatus for attaching a semiconductor reinforcing plate according to claim 7, further comprising control means for automatically controlling the operation of said up-down mechanism based on the detection value detected by the control unit. 9. The apparatus according to claim 8, wherein said pressure detecting means comprises a pressure measuring device. 10. An up / down mechanism comprising a pulse motor, a ball screw driven by the pulse motor, a tape vertical moving member for vertically moving the tape positioning and fixing member via the ball screw, 8. The semiconductor according to claim 7, further comprising: a vertical movement position detecting means for the pressure section; and a control means for automatically controlling the operation of the vertical mechanism based on a detection value detected by the vertical movement position detecting means. Reinforcement plate sticking device. 11. The semiconductor reinforcing plate according to claim 5, wherein the pressing member of the upper pressing portion is made of an elastic body, and the pressing surface is formed in an arc surface or a spherical surface. Sticking device.